JPH1032384A - Method and apparatus for removing surface mounted device with fin - Google Patents

Abstract

PROBLEM TO BE SOLVED: To remove a surface mounted device with heat dissipation fins easily in safety by preheating the fins at the time of removing the device from a printed board thereby suppressing dissipation of heat from the hot air being blown to a soldered part to the fin side. SOLUTION: A nozzle 4 for jetting hot air toward the upper side of a surface mounted device 2 with heat dissipation fins is provided with a heat block 5 incorporating a coil for preheating the heat dissipation fins and the surface mounted device 2 is heated while holding the side face of the heat dissipation fins 3 by means of the heat block 5. Subsequently, hot air is blown to a part for soldering a lead in order to fuse the solder and the nozzle 4 is elevated in the direction of Z axis while holding the heat dissipating fins 3 by a heat block 5 and the surface mounted device 2 with heat dissipation fins is removed from a printed board 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for removing a surface mount component to which a radiating fin is joined from a printed circuit board, and more particularly to a heat source for preheating the radiating fin and a solder joint between the component and the heat source. The present invention relates to a method and an apparatus for removing a surface mount component having a heat radiation fin provided with a plurality of heat sources to be applied and a means for applying heat.

[0002]

2. Description of the Related Art In recent years, components mounted on printed circuit boards have been highly integrated and ultra-high speed, and the resulting heat generation of components has caused abnormal operation of electronic circuit components. It is an issue. As a countermeasure, there are two methods: installing a fan unit in the device and forcibly blowing cooled air into the device to lower the temperature of the device, or attaching large heat-radiating fins to the heat-generating components and cooling naturally. is there. When the latter method is employed, when a component is replaced (repaired) due to a design change or the like, in a conventional repair device, the radiating fin becomes an obstacle and blows hot air to a lead joint of the surface mount component. The nozzle cannot be approached. Even if hot air can be blown by adjusting the shape of the nozzle to the radiating fin, the heat of the hot air alone escapes from the lead to the radiating fin side through the electronic components, and the solder melts. However, if the component is removed by increasing the temperature of the heat source or prolonging the time for blowing hot air, the printed circuit board may be damaged.

Japanese Patent Application Laid-Open Nos. Hei 6-244548, Hei 7-245475, Hei 7-245 disclose devices relating to this type of surface mount component removing apparatus.
No. 476, and the like.

[0004]

The conventional method for removing a surface mount component is not intended for a component whose temperature itself is too high, so that there is no need to attach a radiation fin to an electronic component, and the package is not required. The material of the die is also a plastic mold, and the heat of the hot air blown to the lead hardly escapes to the electronic component side, and the surface-mounted component can be removed from the printed circuit board at a relatively low temperature. On the other hand, components that generate a large amount of heat and require heat dissipation have a ceramic material and a built-in metal member (copper plate) for obtaining a heat dissipation effect.
The heat radiation fins are bonded with an adhesive having excellent heat conductivity, so that the heat radiation is very good. In the conventional method for removing surface mount components, the heat applied to the lead joint is Then, the heat is easily transmitted to the radiating fins through the electronic components, and the heat is easily dissipated, so that the melting temperature of the solder must be increased more than necessary and the heating time must be prolonged. This problem has been particularly noticeable due to the high integration and high speed of electronic circuit components accompanying the enormous transmission capacity and high speed of products.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned conventional problems, and to provide a method and an apparatus for removing a surface-mounted component with heat-radiating fins that can safely and easily remove the surface-mounted component from a printed circuit board. Is to do.

It is another object of the present invention to provide a detaching method and apparatus which can flexibly respond to the size and shape of a surface mounting component having a heat radiation fin.

[0007]

SUMMARY OF THE INVENTION The above object is achieved by providing a package portion and a lead joint portion, wherein a radiation fin is attached to the package portion.
There are methods using a metal-based adhesive such as a silicone-based adhesive, an epoxy-based adhesive, and solder. A) a device for removing a surface-mounted component from a printed circuit board to which the lead joint of the surface-mounted component is fixed by soldering, the device comprising: A heating chamber that covers at least the radiating fin (more preferably, is covered with a heat insulating material or the like and is kept warm); and a heating unit that heats the radiating fin in a state where the radiating fin is covered by the heating chamber. A nozzle unit that is close to the lead joint in a state where the radiation fins are covered with the heating chamber and blows heated air to the lead joint to melt the solder; and the solder in the lead joint. Removing means for removing the surface-mounted component from the printed circuit board after melting of the surface-mounted component. It is achieved by article removal devices. In a preferred embodiment, at least a part of the heating chamber is formed of a member that forms a heating air supply path having the nozzle portion disposed at a tip. More desirably, the heating means is attached to a member constituting the heating chamber, sandwiches the radiation fins, and heats while the radiation fins are clamped. A first heat source for supplying heat to a heating unit for heating the radiating fins, a second heat source for heating air for melting the solder, the first heat source and the second heat source, And a controller for setting a required heating temperature in accordance with the respective heat capacities.

[0008] Further, the object is to remove a surface mount component having a package portion and a lead joint portion and having a radiation fin attached to the package portion from a printed circuit board to which the lead joint portion of the surface mount component is fixed by soldering. A device for removing a surface-mounted component for covering at least the radiation fin of the surface-mounted component soldered and fixed on the printed circuit board, and heating the radiation fin in a state where the radiation fin is covered and covered. After the radiating fins reach a predetermined temperature, the fins are heated by blowing heated air to the lead joints, and after the solder is melted at the lead joints, the surface mount components are detached from the printed circuit board. This is achieved by a method of removing a surface mount component. In a preferred embodiment, the heating of the lead joint is performed after a lapse of a predetermined time to reach a predetermined temperature.

Further, the above object is to remove a surface mount component having a package portion and a lead joint portion, and a radiation fin attached to the package portion, from a printed circuit board to which the lead joint portion of the surface mount component is fixed by soldering. A heating chamber for covering at least the radiating fins of the surface-mounted component soldered on the printed circuit board, and a retractable arm attached to the tip of the heating chamber. And a heating means attached to a member that constitutes the heating chamber, sandwiching the radiating fin, and heating while holding the radiating fin, and the heating chamber covers the radiating fin. A nozzle portion that is close to the lead joint portion and blows heated air to the lead joint portion to melt the solder. The device for removing a surface-mounted component with a heat-dissipating fin, wherein the heating unit performs heating while holding the heat-dissipating fins, and serves as a holding unit for the surface-mounted component when the printed circuit board is removed by the reciprocation of the arm. Is achieved by

[0010] It is another object of the present invention to remove a surface mount component provided with a package portion and a lead joint portion and having a radiation fin attached to the package portion from a printed circuit board to which the lead joint portion of the surface mount component is soldered. A heating unit in which a number of nozzles for heating the radiating fins or the lead portions are arranged in a lattice-like position above the surface mounting component, the heating unit comprising: A part of the nozzle part selected according to the shape of the heat radiation fin performs preheating in proximity to the heat radiation fin, and a part of the nozzle part selected according to the surface mount component has the lead joint. This is achieved by an apparatus for removing a surface-mounted component with a radiating fin, wherein heating for melting the solder is performed in proximity to the portion.

[0011] Further, the object is to remove a surface mount component having a package portion and a lead joint portion and having a radiation fin attached to the package portion from a printed circuit board to which the lead joint portion of the surface mount component is soldered. For removing the surface-mounted component for the purpose of the present invention, a step may be provided on the bottom surface of the heat-dissipation fin by shaving the gap between the heat-dissipation fin and the surface-mounted component (the lower peripheral portion of the heat-dissipation fin is shaved. ), A wedge-shaped block is inserted, the wedge-shaped block is pushed down in a leverage manner, and the heat-dissipating fin is detached from the surface-mounted component.

It is another object of the present invention to provide a surface mount component having a package portion and a lead joint portion, wherein a radiation fin is bonded and fixed to the package portion, from a printed circuit board to which the lead joint portion of the surface mount component is soldered. A device for removing a surface mount component for removal, wherein a heated coil is inserted into a layer of adhesive between the surface mount component and the heat radiation fin, and the adhesive dissolves to release the heat radiation fin from the surface mount component. This is achieved by a method of removing a surface mount component with a heat radiation fin.

[0013]

Embodiments of the present invention will be specifically described below with reference to the drawings.

FIG. 1 is a view showing a device for removing an electronic component with heat radiation fins, and shows a state in which a printed circuit board 1 on which a surface mounting component 2 having a heat radiation fin 3 is mounted is mounted on a repair device. The nozzle 4 for blowing hot air to the soldering part lead 2a of the surface mount component 2 has a structure surrounding the surface mount component 2 so that the heat of the heated surface mount component 2 is difficult to escape. Further, in the component removal in FIG. 1, in order to prevent the heat of the surface mount component 2 heated by the hot air from escaping to the radiating fins 3, the radiating fins 3 have a temperature close to the melting point of the solder in advance. Thus, for example, a pre-heating is performed by a heat block 5 set at 280 to 300 ° C. The heat block 5 is controlled by the width adjusting mechanism 5a.
It is a mechanism that can move in the direction of sandwiching the radiation fins 3 and has a structure in which the radiation fins 3 are heated while being suppressed from the side. This heat block 5 is a surface mounting component 2.
Since it also has a function of holding components at the time of removal, the structure eliminates the need for a mechanism for adsorbing the radiation fins 3 by air. Further, by applying heat to the heat radiation fins 3 in advance by the heat block 5, the leads 2a of the surface mount component 2 can be formed.
In addition, since the amount of heat applied to the printed circuit board 1 can be minimized, damage to the printed circuit board 1 after removing the surface-mounted components 2 can be reduced, and occurrence of defects such as mezing can be suppressed. Furthermore, since the preliminary heating by direct heating is performed using the heat block 5, the radiation fins can be reliably heated, and the printed board 1 and other surface-mounted components are hardly affected by the heat at the time of the preliminary heating. Become.

FIG. 2 shows another embodiment of the present invention, in which hot air is blown onto the radiating fins 3 to preheat them instead of heating the radiating fins 3 by the heat block 5 shown in FIG. It is a method. The component removal method shown in FIG. 2 is performed by using a nozzle 4 for blowing heated hot air.
However, the structure surrounding the surface-mounted component 2 is hard to escape the heated surface-mounted component 2. In order to prevent the heat of the surface-mounted component 2 heated by the hot air from escaping to the radiating fins 3 side, the radiating fins 3 should be brought to a temperature close to the melting point of the solder in advance.
For example, hot air heated by a heat source set at 280 to 300 ° C. is blown out from the air outlet 4 a of the nozzle 4 to preheat the radiating fins 3.
The air outlets for heating the radiating fins 3 and the air outlets for heating the lead 2a of the surface mount component 2 are provided with pipes 6a and 6b, respectively, for providing a time difference in the timing of blowing out the air. It has an independent structure. By arranging this independent pipe 6, preheating is first applied to the radiation fin 3 side, and it is determined that the radiation fin 3 has reached the set temperature by a temperature sensor, a timer, or the like.
After a time lag, the lead portion 2 of the surface mount component 2
Then, the nozzle 7 for adsorbing the radiation fins 3 is lowered to the upper surface of the radiation fin 3 when the solder joint is melted, and the upper surface is adsorbed to remove the component. According to this, since the amount of heat applied to the printed circuit board 1 can be minimized, damage to the printed circuit board 1 after removing the surface mount components 2 can be reduced.
Further, by providing the shielding plate 8 on the side surface of the nozzle 4b, it is possible to reduce the damage to the surrounding components and prevent the components from being broken.

FIG. 3 is a view showing a multi-nozzle type repair apparatus as an example showing another embodiment of the present invention, and is attached to the repair apparatus to remove the surface mount component 2 mounted on the printed circuit board 1. Indicates the status. The multi-nozzle 4 has a structure in which each nozzle moves up and down according to the outer shape of the surface-mounted component 2. By registering the outer shape of the component in advance in the control terminal of the repair device, the multi-nozzle 4 The structure is such that the nozzle selected according to the shape automatically descends near the radiating fin 3 and the lead portion 2a of the surface mount component 2. Further, the nozzle 4 has a structure in which hot air can be ejected only from the nozzle selected by an instruction from the control terminal.

When the surface mount component 2 is detached, the lead 2 a where the surface mount component 2 is soldered to the printed circuit board 1 and the heat radiation fin 3 are directly above the surface mount component 2 based on the component shape data of the target surface mount component 2. Is automatically selected, and after descending to an appropriate position, hot air is blown out to melt the solder joint of the lead 2a.
The surface mounting component 2 can be removed by the suction nozzle 7 lowered to the component height of the radiation fin 3.

FIG. 4 is a view showing a state in which the heat radiation fins 3 are removed from the surface mount component 2 on the printed circuit board 1 on which the surface mount components 2 having the heat radiation fins 3 are mounted. The surface mount component fixing block 9 shown in FIG. 4 holds and fixes the outer periphery of the component by sandwiching the surface mount component 2. Further, the fin fixing block 10 has a structure in which the outer periphery of the fin is held and fixed by sandwiching the radiation fin 3. From this state, while holding the surface mounting component 2 by the surface mounting component fixing block 9, the surface mounting component fixing block 9 is rotated in the circumferential direction, and the adhesive 11 fixing the radiation fins 3 to the surface mounting component 2 is applied. The structure is such that the heat radiation fins 3 are removed from the surface mount component 2 by applying a shearing stress.

FIG. 5 is a view showing a state in which the heat radiation fins 3 are removed from the surface mount component 2 as in FIG. The radiating fin 3 is provided with a step at a portion where the radiating fin 3 is attached. A fin removal fixing block 12 for fixing is set on one of the steps of the heat radiation fin 3, and a wedge-shaped fin removal block 13 is set on the other of the steps. By operating the fin removal fixing block 12 and the fin removal block 13 set on the radiation fin 3 in the direction of the arrow, the fin removal block 13 lifts the radiation fin 3 by the principle of leverage.
The structure is such that the heat radiation fins 3 are removed from the surface mount component 2 by peeling the adhesive 11. After the radiation fins 3 are removed, the surface mount component 2 is removed using a conventional repair device. According to the removal method shown in FIGS. 4 and 5, the lead portion 2 of the printed circuit board 1 and the surface mount component 2 is provided.
Since the component can be removed without applying a mechanical load to “a”, the removed surface mount component 2 can be reused.

FIG. 6 shows a method of removing the heat-generating coil 14 by bringing the heat-generating coil 14 into contact with the adhesive 11 applied between the radiation fin 3 and the surface mount component 2 and heating and melting the adhesive. It is. The adhesive 11 used for fixing the heat radiation fins 3 to the surface mount component 2 is made of a silicone or epoxy-based material. The melting temperature differs depending on the respective materials. 14 is heated to about 300 ° C. and then melted when brought into contact.
This is a method in which while dissolving the adhesive 4 in contact with the adhesive 11, it is moved in the direction of the arrow and removed. Also, FIG. 7 shows that when the adhesive 11 is a metallic substance such as solder, even if the exothermic coil 14 is brought into contact, if the temperature drops below the solder solidification temperature (185 ° C.), there is a concern that the adhesive 11 solidifies again and cannot be removed. Because
FIG. 6 is a diagram showing a method of separating and removing the heat radiation fins 3 from the surface mount component 2 while absorbing the adhesive 11 by any method.

As a method of sucking the adhesive 11, a solder wick 15 is disposed at the tail of the heat generating coil 14,
Immediately after the adhesive 11 is melted in contact with the heat generating coil 14, the solder wick 15 is rotated at a low speed and is advanced in the direction of the arrow to remove the adhesive 11 while absorbing it. This method has an advantage that it can be used as an extremely effective means in repairing a BGA soldered on a printed circuit board, in addition to the purpose of removing the radiation fins 2.

FIG. 8 is an overall perspective view of an apparatus for applying preheating by the heat block 5 shown in FIG. 1 of the present invention and for removing the surface mounting component with the radiation fins. This apparatus for removing a surface-mounted component performs a setup change operation of the nozzle 4 every time the external dimensions of the target component change. This is because the tip of the nozzle 4 is positioned near the lead 2a in accordance with the number of leads of the surface mount component 2 and the external size of the radiating fin 3, and the heat block 5 is connected to the radiating fin 3. This is because it is necessary to match the external size.

After the above-described setup operation, the target printed circuit board is set on the table 16 of the apparatus, and the XYZ axis adjustment switch 17 is operated to operate the X axis operation section 18 and the Y axis operation section. 19 is operated to align the center of the nozzle 4 with the center of the surface mount component 2. Thereafter, the Z axis is operated to lower the tip of the nozzle 4 to a predetermined position on the lead 2a, and the positioning of the nozzle 4 is completed. Next, the heat block 5 is turned by turning the position adjusting screw 5a to move the heat block 5 to a position where the side surface of the heat radiation fin 3 is sandwiched. 5 and the heat source controller 21 as the coil
N and heat. This temperature set value is 280-300 ° C
Then, the heat radiation fins 3 are pre-heated until the heat block 5 reaches 200 ° C. or higher. Further, the Z-axis driving unit 2 of the nozzle 4
0 is connected to a pipe 22 for supplying air.
This air is heated to a high temperature through a coil built in the Z-axis drive unit 20, and is blown toward the lead 2a to melt the solder joint. Next, the XYZ axis adjustment switch 1
By operating the nozzle 7 to raise the nozzle 4 in the Z-axis direction, the radiation fin 3 can be removed from the surface mount component 2.

[0024]

According to the present invention, it is possible to prevent the heat applied to the lead portion from escaping to the radiating fin side, and it is possible to safely and easily remove the surface mounting component with the radiating fin from the printed circuit board. Further, it is possible to provide good quality without damaging the printed circuit board without applying excessive heat to the printed circuit board or exposing the printed circuit board to a high temperature for a long time. In addition, since the heat radiation fin is preheated in a state of surrounding the heat radiation fin, heat can be efficiently transmitted. In addition, the structure of the device can be simplified by integrating the heat radiation fin heating means and the component holding means when the mounted component is removed. Also,
Removal can be performed flexibly according to the size and shape of the surface mount component with the radiation fin.

[0025]

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a main part configuration of a device for removing a surface-mounted component with a heat radiation fin according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a main part of a device for removing a surface-mounted component with a radiation fin according to another embodiment of the present invention.

FIG. 3 is a cross-sectional view of a main part of a device for removing a surface-mounted component with a heat radiation fin according to another embodiment of the present invention.

FIG. 4 is a sectional view of a main part showing a method of removing a heat radiation fin from a surface mount component according to another embodiment of the present invention.

FIG. 5 is a sectional view of a main part showing a method of removing a heat radiation fin from a surface mount component according to another embodiment of the present invention.

FIG. 6 is a perspective view of a main part showing a method of removing a heat radiation fin from a surface mount component according to another embodiment of the present invention.

FIG. 7 is a perspective view of a main part configuration showing a method of removing a component in which a heat radiation fin and a surface mount component are bonded with a metal material in another embodiment of the present invention.

8 is an overall perspective view of the apparatus of the embodiment shown in FIG. 1 of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Printed circuit board, 2 ... Surface mounting components, 3 ... Radiation fins, 4 ... Nozzle, 5 ... Heat block, 6 ... Air piping, 7 ... Suction nozzle, 8 ... Shielding plate, 9 ... Surface mounting component fixing block, 10: Fin fixing block, 11: Adhesive, 12: Fin removing and fixing block, 13: Fin removing block, 14: Heat generating coil, 15: Solder wick, 16: Table, 17: XYZ Axis adjustment switch, 18: X-axis operating unit, 19: Y-axis operating unit, 20
... Z-axis operation part, 21 ... Heat source controller, 22 ... Air
pipe

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yoshiko Mutoh 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside the Hitachi, Ltd.Information and Communications Division (72) Kenji Saito, Inventor 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Hitachi, Ltd.Information and Communications Division (72) Inventor Hideki Ono 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture

Claims (10)

[Claims] 1. A surface for removing a surface mount component having a package portion and a lead joint portion and having a radiation fin attached to the package portion, from a printed circuit board to which the lead joint portion of the surface mount component is fixed by soldering. A mounting component removing device, wherein the heating chamber covers at least the radiation fins of the surface mounted component soldered on the printed circuit board, and the radiation fins are covered by the heating chamber. Heating means for heating the heat-dissipating fins, the heating chamber, a nozzle portion which is close to the lead joint in a state where the radiation fins are covered, and blows heated air to the lead joint for melting the solder; and Removing means for removing the surface-mounted component from the printed circuit board after the solder is melted at the joint. A device for removing a surface mount component having a heat radiation fin. 2. The surface mounting component according to claim 1, wherein at least a part of the heating chamber is formed of a member forming a heating air supply path having the nozzle portion disposed at a tip. Removal device. 3. The heat radiating device according to claim 1, wherein the heating means is attached to a member constituting the heating chamber, holds the heat radiating fins, and heats while holding the heat radiating fins. Removal device for finned surface mount components. 4. A first heat source for supplying heat to heating means for heating the radiating fins, a second heat source for heating air for melting the solder, the first heat source and the second heat source. 2. The apparatus for removing a surface part with radiating fins according to claim 1, further comprising a controller for setting a required heating temperature in accordance with a heat capacity of each of said heat sources. 5. A surface for removing a surface mount component having a package portion and a lead joint portion and having a radiation fin attached to the package portion, from a printed circuit board to which the lead joint portion of the surface mount component is fixed by soldering. A device for removing a mounted component, wherein at least the radiating fin of the surface mounted component soldered on the printed circuit board is covered, and the radiating fin is heated in a state where the radiating fin is covered. After the fins reach a predetermined temperature, the heated air is blown onto the lead joints and heated, and after the solder is melted at the lead joints, the surface mount components with the heat dissipating fins are removed from the printed circuit board. How to remove. 6. The method according to claim 5, wherein the heating of the lead joint is performed after a lapse of a predetermined time to reach a predetermined temperature. 7. A surface for removing a surface mount component having a package portion and a lead joint portion and having a radiation fin attached to the package portion from a printed circuit board to which the lead joint portion of the surface mount component is fixed by soldering. A mounting component removal device, a heating chamber for covering at least the radiating fins of the surface mounting component solder-fixed on the printed circuit board, and a retractable arm portion having the heating chamber attached to a distal end thereof, A heating unit attached to a member constituting the heating chamber, the heating means for sandwiching the radiation fin, and heating the radiation fin while being sandwiched, and the lead joint portion covering the radiation fin in the heating chamber. And a nozzle for blowing air heated to melt the solder to the lead joint, wherein the heating means Serial radiating fins subjected to heat in a sandwich state, said arm portions reciprocating said surface mount component of the retaining means and made possible removal device of the heat radiating fin with a surface mount component, wherein upon removal of the printed circuit board according to the. 8. A surface for removing a surface-mounted component having a package portion and a lead joint portion and having a radiation fin attached to the package portion from a printed circuit board to which the lead joint portion of the surface-mounted component is fixed by soldering. An apparatus for removing a mounted component, comprising heating means in which a plurality of nozzles for heating the radiating fins or the lead portions are arranged in a grid-like position above the surface mounted component, wherein the heating means is a radiating fin. A portion of the nozzle portion selected according to the shape of the nozzle is close to the radiation fin and performs preheating, and a portion of the nozzle portion selected according to the surface mount component is close to the lead joint. A device for removing a surface mount component with a heat radiating fin, wherein the device is heated to melt the solder. 9. A surface for removing a surface mount component having a package portion and a lead joint portion and having a radiation fin attached to the package portion, from a printed circuit board to which the lead joint portion of the surface mount component is fixed by soldering. A device for removing a mounted component, wherein a wedge-shaped block is inserted into a gap between the radiating fin and the surface-mounted component, the wedge-shaped block is pushed down in a leverage manner, and the radiating fin is removed from the surface-mounted component. How to remove surface mount components with radiation fins. 10. A package comprising a package part and a lead joint part,
A surface mount component removal device for removing a surface mount component having a radiation fin bonded and fixed to the package portion from a printed circuit board to which the lead joint of the surface mount component is fixed by soldering, wherein the surface mount component is A method for removing a surface-mounted component with a heat-dissipating fin, wherein a heated coil is inserted into a layer of adhesive between the heat-dissipating fin and the heat-dissipating fin, and the adhesive is dissolved to remove the heat-dissipating fin from the surface-mounted component.