JPH10293006A - Rotary sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a soldering failure from being generated due to a distortion caused by heat and to obtain stable output by allowing a buffer part being provided at the lead part of a Hall IC to have a longer dimension than the shortest laying dimension of the lead part. SOLUTION: A connector 10 with a terminal 12 has a tongue-piece-shaped fixing part 14 for mounting a hybrid IC 30 for mounting a waveform-shaping IC 34 and a Hall IC 32 and connects the hybrid IC 30 to the terminal 12. Also, the inside of a case 50 becomes hollow and only one surface is opened and, for example, a fixing part 14 and the hybrid IC 30 are inserted from the opening for fixing. In this case, a lead part between the part of a solder 36 and the sensor part body of the Hall IC 32 is made shorter than the shortest part that is normally laid and this part becomes a buffer part 38 as a U-shaped, freely deformable layout that floats in the air. As a result, even if the Hall IC 32 moves due to, for example, a thermal expansion, a stress on traveling is absorbed by the buffer part 38 and hence cannot be applied to the soldering part directly, thus preventing a solder failure due to the distortion caused by heat.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rotation sensor for detecting the positions of a crank angle and a cam angle used in an internal combustion engine, and more particularly to a means for mounting a Hall IC as a sensor portion.

[0002]

2. Description of the Related Art Heretofore, there has been known a rotation sensor for an internal combustion engine which detects a position of a crank angle and a cam angle by using a Hall IC utilizing a Hall effect. That is, conventionally, a Hall IC that generates an electric signal according to a rotation angle of a crank angle or a cam angle of an internal combustion engine.
There is known a hybrid IC in which a waveform shaping IC for shaping a waveform of the electric signal is configured as a hybrid (integrated), and the output of the hybrid IC is used to control an internal combustion engine.

FIG. 3 is a side sectional view of a rotation sensor incorporating the above-described hybrid IC, and FIG. 4 is a partially enlarged view of the vicinity of the Hall IC 32. As shown in FIGS. 3 and 4, the rotation sensor is formed by covering a connector 10 having a terminal 12 with a case 50. More specifically, the connector 10 has a hybrid IC mounted with a Hall IC 32 and a waveform shaping IC 34.
It has a tongue-shaped fixing portion 14 to which the IC 30 is attached. The output portion of the hybrid IC 30 and the terminal 12 are connected by wire bonding or the like.

[0004] The case 50 has a hollow inside, and has a shape in which only one surface is opened, and the fixing portion 14 of the connector 10 and the hybrid IC 30 are inserted and fixed through the opening. Reference numeral 40 is a magnet for a rotation sensor. Here, the means of attaching the Hall IC 32 to the conventional hybrid IC 30 will be described. A component hole 35 for inserting a component is provided on a commonly used wiring board, a lead portion of the Hall IC 32 is inserted therein, and fixed by soldering 36 And electrical continuity. In such a rotation sensor, the Hall IC 32 and the magnet 40, the fixing portion 14, the hybrid IC 30 and the like are adhered and fixed to each other by an adhesive 37.

In the above configuration, the Hall IC 32 is disposed directly near the bottom of the case 50, picks up a signal change due to the passage of the projection of the rotating body 20, and converts this signal into a waveform shaping IC 34.
The processing result is sent to an external processing unit (not shown) via the terminal 12.

[0006]

However, the rotation sensor having the above-described structure is exposed to a high temperature due to its location and self-heating during driving. As described above, the Hall IC 32 and the magnet 40, the fixing portion 14, the hybrid IC 30 and the like are mutually bonded with an adhesive 37.
However, the heat shock is repeated due to such high heat and the normal temperature (low temperature) at the time of stoppage, and each electric component repeatedly expands and contracts, causing distortion. Such distortion is particularly applied to the soldered portion of the Hall IC 32, and the solder 36 is liable to crack,
There is a problem that operation as a sensor cannot be obtained.

SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a sensor which can improve solder defects caused by distortion due to heat and obtain a stable output.

[0008]

According to the present invention, there is provided a rotation sensor comprising a connector, a wiring board on which a Hall IC is mounted, and a case. A buffer for absorbing strain is provided, and the buffer comprises a lead having a dimension longer than the shortest laying dimension of the lead between the land for soldering the end of the lead and the main body of the Hall IC 32. The rotation sensor is characterized in that:

[0009]

An embodiment of the present invention will be described with reference to FIG. The rotation sensor connects the connector 10 having the terminals 12 to the case 50.
It is formed by covering with. More specifically, the connector 10 has a tongue-shaped fixing portion 14 for mounting a hybrid IC 30 on which a Hall IC 32 and a waveform shaping IC 34 are mounted, and the output portion of the hybrid IC 30 and the terminal 12 are connected by wire bonding or the like. Connected by

[0010] The case 50 has a hollow interior, and has a shape in which only one surface is opened. The fixing portion 14 of the connector 10 and the hybrid IC 30 are inserted and fixed through the opening. Reference numeral 40 is a magnet for a rotation sensor. Here, the conventional means for attaching the Hall IC 32 to the hybrid IC 30 will be described. A component hole 37 for component insertion is provided on a commonly used wiring board, and a lead portion of the Hall IC 32 is inserted therein, and fixed by soldering. Conducts electrical continuity. In such a rotation sensor, the Hall IC 32 and the magnet 40, the fixing portion 14, the hybrid IC 30 and the like are adhered and fixed to each other by an adhesive 37.

In the present invention, as shown in FIG. 1, the lead of the Hall IC 32 is a buffer 38. In other words, the end of the lead portion is soldered to a terminal portion such as a land with solder 36, but the lead portion between the solder 36 portion and the main portion serving as the sensor portion of the Hall IC 32 is usually provided with a lead portion. It is not the shortest part, but a U-shaped freely deformable arrangement floating in the air.

Further, in the above configuration, the Hall IC 32 is directly disposed near the bottom of the case 50, picks up a change in a signal due to the passage of the projection of the rotating body, sends this signal to the waveform shaping IC 34, and processes the result. Through a terminal 12 to an external processing section (not shown).

As another embodiment, as shown in FIG. 2, the same effect can be obtained if the lead portion of the Hall IC 32 is formed in an arch shape. That is, the present invention provides a lead portion having a dimension longer than the shortest laying dimension of the lead portion between the land for soldering the end of the lead portion and the main portion of the Hall IC 32 regardless of the shape and size of the buffer portion. Buffer
Since 38 is inevitably formed, the same effect can be obtained even if the lead portion is longer than the shortest laying dimension, even if it has a shape having component holes shown in the prior art.

[0014]

According to the above configuration, even if the Hall IC 32 moves due to thermal expansion or contraction, the stress during this movement is not directly applied to the soldering portion but can be absorbed by the buffer portion 38. Thus, a high quality rotation sensor can be provided.

[Brief description of the drawings]

FIG. 1 is a side sectional view of a rotation sensor according to an embodiment of the present invention.

FIG. 2 shows a side sectional view of another embodiment of the present invention.

FIG. 3 shows a side sectional view of a conventional rotation sensor.

FIG. 4 shows a partially enlarged view of FIG. 3;

[Explanation of symbols]

 In the drawings, the same reference numerals indicate the same or corresponding parts. DESCRIPTION OF SYMBOLS 10 Connector 12 Terminal 14 Fixed part 18 Spacer part 20 Rotating body 30 Hybrid IC 32 Hall IC 34 Wave forming IC 35 Component hole 36 Solder 37 Adhesive 38 Buffer part 40 Magnet 50 Case

Claims (1)

[Claims] In a rotation sensor comprising a connector, a wiring board on which a Hall IC is mounted, and a case, a buffer for absorbing distortion due to heat is provided at a lead of the Hall IC, and the buffer is a lead. Characterized by comprising a lead portion having a dimension longer than the shortest laying length of the lead portion between the land for soldering the end of the lead and the main portion of the Hall IC 32.