JPH10137664A - Rotating type substrate treatment device and treatment method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a rotating type substrate treatment device and a treatment method thereof for cleaning sufficiently a substrate retaining means without lowering throughput in the stage of treating a substrate. SOLUTION: A rotating component 2 of a rotation retaining section 1 is fixed horizontally on the end of a shaft 4 of a motor 3 and rotated around the shaft in the vertical direction. The shaft 4 of the motor 3 is constituted of a hollow body, and a back rinse nozzle 7 for cleaning the back is inserted therein. The back rinse nozzle 7 runs through the rotating component 2 and is protruded on the back face side of a substrate 100. A first jet opening 71 is provided on the upper end of the back rinse nozzle 7, while a second jet opening 72 is provided on the peripheral wall near the upper end. The back of the substrate 100 is cleaned by a back rinse liquid jetted out of the first jet opening 71 of the back rinse nozzle, and the rotation retaining section 1 is cleaned by a back rinse liquid jetted out of the second jet opening 72 at the time of cleaning of the back of the substrate 100.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a rotary substrate processing apparatus for performing a predetermined processing on a substrate while rotating the substrate, and a processing method therefor.

[0002]

2. Description of the Related Art In a rotary substrate processing apparatus such as a rotary coating apparatus and a rotary developing apparatus, substrates such as a semiconductor wafer, a glass substrate for a liquid crystal display, a glass substrate for a photomask, and a glass substrate for an optical disk are horizontally held. It is necessary to rotate while holding. Generally, a suction-type spin chuck that sucks and holds the back surface of a substrate by vacuum suction is used.

However, in the suction-type spin chuck, strong suction is performed to surely hold the substrate by suction, so that a suction mark remains on the back surface of the substrate. Further, when cleaning foreign matter such as particles (particles) adhered to the back surface of the substrate with the back rinse liquid, the suction portion and its surroundings cannot be sufficiently cleaned by the spin chuck, and the back surface of the substrate is contaminated with particles. If there is an adsorption mark or an adhering substance on the back surface of the substrate, a focus abnormality may be caused during the exposure processing.

Therefore, there has been proposed a mechanical spin chuck which transmits a rotational force to a substrate while supporting a rear surface of the substrate and holding an outer peripheral end surface of the substrate. FIG. 6 is a sectional view showing an example of a conventional rotary substrate processing apparatus using a mechanical spin chuck.

In FIG. 6, a rotation holding unit (mechanical spin chuck) 1 has a circular plate-shaped rotation member 2. The rotating member 2 is horizontally fixed to a tip of a shaft 4 of a motor (not shown), and is driven to rotate around a vertical axis P.

On the upper surface of the rotating member 2, a plurality of support pins 5 for supporting the back surface of the substrate 100 and a plurality of holding pins 6 for regulating the horizontal position of the substrate 100 are provided. Between each holding pin 6 and the outer peripheral end surface of the substrate 100, the substrate 10
A slight gap is provided to facilitate loading and unloading of zeros.

When the rotation holding unit 1 is driven to rotate about a vertical axis P, some of the plurality of holding pins 6
The substrate 100 rotates together with the rotation holding unit 1 while being pressed against the outer peripheral end surface of the substrate 100 while the center of the substrate 100 is slightly eccentric from the center of rotation.

The shaft 4 of the motor is formed of a hollow body, and a back rinse nozzle 20 for cleaning the back surface is inserted therein. The back rinse nozzle 20 penetrates the rotating member 2 and protrudes to the back surface side of the substrate 100.
A cup (not shown) is provided so as to surround the rotation holding unit 1.

During processing of the substrate 100, the processing liquid discharge nozzle (not shown) moves above the central portion of the substrate 100 while the substrate 100 held by the rotation holding unit 1 is rotationally driven, and the processing liquid discharge nozzle A processing liquid such as a resist liquid or a developing liquid is discharged from the nozzle onto the surface of the substrate 100. For example, when the processing liquid is a resist liquid, a resist coating film 110 is formed on the surface of the substrate 100. The coating film 110 on the periphery of the substrate 100 is removed by cleaning with a solvent discharged from the edge cleaner nozzle 9.

At the time of cleaning the back surface of the substrate 100, the back rinse liquid is supplied from the back rinse nozzle 20 to the center of the back surface of the substrate 100 while the substrate 100 held by the rotation holding unit 1 is driven to rotate around the vertical axis P. Discharged. The back rinse liquid discharged to the center of the back surface of the substrate 100 flows outward along the back surface of the substrate 100 due to centrifugal force and is shaken outward from the outer periphery of the substrate 100. Thus, the entire back surface of the substrate 100 can be cleaned with the back rinse liquid.

[0011]

As described above, in the rotation holding section 1 of the conventional rotary substrate processing apparatus, the substrate 100 is supported at a predetermined height on the rotating member 2 by the plurality of support pins 5, Since there is a gap between the substrate 100 and the rotating member 2, the entire back surface of the substrate 100 can be cleaned with the back rinse liquid discharged from the back rinse nozzle 20, and no contamination of the back surface of the substrate 100 occurs.

However, the rotation holding unit 1 is not
, The processing liquid scattered during the processing of the substrate 100 adheres to the outer peripheral portion of the rotating member 2 and the holding pins 6, and a mist (splash) of the processing liquid is generated between the substrate 100 and the rotating member 2. And penetrates below the substrate 100 from the gap, and adheres to the upper surface of the rotating member 2 and the support pins 5. Rotation holding unit 1
The processing liquid adhered to the substrate 100 may become particles during the rotation processing of the substrate 100 and adhere to the substrate 100.

Substrate 100 with back rinse nozzle 20
When cleaning the back surface of the substrate 100, the cleaning liquid discharged from the back rinse nozzle 20 flows outward along the back surface of the substrate 100 as it is, and hardly touches the rotating member 2 and the holding pins 6 of the rotation holding unit 1 and the outer peripheral portion of the substrate 100. It is shaken out from outside. Therefore, when the back surface of the substrate 100 is cleaned, the rotation holding unit 1 itself cannot be cleaned simultaneously with the back surface cleaning of the substrate 100.

In the edge cleaning process using the edge cleaner nozzle 9, the solvent discharged from the edge cleaner nozzle 9 cleans the outer periphery of the rotating member 2 of the rotation holding unit 1 and a part of the holding pin 6. However,
The area of the rotation holding unit 1 and the support pins 5 below the substrate 100 are hardly washed.

As described above, in the conventional rotary substrate processing apparatus, the rotation holding unit 1 itself cannot be sufficiently cleaned during the processing of the substrate 100. It is not preferable to separately wash the rotation holding unit 1 after the processing of the substrate 100 because the throughput is reduced. Further, in that case, the temperature inside the cup is lowered due to the volatilization of the cleaning liquid only at the time of cleaning the rotation holding unit 1, which is not preferable because a non-uniform temperature environment is created.

An object of the present invention is to provide a rotary substrate processing apparatus and a processing method capable of sufficiently cleaning a substrate holding means (rotation holding section) without lowering throughput in a process of processing a substrate. .

[0017]

According to a first aspect of the present invention, there is provided a rotary substrate processing apparatus for holding a substrate in a horizontal posture, and rotating the substrate holding means about a vertical axis. Driving means for driving, and a first discharge port for discharging the cleaning liquid upward and a second discharge port for discharging the cleaning liquid laterally disposed at a central portion on the back side of the substrate held by the substrate holding means. And a cleaning liquid discharge nozzle.

In the rotary substrate processing apparatus according to the first invention, the substrate held by the substrate holding means in a horizontal position is rotated by the driving means around the axis in the vertical direction. It is driven to rotate around a vertical axis.

When cleaning the back surface of the substrate, the cleaning liquid is discharged upward from the first discharge port of the cleaning liquid discharge nozzle, and the cleaning liquid is discharged laterally from the second discharge port. First
The cleaning liquid discharged from the discharge port flows outward from the central portion of the substrate along the back surface of the substrate due to centrifugal force, and is shaken outward from the outer peripheral portion of the substrate. On the other hand, the cleaning liquid discharged from the second discharge port flows outward along the substrate holding means by centrifugal force and is shaken outward from the outer peripheral portion of the substrate holding means.

Thus, the entire back surface of the substrate is cleaned and the substrate holding means is cleaned. Therefore, it is possible to simultaneously clean the back surface of the substrate and the substrate holding means without lowering the throughput in the process of processing the substrate.

According to a second aspect of the present invention, there is provided a rotary substrate processing apparatus comprising:
In the configuration of the rotary substrate processing apparatus according to the first invention,
The driving unit includes a hollow rotating shaft arranged in a vertical direction, and a rotation driving unit that rotationally drives the rotating shaft around the vertical axis, and the substrate holding unit is horizontally attached to a tip of the rotating shaft. Rotating member, a plurality of supporting portions provided on the rotating member to support the back surface of the substrate, and a plurality of holding portions provided on the rotating member to regulate the horizontal position of the substrate, the cleaning liquid discharge nozzle A first discharge port is provided at a tip of the cleaning liquid discharge nozzle, the first discharge port being provided at a tip of the cleaning liquid discharge nozzle, being inserted into the rotary shaft, penetrating through the rotary member from the upper end of the rotary shaft, and protruding toward the back side of the substrate supported by the support portion. The discharge port is provided on the peripheral wall near the tip of the cleaning liquid discharge nozzle.

In this case, the cleaning liquid discharged from the first discharge port provided at the tip of the cleaning liquid discharge nozzle hits the center of the back surface of the substrate, flows outward along the back surface of the substrate by centrifugal force, and Is washed off from the outer peripheral portion of the substrate while cleaning the upper portions of the support portion and the plurality of holding portions. On the other hand, the cleaning liquid discharged from the second discharge port provided on the peripheral wall portion of the cleaning liquid discharge nozzle accumulates on the rotating member of the substrate holding means and moves outward along the upper surface of the rotating member of the substrate holding means by centrifugal force. And the lower part of the plurality of support parts and the plurality of holding parts is washed out from the outer peripheral part of the rotating member.

Therefore, when cleaning the back surface of the substrate, the upper surface of the rotating member of the substrate holding means, the plurality of support portions, and the plurality of holding portions are sufficiently cleaned. A rotary substrate processing apparatus according to a third aspect of the present invention is the rotary substrate processing apparatus according to the first or second aspect, wherein the second discharge port of the cleaning liquid discharge nozzle is in a horizontal direction or lower than the horizontal direction. It was directed outward. Thus, the substrate holding means below the substrate is efficiently cleaned.

A rotary substrate processing apparatus according to a fourth aspect of the present invention comprises:
A substrate holding means for holding the substrate in a horizontal position, a driving means for driving the substrate holding means to rotate about a vertical axis, and a central part on the back side of the substrate held by the substrate holding means, and A cleaning liquid discharge nozzle for discharging the cleaning liquid, wherein the driving means rotationally drives the substrate holding means at the first rotation speed when cleaning the back surface of the substrate by the cleaning liquid discharge nozzle, and holds the substrate when the cleaning liquid discharge nozzle cleans the substrate holding means. The means is rotated at a second rotation speed lower than the first rotation speed.

In the rotary substrate processing apparatus according to the fourth aspect of the present invention, the substrate held in the horizontal position by the substrate holding means is rotated by the driving means around the vertical axis. It is driven to rotate around a vertical axis.

When cleaning the substrate holding means, the substrate holding means is rotated at a lower speed than when cleaning the back surface of the substrate.
As a result, the cleaning liquid discharged from the cleaning liquid discharge nozzle hangs down from the back surface of the substrate to the substrate holding means, and the substrate holding means is cleaned by the cleaning liquid.

As described above, by controlling the rotation speed of the substrate holding means, it becomes possible to clean the substrate holding means without lowering the throughput during the processing of the substrate. A rotary substrate processing apparatus according to a fifth aspect of the present invention is the rotary substrate processing apparatus according to the fourth aspect, wherein the driving unit includes a hollow rotary shaft disposed in a vertical direction and a vertical rotary shaft. A rotation drive unit that rotates around an axis,
A substrate holding means, a rotating member horizontally attached to the tip of the rotating shaft, a plurality of support portions provided on the rotating member to support the back surface of the substrate, and a horizontal position of the substrate provided on the rotating member. The first rotation speed is equivalent to the speed at which the cleaning liquid discharged from the cleaning liquid discharge nozzle flows from the center to the outer periphery of the back surface of the substrate, and the second rotation speed is the processing liquid discharge. This corresponds to the speed at which the cleaning liquid discharged from the nozzle hangs down from the back surface of the substrate onto the rotating member around the cleaning liquid discharge nozzle.

During rotation at the first rotation speed, the cleaning liquid discharged from the cleaning liquid discharge nozzle hits the center of the back surface of the substrate and flows outward along the back surface of the substrate due to centrifugal force. The upper portion of the plurality of holding portions is washed off from the outer peripheral portion of the substrate while being washed. Thereby,
The entire back surface of the substrate is sufficiently cleaned. Further, at the time of rotation at the second rotation speed, the cleaning liquid discharged from the cleaning liquid discharge nozzle hangs down on the rotating member around the cleaning liquid discharge nozzle from the back surface of the substrate. The cleaning liquid dripping on the rotating member flows outward on the upper surface of the rotating member due to centrifugal force while collecting on the rotating member, and is removed from the outer peripheral portion of the rotating member while cleaning the lower portions of the plurality of support portions and the plurality of holding portions. Shake off towards you.

Therefore, the upper surface of the rotating member, the plurality of support portions, and the plurality of holding portions are sufficiently cleaned. A rotary substrate processing apparatus according to a sixth aspect of the present invention is the rotary substrate processing apparatus according to the fourth or fifth aspect, wherein the second rotation speed is approximately 100 revolutions / minute or less. Thus, at the time of rotation at the second rotation speed, the cleaning liquid discharged by the cleaning liquid discharging means hangs down from the back surface of the substrate to the substrate holding means below the substrate, and the substrate holding means is sufficiently cleaned.

A processing method in a rotary substrate processing apparatus according to a seventh aspect of the present invention is directed to a substrate holding means for holding a substrate in a horizontal position, a driving means for driving the substrate holding means to rotate about a vertical axis, A cleaning liquid discharge nozzle that is disposed at a central portion on the back surface side of the substrate held by the holding means and discharges a cleaning liquid upward, the cleaning method comprising: At the time of cleaning, the rotation speed of the substrate holding means is set to a predetermined speed or less, and the cleaning liquid discharged from the cleaning liquid discharge nozzle is dropped from the back surface of the substrate.

In this case, the cleaning solution dripping from the back surface of the substrate flows outward along the substrate holding means by centrifugal force and is shaken outward from the outer periphery of the substrate holding means. Therefore, it is possible to sufficiently clean the substrate holding unit without lowering the throughput in the process of processing the substrate.

[0032]

FIG. 1 is a sectional view of a rotary substrate processing apparatus according to a first embodiment of the present invention. In this embodiment, a rotary coating apparatus that applies a processing liquid such as a resist to a substrate will be described as an example of a rotary substrate processing apparatus.

In FIG. 1, a rotation holding unit (mechanical spin chuck) 1 includes a circular plate-shaped rotation member 2. The rotating member 2 is horizontally fixed to the tip of the shaft 4 of the motor 3 and is driven to rotate about a vertical axis P.

A plurality of support pins 5 for supporting the back surface of the substrate 100 and a plurality of holding pins 6 for regulating the horizontal position of the substrate 100 are provided on the upper surface of the rotating member 2. The plurality of holding pins 6 are arranged at equal distances from the rotation center of the rotation holding unit 1.

The shaft 4 of the motor 3 is formed of a hollow body, and a back rinse nozzle 7 for cleaning the back surface is inserted therein. The back rinse nozzle 7 penetrates the rotating member 2 and protrudes to the back surface side of the substrate 100.

FIG. 2 is an enlarged sectional view of the tip of the back rinse nozzle 7. As shown in FIG. 2, at the upper end of the back rinse nozzle 7, a first discharge port 71 for discharging the back rinse liquid is provided vertically upward, and the back rinse liquid is laterally discharged to a peripheral wall portion near the upper end. A second discharge port 72 is provided. A cylindrical portion 73 is provided around the second discharge port 72.

In FIG. 1, above the rotation holding unit 1,
A processing liquid discharge nozzle 8 for discharging a processing liquid such as a resist liquid is provided so as to be movable vertically and horizontally.
The processing liquid discharge nozzle 8 waits at a position deviated from above the substrate 100 before and after the processing liquid coating processing, and moves above the center of the substrate 100 during the processing liquid coating processing.

Above the periphery of the substrate 100, an edge cleaner nozzle 9 for discharging a solvent is movably disposed. The edge cleaner nozzle 9 removes the coating film on the peripheral portion of the surface of the substrate 100 by cleaning with a solvent during the edge cleaning process. Further, a cup 10 for preventing scattering of the processing liquid is disposed so as to freely move up and down so as to surround the rotation holding unit 1.

A series of operations such as rotation and stop of the motor 3, discharge of the processing liquid from the processing liquid discharge nozzle 8, and discharge of the back rinse liquid from the back rinse nozzle 7 are controlled by the control unit 11.

In this embodiment, the rotation holding unit 1 corresponds to a substrate holding unit, the motor 3 and the shaft 4 correspond to a driving unit, and the back rinse nozzle 7 corresponds to a cleaning liquid discharge nozzle. Further, the shaft 4 corresponds to a rotating shaft, and the motor 3 corresponds to a rotation driving unit. Further, the support pin 5 corresponds to a support portion, and the holding pin 6 corresponds to a holding portion.

Next, the operation of the rotary substrate processing apparatus of FIG. 1 will be described with reference to FIG. At the time of applying the processing liquid, the motor 3 drives the rotating member 1 to rotate about the vertical axis P, and the processing liquid discharge nozzle 8
And discharges the processing liquid to the center of the surface of the substrate 100. The processing liquid discharged to the center of the substrate 100 is spread to the peripheral portion of the surface of the substrate 100 by centrifugal force, and the coating liquid 1 of the processing liquid is applied to the entire surface of the substrate 100.
10 are formed.

At the time of the edge cleaning process, the solvent is discharged from the edge cleaner nozzle 9 and the coating film 110 on the peripheral portion of the surface of the substrate 100 is washed and removed. Substrate 1
In the back surface cleaning process of 00, the motor 3 drives the rotation holding unit 1 to rotate about the axis P in the vertical direction. In this state, the back rinse liquid is discharged substantially vertically upward from the first discharge port 71 of the back rinse nozzle 7, and the back rinse liquid is discharged substantially horizontally from the second discharge port 72.

The back rinse liquid discharged from the first discharge port 71 is moved from the center of the substrate 100 to the substrate 1 by centrifugal force.
The fluid flows outward along the rear surface of the substrate 100 and is washed off the outer periphery of the substrate 100 while cleaning the upper portions of the plurality of support pins 5 and the plurality of holding pins 6. The back rinse liquid discharged from the second discharge port 72 flows outward along the upper surface of the rotating member 2 due to centrifugal force while collecting on the bottom surface of the rotating member 2 of the rotation holding unit 1, and the plurality of support pins 5 and The lower part of the plurality of holding pins 6 is washed out from the outer peripheral part of the rotating member 2 while cleaning the lower part.

As described above, during the back surface cleaning process of the substrate 100, the upper surface of the rotating member 2 of the rotation holding unit 1, the plurality of support pins 5, and the plurality of holding pins 6 are sufficiently cleaned. In the rotary substrate processing apparatus of the present embodiment, it is possible to clean the rotation holding unit 1 during the back surface cleaning processing of the substrate 100 by only slightly improving the back rinse nozzle.

Further, in the rotary substrate processing apparatus of this embodiment, the amount of the back rinse liquid required for back surface cleaning is slightly increased as compared with the conventional rotary substrate processing apparatus. Since the holding unit 1 can be cleaned, a decrease in throughput does not occur.

Although the cylindrical portion 73 is formed around the second discharge port 72 in the example of FIG. 2, the second discharge port 72 is formed by simply providing a hole in the peripheral wall of the back rinse nozzle 7. May be formed.

Also, the discharge direction of the back rinse liquid from the second discharge port 72 may be outward below the horizontal.
It is appropriately selected according to the size of the rotation holding unit 1 and the discharge flow rate of the back rinse liquid.

FIG. 4 is a sectional view of a main part of a rotary substrate processing apparatus according to a second embodiment of the present invention. The rotary substrate processing apparatus of FIG. 4 differs from the rotary substrate processing apparatus of FIG. 1 in that a back rinse nozzle 20 having the same structure as that of the related art is provided instead of the back rinse nozzle 7 of FIG. Is that a control unit 12 is provided instead of

At the upper end of the back rinse nozzle 20, a discharge port 21 for discharging the back rinse liquid is provided upward. The control unit 12 controls the rotation of the rotation holding unit 1 during the back surface cleaning processing of the substrate 100 by a method described later. The configuration of other parts of the rotary substrate processing apparatus of FIG. 4 is the same as the configuration of the rotary substrate processing apparatus of FIG.

Next, the operation of the rotary substrate processing apparatus of FIG. 4 will be described with reference to FIG. FIG. 6 is a diagram illustrating an example of a change in the number of rotations of the rotation holding unit 1. At the time of applying the processing liquid, the control unit 12 drives the rotation holding unit 1 to rotate around the vertical axis P by the motor 3. In this state, the processing liquid discharge nozzle (not shown) moves above the central part of the substrate 100, and discharges the processing liquid to the central part of the surface of the substrate 100. In this way, for example, 3000 rpm (rotation /
In minutes, the treatment liquid is applied.

Next, at the time of cleaning the back surface of the substrate 100,
First, during the initial period T, the control unit 12 causes the motor 3 to rotate the rotation holding unit 1 at a low speed, for example, at 50 rpm. In this state, the discharge port 21 at the upper end of the back rinse nozzle 20
Back rinse liquid is discharged to the center of the back surface of the substrate 100. The back rinse liquid once drops on the rotating member 2 around the back rinse nozzle 20 as droplets after hitting the back surface of the substrate 100.

Thereafter, the control unit 12 increases the rotation speed of the rotation holding unit 1 to, for example, 1200 rpm. As a result, the back rinse liquid that has fallen on the rotating member 2 flows outward along the upper surface of the rotating member 2 due to centrifugal force, and cleans the lower parts of the plurality of support pins 5 and the plurality of holding pins 6 while rotating the holding part. It is shaken out from the outer periphery of 2.

At the same time, the back rinse liquid is discharged from the discharge port 21 of the back rinse nozzle 20 to the back surface of the substrate 100. The back rinse liquid discharged from the back rinse nozzle 20 flows outward from the center of the substrate 100 along the back surface of the substrate 100 due to centrifugal force, and the plurality of support pins 5
And the substrate 100 while cleaning the upper portions of the plurality of holding pins 6.
Is shaken outward from the outer periphery.

In this way, the upper surface of the rotating member 2 of the rotation holding unit 1, the plurality of support pins 5, and the plurality of holding pins 6 are sufficiently cleaned in the process of cleaning the back surface of the substrate 100.
In the rotary substrate processing apparatus according to the present embodiment, the rotation holding unit 1 can be cleaned during the back surface cleaning processing of the substrate 100 only by changing the processing program of the control unit 12. Further, since the rotation holding unit 1 can be cleaned in the processing sequence of the substrate 100, the throughput does not decrease.

In the second embodiment, the cleaning of the spin holder 1 is performed at the beginning of the back surface cleaning process of the substrate 100. However, the present invention is not limited to this.
It may be performed during the back surface cleaning process of 00 or at the end of the back surface cleaning process.

The rotation speed of the rotation holding unit 1 during washing is
When the discharge flow rate of the back rinse liquid is, for example, 80 cc / min, it is preferably about 30 rpm or more and about 100 rpm or less, but is appropriately selected according to the size of the rotation holding unit 1 and the discharge flow rate of the back rinse liquid. Further, after the back rinsing liquid is discharged with the rotation holding unit 1 stopped, the rotation holding unit 1 may be rotated.

The present invention can be applied not only to the rotary coating apparatus but also to various rotary substrate processing apparatuses such as a rotary developing apparatus and a rotary cleaning apparatus.

[Brief description of the drawings]

FIG. 1 is a sectional view of a rotary substrate processing apparatus according to a first embodiment of the present invention.

FIG. 2 is an enlarged cross-sectional view of a tip of a back rinse nozzle in the rotary substrate processing apparatus of FIG.

FIG. 3 is a sectional view for explaining an operation of the rotary substrate processing apparatus of FIG. 1;

FIG. 4 is a sectional view of a main part of a rotary substrate processing apparatus according to a second embodiment of the present invention.

5 is a diagram illustrating an example of a change in the number of rotations of a rotation holding unit in the rotary substrate processing apparatus of FIG. 4;

FIG. 6 is a sectional view showing an example of a conventional rotary substrate processing apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Rotation holding part 2 Rotating member 3 Motor 4 Rotating shaft 5 Support pin 6 Holding pin 7, 20 Back rinse nozzle 11, 12 Control part 71 First discharge port 72 Second discharge port 100 Substrate

Claims (7)

[Claims] 1. A substrate holding means for holding a substrate in a horizontal position; a driving means for driving the substrate holding means to rotate about a vertical axis; and a center of a backside of the substrate held by the substrate holding means. And a cleaning liquid discharge nozzle having a first discharge port for discharging the cleaning liquid upward and a second discharge port for discharging the cleaning liquid laterally. 2. The driving unit includes: a hollow rotary shaft disposed in a vertical direction; and a rotary driving unit that drives the rotary shaft to rotate around a vertical axis. A rotating member horizontally attached to a tip of a rotating shaft; a plurality of supporting portions provided on the rotating member to support a back surface of the substrate; and a plurality of supporting portions provided on the rotating member to regulate a horizontal position of the substrate. A plurality of holding portions, wherein the cleaning liquid discharge nozzle is inserted into the rotating shaft, protrudes from the upper end of the rotating shaft, penetrates the rotating member, and projects to the back surface side of the substrate supported by the support portion, 2. The rotary type according to claim 1, wherein the first discharge port is provided at a tip of the cleaning liquid discharge nozzle, and the second discharge port is provided at a peripheral wall portion near a tip of the cleaning liquid discharge nozzle. Substrate processing equipment. 3. The rotary substrate processing apparatus according to claim 1, wherein the second discharge port of the cleaning liquid discharge nozzle is directed outward in a horizontal direction or below the horizontal direction. 4. A substrate holding means for holding a substrate in a horizontal posture; a driving means for driving the substrate holding means to rotate about a vertical axis; and a center on the back side of the substrate held by the substrate holding means. A cleaning liquid discharge nozzle that discharges a cleaning liquid upward, wherein the driving unit rotationally drives the substrate holding unit at a first rotation speed when cleaning the back surface of the substrate by the cleaning liquid discharge nozzle, A rotary substrate processing apparatus, wherein the substrate holding means is rotated at a second rotation speed lower than the first rotation speed when the substrate holding means is cleaned by the cleaning liquid discharge nozzle. 5. The driving unit includes: a hollow rotary shaft disposed in a vertical direction; and a rotary driving unit that drives the rotary shaft to rotate around a vertical axis. A rotating member horizontally attached to a tip of a rotating shaft; a plurality of supporting portions provided on the rotating member to support a back surface of the substrate; and a plurality of supporting portions provided on the rotating member to regulate a horizontal position of the substrate. The first rotation speed corresponds to the speed at which the cleaning liquid discharged from the cleaning liquid discharge nozzle flows from the center to the outer periphery of the back surface of the substrate, and the second rotation speed is The rotary substrate processing apparatus according to claim 4, wherein the cleaning liquid discharged from the cleaning liquid discharge nozzle corresponds to a speed at which the cleaning liquid hangs down from the back surface of the substrate onto the rotating member around the cleaning liquid discharge nozzle. 6. The second rotation speed is approximately 100 rotations /
The rotary substrate processing apparatus according to claim 4, wherein the number is less than or equal to minutes. 7. A substrate holding means for holding a substrate in a horizontal posture, a driving means for driving said substrate holding means to rotate about a vertical axis, and a center on the back side of the substrate held by said substrate holding means. A cleaning liquid discharge nozzle that discharges a cleaning liquid upwardly disposed in a portion, wherein the cleaning liquid discharge nozzle cleans the back surface of the substrate by the cleaning liquid discharge nozzle, the rotation speed of the substrate holding unit. A cleaning liquid discharged from the cleaning liquid discharge nozzle from a back surface of the substrate at a predetermined speed or less.