JPH10302924A - Connector for electronic element and electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce manufacturing cost for an expansion pitch electrode and simplify a correlation between an electrode and the expansion pitch electrode by simplifying a connection structure between the electrode and the expansion pitch electrode. SOLUTION: A connector 1 connected to an electric element 2 in which an electrode is arrayed and formed on one main face side is provided with a plurality of lead pins 11 provided with their maintained insulation and a frame body 12 for supporting the lead pins 11. Each lead pin 11 is provided with a first end 11a at a same pitch p0 as an electrode of an electric element 2 on one plane, and the pitch is gradually expanded toward a second end 11b from the first end 11a. The frame body 12 supports these lead pins 11 with the first end 11a and the second end 11b of each lead pin 11 being exposed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connector for an electronic element and an electronic component, and more particularly to a connector for an electronic element used for converting a pitch of electrodes arranged on one main surface of an electronic element into an extended pitch. And an electronic component using the same.

[0002]

2. Description of the Related Art As electronic components become more highly integrated, more and more electrodes are provided at higher density in electronic devices such as IC chips. When mounting or checking the function of such an electronic element, it is necessary to convert the pitch of the electrodes into an expanded pitch using a circuit board.
The circuit board includes, for example, electrode pads arranged and formed on the substrate surface at the same pitch as the electrodes arranged on the electronic element, a wiring pattern drawn out from the electrode pads on all sides on the substrate surface, and a wiring pattern of the wiring pattern. And an extended pitch electrode provided at the tip. The circuit board also has a multilayer structure.

[0003]

However, in the case where the above-mentioned circuit board is used for mounting or checking the function of an electronic element in which electrodes are arranged in lattice points, the density of the electrodes is increased and the pitch between the electrodes is increased. Becomes narrower, it becomes more difficult to draw a wiring pattern from each electrode pad to the periphery of these electrode pads. For this reason, the design of the wiring pattern on the substrate surface (including the inside in the case of a multilayer substrate) becomes complicated, and the manufacturing cost of the circuit board including the design cost increases.

In addition, since the wiring pattern drawn from the electrode pad is routed between the electrode pads, the line width must be made thinner than the pitch between the electrode pads. For this reason, the frequency response is reduced, and the characteristics of the electronic element itself cannot be accurately extracted from the extended pitch electrode. Further, the extended pitch electrodes pulled out by the wiring pattern are arranged in a different state from the above-mentioned electrodes. This complicates the correlation between the electrodes of the electronic element and the extended pitch electrodes.

[0005]

SUMMARY OF THE INVENTION The present invention is a connector for an electronic element for solving the above-mentioned problems, and comprises a plurality of lead pins provided with insulation properties, and a frame supporting these lead pins. Have. Each of the above lead pins is
One end is provided on one plane at the same pitch as the electrodes arranged on one main surface side of the electronic element, and the pitch is gradually increased from each end to the other end. Further, the frame has a support portion for supporting the lead pins in a state where one end and the other end of each lead pin are exposed. In this electronic device connector, the one end is arranged in a lattice point shape.

One end of each lead pin constituting the electronic device connector is provided on one plane at the same pitch as the electrodes arranged on one main surface of the electronic device. And an electrode pad connected one-to-one. Further, since the pitch of each lead pin is gradually increased from the one end to the other end, even if one end of each lead pin is arranged in a lattice point, regardless of the pitch between these one ends, The other ends of the lead pins are arranged at a larger pitch while ensuring the cross-sectional area of the lead pins at the one end. In addition, the arrangement state of the other end of each lead pin is maintained at the arrangement state of each end.

Further, on the frame on the side where one end of each of the lead pins is provided, a guide portion for holding the electronic element at a position where the one end and each electrode of the electronic element face one to one. May be provided. In such a case, the electrode of the electronic element and one end of the lead pin have a one-to-one correspondence.
Is securely connected.

[0008] Further, an end of one end of each of the lead pins may have elasticity. In this case, even if there is a variation in the distance between each of the above-mentioned one ends and each of the electrodes of the electronic element provided opposite to each of the above-mentioned one ends, one end of the lead pin is pressed against the variation. The height position changes. Therefore, the above variation is absorbed and corrected.

In this case, the support portion of the frame is made of an elastic material that embeds the elastic end portion with one end of each lead pin exposed, whereby the elasticity is protected by the support portion. You. Therefore, it is possible to prevent the end having the elasticity from being bent when one end of the lead pin is pressed.

An electronic component according to the present invention includes the above-described electronic element connector and an electronic element. The above-mentioned electronic element has, on one main surface thereof, electrodes arranged and formed at the same pitch as one end of a lead pin of the electronic element connector. Moreover, this electronic element is characterized in that these electrodes are provided in a state where they face one end of each of the lead pins on a one-to-one basis.

In the electronic component, the electrode of the electronic element and one end of the lead pin are connected one to one. The other ends of the lead pins connected to the electrodes are arranged at a pitch larger than the one end. For this reason, the other end is an electrode in which the pitch of the electrodes of the electronic element is enlarged.

In this electronic component, by providing an elastically deformable anisotropic conductive sheet between the electrode of the electronic element and one end of the lead pin, even if the distance between each electrode and one end of the lead pin varies. Each electrode is connected to one end of the lead pin in a state where this variation is corrected by the conductive sheet.

[0013]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of an electronic device connector and an electronic component according to an embodiment of the present invention. Here, as an example, a connector for connecting an electronic element in which n × n electrodes are arranged in the form of lattice points at the same pitch p ₀ on one principal surface side, and a connector for connecting to another external device, and this connector An embodiment will be described by taking an electronic component using an example as an example.

(First Embodiment) FIG. 1 is a perspective view showing components of an electronic device connector and an electronic component according to a first embodiment, and a part of the electronic device connector 1 is a perspective view. As shown in FIG.
Has a plurality of (n × n) lead pins 11 and a frame 12 that supports these lead pins 11.

The lead pin 11 is made of a highly conductive metal.
One end made of material and located at the upper end in the sectional view
(Hereinafter referred to as a first end) 11a is a pin on one plane.
Pitch ₀And n × n (in the drawing, n = 5 as an example)
Are arranged in the form of lattice points. In addition, each lead pin 11
Is located from the first end 11a to the other end (the lower end in the drawing).
(Hereinafter referred to as the second end) gradually toward 11b.
In a state where the pitch is widened, that is, the expanded pitch is converted
It is provided in a state. And each second end 11b is
The other plane which is substantially parallel to the plane on which the first end 11a is arranged
On the surface, the pitch p₀Larger pitch p₁And nx
It is arranged in n lattice points.

The expansion pitch conversion is performed by, for example, bending a lead pin having a rod shape or a lead frame on which a lead pin is formed, or by correcting the shape of a lead pin made of a flexible lead pin or a cable. Is done. However, the leading end portion of each lead pin 11 on the first end 11a side and the second end 11
The tip portion on the b side is formed so as to be substantially perpendicular to the one plane.

Further, the lead pins 11 are connected from the first end 11a in order to improve electrical contact and continuity between the electronic device 2 connected by the electronic device connector 1 and an external device (not shown). It is preferable to use one having a large cross-sectional area corresponding to the spread of the pitch toward the second end 11b.

Each of the lead pins 11 is configured as an individual unit or a lead frame. When each lead pin 11 is formed as an individual unit, it can be obtained by, for example, hollowing out a substantially pyramid-shaped metal block.

On the other hand, when the lead pins 11 are formed as a lead frame, for example, first, as shown in FIG. 2A, a planar lead frame 50 having n rows of n lead pins 11 is formed. Form. Next, FIG.
As shown in (2), the lead frame 50 is bent in accordance with the enlarged pitch width of each row by bending and straightening. Thereafter, as shown in FIG. 2C, each lead frame 501 from the first row to the n-th row (here, the fifth row) is used.
505 are aligned in parallel. Then, as shown in FIG. 2 (4), the lead frames 501 to 505 are held by the frame body 12 in an aligned state, and the lead pins 11 are cut off to obtain the electronic device connector 1.

Further, as shown in FIG.
Is made of, for example, an insulating resin material, and holds the lead pins 11 in a state where the arrangement of the lead pins 11 is ensured and the leading ends of the first end 11a and the second end 11b of the lead pins 11 are exposed. Is what you do.

The second end 11b of the lead pin 11 is made to protrude from the frame 12 with a length in consideration of the solderability between each lead pin 11 and the external device and the insertion and removal of each lead pin 11 with respect to the external device. However, when considering prevention of bending of the second end 11b, the frame 12
A spacer (not shown) is provided on the periphery of the lower surface of the above, that is, around the second end 11b. This spacer is
It may be formed integrally with the frame 12.

Further, the frame 12 is not limited to one made of an insulating resin material, but may be made of a metal material subjected to an insulation treatment. Furthermore, when each of the lead pins 11 is individually insulated, the frame 12 does not necessarily need to be insulative.

The holding portions of the frame 12 for holding the lead pins 11 are formed by hole patterns or slits into which the respective lead pins 11 are inserted and sandwiched. In addition, the frame 12 may be provided with an uneven pin, a countersink, and the like (not shown) for use in positioning and fixing with another jig (for example, a positioning member described below).

In the electronic device connector 1 described above, the positioning member 13 for the electronic device 2 may be provided on the frame 12 on the side where the first end 11a of each lead pin 11 is provided. The positioning member 13 is provided between the first end 11 a of each lead pin 11 and the electronic element 2.
The electrode (not shown) supports the electronic element 2 at a position where it is provided at a ratio of 1: 1, and is provided, for example, by fitting the lead pin 11 to the frame 12 from the first end 11a side of the lead pin 11. It is configured as a separate body. The positioning member 13 is provided with a hole-shaped guide portion 13a into which the electronic element 2 is fitted while being fitted to the frame 12.

The guide section 13a is not limited to the case where the guide section 13a is provided using the positioning member 13. For example, the guide section 13a is formed integrally with the frame body 12 by molding a resin or metal material constituting the frame body 12. It may be a molded one.

Next, the structure of an electronic component using the electronic device connector 1 will be described with reference to the sectional view of FIG. 3 together with FIG. The electronic component 4 is provided with the electronic element connector 1 (provided with a positioning member 13 as necessary).
And an electronic element 2.

This electronic element 2 is composed of n × n electrodes 21 (omitted in FIG. 1) arranged at the same pitch p ₀ on one principal surface side (lower surface side in the figure) in the form of lattice points. That is, the first end 1 of the lead pin 11 of the electronic element connector 1
The electrode 21 is provided in the same arrangement state as 1a. The electronic element 2 is connected to the first
Each of the electrodes 21 is provided so as to face the end 11a on a one-to-one basis.

If the electronic device connector 1 is provided with the positioning member 13 (or has a frame provided with the guide portion 13a), the electronic device 2 is connected to the guide portion 13a. It is arranged in a state where the surface on which the electrode 21 is formed faces the electronic device connector 1 side.

In the electronic component 4 having the above configuration, the conductive sheet 3 may be provided in a state of being sandwiched between the first end 11a of each lead pin 11 and the electronic element 2 as shown in the figure. The conductive sheet 3 is made of an elastically deformable anisotropic conductive material. As such a material, a rubber contact or a spring probe obtained by dispersing a conductive material in rubber is used. Further, although not shown here, an open / close lid having a mechanism for pressing the electronic element 2 from above in a state where the electronic element 2 is disposed in the guide portion 13a is provided as necessary.

In the electronic device connector 1 described above, the first end 11a of the lead pin 11 is provided on one plane at the same pitch p ₀ as the electrodes 21 arranged on one main surface side of the electronic device 2. Therefore, these first ends 11a become electrode pads that are connected to the electrodes 21 on a one-to-one basis. Then, each lead pin 11 is moved from the first end 11a to the second end 11b.
, The second end 11b is connected to the pitch p ₀ of the electrode 21 of the electronic element 2 because the pitch is gradually increased toward.
The extended pitch electrodes arranged in a wider pitch p _1.

Moreover, the first end 11a of each lead pin 11
Are arranged in the form of lattice points, the lead pins 11 are maintained in the arrangement state from the first end 11a to the second end 11b and do not interchange with each other.
Of the lead pin 11 at the first end 11a.
, The frequency response can be secured. For example, when the pitch p ₀ of the first end 11a is about 0.5 mm, the cross section of the lead pin 11 is 0.25 mm × 0.
It can be set to about 25 mm square or about 0.25 mm in diameter.
Further, since the second end 11b serving as the extended pitch electrode is maintained in the arrangement state of the electrodes 21 of the electronic element 2, the electrodes 21
Is easy to obtain.

Further, by providing the electronic device connector 1 with the guide portion 13a, the electronic device 2 is located at a position where the electrode 21 of the electronic device 2 and the first end 11a of the lead pin 11 are securely connected one to one. 2 can be held.

For this reason, in the electronic component 4 composed of the electronic device connector 1 and the electronic device 2, the pitch p ₀ of the electrodes 21 of the electronic device 2 is equal to the pitch p in the electronic device connector 1.
_It will be expanded to ₁ . Moreover, in the electronic component 4, the electrode 21 of the electronic element 2 and the first end 1 of the lead pin 11 are provided.
1a, the elastically deformable anisotropic conductive sheet 3 is provided between each electrode 21 and the first pin 11 of the lead pin 11.
Even if there is a variation in each interval with the end 11a, each electrode 21 and the first end 11a of the lead pin 11 are connected in a state where the variation is corrected by the conductive sheet 3. The electronic component 4 having the above configuration can be used, for example, as an IC socket. The conductive sheet 3 may be provided in advance on the electronic device connector 1, that is, may be a part of components constituting the electronic device connector.

(Second Embodiment) FIG. 4 is a view showing a configuration of an electronic device connector according to a second embodiment, and FIG.
4 is a top view of the electronic device connector, and FIG.
FIG. 4A is a cross-sectional view taken along the line AA ′ of FIG.
FIG. 14 is a sectional view taken along the line B-B '.

The difference between the electronic device connector 1 'shown in this figure and the electronic device connector (1) of the first embodiment is that the end portion 11c of each lead pin 11' on the first end 11a side, specifically, The vicinity of the center of the leading end portion of the lead pin 11 ', which is substantially perpendicular to the plane on which the first ends 11a are arranged (that is, the end portion 11c), is located at a location having elasticity. Here, for example, the first end 1
1a is perpendicular to a vertical line on which the lead pin 1a is disposed.
It is assumed that the end 11c has elasticity by forming the end 11c of the 1 ′ into a bow shape.
The bending direction is not particularly limited as long as it is substantially the same direction in each lead pin 11 ′ in order to ensure an insulating state between the lead pins 11 ′. Also, lead pin 1
The end 11c of 1 'may be curved in an S shape.

In the frame 12, each lead pin 1
The support portion 12a serving as the support portion 1 'is made of an elastic material (for example, a resin material), and the end portion 11c having the elasticity is supported by the support portion 12a. In this case, if the lead pin 11 'itself is not subjected to insulation processing, an elastic material is used as the elastic material. Further, an electrode of an electronic element (not shown) to be connected to the electronic element connector 1 'and a lead pin 1
In order to facilitate contact with 1 ′, the tip of each lead pin 11 ′ on the first end 11a side protrudes from this support portion 12a. Then, the electrode and the first end 1 of the lead pin 11 ′
1a to improve the contact area with the lead pin 1a.
The 1 ′ first end 11 a is preferably formed by inverting the surface shape of the electrode 21. For example, when the electrode is formed of a spherical bump, the first end 11a is formed in a spherical inner concave shape. When the electrode is formed of a columnar bump, the first end 11a is flat.
Further, the electronic device connector 1 'is provided with the guide portion described in the first embodiment as necessary.

The electronic device connector 1 'having the above-described structure,
An electronic component using the electronic device connector 1 'and an electronic device (not shown) has been described with reference to the electronic device connector (1) described with reference to FIG. 1 and FIG. 3 in the first embodiment. An effect similar to that of the electronic component (4) can be obtained. In this electronic component, the arrangement state of the electronic element with respect to the electronic element connector 1 'is the same as in the first embodiment.

In particular, the electronic device connector 1 '
By making the end 11c on the first end 11a side elastic, the connection state between the electronic element connector 1 'and the electronic element can be secured without using the conductive sheet (3). Therefore, it is not necessary to consider the resistance, heat resistance, life, price, etc. of the conductive sheet (3) used for the electronic component of the first embodiment.

In addition, in the electronic device connector 1 ', since the end portion 11c of the lead pin 11' is supported by the support portion 12a made of an elastic resin material, the elasticity is protected by the support portion 12a. .
This prevents the elastic end 11c from being bent when the first end 11a of the lead pin 11 'is pressed.

In each of the above embodiments, the lead pins are integrally formed. However, these lead pins may be obtained by combining and connecting those formed by dividing into a plurality of portions. .

In each of the above embodiments, the arrangement of the electrodes of the electronic element and the arrangement of the first ends of the lead pins of the connector for the electronic element are in the same lattice point (full matrix). The explanation has been given for an example. However, the present invention is not limited to this. If the first ends of the lead pins of the connector for an electronic element are arranged at the same pitch as the arrangement of the electrodes of the electronic element, the arrangement state of the first end is as follows. A lattice point shape with some points missing may be used. However, when it is necessary to connect all the electrodes of the electronic element to the terminals of the external device, the first end is necessarily disposed at a position facing each electrode on a one-to-one basis.

From the above, the maximum number of arrangements of the electrodes in various electronic devices formed with the same arrangement pitch of the electrodes is grasped, and the maximum arrangement number is the same pitch as the standardized arrangement pitch. By arranging the first ends of the respective lead pins in a matrix of a matrix to form an electronic device connector, the electronic device connector can be generalized.

[0043]

As described above, according to the electronic device connector of the present invention, the other end (second end) of the lead pin connected one-to-one with the electrode arranged on one main surface side of the electronic device. )
By gradually increasing the pitch of the electrodes, it is possible to use the second end as an extended pitch electrode of the electrode while the arrangement state of the electrodes of the electronic element is secured. Therefore,
The following excellent effects can be obtained as compared with an extended pitch electrode obtained by routing a wiring pattern on a substrate. That is, the connection structure between the electrode and the extended pitch electrode is simplified, and the manufacturing cost for obtaining the extended pitch electrode can be reduced. Further, the correlation between the electrode and the extended pitch electrode can be simplified. Further, the connection wiring between the electrode and the extended pitch electrode can be made thicker to improve the frequency response, and the characteristics of the electronic element itself can be accurately extracted from the extended pitch electrode.

According to the electronic component of the present invention, the arrangement pitch of the electrodes of the electronic element is increased by using the connector for the electronic element, so that the pitch of the electrodes is not increased by using the circuit board. The electrodes can be connected to the terminals of the external device.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a first embodiment.

FIG. 2 is a diagram illustrating an example of forming lead pins of an electronic device connector.

FIG. 3 is a cross-sectional view of the electronic component according to the first embodiment.

FIG. 4 is a diagram illustrating a second embodiment.

[Explanation of symbols]

1,1 'Connector for electronic element 2 Electronic element 3
Conductive sheet 4 Electronic component 11, 11 'Lead pin 11a
The first end (one end) 11b second end (other end) 11c ends 12 frame 12a supporting portion 13a guide portion 21 electrode p _0, p ₁ pitch

Claims (7)

[Claims] 1. A connector connected to an electronic element having electrodes arranged and formed on one main surface side, comprising: a plurality of lead pins provided with insulation; and a frame supporting these lead pins. Wherein each of the lead pins has one end provided on one plane at the same pitch as the electrode of the electronic element, and the pitch is gradually increased from each end toward the other end; The electronic device connector according to claim 1, further comprising a support portion that supports the lead pins in a state where one end and the other end of each of the lead pins are exposed. 2. The electronic device connector according to claim 1, wherein one end of each of the lead pins is arranged in a lattice point shape. 3. The connector for an electronic element according to claim 1, wherein the one end and each electrode of the electronic element face each other on the frame on the side where one end of each of the lead pins is provided. A guide portion for holding the electronic element at a position where the electronic element is located. 4. The electronic device connector according to claim 1, wherein one end of each of the lead pins has elasticity. 5. The electronic device connector according to claim 4, wherein the support portion of the frame is made of an elastic material that embeds the elastic end while exposing one end of each of the lead pins. Characteristic connector for electronic devices. 6. A plurality of lead pins, one end of which is provided on one plane, and each of which is provided with a pitch gradually increased from one end to the other end while maintaining an insulating property, and A frame for supporting these lead pins with one end and the other end being exposed; and electrodes arranged at the same pitch as one end of the lead pins. Each electrode is one-to-one with each end of the lead pin. An electronic component, comprising: an electronic element provided so as to be opposed to the electronic component. 7. The electronic component according to claim 6, wherein an elastically deformable anisotropic conductive sheet is provided between the electrode of the electronic element and one end of the lead pin. Electronic components.