JPH1033472A - Endoscope device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an endoscope device capable of identifying plural types of endoscopes and meet the specification of each endoscope without making the endoscope size larger. SOLUTION: A SID 12 is composed of a substrate 13 and an SID chip 14. The SID chip 14 is composed of a shoot area 14a, an optical black 14b, a shift register 14c, a Random Access Memory 14d to store the data to identify the endoscopes capable of adding the data and several chip lands 14e. A land 13c for the substrate and the chip lands 14e are electrically connected together through bonding wires 15. Writing and reading the data on/out the Random Access Memory 14d are done by an endoscope detector applied in peripheral equipment as well as sending and receiving the data are done through a writing and reading data circuit put in the endoscope detector.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an endoscope apparatus having a plurality of types of endoscopes which are selectively connected to a single peripheral device and used.

[0002]

2. Description of the Related Art A plurality of endoscopes used in an endoscope apparatus are prepared because the length of the insertion portion and the diameter of the insertion portion are different depending on the insertion site and application. Further, a plurality of solid-state imaging devices (hereinafter abbreviated as SIDs) provided at the distal end of the insertion section are prepared in plurality depending on the type of the solid-state imaging device. The plurality of endoscopes are generally connected to one peripheral device provided in the endoscope apparatus.

However, in these endoscopes, for example, if the length of the insertion portion is different, the cable length naturally changes, so that the drive characteristics and output characteristics of the SID are different. Also,
An endoscope having a small insertion section diameter uses a small SID, so that the number of SID pixels is small, and an endoscope for obtaining high resolution uses an SID having a large number of pixels. Therefore, it is extremely difficult to properly control each device so that one peripheral device can cope with the drive characteristics and output characteristics due to the above-described difference in SID and change in cable length.

For this reason, an ID generation circuit is provided as identification means for the endoscope, for example, in a connector of the endoscope or in the operation section, and this ID is detected by a detection means provided in a peripheral device, whereby the SID of the SID is detected. By appropriately adjusting the driving characteristics and the like, observations can be made by appropriately adjusting a plurality of combinations of endoscopes.

[0005]

However, by providing an ID generating circuit and wiring for identification means in the connector and the operation unit of the endoscope, the connector and the operation unit are enlarged and the operability is reduced. There was a problem that the assemblability deteriorated.

Further, since the ID generation circuit is incorporated at the time of assembling the endoscope, when the characteristic value of the SID or the like changes or the cable length changes due to repair or the like, the characteristic value changes. There was a problem that it could not be done.

The present invention has been made in view of the above circumstances, and can identify a plurality of types of endoscopes without increasing the size of the endoscopes, and can easily cope with changes in the characteristics of each endoscope. An object of the present invention is to provide an endoscope apparatus.

[0008]

An endoscope apparatus according to the present invention comprises:
A plurality of endoscopes having a built-in solid-state imaging device at the tip of the insertion portion, and an endoscope device including a peripheral device to which the plurality of endoscopes are selectively connected, wherein the solid-state imaging device An endoscope identification means having a write-once memory unit capable of additionally writing data is provided, and the peripheral device writes data to the write-once memory unit and reads data written in the write-once memory unit. Detection means having a write / read circuit is provided.

According to this configuration, it is easy to detect various characteristics of the endoscope from the information in the write-once memory unit and appropriately control the peripheral device. Further, when various characteristics of the endoscope are changed due to repair or the like, new data is additionally written in the write-once type memory unit, and the setting of the characteristics can be easily changed.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 relate to an embodiment of the present invention, FIG. 1 is an explanatory diagram showing a schematic configuration of an endoscope device,
FIG. 2 is an explanatory diagram illustrating the configuration of the solid-state imaging device.

As shown in FIG. 1, an endoscope apparatus 1 according to the present embodiment is, for example, a solid-state image pickup device (hereinafter referred to as SI) for observing the inside of a body cavity.
An electronic endoscope (hereinafter abbreviated as “endoscope”) 3 in which an imaging device 2 in which an abbreviated D is arranged is incorporated in a distal end component 3b on the distal end side of the insertion portion 3a, and an imaging device for the endoscope 3 2 is an external device including a video processor 4 for processing an electric signal converted by the imaging device 2 into an image signal and a light source device 5 for supplying illumination light to an illumination optical system (not shown) of the endoscope 3. It mainly comprises a peripheral device 10 and a monitor device 6 which is an external device for displaying an image signal generated by the video processor 4 on a screen 6a as a subject image.

The image pickup device 2 and the peripheral device 10 are connected by an electric cable 7.
Is an elongated insertion portion 3a to be inserted into a body cavity;
The operation part 8 which is located on the base end side of FIG. 1A and which serves as a holding part, and the inside of a universal cord 9 extending from the side part of the operation part 8 are inserted therethrough, and an electric connector provided at the end of the universal cord 9 It is configured to be detachably connected to the peripheral device 10 via 9a. The electrical connector 9a
Is connected to the peripheral device 10 so that the light guide 9 is
The distal end face b faces the lamp 5a of the light source device 5, and is electrically connected to the electric cable 7, the video processor 4, and an endoscope detector 11, which will be described later, which is detection means having a data writing / reading circuit. It has become so. Reference numeral 8a denotes a treatment instrument insertion port provided in the operation unit 8, which communicates with a suction conduit 3c provided in the insertion unit.

[0013] As shown in FIG.
D12 is arranged. The SID 12 includes, for example, a ceramic substrate (hereinafter, referred to as a substrate) 13 and an SID chip 14, and the SID chip 14 is provided in a groove 13 a formed in the substrate 13.

The SID chip 14 has an imaging area 14a on which a subject image captured by an observation optical system (not shown) is formed.
An optical black unit 14b for determining a black reference of a light receiving signal from an image formed on the imaging area 13;
A shift register unit 14c for transferring a light receiving signal of an image formed on the imaging area 13, and information serving as an endoscope identifying unit are recorded, and data can be additionally written, for example, EEP
It is composed of a write-once type memory section 14d composed of a ROM and a plurality of chip lands 14e,..., 14e.

The chip land 14e is connected to the substrate 1
The substrate land 13c and the chip land 14e are provided so as to respectively correspond to the plurality of substrate lands 13c electrically connected to the external leads 13b protruding from the third. Are electrically connected via

The writing of data into the write-once memory unit 14d and the reading of information from the write-once memory unit 14d are performed by an endoscope detector 11 provided in the peripheral device 10. And a data writing / reading circuit 1 provided in the endoscope detector 11.
Data is transmitted to and received from the write-once type memory unit 14d via 1a.

When writing data into the write-once type memory section 14d, new data is input using a keyboard, digitizer, and mouse (not shown) to write and write data.
The data in the write-once memory unit 14d is updated via the reading circuit 11.

The data stored in the write-once memory unit 14d includes, for example, the number of SID pixels provided in the endoscope, the type of SID such as an interline transfer system, a frame transfer system, and a line transfer system. Whether the device is sequential or simultaneous, device characteristics of the SID such as sensitivity, material and number of light guides, cable length, SID energizing time (single inspection time or total inspection time), SID ID number, These include patient data, operator data, and spectral characteristics of the SID.

Reference numeral 13d is a contact surface serving as a reference surface for arranging the SID chip 14 at a predetermined position, and reference numeral 13e is a guide surface serving as a reference surface for arranging the SID chip 14 at a predetermined position. is there. Reference numerals 13f and 13g are escape portions.

As shown in the figure, the SID chip 14 has functional parts such as an optical black part 14b and a shift register part 14c arranged in a well-balanced manner around the imaging area 14a. The optical black portion 14b is brought into close contact with the surface 13c.
The imaging area 14a of the SID chip 14 is arranged substantially at the center of the substrate 13 by making the side surface of the side and the guide surface 13d face-to-face, so that the space around the imaging area 14a is effectively utilized. In addition, by arranging the imaging area 14a substantially in the center of the substrate 13, the size of the imaging device can be reduced, which leads to an improvement in the insertability of the endoscope insertion portion.

The operation of the endoscope apparatus 1 configured as described above will be described. First, the electric connector 9a of the universal cord 9 provided in the endoscope 3 is connected to the peripheral device 10. Then, the data write / read circuit 11a of the endoscope detector 11 provided in the peripheral device 10 causes the write-once type memory unit 14d provided in the imaging device 2 of the distal end component 3b of the endoscope 3 to be provided. Is read out. The information read from the write-once type memory unit 14d is transmitted to each device such as the video processor 4, the light source device 5, and the monitor device 6, and each device and the like are transmitted to the endoscope 3.
Is controlled to the optimum state.

Next, it is assumed that a second endoscope (not shown) is connected to the peripheral device 10 in place of the endoscope 3. Then, the information in the write-once type memory unit provided in the second endoscope is read out to the endoscope detector 11, and based on the data, each device or the like is optimized for the second endoscope. Conditions are reset.

On the other hand, when the cable length is shortened for repair or the like, the data in the write-once memory unit 14d of the SID 12 in the endoscope 3 is updated. That is, data on a new cable length is input using a keyboard (not shown), and data in the write-once memory unit 14d is updated via the write / read circuit 11a.

Further, deterioration of CCD characteristics, patient data,
If data registered in advance, such as operator data, is valid later, additional writing, change, erasing, and the like can be performed via the writing / reading circuit 11a. In addition,
Reference numeral 16 denotes a cover glass that covers the front surface of the SID chip 14.

As described above, the write-once memory unit serving as endoscope identification means is provided in a very small area in the SID chip.
By providing an endoscope detector serving as a detecting means in a peripheral device which is an external device of the endoscope, wiring and assembly work have been simplified without increasing the number of parts and providing a new arrangement space. A small endoscope device can be provided. As a result, the size of the image pickup element itself becomes smaller than that in the case where the write-once type memory unit is provided on a separate substrate, and wiring work is greatly reduced.

In addition, since endoscope characteristic data such as SID deterioration and repair, patient data, operator data, and the like can be added, changed, or deleted later as needed, maintenance is greatly improved.

Furthermore, since each device can be controlled to an optimum state according to the characteristics of each endoscope, stable and high-quality observation and diagnosis can always be performed.

The contact surface and the guide surface provided on the substrate are S
By using it as a reference plane for ID chip placement, SI
By arranging the imaging area of the D chip at substantially the center of the substrate, the flare characteristics can be made uniform. Thereby, the flare resistance due to the light reflected from the side surface of the cover glass is made uniform.

Some endoscopes can change the focal point and magnification by moving a part of the objective lens provided at the distal end portion. As a mechanism for moving a part of the objective lens, there are a drive wire mechanism using a drive wire, an electromagnet mechanism using an electric wire or a coil, an actuator mechanism using an air tube or an electric wire, and the like. Since a space for arranging a drive wire, a coil, an electric wire, an air tube, and the like is required, there is a problem in that the circumference of the objective lens becomes large, and the end of the endoscope has a large diameter.

For this reason, an endoscope having a drive mechanism capable of driving a part of the objective lens to change the focal point and magnification without increasing the outer dimension of the end portion of the endoscope is desired.

As shown in FIG. 3, the distal end component 3 of the endoscope 3
The image pickup unit 20 provided with the SID 12 is provided in b. An objective optical system unit 21 for forming a subject image on an imaging area of an SID chip (not shown) is provided in front of the SID 12.

The objective optical system unit 21 includes a fixed-side objective lens 22 and a movable-side objective lens 23, and the fixed-side objective lens 22 includes a first lens frame 22.
a, the insulating frame 22b and the second lens frame 22c. The insulating frame 22 b is provided in the first lens frame 2.
The second lens frame 22c is electrically insulated from the second lens frame 22c, and prevents external electric noise applied to the distal end component 3b from being transmitted to the imaging unit 20.

The rear end of the second lens frame 22c is S
The SID holder 2 is fixed to the ID holder 24.
The SID 12 and the shield frame 25 are fixed to 4.

The moving-side objective lens 23 is fixed to a moving lens frame 23a, and the moving lens frame 23a is configured to freely move in the second lens frame 22c in the axial direction. The two lenses in the moving lens frame 23a are arranged at a predetermined interval by the interval tube 23b.

The moving lens frame 23a is, for example, a magnetic material having a magnetic pole in the direction of the moving axis, and is inserted from the treatment tool insertion port 8a, passes through the suction conduit 3c, and reaches the distal end component 3b. Makes it movable.

The focusing member 30 is composed of a coil base 31 and a focusing tube 32 constituting a distal end portion. A first coil 33a is wound around the distal end surface of the coil base 31. A second coil 33b is wound around the rear end.

The first coil 33a and the second coil 33b are wound around the focusing tube 32 and connected to a peripheral device, which is an external device (not shown). Coil 33b
The movable lens frame 23a moves in the axial direction by a magnetic force generated when a current flows through the movable lens frame 23a.

That is, with the current flowing through the first coil 33a and the second coil 33b, the hand of the focusing tube 32 is pushed and pulled to move the coil base 31 in the axial direction. Accordingly, the movable lens frame 23a moves following the movement of the coil base material 31.

Further, by changing the direction of the current flowing through the first coil 33a and the second coil 33b of the coil base 31, the polarity can be switched without moving the coil base 31 in the axial direction. By doing so, the moving lens frame 23a moves.

The coil base 31 and the focusing tube 32 are formed by hollow pipe members. Therefore, suction and insertion of a treatment tool can be performed through the hollow portions of the coil base material 31 and the focusing tube 32 and the opening 32a of the focusing tube 32.

The focusing tube 32
By providing a plurality of openings 32a, the flexibility of the focusing tube 32 itself is further enhanced.

In this embodiment, the same members as those in the above embodiment are denoted by the same reference numerals, and description thereof is omitted.

As described above, the moving lens frame is moved into and out of the existing fluid channel without disposing wires, coils, and the like in the distal end portion as the moving means for moving the moving lens frame provided in the endoscope. By inserting a focusing member to generate a magnetic field,
The movable lens frame can be moved freely. This eliminates the necessity of disposing a wire, a coil, or the like, which is the advancing / retreating means, in the distal end component, and makes the distal end of the endoscope smaller in diameter. Also, since there is no need to provide a mechanism for moving the wire back and forth in the operation unit, the structure of the operation unit is simplified,
By providing an endoscope having a small and lightweight focus mechanism and zoom mechanism, more accurate and reliable inspection / observation becomes possible.

Further, since the focusing member and the focusing tube are formed by hollow pipe-shaped members, the function of the suction line is impaired even when the focusing member and the focusing tube are inserted into the suction line. Nothing.

Further, by providing a plurality of openings in the focusing tube, it is possible to sufficiently secure the flexibility of the focusing tube. The operability of the endoscope is not impaired even in the state in which the endoscope is present.

By the way, the sheath covering the bundle of electric cables extending from the imaging unit provided in the distal end portion of the endoscope is generally fixed to the imaging unit with an adhesive. However, if the adhesive is peeled and the sheath becomes free with respect to the imaging unit, the electric cable may move and be disconnected every time the endoscope is operated.

For this reason, it has been desired to securely fix the sheath covering the bundle of electric cables so as to eliminate disconnection of the electric cables.

As shown in FIG. 4, an electric cable 41 extending from the image pickup unit 40 of the present embodiment includes a signal cable bundle 42 in which signal cables 42a are bundled together, and covers the signal cable bundle. A protection tape 43;
The protective tape 43 includes a shield member 44 covering the outer periphery of the protective tape 43 and a sheath 45 covering the outer periphery of the shield member 44. A protective tube 46 is selectively attached near the curved portion of the endoscope end portion. ing.

External lead 1 protruding from SID 12
The board 13 is connected to 3b, and the signal cable 42a is wired to the board 13. A locking claw 47a, which has a sharp tip and protrudes in the central axis direction and is oriented in the SID12 direction, is provided on the cable stopper member 47 constituting the hand side of the imaging unit 40. The locking claws 47a protruding in the direction of the central axis and in the direction of the SID 12 bite into the protective tube 46 of the electric cable 41, and position and fix the electric cable 41 at a predetermined position.

When the protective tube 46 moves in the direction of the objective lens 55, the locking claw 47a moves outward and smoothly passes through the protective tube 46. It is configured to be stretched when moving in the direction in which it is pulled out. In the present embodiment, the same members as those in the above embodiment are denoted by the same reference numerals, and description thereof is omitted.

As described above, the protection tube or the sheath covering the outermost periphery of the electric tube is fixed by biting the locking claw provided on the cable stopper so that the protection tube or the sheath does not recede and the signal cable or the sheath is not retreated. Breakage of the shield member can be prevented, and the durability of the imaging unit can be significantly improved.

Further, when the electric tube is fixed to the cable fixing member, the electric tube can be easily moved simply by changing the moving direction of the electric cable, which has been moved in the direction of the board, toward the hand side, so that the assembling workability is improved.

By the way, in the imaging unit in which the SID is arranged on the same plane as the substrate, pads for connecting the SID and the substrate are provided on the front end side and the hand side in the longitudinal axis direction. There was a problem that would be long. Further, since the SID and the bad portion are connected by a bonding wire, a gap for arranging the bonding wire must be provided between the objective optical system unit and the substrate.

For this reason, there has been a demand for an endoscope in which the length of the substrate in the longitudinal direction is reduced, the length of the distal end hard portion is reduced, and the diameter is reduced.

As shown in FIG. 5, the image pickup unit 50 of the present embodiment has a capacitor 52 and an IC 53 mounted on a bendable flexible board 51. The electric cable 54 is connected to a land (not shown) of the flexible board 51. The signal cable 54a is connected.

The SID chip 55 of the present embodiment is of an insertion type, and is fixed to a prism 57 via a cover glass 56.

The SID chip 55 is connected to the bumps 59 by connecting the leads 51 a protruding from the substrate 51 toward the objective optical unit 58.
And the flexible substrate 51 are electrically connected. That is, all the connection portions of the SID chip 55 are provided on the imaging unit side.

As described above, since the connection portions between the SID chip and the flexible substrate are provided at the front end of the substrate, the connection portion provided on the near side of the substrate becomes unnecessary, and the rigid length of the imaging unit is shortened. Thus, the endoscope can be downsized.

Further, since no other structure is arranged on the tip side of the SID, effective wiring can be performed.

Incidentally, as shown in FIG.
The flexible substrate 51 of FIG. 5A is divided into two connection pieces 51b and 51c on the tip side of the SID chip 55, and these connection pieces 51b and 51c are connected to pumps 59 provided on both sides of the objective lens unit 58. The SID chip 55
And the flexible substrate 51 may be electrically connected.
As a result, the wiring can be selectively performed by effectively utilizing the empty space on the tip side of the SID chip. As a result, the wiring space can be provided in the empty space, so that the endoscope can be downsized.

Further, as shown in FIG.
By setting the empty space on the side surface of the prism 57b as a wiring portion for passing the conducting wire 61, the same operation and effect as those of the imaging unit in FIG. 6 can be obtained. Further, since the inclined surface of the prism 57 is used as the connection portion 62, a space for wiring can be widened, so that assemblability is improved.
Further, since the SID chip 55 and the substrate 63 are not directly connected, the heat generated in the substrate 63 is less likely to be transmitted to the SID chip 55, thereby preventing the temperature of the SID chip 55 from rising and improving the S / N. be able to.

When cleaning the inside of the fluid conduit provided in the endoscope, a channel cleaning brush is used. Conventionally, in the channel cleaning brush 70, as shown in FIG. 8 (a), a brush part 71 on the tip side, a coil sheath 72, and the coil sheath 72 and a reinforcing wire 73 in the coil sheath are fixed by solders 74a and 74b. For this reason, during ultrasonic cleaning or autoclave, the solder 7
4a and 74b come off, the brush part 71 falls off from the coil sheath 72, or the reinforcing wire 7 from the coil sheath 72.
3 sometimes dropped out. Therefore, a channel cleaning brush that can withstand ultrasonic cleaning and autoclave has been desired.

Accordingly, the brush part 71 and the coil sheath 7 on the tip side of the channel cleaning brush 70 shown in FIG.
2 and a solder portion 74b for fixing the coil sheath 72 and the reinforcing wire 73 in the coil sheath 72 by high-temperature solder. As a result, the resistance of the solder portion is improved, and the solder does not fall off during ultrasonic cleaning or autoclave.

As shown in FIG. 8B, in the present embodiment, the brush wire 7
1a is extended to the coil sheath 72 near the ring portion 75 on the hand side, and solder portions 74a and 74b are provided and fixed. This makes it possible to provide a channel cleaning brush in which the brush portion does not fall off.

It should be noted that the present invention is not limited to only the above-described embodiments, and various modifications can be made without departing from the spirit of the invention.

[Appendix] According to the above-described embodiment of the present invention as described in detail above, the following configuration can be obtained.

(1) A plurality of endoscopes having different types of solid-state imaging devices disposed at the distal end of the endoscope insertion portion, and a peripheral device to which the plurality of endoscopes are selectively connected are provided. In the endoscope apparatus, the solid-state imaging device is provided with endoscope identification means having a write-once type memory unit capable of additionally writing data, and the peripheral device writes data into the write-once type memory unit and writes the data into the write-once type memory unit. An endoscope apparatus provided with a detection unit having a data writing / reading circuit for reading information written in a memory unit.

(2) The endoscope apparatus according to appendix 1, wherein information of the endoscope identification means detected by the detection means provided in the peripheral device is output to an external device such as a video processor, a light source device, and a monitor.

(3) The write-once type memory section is arranged around an image pickup area in order to balance with a place where other functional sections such as an optical black section and a shift register section are arranged. 3. The endoscope apparatus according to claim 1, wherein the endoscope apparatus is disposed at a central portion of the endoscope.

(4) An objective optical unit provided with an optical axis parallel to the longitudinal axis direction of the endoscope insertion section, an optical element for deflecting a light beam emitted from the objective optical unit in a right angle direction, and A solid-state imaging device having a light-receiving surface parallel to the longitudinal axis direction of the distal end portion facing the device,
An endoscope in which the solid-state imaging device is arranged on the same plane as a substrate, wherein a connecting portion between the solid-state imaging device and the substrate is provided on an objective optical unit side of the substrate.

[0071]

As described above, according to the present invention, it is possible to identify a plurality of types of endoscopes without increasing the size of the endoscope, and to easily cope with a change in the characteristics of each endoscope. An endoscope device can be provided.

[Brief description of the drawings]

FIGS. 1 and 2 relate to an embodiment of the present invention, and FIG. 1 is an explanatory view showing a schematic configuration of an endoscope apparatus.

FIG. 2 is an explanatory diagram illustrating a configuration of a solid-state imaging device.

FIG. 3 is a diagram showing an endoscope having a drive mechanism that can change a focus and a magnification by driving a part of an objective lens;

FIG. 4 is an explanatory view showing an imaging unit in which a sheath covering an electric cable bundle is securely fixed.

FIG. 5 is an explanatory diagram showing a configuration of an imaging unit for shortening the length of a hard tip portion.

FIG. 6 is an explanatory view showing another configuration of the imaging unit for shortening the length of the hard end portion.

FIG. 7 is an explanatory diagram showing another configuration of the imaging unit for shortening the length of the hard end portion.

FIG. 8 is an explanatory diagram showing a configuration of a channel cleaning brush.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 ... Endoscope detector 12 ... SID (solid-state image sensor) 14 ... SID chip 14d ... Write-once type memory part

Claims (1)

[Claims] 1. An endoscope apparatus comprising: a plurality of endoscopes each including a solid-state imaging device at a distal end of an insertion portion; and a peripheral device to which the plurality of endoscopes are selectively connected. An endoscope identification unit having a write-once memory unit on which data can be additionally written is provided on the image sensor, and the peripheral device writes data to the write-once memory unit and information written in the write-once memory unit. An endoscope apparatus provided with a detection unit having a data writing / reading circuit for reading data.