JPH10284413A - Substrate processor and substrate processing aligner - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an aligner which can prevent deterioration in the developing quality to realize a uniform quality, by shortening the time until an exposed substrate is heated and eliminating variations, among substrates, in the time from completion of the substrate exposure to its heating process. SOLUTION: A heat treatment unit 14 is provided as connected with an interface IF. The unit 14 includes a heat treatment parts PEB and CP3 for heating and cooling a substrate subjected to an exposing process in a stepper ST, an exclusive substrate transportation means for feeding the exposed substrate to the heat treatment parts, and another substrate transportation means for the substrate from the heat treatment parts to the interface IF. The unit 14 feeds the exposed substrate to the interface IF through the heat treatment unit 14, and then from the interface to developing parts SD1 and SD2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for heat-treating an exposed substrate and then developing the same, and an exposure apparatus for exposing the substrate, and more particularly, to an exposure apparatus such as a chemically amplified resist. The present invention relates to a substrate processing apparatus for processing a substrate such as a semiconductor substrate by a photolithography process using a resist in which a reaction is accelerated by performing heat treatment on a substrate, and a substrate processing exposure apparatus for performing substrate exposure processing. .

[0002]

2. Description of the Related Art In recent years, there has been a demand for a technique for increasing the definition of a circuit pattern as semiconductor devices become more highly integrated.
In order to meet this demand, a chemically amplified resist is used in a semiconductor device manufacturing process. This chemically amplified resist is exposed to a desired pattern on a substrate to which the resist is applied, and the photoacid generator contained in the resist generates an acid, and then the substrate is heated to perform a catalytic action. Is activated to promote a crosslinking reaction (in the case of a negative type) or a decomposition reaction (in the case of a positive type) in an exposed portion of the resist. After the heat treatment, the substrate is cooled to stop the reaction of the resist, and then the substrate is developed, so that the unreacted portion (in the case of the negative type) or the reacted portion (in the case of the positive type) of the resist is developed. Dissolved in
A desired resist film is obtained.

FIG. 6 shows a schematic configuration example of a conventional apparatus for processing a substrate using a chemically amplified resist. In this example, the entire apparatus is composed of the substrate processing apparatus 1 and the exposure apparatus ST. In the substrate processing apparatus 1, a cassette (not shown) capable of storing a plurality of substrates is placed, and a substrate to be processed is taken out of the cassette one by one, carried out, and a substrate on which all the processing is completed. Unit (cassette stage) ID for receiving the sheets one by one and storing them again in a cassette, a transfer unit TR provided with a self-propelled substrate transfer robot (not shown) equipped with a substrate transfer arm, and a substrate. On the other hand, a substrate processing area 2 having a plurality of substrate processing units for performing predetermined processing, and an interface unit IF for transferring a substrate to and from the exposure apparatus ST
It is composed of In this example, the plurality of substrate processing units in the substrate processing area 2 include a coating processing unit SC having a spin coater (not shown), and HMDS (hexamethyldisilazane) for improving the adhesion between the substrate surface and the resist. ), An adhesion section AH for heating the substrate in an atmosphere, four heating sections HP1, HP2, HP3, HP4 each having a hot plate (not shown), and a hot plate (not shown) for exposure processing. (Hereinafter referred to as a “baked part”) PEB for performing a heat treatment (post-exposure baking) on the substrate after the heat treatment, and four cooling processing parts CP1, CP2, CP3 each having a cool plate (not shown). CP4 and two development processing units SD1 and SD2 each having a spin developer (not shown). The exposure apparatus ST includes an exposure processing unit (not shown) including a stepper for performing exposure processing on the substrate.
have. In FIG. 6, a plurality of substrate processing units are depicted as being arranged in a plane, but the adhesion unit AH, the heat treatment units HP1 to HP4, the bake unit PEB, and the cooling units CP1 to CP4 are appropriately (The same applies to FIGS. 1 and 8).

FIG. 7 shows an example of a substrate processing flow in the substrate processing apparatus 1 and the exposure apparatus ST shown in FIG.
The processing procedure of the substrate will be briefly described with reference to FIG. 7. First, the substrates before processing stored in the cassette are supplied to the transport unit TR one by one from the indexer unit ID.
The substrate transport robot includes an adhesion section AH, a cooling section CP1, a coating section SC, and a heating section HP.
1. While sequentially moving to the HP2 and the cooling processing unit CP2, in each of the substrate processing units, the substrate that has been put in is taken out and the substrate to be processed is loaded. Required processing is performed. Thereby, a resist film is applied and formed on the surface of the substrate. Next, the substrate having the resist film formed on the surface is transferred from the transport unit TR to the interface unit IF, and is carried into the exposure apparatus ST through the interface unit IF. Then, the substrate is subjected to the exposure processing in the exposure processing section of the exposure apparatus ST, and the substrate on which the exposure processing has been completed is returned from the exposure apparatus ST to the interface section IF, and transferred to the transport unit TR through the interface section IF.

[0005] The substrate after the exposure processing returned to the transport unit TR is transported to the bake section PEB by the substrate transport robot, and is heated by the bake section PEB. This heat treatment promotes the chemical reaction in the exposed portion of the chemically amplified resist as described above. Then, the substrate is transferred from the baking unit PEB to the cooling unit CP3 by the substrate transfer robot, and the substrate is cooled in the cooling unit CP3. By this cooling process, the reaction in the exposed portion of the chemically amplified resist stops. Thereafter, the substrate transfer robot moves the cooling processing unit CP3 to the developing processing unit SD1,
SD2, heat treatment sections HP3, HP4 and cooling processing section CP
While sequentially moving to step 4, in each of the substrate processing units, the substrate that has been placed in before is taken out and the substrate to be processed is loaded. The required processing is performed on the substrate by each of the substrate processing units. You. This allows
A resist film having a desired pattern is formed on the surface of the substrate. The substrate on which the resist film having the desired pattern is formed is transferred from the transport unit TR to the indexer unit ID, and is stored in the cassette on the indexer unit ID.

In addition, for example, in Japanese Patent Application Laid-Open No. Hei 6-151293, a bake unit PEB and a cooling unit CP3 are not arranged in a substrate processing area 4 of a substrate processing apparatus 3 as shown in FIG. Discloses a configuration in which a bake unit PEB and a cooling unit CP3 are arranged in an interface unit IF. In an apparatus having such a configuration, the exposure apparatus S
The substrate subjected to the exposure processing in the exposure processing section T is exposed to the exposure apparatus ST
From the interface unit IF, the substrate is heated by the bake unit PEB in the interface unit IF, the chemical reaction of the chemically amplified resist is promoted, and the substrate is cooled by the cooling unit CP3 to stop the reaction of the resist. Can be Thereafter, the board is moved to the interface section I.
The substrate F is returned to the transport unit TR, and is subjected to development processing in the development processing sections SD1 and SD2 arranged in the substrate processing area 4.

[0007]

As described above, the chemically amplified resist generates an acid inside the resist by exposure treatment, and promotes the chemical reaction of the resist by the catalytic action of the acid by heat treatment. . Therefore, when an alkaline substance is present in the atmosphere, the acid generated inside the resist is neutralized, the catalytic action of the acid is deactivated, and the chemical reaction of the resist is inhibited. Therefore,
In the substrate processing apparatuses 1 and 3, a chemical adsorption filter is installed on a clean bench provided so as to cover the entire upper part thereof, so that an alkaline substance is removed from the atmosphere. However, it is difficult to completely remove the alkaline substance in the atmosphere. Therefore, in order to minimize the neutralization reaction between the acid and the alkaline substance in the resist, it is necessary to minimize the time from the exposure processing to the heat treatment in the bake portion PEB.

However, in the conventional apparatus as shown in FIG. 6, the substrate subjected to the exposure processing is once passed from the exposure apparatus ST to the interface section IF, transported in the interface section IF, and transported from the interface section IF. It is passed to the unit TR and is baked by the transport unit TR.
Transported to As described above, in the process of transporting the substrate after the exposure processing to the baking unit PEB, the process of transferring the substrate at the interface unit IF is interposed, so that it takes time from the exposure processing to the heating processing in the baking unit PEB. Become. As a result, there is a problem that the catalytic action of the acid during the heat treatment decreases, the chemical reaction of the resist becomes insufficient, and the shape of the resist pattern becomes abnormal during the development treatment, and the product yield decreases. is there.

Further, while the substrate processing and the substrate transport in the substrate processing apparatus 1 are controlled so as to be performed in a certain time, the exposure apparatus ST requires a time for the substrate alignment for each substrate. Unlikely, it is not time managed. For this reason, the timing at which the substrate carried into the exposure apparatus ST is exposed by the exposure processing unit and returns to the substrate transfer position with the interface unit IF is not constant. On the other hand, in the interface unit IF, the substrate transport robot receives the substrate from the transport unit TR, passes the substrate to the exposure apparatus ST, receives the substrate after the exposure processing from the exposure apparatus ST, and transports the substrate. Unit T
I will pass it to R. Therefore, if the timing at which the exposed substrate is returned to the substrate transfer position with the interface unit IF is not constant, even if the substrate transfer robot moves to the substrate transfer position to receive the substrate from the exposure apparatus ST, In some cases, a substrate cannot be received because the substrate does not exist at the substrate transfer position. Further, even if the substrate after the exposure processing is returned to the substrate transfer position, the substrate transfer robot may not yet arrive at the substrate transfer position. As a result, the time from the completion of the exposure processing to the transfer of the substrate to the interface unit IF differs for each substrate. Therefore, the time from the completion of the exposure processing to the transfer of the substrate to the baking unit PEB is reduced. Will be different for each.

Exposure processing unit and bake unit PE of exposure apparatus ST
If there is a variation in the transfer time of the substrate between B and
The progress of the crosslinking reaction or the decomposition reaction in the exposed portion of the resist varies due to the influence of the alkali substance in the atmosphere. As a result, there has been a problem that the line width of the pattern on the resist film after the development processing varies, and the yield of the product is greatly reduced.

Further, even if the substrate after the exposure processing is returned to the substrate transfer position, if the transfer timing of the interface unit IF with the substrate transfer robot does not match, the substrate is baked after the exposure processing is completed. There is also a disadvantage that it takes a long time to be transported to the unit PEB.

Further, in the apparatus having the configuration in which the baking section PEB and the cooling processing section CP3 are arranged in the interface section IF as shown in FIG. 8, compared to the apparatus as shown in FIG. Even if the time until the heat treatment in the PEB is somewhat shortened, the substrate subjected to the exposure processing is once transported from the exposure apparatus ST through the interface section IF to the bake section PEB, so that it takes time. Also, in the apparatus shown in FIG.
The transfer of the substrate from the substrate unit to the baking unit PEB of the interface unit IF is performed in the same manner as the apparatus shown in FIG.
Also, the substrate transport time varies between the exposure processing unit of the exposure apparatus ST and the bake unit PEB of the interface unit IF, and the interface unit I returns to the substrate delivery position after the exposure processing.
If the transfer timing of the substrate F with the substrate transfer robot does not match, the substrate is not baked after the exposure process is completed.
The inconvenience that the time required for transport to the EB becomes long also occurs. For this reason, problems such as occurrence of abnormalities in the shape of the resist pattern after the development process and variation in the line width of the pattern on the resist film, resulting in a reduction in product yield, remain unsolved.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and shortens the time required to heat a substrate that has been subjected to an exposure process. To provide a substrate processing apparatus capable of preventing the deterioration of the development processing quality, uniforming the development processing quality, and improving the product yield, while eliminating the variation between the substrates in the time required for the processing. Reduce the time until the exposed substrate is heated, and
Eliminating the variation in the time from the completion of the exposure processing of the substrate to the heating processing between the substrates, preventing the deterioration of the development processing quality, uniforming the development processing quality, and improving the product yield. It is an object of the present invention to provide an exposure apparatus that can perform the exposure.

[0014]

The invention according to claim 1 is
In a substrate processing apparatus provided with an interface unit for transferring a substrate and at least a substrate processing unit having a developing unit for developing the exposed substrate, a heat treatment unit for heat-treating the exposed substrate, A first substrate transfer unit dedicated to transfer the substrate subjected to the exposure processing, and a heat treatment unit including a second substrate transfer unit for unloading the substrate heat-treated from the heat treatment unit to the interface unit, The substrate subjected to the exposure processing is transported to the interface unit via the heat treatment unit, passed from the interface unit to the substrate processing unit, and the substrate is subjected to development processing by the developing unit. I do.

According to a second aspect of the present invention, in the substrate processing apparatus of the first aspect, the heat treatment section of the heat treatment unit is heat-treated by the heat treatment section for heating the exposed substrate. And a cooling unit for cooling the substrate.

According to a third aspect of the present invention, in the substrate processing apparatus according to the first aspect, a transfer time required for transferring the substrate immediately after the completion of the exposure processing to the heat treatment section by the first substrate transfer means, and the heat treatment section Wherein a first control means for controlling the heat treatment time of the substrate in each of the methods is kept constant.

According to a fourth aspect of the present invention, in the substrate processing apparatus of the second aspect, the second substrate transfer means transfers the substrate from the heating processing section to the cooling processing section. A transport time required for transporting the substrate from the heat processing unit to the cooling processing unit by the substrate transport unit, and a control for controlling each processing time of the substrate in the heat processing unit and the cooling processing unit to be kept constant. 2 is provided.

According to a fifth aspect of the present invention, there is provided an exposure processing section for performing exposure processing on a substrate, a heat treatment section for performing heat treatment on the exposed substrate, and transporting the substrate subjected to exposure processing in the exposure processing section to the heat treatment section. Substrate transfer means.

According to a sixth aspect of the present invention, there is provided an exposure apparatus comprising: an exposure processing section for exposing a substrate; and a substrate transport means for transporting the substrate to the exposure processing section. Unit, a first substrate transfer unit dedicated to transfer the substrate subjected to the exposure processing from the exposure processing unit to the heat treatment unit, and a second substrate transfer unit to carry out the substrate heat-treated from the heat treatment unit to the outside Means are provided.

According to a seventh aspect of the present invention, in the exposure apparatus according to the fifth or sixth aspect, the heat treatment section includes a heat treatment section for heating the exposed substrate, and a heat treatment section for performing heat treatment by the heat treatment section. And a cooling unit for cooling the substrate.

According to an eighth aspect of the present invention, in the exposure apparatus according to the sixth aspect, a transfer time required for transferring the substrate from the exposure processing section to the heat treatment section by the first substrate transfer means, and a substrate in the heat treatment section. A first control means for controlling the heat treatment times to be kept constant.

According to a ninth aspect of the present invention, in the exposure apparatus according to the seventh aspect, the substrate is transferred from the heating processing section to the cooling processing section by the second substrate transfer means. The second control is performed so that the transport time required for transporting the substrate from the heat processing unit to the cooling processing unit by the transport unit, and the respective processing times of the substrates in the heat processing unit and the cooling processing unit are kept constant. Is provided.

In the substrate processing apparatus according to the first aspect of the present invention,
The substrate subjected to the exposure processing is put into a heat treatment unit, transported to a heat treatment section by a first substrate transport means, and subjected to heat treatment by the heat treatment section. In this case, the first substrate transfer means is used only for transferring the substrate to the heat treatment unit in the heat treatment unit. For this reason, the first substrate transfer means that has loaded the substrate into the heat treatment section immediately moves to the delivery position of the exposed substrate and is always in a standby state to receive the exposed substrate. Therefore,
When the substrate subjected to the exposure processing is transported to the transfer position of the substrate, the substrate is directly transported to the heat treatment unit by the first substrate transport unit without waiting. For this reason, the time required to heat the exposed substrate is reduced, and the time required from the completion of the exposure processing of the substrate to the time when the heat processing is performed is not varied between the substrates. Therefore, when a chemically amplified resist is used,
The effect of the alkali substance in the atmosphere is reduced and uniform, so that the chemical reaction of the resist is not hindered, and the progress of the chemical reaction does not vary between the substrates. The substrate that has been heat-treated (heated and cooled) by the heat-treating unit is carried out from the heat-treating unit to the interface unit by the second substrate transfer unit, passed from the interface unit to the substrate processing unit, and developed by the developing unit. You.

In the substrate processing apparatus according to the second aspect of the present invention,
The substrate carried into the heat treatment unit is conveyed to the heat treatment unit, is subjected to heat treatment by the heat treatment unit, is conveyed from the heat treatment unit to the cooling treatment unit, and is cooled by the cooling treatment unit.

In the substrate processing apparatus according to the third aspect of the present invention,
By the control of the first control means, the transfer time during which the substrate is transferred to the heat treatment section immediately after the end of the exposure processing and the heat treatment time of the substrate in the heat treatment section are kept constant, so that the processing histories between the substrates can be equalized. Therefore, the management of the processing quality is facilitated, and the processing quality between the substrates is made uniform.

In the substrate processing apparatus according to the fourth aspect of the present invention,
The substrate that has been subjected to the heat treatment from the heat treatment unit by the second substrate carrying means is carried to the cooling treatment unit. Then, by the control of the second control means, the heat treatment time of the substrate in the heat treatment unit, the transport time of the substrate from the heat treatment unit to the cooling treatment unit, and the cooling time of the substrate in the cooling treatment unit are each constant. Since it is kept, the history of the heat treatment between the substrates is equalized, the management of the processing quality becomes easy, and the processing quality between the substrates becomes uniform.

In the exposure apparatus according to the fifth aspect of the present invention, the substrate exposed by the exposure processing section is immediately received by the substrate transfer means inside the apparatus and transferred to the heat treatment section. Done. For this reason, the time required for performing the heat treatment on the exposed substrate is reduced, and the variation in the time required for performing the heat treatment after the substrate exposure processing is completed is reduced. Therefore, when a chemically amplified resist is used, the influence of the alkali substance in the atmosphere is reduced and uniform,
The chemical reaction of the resist is not hindered, and the progress of the chemical reaction is less likely to vary between the substrates.

In the exposure apparatus according to the sixth aspect of the present invention, the substrate carried into the apparatus is transported to the exposure processing section by the substrate transport means, and is exposed by the exposure processing section. The substrate that has been subjected to the exposure processing is transferred to the heat treatment unit by the first substrate transfer unit, and is subjected to heat treatment by the heat treatment unit. In this case, the first substrate transfer means is used only for transferring the substrate to the heat treatment section in the exposure apparatus. For this reason,
The first substrate transfer means that has loaded the substrate into the heat treatment unit immediately moves to the delivery position of the exposed substrate and is always in a standby state to receive the exposed substrate. Therefore, when the exposed substrate is transported to the substrate transfer position, the substrate is directly transported to the heat treatment unit by the first substrate transport unit without being kept on standby. For this reason, the time required to heat the exposed substrate is reduced, and the time required from the completion of the exposure processing of the substrate to the time when the heat processing is performed is not varied between the substrates. Therefore, when a chemically amplified resist is used, the influence of an alkaline substance in the atmosphere is reduced and uniform, and the chemical reaction of the resist is not hindered. There is no variation between them. The substrate that has been heat-treated (heated and cooled) by the heat-treating unit is transferred from the heat-treating unit to a substrate transfer position with the outside of the apparatus by the second substrate transfer unit.

In the exposure apparatus according to the present invention, the substrate subjected to the exposure processing by the exposure processing unit is transported to the heating processing unit, subjected to the heating processing by the heating processing unit, and then transferred from the heating processing unit to the cooling processing unit. And cooled by the cooling unit.

In the exposure apparatus of the invention according to claim 8, the first
By the control by the control means, the transfer time during which the substrate is transferred to the heat treatment section immediately after the exposure processing is completed, and the heat treatment time of the substrate in the heat treatment section is kept constant.
The processing history between the substrates is equalized, the management of the processing quality becomes easy, and the processing quality between the substrates becomes uniform.

In the exposure apparatus according to the ninth aspect, the second
The substrate that has been subjected to the heat treatment from the heat treatment section by the substrate carrying means is carried to the cooling treatment section. Then, under the control of the second control means, the heat treatment time of the substrate in the heat treatment unit, the transfer time of the substrate from the heat treatment unit to the cooling treatment unit,
In addition, since the cooling processing time of the substrate in the cooling processing unit is kept constant, the history of the heat treatment between the substrates is equalized, the management of the processing quality is facilitated, and the processing quality between the substrates is improved. Becomes uniform.

[0032]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 is a schematic structural view of an entire apparatus in which an exposure apparatus is connected to a substrate processing apparatus according to the present invention. This substrate processing apparatus 10 has an indexer unit ID and a transport unit T, similarly to the substrate processing apparatuses 1 and 3 shown in FIGS.
R, a substrate processing area 12 having a plurality of substrate processing units, and an interface unit IF.
In the substrate processing area 12, the substrate processing apparatus 3 shown in FIG.
Similarly to the above, a coating processing section SC, an adhesion section AH, four heating processing sections HP1 to HP4, three cooling processing sections CP1, CP2, CP4, and two development processing sections SD1, SD2 are arranged. In the substrate processing apparatus 10, instead of arranging the bake unit PEB and the cooling processing unit CP3 in the substrate processing area 12 and the interface IF, the heat treatment unit 14 is added to the substrate processing apparatus 10.
And the bake part PEB and the cooling part CP3 are arranged in the heat treatment unit 14. This heat treatment unit 1
Numeral 4 is disposed at an end of the substrate processing apparatus 10 facing the exposure apparatus ST so as to be interposed between the interface IF and the exposure apparatus ST.

An example of the configuration of the interface section IF and the heat treatment unit 14 will be described with reference to the schematic plan view shown in FIG. First, the interface unit IF is provided with a substrate transfer unit P that transfers a substrate W to and from the transport unit TR at a position facing one end of the transport unit TR (see FIG. 1). A plurality of, for example, three support pins 16 are implanted in the substrate transfer section P. Then, the substrate W before the exposure processing transferred by the substrate transfer robot (not shown) of the transfer unit TR is transferred and supported on the support pins 16, and the exposure processing is performed on the support pins 16. Is supported, and the substrate transport robot of the transport unit TR receives the substrate W from above the support pins 16. A substrate transfer robot 18 having a substrate transfer arm 20 is disposed at a position facing one end of the transport unit TR with the substrate transfer portion P interposed therebetween. The substrate transfer robot 18 moves up and down the arm 20 and expands and contracts in the longitudinal direction.
0 is configured to rotate within an angle range of 180 ° in a horizontal plane.

A substrate unloading table 22 for transferring a substrate W before exposure processing to the exposure apparatus ST is provided at a position facing the substrate transfer section P with the substrate transfer robot 18 interposed therebetween. Further, at a position facing the substrate transfer robot 18 and at an angle of 90 ° with the substrate transfer unit P and the substrate unloading table 22, a substrate loading table 30 for receiving the exposed substrate from the processing unit 14 is provided. It is arranged. A plurality of, for example, three support pins 26 and 32 are implanted in the substrate carrying-out table 22 and the substrate carrying-in table 30, respectively, and the substrate W is supported on the support pins 26 and 32. The substrate unloading table 22 and the substrate unloading table 30 are respectively disposed on both sides of the support pins 26 and 32 so as to face each other, and are movably supported so as to be separated from and approach to each other. Guide plates 28a, 28b; 3
A substrate centering mechanism composed of 3a and 33b is provided. Each guide plate 28a, 28b; 33a, 3
3b, the edges facing each other are formed in an arc shape in accordance with the outer peripheral edge shape of the substrate W, and when the pair of guide plates 28a, 28b; 33a, 33b approach each other, each guide plate 28a, 28b; the arc-shaped edges of 33a and 33b abut against the outer peripheral edge of the substrate W, whereby the substrate W is aligned and positioned with respect to the substrate carrying-out table 22 and the substrate carrying-in table 30. I have.

Next, the heat treatment unit 14 is provided with a bake section PEB and a cooling section CP3. The bake part PEB and the cooling processing part CP3 are arranged vertically as shown in a schematic front view in FIG. A hot plate 34 is provided in the upper bake portion PEB, and a plurality of, for example, three support pins that move vertically through a through hole (not shown) formed in the hot plate 34. 36 are provided. Then, the baking unit PEB receives the substrate W in a state where the support pins 36 are raised,
Thereafter, when the support pins 36 are lowered, the substrate W is brought into contact with or close to the upper surface of the hot plate 34 as shown by a two-dot chain line, and the substrate W is subjected to heat treatment in that state. After the heat treatment, the support pins 36 are raised,
The substrate W is separated from the upper surface of the hot plate 34, and in this state, the substrate W is taken out from the bake portion PEB. Also,
A cool plate 38 is provided in the lower cooling processing unit CP1, and although not shown, moves in the vertical direction through a through hole formed in the cool plate 38, like the bake unit PEB. , For example, three support pins are provided. Then, the cooling processing unit CP1 receives the substrate W with the support pins raised, and then lowers the support pins to bring the substrate W into contact with or close to the upper surface of the cool plate 38, and cool the substrate W in that state. Process,
After the cooling process, the support pins are lifted to separate the substrate W from the upper surface of the cool plate 38, and the substrate W is taken out in this state. The baking part PEB and the cooling part CP1
May not be arranged vertically, but may be arranged horizontally. Further, instead of separately providing the bake section PEB and the cooling section CP1, a heat treatment section having a plate having both functions of a hot plate and a cool plate by using a Peltier element may be used.

The heat treatment unit 14 is provided with a substrate transport unit 40.
Are provided with two substrate transfer robots 42 and 46 having substrate transfer arms 44 and 48, respectively.
The arms 44 and 48 of the substrate transfer robots 42 and 46 respectively move up and down, expand and contract in the longitudinal direction, and further rotate in a horizontal plane. The one substrate transfer robot 42 has a moving mechanism that linearly reciprocates between a position facing the substrate unloading position of the exposure apparatus ST and a position in front of the bake unit PEB (cooling processing unit CP1). Yes,
The other substrate transport robot 46 has a moving mechanism that linearly reciprocates between a position in front of the cooling processing unit CP1 (bake unit PEB) and a position of the interface unit IF facing the substrate loading table 30. I have. Then, the substrate transport robot 42 sends the exposed substrate W from the exposure apparatus ST.
Is received, and the substrate W is loaded into the baking unit PEB. Further, the substrate transport robot 46 takes out the substrate W heated by the baking unit PEB from the baking unit PEB, throws the substrate W into the cooling processing unit CP1, and
The substrate W cooled by the cooling processing unit CP1 is taken out of the cooling processing unit CP1, and transported to the substrate loading table 30 of the interface unit IF. Then, the substrate transport robot 42 transports the substrate W immediately after the completion of the exposure processing to the bake part PEB, the processing time for heating the substrate W in the bake part PEB, and the substrate transport robot 46 from the bake part PEB to the cooling processing part CP3. The transport time for transporting the substrate W to the substrate W and the processing time for cooling the substrate W in the cooling processor CP3 are controlled by a controller (not shown) so as to be kept constant.

The operation of the interface unit IF and the heat treatment unit 14 shown in FIG. 3 will be described. A substrate W having a resist film formed on its surface before exposure processing is transferred from the transport unit TR to the substrate transfer unit P of the interface unit IF.
The substrate W is transferred to the support pins 26 of the substrate unloading table 22 by the substrate transfer robot 18 and is positioned by the pair of guide plates 28a and 28b. You. Then, the substrate W is transferred from above the support pins 26 to the exposure apparatus ST by a substrate transport mechanism (not shown) of the exposure apparatus ST, and is loaded into an exposure processing section (not shown) of the exposure apparatus ST. When the exposure processing by the exposure processing unit is completed, the substrate W after the exposure processing is transferred to the exposure apparatus S by the substrate transport mechanism of the exposure apparatus ST.
The substrate is transferred to the substrate unloading position of T, and is transferred from the substrate unloading position of the exposure apparatus ST to the baking unit PEB by the substrate transfer robot 42 of the heat treatment unit 14. Then, the substrate W after the exposure processing is heated by the baking unit PEB, and then transferred from the baking unit PEB to the cooling processing unit CP1 by the substrate transfer robot 46, and the substrate W after the heating processing is cooled. The substrate W subjected to the exposure processing and the heating and cooling processing is cooled by a cooling processing unit C by the substrate transfer robot 46.
Board loading table 30 of interface section IF from P1
And is supported on the support pins 32. Then, the substrate W that has been subjected to the exposure processing is a pair of guide plates 33a and 33b.
After being positioned by the substrate transfer robot 18, the support pins 1 of the substrate transfer portion P are
6 and transferred out of the interface unit IF by the substrate transfer robot (not shown) of the transfer unit TR and transferred to the development processing units SD1 and SD2 (see FIG. 1).

FIG. 2 shows a substrate processing flow in the substrate processing apparatus 10 and the exposure apparatus ST shown in FIG. The substrate processing procedure will be described with reference to FIG. 2. First, the substrates before processing stored in the cassette are supplied to the transport unit TR one by one from the indexer unit ID. The substrates supplied to the transport unit TR are transported to the adhesion section AH, the cooling processing section CP2, the coating processing section SC, the heating processing sections HP1, HP2, and the cooling processing section CP2 in order, and required by the respective substrate processing sections. Is performed. Thereby, a resist film is applied and formed on the surface of the substrate. Next, the substrate having the resist film formed on the surface is transferred from the transport unit TR to the interface unit IF, and is carried into the exposure apparatus ST through the interface unit IF by the above-described operation. Then, the exposure apparatus S
The substrate is subjected to the exposure processing in the exposure processing section of T, and the substrate after the exposure processing is
It is carried into 4. The substrate subjected to the exposure processing carried into the heat treatment unit 14 is subjected to the heating operation in the baking unit PEB, then the cooling processing in the cooling processing unit CP3, and then returned to the interface unit IF by the above-described operation. It is delivered to the transport unit TR through the interface unit IF. The substrates subjected to the exposure processing returned to the transport unit TR are subjected to development processing sections SD1, SD2, heat treatment sections HP3, H
The required processing is performed by the respective substrate processing units while being sequentially transported to the P4 and the cooling processing unit CP4. As a result, a resist film having a desired pattern is formed on the surface of the substrate, and the substrate having the resist film having the desired pattern formed on the surface is transferred from the transport unit TR to the indexer unit I.
D and is stored in the cassette on the indexer ID.

Next, an exposure apparatus according to the present invention will be described with reference to FIG. FIG. 5 shows Embodiment 1 of the present invention.
It is a schematic plan view of an exposure apparatus showing an example.

The exposure apparatus 50 has a bake section PEB and a cooling section CP3 in itself, and is used by being connected to a substrate processing apparatus in which the bake section PEB and the cooling section CP3 are not provided. The exposure device 50 includes:
An exposure processing section 52 provided with a stepper (not shown), and a substrate W before exposure processing received from an interface section IF of the substrate processing apparatus, and the substrate W is processed by the exposure processing section 52
In addition to the substrate transfer unit 54 having the substrate transfer robot 56 to be loaded into the
4 are provided. Arm 6 of each substrate transfer robot 58, 62
Each of 0 and 64 moves up and down, expands and contracts in its longitudinal direction, and further rotates in a horizontal plane. The one substrate transport robot 58 has a moving mechanism that linearly reciprocates between a substrate transfer position with the exposure processing unit 52 and a position in front of the bake unit PEB (cooling processing unit CP1). The other substrate transfer robot 62 includes a cooling unit CP
1 (bake part PEB) forward position and interface part I
It has a moving mechanism that linearly reciprocates between a substrate unloading position where the substrate W is unloaded to F. Then, the substrate transport robot 58 immediately receives the substrate W after the exposure processing taken out from the exposure processing unit, and puts the substrate W into the baking unit PEB. Further, the substrate transfer robot 62
The substrate W heated by the bake part PEB is taken out of the bake part PEB, and the substrate W is cooled.
The substrate W cooled by the cooling processing unit CP1 is taken out of the cooling processing unit CP1, and transported to a substrate unloading position which is a boundary position with the interface unit IF of the substrate processing apparatus. Then, a transport time for transporting the substrate W immediately after being taken out of the exposure processing unit 52 by the substrate transport robot 58 to the bake unit PEB, a processing time for heating the substrate W in the bake unit PEB,
Substrate W from bake part PEB to cooling processing part CP3 by 2
And a processing time for cooling the substrate W in the cooling processing unit CP3 are controlled by a controller (not shown) so as to be kept constant.

In the exposure apparatus 50 shown in FIG. 5, the substrate transport robot 58 is used only to transport the substrate W exposed by the exposure processing unit 52 to the baking unit PEB. Therefore, immediately after the substrate W is loaded into the bake unit PEB, the substrate transfer robot 58
To the substrate transfer position, and the exposure processing unit 52
Is waiting for the next substrate W to be taken out.
Therefore, when the substrate W subjected to the exposure processing by the exposure processing unit 52 is transported to the substrate transfer position, the substrate W is directly transported to the bake unit PEB by the substrate transport robot 58 without being kept on standby. For this reason, the time from the completion of the exposure processing of the substrate W by the exposure processing unit 52 to the time when the heating processing of the substrate W is performed by the baking unit PEB is extremely shortened, and the transfer time during that time varies between the substrates. Disappears.

In the exposure apparatus of the above-described embodiment, an example has been shown in which the substrate W after the exposure processing from the exposure processing section is taken out and the substrate W is carried to the bake section PEB by another substrate carrying means. However, this may be realized by one substrate transfer means. Also in this case, the time from the end of the exposure processing to the time when the substrate W is heated by the bake portion PEB can be shortened as compared with the conventional case.

[0044]

When the substrate processing apparatus according to the first aspect of the present invention is used, the time required to heat the exposed substrate is reduced, and the substrate is heated after the exposure processing is completed. Since there is no variation between substrates in the time required, when a chemically amplified resist is used, the effects of alkali substances in the atmosphere are reduced and uniform, and the chemical reaction of the resist is hindered. In addition, the progress of the chemical reaction does not vary between the substrates. Therefore, it is possible to prevent the deterioration of the development processing quality and to make the development processing quality uniform, and as a result, the product yield is improved.

In the substrate processing apparatus according to the second aspect of the present invention,
The substrate is subjected to heat treatment by the heat treatment unit in the heat treatment unit within a short period of time after the exposure treatment, and then cooled by the cooling treatment unit.

In the substrate processing apparatus according to the third aspect of the present invention,
The processing history between the substrates is equalized, the management of the processing quality becomes easy, and the processing quality between the substrates becomes uniform.

In the substrate processing apparatus according to the fourth aspect of the present invention,
The history of the heat treatment between the substrates is equalized, the management of the processing quality is facilitated, and the processing quality between the substrates is made uniform.

In the exposure apparatus according to the fifth aspect of the present invention, the time required to heat the exposed substrate is reduced.
In addition, variations in the time from the completion of the exposure processing of the substrates to the time of the heating processing between the substrates are reduced. Therefore,
When a chemically amplified resist is used, the influence of an alkaline substance in the atmosphere is reduced and uniform, so that the chemical reaction of the resist is not hindered. Variations are reduced.

When the exposure apparatus according to the sixth aspect of the present invention is used, the time required for receiving the exposed substrate from the exposure processing unit and performing the heating process is extremely shortened, and after the substrate exposure process is completed. Since there is no variation between substrates in the time until heat treatment, when a chemically amplified resist is used, the influence of an alkaline substance in the atmosphere is reduced and uniform, and the chemical reaction of the resist is reduced. And the progress of the chemical reaction does not vary between the substrates. Therefore, it is possible to prevent the deterioration of the development processing quality and to make the development processing quality uniform, and as a result, the product yield is improved.

In the exposure apparatus according to the seventh aspect of the present invention, the substrate exposed by the exposure processing section is heat-treated by a heating processing section provided within the apparatus within a short period of time after the exposure processing for a certain period of time. After the cooling process, the cooling process is performed.

In the exposure apparatus according to the eighth aspect of the present invention, the processing history between the substrates is equalized, the management of the processing quality is facilitated, and the processing quality between the substrates is made uniform.

In the exposure apparatus according to the ninth aspect of the present invention, the history of the heat treatment between the substrates is equalized, the management of the processing quality is facilitated, and the processing quality between the substrates is made uniform.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of an entire apparatus in which an exposure apparatus is connected to a substrate processing apparatus according to the present invention.

FIG. 2 is a diagram illustrating a substrate processing flow in the substrate processing apparatus and the exposure apparatus illustrated in FIG. 1;

FIG. 3 is a schematic plan view showing an example of a configuration of an interface unit and a heat treatment unit of the substrate processing apparatus shown in FIG.

FIG. 4 is a schematic front view illustrating an example of a configuration of a baking unit and a cooling processing unit in the heat treatment unit of the substrate processing apparatus illustrated in FIG.

FIG. 5 is a schematic plan view showing one embodiment of an exposure apparatus according to the present invention.

FIG. 6 is a schematic configuration diagram illustrating an example of a conventional substrate processing apparatus.

FIG. 7 is a flowchart illustrating a substrate processing flow in the substrate processing apparatus and the exposure apparatus illustrated in FIG. 6;

FIG. 8 is a schematic configuration diagram showing another example of a conventional substrate processing apparatus.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Substrate processing apparatus 12 Substrate processing area 14 Heat treatment unit 18 Substrate transfer robot 22 Substrate carry-out table 30 Substrate carry-in table 40 Substrate transfer unit 42, 46, 56, 58, 62 Substrate transfer robot 50 Exposure device 52 Exposure processing part 54 Substrate transport unit ID Indexer unit TR Transport unit IF interface unit SC Coating unit AH Adhesion unit HP1 to HP4 Heat processing unit CP1 to CP4 Cooling unit PEB Heating unit (bake unit) for heating substrate after exposure processing SD1, SD2 Development processing unit ST Exposure device P Substrate transfer unit

Continued on the front page (72) Inventor Yasuo Imanishi 322 Hashinashi Furukawacho, Fushimi-ku, Kyoto-shi Dainichi Screen Manufacturing Co., Ltd.Rakusai Office (72) Inventor Yuki Iwami 322 Hazushi-Furukawa-cho, Fushimi-ku, Kyoto-Dainhon Inside Screen Manufacturing Co., Ltd. (72) Joichi Nishimura, Inventor Johichi Nishimura 322 Hahazushi Furukawacho, Fushimi-ku, Kyoto-shi Dainichi Inside Screen Manufacturing Co., Ltd. (72) Inventor Akihiko Morita Hashizushi Furukawacho, Fushimi-ku, Kyoto-shi 322 Dainichi Screen Manufacturing Co., Ltd.Rakusai Office (72) Inventor Takanori Kawamoto 322 Hainashishi Furukawacho, Fushimi-ku, Kyoto Dainichi Screen Manufacturing Co., Ltd.Rakusai Office

Claims (9)

[Claims] 1. A substrate processing apparatus comprising: an interface unit for transferring a substrate; and a substrate processing unit having at least a developing unit for developing the exposed substrate. A heat treatment unit, a first substrate transfer unit dedicated to transfer the substrate exposed to the heat treatment unit to the heat treatment unit, and a second substrate transfer unit to unload the substrate heat-treated from the heat treatment unit to the interface unit. Wherein the exposed substrate is transported to the interface unit via the heat treatment unit, transferred from the interface unit to the substrate processing unit, and developed by the developing unit. A substrate processing apparatus characterized by the above-mentioned. 2. A heat treatment unit of the heat treatment unit, comprising: a heat treatment unit for heating the exposed substrate; and a cooling unit for cooling the substrate heated by the heat treatment unit. 2. The substrate processing apparatus according to 1. 3. A control is performed such that a transfer time required for transferring the substrate immediately after the exposure processing to the heat treatment section by the first substrate transfer means and a heat treatment time of the substrate in the heat treatment section are kept constant. The substrate processing apparatus according to claim 1, further comprising a first control unit. 4. A substrate is transported from the heat processing section to the cooling section by the second substrate transport section, and is required for transport of the substrate from the heat processing section to the cooling section by the second substrate transport section. 3. The substrate processing apparatus according to claim 2, further comprising a second control unit that controls the transport time and each processing time of the substrate in the heat processing unit and the cooling processing unit to be kept constant. 4. 5. An exposure processing section for exposing a substrate, a heat treatment section for heat-treating the exposed substrate, and a substrate transfer section for transferring the substrate exposed in the exposure processing section to the heat treatment section. An exposure apparatus for substrate processing, comprising: 6. An exposure apparatus comprising: an exposure processing section that performs exposure processing on a substrate; and a substrate transport unit that transports the substrate to the exposure processing section. Dedicated substrate transfer means for transferring the substrate subjected to the exposure processing from the heat treatment section to the heat treatment section, and second substrate transfer means for carrying out the heat-treated substrate from the heat treatment section to the outside An exposure apparatus for processing a substrate, comprising: 7. The heat treatment unit according to claim 5, wherein the heat treatment unit comprises a heat treatment unit for heating the exposed substrate, and a cooling treatment unit for cooling the substrate heated by the heat treatment unit. Item 7. An exposure apparatus for processing a substrate according to Item 6. 8. A transport time required for transporting the substrate from the exposure processing section to the heat treatment section by the first substrate transport means, and
7. The substrate processing exposure apparatus according to claim 6, further comprising first control means for controlling a heat treatment time of the substrate in the heat treatment unit to be kept constant. 9. The transfer of the substrate from the heat treatment section to the cooling processing section by the second substrate transfer means, which is required for the transfer of the substrate from the heat treatment section to the cooling processing section by the second substrate transfer means. 8. The substrate processing exposure apparatus according to claim 7, further comprising a second control unit for controlling the transport time and each processing time of the substrate in the heating processing unit and the cooling processing unit to be kept constant. .