JPH0399790A - Laser beam machine - Google Patents

Abstract

PURPOSE:To improve air bubble eliminating efficiency and machining efficiency by providing a liquid supply pipe on a part close to a condenser lens of a nozzle. CONSTITUTION:A laser beam 11 is condensed by the condenser lens 10 and a workpiece is irradiated with the laser beam and machined thereby. At this time, a liquid 14 such as an etching liquid is fed into the nozzle 13 from the liquid supply pipe 15 and the liquid 14 is sprayed toward a laser beam irradiation point from an opening of the nozzle tip. By this method, the laser beam 11 performs machining in the liquid and the liquid 14 injected from the nozzle 13 eliminates rapidly air bubbles generated on a machining point and the liquid 14 can be supplied up to the inner part of the machining point and machining efficiency can be improved.

Description

[Detailed Description of the Invention] [Summary] Regarding laser processing equipment that performs laser processing in liquid such as laser assisted etching, the purpose of this is to improve bubble removal efficiency and processing efficiency. In a laser processing device that performs processing by irradiating a workpiece with a laser beam, the laser beam irradiation unit includes a laser light source, a lens that focuses the light from the laser light source, and a beam that is focused by the focusing lens. and an inverted conical nozzle extending along the outside of the nozzle, and a liquid supply pipe is provided in a portion of the nozzle near the condenser lens.

[Industrial application field]

The present invention relates to a laser processing apparatus that performs laser processing in a liquid such as laser assisted etching.

With the expansion of the fields of use of highly brittle materials such as ceramics,
High precision and high quality processing is required.

For this purpose, the material is immersed in an etching solution such as Si, N, etc.
In the case of No. 4, a KDH aqueous solution) laser-assisted etching processing (1, AE processing), which performs selective etching using thermal energy or optical energy of a laser, has come to be used. However, since processing is carried out in a liquid, bubbles are generated at the laser irradiation part and processing cannot be carried out smoothly, so these bubbles must be removed.

[Conventional technology]

FIG. 4 shows a conventional LAE processing device. In this method, an etching solution 3 is poured into a closed container 2 having a glass window 1 from the side, and a laser beam 6 focused by a condensing lens 5 is directed onto a workpiece 4 placed inside the container. The light is irradiated through a glass window 1.

[Problem to be solved by the invention]

In the conventional LAE processing apparatus described above, bubbles generated during processing are efficiently removed by the flow of the etching liquid 3, but there is a problem in that the etching liquid cannot be supplied to the processing point and efficient processing cannot be performed. Also, the workpiece 4
Since it is housed in the airtight container 2, there is also the problem that it takes time and effort to replace it.

In view of the above-mentioned conventional problems, the present invention provides a laser processing unit (3) that is capable of improving bubble removal efficiency and processing efficiency.

[Means to solve the problem]

FIG. 1 is a diagram explaining the principle of the present invention.

In the figure, numeral 10 is a condensing lens, which condenses laser light 11 onto a workpiece 12 . 13 is an inverted conical nozzle provided to cover the outer periphery of the laser beam focused by the condensing lens 10, and has an opening at its tip through which the laser beam and a liquid such as an etching solution pass through. , a condenser lens 10 is airtightly attached to the base. Furthermore, a liquid 14 such as an etching liquid is placed in the upper part of the nozzle 13 near the lens.
A liquid supply pipe 15 is provided for feeding the liquid.

[For production]

The laser beam 11 is focused by a condensing lens 10 and irradiates the workpiece to perform processing. At this time, a liquid 14 such as an etching liquid is sent into the nozzle 13 from the liquid supply pipe 15 to close the opening at the tip of the nozzle. The liquid is sprayed (4) toward the laser irradiation point. As a result, the laser beam performs processing in the liquid, and the liquid ejected from the nozzle 13 can quickly remove air bubbles generated at the processing point and supply the liquid deep into the processing point.
Enables improvement of processing efficiency.

〔Example〕

FIG. 2 is a diagram showing an embodiment of the present invention.

In this embodiment, the housing 16 includes, for example, a carbon dioxide laser,
A laser light source 17 such as a YAG laser, a reflecting mirror 18, and a condensing lens 1 airtightly attached by an O ring 19.
0 is provided, and the tip of the housing 16 is provided with a nozzle 13.
It becomes. The laser beam 11 emitted from the laser light source 17 passes through a reflecting mirror 18 and is focused by a condensing lens 10 onto a processing point of the workpiece 12. The nozzle 13 has an inverted conical shape so as to cover the outer periphery of the laser beam condensed by the condenser lens 10, and an opening through which the laser beam and liquid pass is provided at the tip, and the nozzle 13 has an opening near the condenser lens at the base. A liquid supply pipe 15 is provided for feeding a liquid such as an etching liquid into the nozzle.

(5) The operation of this embodiment configured as described above will be explained with reference to FIG.

The liquid supply pipe 15 in this embodiment is connected to a pump 2 from a tank 20.
1 is connected to a pipe 22 through which liquid is sent, and the tip of the nozzle 13 is immersed together with the workpiece 12 in a water tank 23 filled with a liquid 14 such as an etching liquid. Laser light 11 emitted from laser light source 17 passes through reflection mirror 18 and is focused by condenser lens 10 onto the processing portion of workpiece 12 .

At the same time, a liquid 14 such as an etching liquid is fed into the nozzle 13 via the liquid supply pipe 15 by the pump 21, and is ejected from the opening at its tip. As a result, bubbles generated when the liquid 14 is heated by the laser beam can be removed, and the liquid 14 can be supplied deep into the processing section, thereby improving processing efficiency. The liquid 14 in the water tank 23 overflows the partition wall 24 to maintain a constant water level, and the overflowed liquid 14 returns to the tank 20 via a return pipe 25 and is used for circulation.

(6) [Effects of the Invention] As explained above, according to the present invention, there is no need for a conventional sealed container in LAE processing, and workpieces can be easily replaced. In addition, since air bubbles generated during processing can be efficiently removed and liquid such as etching liquid can be supplied deep into the processing area, highly efficient processing is possible.

[Brief explanation of drawings]

FIG. 1 is a diagram explaining the principle of the present invention, FIG. 2 is a diagram showing an embodiment of the present invention; FIG. 3 is a diagram for explaining the operation of the embodiment of the present invention; FIG. 4 is a diagram showing a conventional LAE processing device. In the figure, 10 is a condensing lens; 11 is a laser beam, 12 is a workpiece, 13 is Nozunobe 14 is liquid, 15 is a liquid supply pipe; (7) 16 is a housing; 17 is a laser light source; 18 is a reflective mirror 19 is ○ ring, 20 is a tank, 23 is an aquarium shows.

Claims (1)

[Claims] 1. In a laser processing device that performs processing by irradiating a workpiece immersed in a liquid with laser light, the laser light irradiation unit includes a laser light source (17) and a lens that focuses the light from the laser light source (17). (10) and the condenser lens (10
), and a liquid supply pipe (15) is provided in a part of the nozzle near the condensing lens (10). Laser processing equipment featuring: