JPH0389540A - Hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To make insertion of a connector easier and, at the same time, to prevent occurrence of short circuit between the substrates and terminals of a hybrid integrated circuit by continuously coating the side face at the end section of the circuit where terminals are formed with a resin which insulates conducting paths from the substrate. CONSTITUTION:Conducting paths 5 and 6 having required shapes are respectively formed on one main surface sides of metallic substrates 1 and 2, with insulating resin films 3 and 4. A polyimide resin, etc., having flexibility is employed for the films 3 and 4 and one main surface of each film 3 and 4 is covered integrally with copper foil over almost the whole surface of each film except the marginal section on one side. When such films 3 and 4 are stuck to the substrates 1 and 2, the marginal sections with no copper foil protrude from the side faces of the substrates 1 and 2. The protruding parts of the resin films 3 and 4 cover at least the edge on the main surface sides of each substrate 1 and 2 where conducting paths 5 and 6 are firmly fixed to the side faces of the substrates 1 and 2, forming coating resin films 3' and 4'. The resin films 3' and 4' thus formed absorb metallic burrs produced at the end sections of the substrates when the substrates 1 and 2 are formed by punching and, accordingly, prevent occurrence of short circuit between terminals 10 and between connector-side terminals.

Description

DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to a hybrid integrated circuit, and more particularly to a terminal structure of a hybrid integrated circuit consisting of two hybrid integrated circuit boards.

(b) Prior Art A conventional hybrid integrated circuit will be explained with reference to FIGS. 4 and 5.

The hybrid integrated circuit shown in FIG. 4 has a conductive path (not shown) of a predetermined shape formed on the surface of a ceramic substrate or an insulated metal substrate (41), and a plurality of circuit elements (
42) and a metal lead terminal (44) is fixed to a fixing pad (not shown) continuous to a predetermined conductive path to form a hybrid integrated circuit board, and this hybrid integrated circuit board is then fixed to a resin-based The circuit element (
42) is sealed so that it is sealed.

With the increasing density of hybrid integrated circuits, a hybrid integrated circuit constructed from two hybrid integrated circuit boards (51) and (52) as shown in FIG. 5 has been proposed.

In the figure, substrates (51) and (52) are insulated metal substrates in which one side of metal such as aluminum is coated with resin, and a conductive path (not shown) of a predetermined shape is formed on each substrate. A plurality of circuit elements (53) (54)
) is fixed. Additionally, metal lead terminals (55) and (56) for external connection are fixed to fixed pads (not shown) that are continuous with a predetermined conductive path, and a circuit element to which the lead terminals are fixed ( 51) (52)
are fixed and integrally fixed to the case material (57) so that the respective circuit elements (53) and (54) face each other. In addition,
In order to match the pitch Q in the vertical direction of the lead terminals to the standardized pitch between the electrodes of the socket, the lead terminals are spaced apart from the substrate by Q' at a predetermined portion and take on an abbreviated shape.

Such a hybrid integrated circuit has its lead terminal (55) on the main circuit board.
)<56) are directly attached, or sockets (not shown) are inserted into the lead terminals (55) and (56) to connect to an external circuit.

(c) Problems to be Solved by the Invention In conventional hybrid integrated circuits, the lead terminals are deformed, so prior to fixing the lead terminals, the vertical and horizontal positioning and tilt adjustment of the lead terminals must be performed at the same time. , the fixed part of the lead terminal must be correctly opposed to the conductive path,
Assembly work required a high degree of skill.

Further, in conventional hybrid integrated circuits, lead terminals must be connected to a printed circuit board or the like by soldering, and a printed circuit board is always required.

Furthermore, as mentioned above, since a soldering process is sometimes essential for installation, there is a problem in that the installation of the hybrid integrated circuit becomes extremely complicated.

(d) Means for Solving the Problems The present invention has been made in view of the above-mentioned problems, and is a hybrid structure made of two metal sheets in which a conductive path of a predetermined shape and a terminal continuous to the predetermined conductive path are formed. an integrated circuit board; a case member disposed around the two hybrid integrated circuit boards to fix the two boards at a predetermined distance and to form a sealed space between the two boards; A hybrid integrated circuit comprising an end of a hybrid integrated circuit board and a connector housing surrounded by a case material and having a terminal formed on the end of the board, the side surface of the end of the hybrid integrated circuit board having the terminal formed thereon. To,
The above-mentioned problem is solved by continuously covering the conductive path and the substrate with insulating resin.

(f) Effects According to the present invention, a terminal continuous to a predetermined conductive path is formed at the same time as the conductive path is formed, so a special lead terminal structure is not required, and the number of parts and steps are reduced.

In addition, since the resin is continuously coated on the peripheral side surfaces of both boards, the metal particles generated on the peripheral edges of the boards are absorbed, creating a smooth end face shape that makes it easy to insert the connector into the metal board and housing. This prevents short circuits with connectors connected to the connector. Furthermore, short circuits between the board and the terminals due to metal powder generated when the connector is pushed in are avoided.

(f) Example First, the cross-sectional structure of the example will be explained with reference to FIG.

The hybrid integrated circuit of the present invention each includes a plurality of circuit elements (
7) A hybrid integrated circuit board (1) and (2) made of two metal sheets to which (8) is fixed (hereinafter simply referred to as the board);
It is placed around the two substrates (1) and (2), and fixes the two substrates (1) and (2) at a predetermined distance apart, and also creates a sealed space between the two substrates (1) and (2). Case material to be formed (1
It consists of 1).

Due to its physical properties, the metal substrate (]) (2) is preferably made of aluminum.The surface of the metal substrate (]) (2) is alumite-treated by a well-known method, and - the main surface is coated with a desired shape via an insulating resin (3) (4). Conductive paths (5) and (6) are formed. The insulating resins (3) and (4) are flexible resins such as polyimide resins, and copper foil is preliminarily fixed to the main surface thereof over almost the entire surface excluding the peripheral edge of one side. . When such insulating resins (3) and (4) are attached to the respective substrates (1) and (2), the copper foil portion is placed on the substrate, and the peripheral edge of one side where there is no copper foil is not shown in the figure. , protrudes from the peripheral edge of the board. Protruding insulating resin (3)
(4) covers at least the edges on the main surface side where the conductive paths (5) and (6) are formed, and is further fixed along the side surfaces of the substrates (1) and (2) to cover the resin (3°) (4). ') becomes,
The adhesion of this coating resin (3゛) (4゛) is due to the insulating resin (3)
This can be done by adhering (4) when adhering to the substrates (1) and (2), or by separately applying an adhesive to the adhesion part and adhering. In this example, the coating resin (3°) (4') extends to the back side of the substrates (1) and (2).

This coating resin (3°) (4') is applied to the substrate (1) (2)
It absorbs the metal particles generated at the edge of the board when the board is formed by press punching, and prevents short circuits between the terminals (10) and short circuits of the connector side terminals.

A conductive path (5) of a predetermined shape is formed by selectively etching the copper foil placed on each of the substrates (1) and (2).
(6) is formed, and the conductive paths (5) and (6) are extended to form terminals (9) and (10) to be connected to external terminals at the - side edges of the metal substrates (1) and (2). be done. Further, circuit elements (7) (8) such as transistors, ICs, LSIs, or chip resistors are fixed on the conductive paths (5) (6) to form a hybrid integrated circuit. The substrates (2) (2) to which the circuit elements (7) (8) are fixed
) are formed in a frame shape so that the case members (11
) using an adhesive sheet, etc. Terminal (9) (
The space formed by the peripheral end portions of the substrates (1) and (2) (10) and the case material (11) is used as a connector housing into which an external connector is inserted, and a connector to be described later is inserted therein.

The second part explaining the method of external connection of the hybrid integrated circuit of the present invention.
The explanation will be continued further with reference to the figures.

The figure shows a resin (3) coated on the surface of the board, a coating resin (3') coated on the side surface of the board, and a plurality of terminals (9) formed on the top surface of the resin (3). One substrate, the other substrate (2) whose back surface is partially coated with the coating resin (4゛), and the case material (11) are illustrated as elements of a hybrid integrated circuit, and the plurality of terminals ( A connector (12) is shown in which a terminal (13) is formed and a flat cable (14) is connected to the connector (12). Although not shown, it is effective to form radiation fins on one or both substrates.

As shown in the figure, the hybrid integrated circuit of the present invention has two substrates (
1) A connector (I2) is inserted into the connector housing formed by (2) and the case material (11) to establish connection with an external circuit.

Next, referring to FIGS. 3A, 3B, and 3C showing the cross-sectional structure of an untreated connector housing, the coating resin that is continuously coated on the side surface of the end of the board and a part of the back surface of the board will be explained. The function of (3') (4°) will be explained.

Housing terminals (9) (20) and connector terminals (13)
In order to make close contact with the connector, the widths of both the housing and the connector are designed to be approximately equal, so that there is almost no gap when the connector is inserted. Therefore, when inserting the connector, it is unavoidable that the edge portions of the boards (1) and (2) come into contact with the connector, and as shown by the arrow in Fig. 3 (A), the connector is aligned with the board axis. Therefore, if the connector is inserted and removed repeatedly, the resin (3°) (4') may not be coated on the end surface of the board and the back surface of the board.
3) The end of (4) is rubbed by the connector, and the same (B)
It is peeled off as shown in the figure. As the peeling progresses further, the metal of the substrates (1) and (2) is exposed as it is worn away as shown in FIG.

In addition, since the thickness of the resin (3H4) is around 100 μm, it is important to note that before the edges of the resins (3) and (4) are peeled off or worn out, there is a gap that occurs during the pressing process of the board and the cover side. There is also a risk that the terminals may be rubbed. the result,
Substrate metal or terminal metal will adhere between the terminals (9) and (10) and the substrate, shorting them.

However, as in the present invention, resin (3') is continuously applied to a part of the side and back surfaces of the board forming the connector housing.
(4”), coating resin (3°) (4°)
The metal powder is absorbed by the metal powder, and the smooth end face shape allows smooth insertion of the connector, and short circuit between the board and the terminal due to metal powder is avoided.

()) Effects of the Invention As described above, according to the present invention, terminals continuous to predetermined conductive paths are formed at the end of the board at the same time, eliminating the need for a special lead terminal structure and reducing the number of parts and processes. reduced.

In addition, since the resin is continuously coated on multiple surfaces of the board,
The smooth end shape facilitates insertion of the connector and avoids short circuits between the board and the terminals.

Further, in the present invention, even if the connector is inserted and removed many times, the edges are covered with the coating resin, so the durability is significantly improved and the reliability of the system is improved.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a hybrid integrated circuit of the present invention, FIG. 2 is a perspective view illustrating a method of external connection of the hybrid integrated circuit of the present invention, and FIGS. 3 (A), (B), and (C). 4 is a sectional view illustrating the deformation of the board end due to connector insertion and removal, respectively.
FIG. 5 and FIG. 5 are sectional views each showing a conventional example. (1)(2)...Hybrid integrated circuit board, (3)(4)
... Resin, (5) (6) ... Conductive path, (7) (
8)...Circuit element, (9)(10)...Terminal,
(11) Case material, (12) --- connector, (13)
)...Connector terminal, (14)...Flat cable.

Claims (3)

[Claims] (1) A hybrid integrated circuit board made of two metals on which a conductive path of a predetermined shape and a terminal continuous to the predetermined conductive path are formed; A case material that fixes the two boards at a predetermined distance and forms a sealed space between the two boards, and is surrounded by the ends of the two hybrid integrated circuit boards and the case material, and terminals are formed at the ends of the board. A hybrid integrated circuit comprising: a connector housing comprising: a side surface of an end portion of the hybrid integrated circuit board on which the terminal is formed;
A hybrid integrated circuit characterized in that a resin insulating between the conductive path and the substrate is continuously coated. (2) The hybrid integrated circuit according to claim 1, wherein the insulating resin is made of a flexible material. (3) The hybrid integrated circuit according to claim 1, wherein the hybrid integrated circuit board is an aluminum substrate whose surface is insulated.