JPH0394456A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPH0394456A JPH0394456A JP23110489A JP23110489A JPH0394456A JP H0394456 A JPH0394456 A JP H0394456A JP 23110489 A JP23110489 A JP 23110489A JP 23110489 A JP23110489 A JP 23110489A JP H0394456 A JPH0394456 A JP H0394456A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin molding
- parts
- attached
- prevent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 31
- 239000011347 resin Substances 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 230000035939 shock Effects 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract 6
- 238000000034 method Methods 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は外部に放熱体を取り付ける必要のある半導体装
置に関するものである.
従来の技術
従来、半導体装置の動作時に発生する熱を効率的に外部
へ放散させるために、熱伝導性の良t1リードフレーム
材を採用したり,半導体装置内に放熱ブロックを内蔵す
るなどの改良を加えてきた.さらに、熱放散効果をより
一層高めるために、半導体装置の外部に放熱体を接着剤
などで固定させたり、放熱体の材料自体が持つばね性を
利用し、半導体装置の側面を放熱体で挟んで取り付けて
いた.
発明が解決しようとする課題
しかしながら、上記の従来の構成において、接着剤を用
いて半導体装置の外部に放熱体を接続させた場合,半導
体装置との位置合わせの精度を十分に得ることが難しい
ほか,半導体装置と放熱体の間にある接着剤が熱伝達率
を低下させるという問題点がある.また,放熱体で半導
体装置の側面を挟んで取り付ける場合、振動や衝撃など
により半導体装置の側面の長さ方向に位置ずれが生じた
り、外れたりするという問題点がある.本発明はこのよ
うな課題を解決するもので,半導体装置の外部の所定位
置に放熱体を容易に熱伝達率が低下することなく取り付
けることができるようにすることを目的とするものであ
る.課題を解決するための手段
この課題を解決するために本発明は,半導体チップを封
入する樹脂或形体の外部に取り付けられる放熱体から脚
部を突設し、この脚部を前記樹脂或形体をから突設され
た突部で挟持するようにしたものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a semiconductor device that requires an external heat sink. Conventional technology In order to efficiently dissipate the heat generated during the operation of semiconductor devices to the outside, improvements have been made such as using T1 lead frame material with good thermal conductivity and incorporating heat dissipation blocks inside semiconductor devices. has been added. Furthermore, in order to further enhance the heat dissipation effect, it is possible to fix the heat sink to the outside of the semiconductor device with adhesive, or to use the springiness of the material of the heat sink to sandwich the sides of the semiconductor device between the heat sinks. It was installed with Problems to be Solved by the Invention However, in the conventional configuration described above, when the heat sink is connected to the outside of the semiconductor device using an adhesive, it is difficult to obtain sufficient alignment accuracy with the semiconductor device. However, there is a problem in that the adhesive between the semiconductor device and the heat sink reduces the heat transfer coefficient. Furthermore, when attaching the semiconductor device by sandwiching the side surface of the semiconductor device with a heat sink, there is a problem that the side surface of the semiconductor device may become misaligned in the length direction or come off due to vibration or impact. The present invention solves these problems and aims to enable a heat sink to be easily attached to a predetermined position outside a semiconductor device without reducing the heat transfer coefficient. Means for Solving the Problems In order to solve this problem, the present invention provides legs that protrude from a heat sink attached to the outside of a resin or shaped body that encapsulates a semiconductor chip, and connects the legs to the resin or shaped body. It is designed to be held by a protrusion that protrudes from the base.
作用
この構成により、半導体装置の樹脂成形体から突設され
た突部で放熱体の脚部を扶持するため,取り付けるとき
の位置合わせのずれや、取り付け後の振動や衝撃などに
よる位置ずれや外れを防止することができる.また、放
熱体取り付けのために接着剤を用いないため、放熱体の
着脱が容易で、かつ熱伝導率が低下しないことから、半
導体装置の品質および性能を長期に亘って維持すること
ができる。Function: With this configuration, the legs of the heat sink are supported by the protrusions protruding from the resin molded body of the semiconductor device, so there is no possibility of misalignment during installation or misalignment or dislodgement due to vibration or impact after installation. can be prevented. Further, since no adhesive is used to attach the heat sink, the heat sink can be easily attached and removed, and the thermal conductivity does not decrease, so the quality and performance of the semiconductor device can be maintained over a long period of time.
実施例
以下、本発明の一実施例について、図面に基づいて説明
する。EXAMPLE Hereinafter, an example of the present invention will be described based on the drawings.
第l図および第2図において、1は半導体装置の本体部
となる樹脂戒形体で、その内部には各電極端子がリード
部2の一端に結線された半導体チップが封入されており
、リード部2の他端側は樹脂威形体1の外方に引き出さ
れている.3は樹脂戒形体1の上面に当接するように設
けられる放熱体で、断面形状がほぼ一状を呈している。In FIGS. 1 and 2, reference numeral 1 denotes a resin-shaped body serving as the main body of the semiconductor device, and a semiconductor chip with each electrode terminal connected to one end of a lead part 2 is sealed inside the body. The other end of 2 is drawn out of the resin body 1. Reference numeral 3 denotes a heat sink provided so as to come into contact with the upper surface of the resin molded body 1, and has a substantially uniform cross-sectional shape.
この放熱体3は前記樹脂或形体工の上に重なるように設
けられて、両端に突設される脚部4の下端部が前記樹脂
成形体■の両端から突設された一対の突部5,5間に嵌
まり込み電気的に非接触で挟持されるようになっている
。なお、前記突部5,5は樹脂成形体工の内部に封止さ
れたリードフレームの一部であって,外方に突出してい
る。This heat dissipating body 3 is provided so as to overlap the resin or molded body, and the lower end portions of legs 4 protruding from both ends are connected to a pair of protrusions 5 protruding from both ends of the resin molded body (2). , 5, and are held between them without electrical contact. The protrusions 5, 5 are part of a lead frame sealed inside the resin molded body and protrude outward.
ところで,図面に示す実施例では前記リード部2のない
両端面で放熱体3の脚部4を扶持するようにしているが
,一端側で支持するようにしても良い。Incidentally, in the embodiment shown in the drawings, the legs 4 of the heat sink 3 are supported by both end faces without the lead part 2, but they may be supported by one end.
発明の効果
以上のように本発明によれば、半導体装置の樹脂成形体
から突設された突部で放熱体の脚部を挟持するため、取
り付けるときの位置合わせのずれや、取り付け後の振動
や衝撃などによる位置ずれや外れを防止することができ
る。また、放熱体取り付けのために接着剤を用いないた
め,放熱体の着脱が容易で、かつ熱伝導率が低下しない
ことから、半導体装置の品質および性能を長期に亘って
維持することができる。Effects of the Invention As described above, according to the present invention, since the legs of the heat sink are held between the protrusions protruding from the resin molded body of the semiconductor device, misalignment during installation and vibration after installation are avoided. It is possible to prevent misalignment or detachment due to shock or impact. Furthermore, since no adhesive is used to attach the heat sink, the heat sink can be easily attached and removed, and the thermal conductivity does not decrease, so the quality and performance of the semiconductor device can be maintained over a long period of time.
第1図は本発明の一実施例を示す半導体装置の正面図,
第2図は同斜視図である。
1・・・樹脂成形体、2・・・リード部,3・・・放熱
体、4・・・脚部,5・・・突部。FIG. 1 is a front view of a semiconductor device showing an embodiment of the present invention.
FIG. 2 is a perspective view of the same. DESCRIPTION OF SYMBOLS 1... Resin molded body, 2... Lead part, 3... Heat sink, 4... Leg part, 5... Protrusion part.
Claims (1)
けられる放熱体から脚部を突設し、この脚部を前記樹脂
成形体から突設された突部で挟持するようにした半導体
装置。1. 1. A semiconductor device in which legs are provided protruding from a heat sink attached to the outside of a resin molded body that encapsulates a semiconductor chip, and the legs are held between protrusions that protrude from the resin molded body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23110489A JPH0394456A (en) | 1989-09-06 | 1989-09-06 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23110489A JPH0394456A (en) | 1989-09-06 | 1989-09-06 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0394456A true JPH0394456A (en) | 1991-04-19 |
Family
ID=16918362
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23110489A Pending JPH0394456A (en) | 1989-09-06 | 1989-09-06 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0394456A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5521439A (en) * | 1993-04-05 | 1996-05-28 | Sgs-Microelectronics S.R.L. | Combination and method for coupling a heat sink to a semiconductor device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS622252B2 (en) * | 1982-07-26 | 1987-01-19 | Toyoda Chuo Kenkyusho Kk |
-
1989
- 1989-09-06 JP JP23110489A patent/JPH0394456A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS622252B2 (en) * | 1982-07-26 | 1987-01-19 | Toyoda Chuo Kenkyusho Kk |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5521439A (en) * | 1993-04-05 | 1996-05-28 | Sgs-Microelectronics S.R.L. | Combination and method for coupling a heat sink to a semiconductor device |
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