JPH10289816A - Printed laminated coil and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To hardly generate a positional deviation of a coil base when the coil base is multilayered, to increase the number of lamination of insulative bases and to make it possible to make a printed-laminated coil apply easily also to a miniaturization by a method wherein the coil base is folded hack into an eddy shape in the arrangement direction of coil patterns in such a way that the axial centers of the coil patterns are made to align with each other and the fellow coil patterns are superposed. SOLUTION: A base material coil wound with a filmy printed circuit base is prepared. While this base material coil feeds out continuously the filmy printed circuit base, etching masks are respectively formed on both surfaces of the fed out filmy printed circuit base, both surfaces are subjected to etching treatment and water washing treatment to arrange coil patterns 4 and 5 on both surfaces. After that, a formation treatment of connection holes and a connection treatment of the fellow coil patterns 4 and 5 on the surface and rear of the printed circuit base are performed and lastly, the printed circuit base is subjected to corona discharge treatment to obtain a double-sided coil base, which is used as the base material for a printed-laminated coil. Then, the obtained double-sided coil base is multilyered while the coil base is wind-lapped in order into an eddy shape and after that, this coil base is cut off into multilayered coils. Lastely, the cut-off multilayered coils are thermally bonded to each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed laminated coil used for an electromagnetic coil such as a motor, an exciting coil used for a relay, a detecting coil such as a high-frequency proximity switch, or an antenna coil such as a data carrier. It relates to the manufacturing method.

[0002]

2. Description of the Related Art Conventional coil manufacturing methods include (1)
Generally, there are a method of winding a wire, (2) a method of laminating deposition applying IC technology, (3) a method of forming a multilayer printed circuit board, and (4) a method of folding a printed circuit board. Although they are known, they each have the following problems.

[0003]

The method (1) for winding a wire has the following problems. That is, in this method (1), in order to increase the winding density as a measure to meet the demand for miniaturization, it is necessary to make the wire thin, and the wire is easily broken. The process of connecting the wire end to another circuit portion becomes complicated, and the cost increases. Further, an axis for winding the wire in a coil is required, which limits the size reduction. In addition, outgas is generated from the lubricating layer coated on the surface of the wire in order to perform the winding well.

[0004] The method (2) based on laminated deposition using IC technology has the following problems. That is, in the method (2), the steps of vapor deposition in a vacuum chamber → photo etching → coating are repeated to form a coil by laminating several layers. The number of layers is limited due to problems such as surface uniformity in the process and the yield of photoetching.

The method (3) using the same method as that for manufacturing a multilayer printed circuit board has the following problems. That is, in the method (3), the electrical connection between the multilayered layers needs to be performed by a through hole or a blind hole in which a conductive metal is plated in a hole penetrating the circuit of each layer. An area for processing this through hole is required, miniaturization is limited, and the manufacturing process becomes complicated, resulting in high cost.

Method of folding printed circuit board (4)
Has the following problems. That is, in this method (4), as shown in, for example, JP-A-54-67667, a printed circuit board is bent in a zigzag manner to form a multilayer. FIG. 9 shows an example of a coil structure manufactured by this method. The coil in the figure is formed by folding a printed circuit board in a zigzag shape to form a multilayer. In this structure, one printed circuit board can be multilayered by the number of times of folding, so that a flat coil having substantially many windings can be obtained.

However, in this structure, the circuit pattern surfaces a and b are electrically contacted to form a multilayer structure, and an insulating layer is formed on the surface of the circuit pattern or an insulating film is formed in order to secure insulation of the circuit. Need to be inserted.

Further, in this structure, misalignment between the layers is apt to occur at the time of bending, a guide pin for positioning the layers is required, and the processing is troublesome.
Even if such a positioning pin is used, there is a disadvantage that the number of layers to be multilayered is limited.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems. It is an object of the present invention to reduce the number of laminations by making it difficult to cause misalignment in multi-layering. Another object of the present invention is to provide a printed laminated coil which can be easily adapted to miniaturization and a method of manufacturing the same.

[0010]

Means for Solving the Problems In order to achieve the above object, the present invention according to claim 1 of the present invention is directed to a film-like or thin-plate-like insulating substrate in which a plurality of coil patterns are provided at appropriate intervals. The arranged coil base material is characterized by being spirally folded in the direction in which the coil patterns are arranged so that the coil patterns overlap each other with their axes aligned.

Therefore, according to the first aspect of the present invention, by folding in a spiral shape, displacement is less likely to occur than in the conventional zigzag folding mode, and the number of folding is not limited. It is small and flat, and a sufficient number of turns can be obtained.

[0012] Of the present invention, the invention described in claim 2 is:
In the invention according to claim 1, the coil pattern is:
It consists of a pair of coil patterns arranged on the front and back of the insulating base material with their axes aligned with each other, and that the pair of coil patterns are connected in series via a conductive part penetrating the insulating base material. It is a feature.

Therefore, in the invention according to the second aspect, the number of windings is twice as large as the number of folds by using a double-sided printed coil.

According to a third aspect of the present invention, in the first aspect of the present invention, the coil pattern is disposed on only one surface of the insulating base material and two adjacent ones are formed on the outer peripheral end. Each coil pattern is connected to each other to form a set, and further, a conductive portion that penetrates the insulating base material is provided at an inner peripheral end portion of each coil pattern. The members belonging to the set are connected to each other by a lead pattern on a surface of the insulating substrate opposite to the surface on which the coil pattern is arranged.

Therefore, the invention according to claim 3 is
Although the number of windings is reduced, the number of man-hours for coil pattern processing can be reduced, and when spirally folded, the coil patterns do not adhere to each other. No insulating layer is required.

According to a fourth aspect of the present invention, in the first aspect of the present invention, the coil pattern is disposed only on one surface of the insulating base material, and two adjacent coil patterns are connected to outer peripheral end portions. Are connected to each other to form a set, and among the inner peripheral end portions of the respective coil patterns, those belonging to the adjacent set are jumpered on the same side as the coil pattern arrangement surface of the insulating base material. It is characterized by being connected to each other by a wire.

Therefore, the invention described in claim 4 is
The process for forming the circuit may be performed only on one side of the insulating base material 1, so that the process can be simplified. In addition, since the surface on which the coil pattern 4 is formed and the surface on which the coil pattern 4 is not formed come into contact with each other, a special insulating layer for electrical insulation between layers is not required.

The method according to the fifth aspect of the present invention is characterized in that:
A step of preparing a plurality of coil bases arranged at intervals of gradually increasing coil patterns on a film-like or thin-plate-like insulating base; and winding the coil base around a core material having a predetermined cross-sectional shape. And a step of adhering each layer of the spirally folded coil base material to each other by spirally folding in the arrangement direction of the coil base material.

Therefore, in the method according to the fifth aspect of the present invention, continuous production can be performed from one insulating substrate, the production is simple, and the method can be adapted to continuous production.

[0020] The method according to claim 6 of the present invention is as follows.
In the invention according to claim 5, the arrangement of the coil pattern in the step of preparing the coil base material is performed by an etching process, and an etching mask is left on a surface of the coil pattern. The bonding step is performed by fusing the insulating substrate itself by heating.

Therefore, according to the method of the present invention, the electrical insulation between the folded coil patterns can be maintained without using an insulating film or other electrical insulating means.

According to a seventh aspect of the present invention, in the method of the sixth aspect, the surface of the coil base material is subjected to a corona discharge treatment prior to the folding step. Things.

Therefore, in the method according to the present invention, in the thermocompression bonding step, the thermocompression bonding temperature can be reduced, and the interlayer adhesion strength can be increased.

[0024] In the invention according to claim 8, in the invention according to claim 5, in the invention according to claim 5, the coil pattern is disposed only on one surface of the insulating base material and two adjacent coils are arranged on the outer peripheral side. End portions are connected to each other to form a set, and further, a conductive portion penetrating the insulating base material is provided at an inner peripheral end portion of each coil pattern, and adjacent ones of the conductive portions are adjacent to each other. The members belonging to the set are connected to each other by a lead pattern on a surface of the insulating substrate opposite to the surface on which the coil pattern is arranged.

The method according to the eighth aspect of the present invention shows a specific manufacturing method that embodies the invention according to the third aspect.

The method according to the ninth aspect of the present invention provides:
In the invention according to claim 5, the coil pattern is:
A pair is arranged only on one side of the insulating base material and two adjacent ones are connected to each other at outer peripheral end portions to form a pair,
Further, among the inner peripheral end portions of the respective coil patterns, those belonging to the adjacent set are connected to each other by jumper wires on a surface on the same side as the coil pattern arrangement surface of the insulating base material. Is what you do.

The ninth aspect of the present invention shows an optimum manufacturing method for embodying the fourth aspect of the present invention.

[0028]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Figure 1
FIG. 4 shows a first embodiment in which the present invention is applied to a double-sided printed laminated coil using a double-sided coil base material having a coil pattern on both sides. FIG. 1 shows all the steps, and FIG. 2 shows a change in the shape of the substrate in each step.

The manufacturing method shown in the figure includes three steps of first to third steps. First, these steps will be schematically described.

In the first step, first, a material coil on which a film-shaped printed circuit board is wound (see FIG. 2A)
Prepare This material coil is 25 μm in this example.
The metal conductive layers 2 and 3 made of 18 μm copper foil are laminated on both surfaces of an insulating substrate made of polyethylene terephthalate (PET) film. Then
While continuously feeding the material coil, an etching mask is formed on both sides of the film-shaped printed circuit board that has been fed, and subsequently, a known etching process and a water-washing process are performed using the etching mask to form a film. The arrangement of the coil patterns on both sides of the insulating substrate is completed. After that, a process for forming connection holes for connecting the coil patterns arranged on both sides, and a process for connecting the coil patterns on the front and back sides, and finally, performing a corona discharge process to make the printed type laminated coil material and Is obtained.

Next, in a second step, the double-sided coil base material obtained through the first step is successively spirally wound to be multilayered, and then cut into individual multilayered coils.

Finally, in a third step, the separated multilayered coil is thermocompression-bonded to obtain a finished printed laminated coil.

The reason why the corona discharge treatment is performed at the final stage of the first step is to lower the thermocompression bonding temperature and increase the interlayer adhesive strength in the third step of thermocompression bonding.

Next, the contents of the processing in each of the above steps will be described in more detail.

First step: etching mask forming step,
As shown in FIGS. 2B and 3, the coil patterns 4 and 5 formed through the photoetching process have each section defined by the bending lines a to f as one winding unit, and are adjacent to each other. The spiral coil patterns 4 and 5 on the front and back sides where the mating sections are electrically connected to each other are formed continuously in the same repetitive pattern along the longitudinal direction of the substrate 1.

The coil patterns 4 and 5 are formed by
In a state in which a to f are wound as bending lines, the patterns are formed such that magnetic fields generated from patterns having the same winding direction, that is, magnetic fields generated from the front and back coil patterns do not cancel each other.

Next, in the connection hole forming step, a hole is formed through the center of each of the coil patterns 4 and 5 at the same time. Thus, the double-sided printed coil base material 7 in which the front and back coil patterns 4 and 5 are connected in series is continuously formed.

As an etching mask used in the photoetching in this step, a mask material having flexibility and heat resistance such as photosensitive polyimide and having good adhesion to a metal material is used. If it is kept as it is, it can be used as an electrical insulating film between layers at the time of multilayering described later.

Second Step: In this second step, as shown in FIG. 2C, the printed coil base material 7 is folded into a flat core material 8 while applying tension to the printed coil base material 7. A bending jig and bending lines ab, bc, cd, d-
It is spirally folded into five layers along e and ef, and cut at the folding line f when the folding is completed. As a result, the coil patterns 4 and 5 on the front and back sides constitute a five-layer double-sided printed laminated coil 9 having the same winding direction when folded.

Since the total thickness increases as the number of windings increases, in the process of forming the coil patterns 4 and 5 in the first step, the amount of increase in the thickness reaching each of the bending lines a to f is anticipated. , The pitch interval of the coil pattern is gradually increased.

In this step, the printed coil base material 7 to be fed can be multilayered by rotating the core member 8 while applying tension to the printed coil base material 7, so that there is no displacement between the layers, and the axial center of the coil pattern of each layer is adjusted. Accurately matched multilayering is possible.

It should be noted that the interval between the first step and the second step is off-line, the coil patterns 4 and 5 formed once are wound and stocked, and supplied to the second step while being fed out. Is also good.

Third step: The core material 8 is removed from the center of the folded printed type double-sided laminated coil 9, and the separated print-type double-sided laminated coil 9 is transferred in a direction perpendicular to the coil transfer direction, and is subjected to a thermocompression roll. By heating and pressurizing by 10 (see FIG. 1), thermocompression bonding between the respective layers is performed to complete a printed laminated coil as a product. In addition,
The heating temperature in this thermocompression bonding step is 120 to 150 ° C,
It is considered that the pressure is preferably about 5 kg / cm ² .

Although not shown, each of the coil patterns 4 and 5 is formed not only in one line in the longitudinal direction of the insulating base material 1 but also in a plurality in the width direction.
By cutting or fusing in the width direction, individual products are cut off.

FIG. 4 shows the completed, flat, printed double-sided laminated coil 9. The ends of the coil patterns 4 and 5 protruding from the front and back of the section ef which is the outer surface of the laminated coil 9 are used as external connection terminals 4a and 5a, and the lead wires 11 are soldered to the terminals 4a and 5a, respectively. so,
Can be connected to the outside.

Also, on the surfaces of the coil patterns 4 and 5,
As shown in an enlarged view in a part of FIG. 4, the insulating layer 12 by the above-described etching mask is left, thereby preventing electrical connection between the coil patterns 4 and 5 due to close contact.

In the above embodiment, PET is used as the insulating base material 1. However, a thermosetting resin film such as polyimide may be used. However, in this case, since pressure bonding between layers cannot be performed by heat, it is necessary to previously coat a heat-welding resin adhesive in the final stage of the first step. Also, the conductive layers 2 and 3 can be made of aluminum foil instead of copper.

In the third step, the fusing method using the thermocompression bonding roll 10 is used. However, it is also possible to apply an ultrasonic sealing method. In this case, for example, the ultrasonic horn preferably has an amplitude of 30 μm, a sealing speed of 0.6 m / min, and a horn pressure of 3 kgf. Further, an impulse sealing method or the like can be adopted.

Further, in the above-described embodiment, the core member 8 is a flat plate having a length substantially equal to the length of the section ab. For example, as shown in FIG. Core material 8 'can be used. In this case, the positions of the bending lines a to f are sharply formed, and a highly accurate bending operation according to the positions of the bending lines b to d can be performed.

FIGS. 6 and 7 show a second embodiment in which the present invention is applied to a single-sided printed laminated coil. In the drawing, the same parts as those in the first embodiment are denoted by the same reference numerals, and only different parts will be described using different reference numerals.

The single-sided printed laminated coil 20 shown in FIG.
As shown in FIG. 6, a coil pattern 4 similar to the above is formed only on one surface of the base material 1, a lead pattern 21 is formed on the back surface side of a hole portion serving as the center thereof, and the conductive agent 6 is filled. A printed coil substrate 22 having the same winding direction is formed in a state where the coil patterns 4 are connected to each other and wound, and this is wound around the core material 8 as a bending axis, as shown in FIG. , A single-sided printed laminated coil 20 in which the lead pattern 21 is located inside the winding.

Therefore, in this embodiment, when the outer size of the laminated coil 20 is reduced, the positional accuracy between the coil patterns 4 of each layer becomes severe and the yield decreases, but the line width of the lead pattern 21 is reduced. By forming it thick, the positional accuracy can be relaxed and the yield can be improved.

Instead of the above-described lead pattern 21, the coil patterns 4 can be connected to each other by jumper wires 23 as shown in FIG. In this case, the process for forming the circuit may be performed only on one side of the insulating base material 1, and thus the process can be simplified. Further, since the surface on which the coil pattern 4 is formed and the surface on which the coil pattern 4 is not formed are in contact with each other, there is an advantage that a special insulating layer for electrical insulation between the layers is not required.

[0054]

As is apparent from the above description, the printed laminated coil according to the present invention is suitable for multilayering because the coil pattern can be folded with high accuracy.

Further, in the manufacturing method of the present invention, a printed laminated coil can be continuously manufactured from one printed coil base material, and can be folded with high accuracy by winding with a core material. It will be good.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a manufacturing procedure when the method of the present invention is applied to the manufacture of a double-sided printed laminated coil.

FIG. 2 is a schematic plan view and a cross-sectional view illustrating an example of the shape of an intermediate product in first and second steps.

FIG. 3 is a schematic diagram showing a connection configuration of front and back coils.

FIG. 4 is a view showing a completed state of a double-sided printed laminated coil and a partially enlarged view.

FIG. 5 is a sectional view showing another example of the shape of the shaft.

FIG. 6 is a schematic sectional view of a completed state when the present invention is applied to a single-sided printed laminated coil.

FIG. 7 is a plan view and a side view showing a print pattern in the single-sided printed laminated coil.

FIG. 8 is a view showing another connection form on the back side of the single-sided printed laminated coil.

FIG. 9 is a schematic sectional view of a conventional zigzag type printed laminated coil.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulating base material 2, 3 Conductive layer 4, 5 Coil pattern 6 Conductive material 8 Core material 9 Double-sided printed laminated coil 10 Thermocompression roll 12 Insulating layer 20 Single-sided printed laminated coil. 21 Lead pattern 23 Jumper wire

Claims (9)

[Claims] 1. A coil substrate in which a plurality of coil patterns are arranged at appropriate intervals on a film-like or thin-plate-like insulating substrate, such that the coil patterns overlap each other with their axes aligned. A print-type laminated coil characterized by being spirally folded in the arrangement direction of a coil pattern. 2. The coil pattern is composed of a pair of coil patterns arranged on the front and back of the insulative base material so that their axes are aligned with each other, and the pair of coil patterns are conductive portions penetrating the insulative base material. 2. The printed laminated coil according to claim 1, wherein the printed laminated coil is connected in series via a wire. 3. The coil pattern is arranged on only one surface of the insulating base material, and two adjacent ones are connected to each other at outer peripheral ends thereof to form a set. A conductive portion penetrating the insulating base material is provided at the peripheral end, and among the conductive portions, those belonging to the adjacent set are opposite to the coil pattern arrangement surface of the insulating base material. The printed-type laminated coil according to claim 1, wherein the surfaces are connected to each other by a lead pattern. 4. The coil pattern is arranged on only one surface of the insulating base material, and two adjacent ones are connected to each other at outer peripheral ends thereof to form a set. The side end portions belonging to the adjacent set are connected to each other by a jumper wire on a surface on the same side as the coil pattern arrangement surface of the insulating base material, according to claim 1, characterized in that: Printed laminated coil. 5. A step of preparing a plurality of coil bases arranged at intervals of gradually increasing coil patterns on a film-shaped or thin-plate-shaped insulating base; Spirally folding in the arrangement direction of the coil pattern while winding around and separating them individually; and adhering each layer of the spirally folded coil base material. Manufacturing method of printed type laminated coil. 6. The arrangement of the coil pattern in the step of preparing the coil base material is performed by an etching process, and an etching mask is left on a surface of the coil pattern. 6. The method according to claim 5, wherein the heating is performed by fusing the insulating base material itself by heating. 7. The method according to claim 6, wherein a corona discharge treatment is performed on a surface of the coil base material before the folding step. 8. The coil pattern is disposed on only one surface of the insulating base material, and two adjacent ones are connected to each other at outer peripheral ends thereof to form a set. Conductive portions penetrating the insulating base material are provided at the side end portions, and among the conductive portions, those belonging to the adjacent groups are surfaces on the side opposite to the coil pattern arrangement surface of the insulating base material. 6. The method according to claim 5, wherein the coils are connected to each other by a lead pattern. 9. The coil pattern is disposed on only one surface of the insulating base material, and two adjacent ones are connected to each other at outer peripheral ends thereof to form a set. The side end portions belonging to the adjacent set are connected to each other by a jumper wire on a surface on the same side as a coil pattern arrangement surface of the insulating base material, according to claim 5, characterized in that: Manufacturing method of printed laminated coil.