JPH0361231B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improved module that can be broadly applied to information processing devices, such as electronic translators, programmer machines, and the like.

Circuit networks such as ROM and RAM are generally used as information storage devices, but the storage devices must be set in various storage states in response to various purposes. However, incorporating a large number of types of storage devices increases the size of the device, and is not suitable when applied to a device that requires a small size.

In addition, in recent years, for example, electronic translators, which have been developed, use ROMs that digitally store language and audio data as language modules and audio modules. It has become possible to simultaneously translate between The modules can be attached and removed freely, and by adding additional modules, it can be used for a wide range of purposes, from more advanced foreign language learning to business and overseas travel. That is, the back cover 3 of the electronic translator 1 shown in FIGS. 4
and are configured to be in contact with each other.

FIG. 3 is a block diagram showing the system configuration of an example of an electronic translator using such a module.

In the figure, 7 is a display section, which is a display drive control IC.
is controlled by the output signal from 8. Reference numeral 9 denotes a key matrix circuit constituting a key portion connected to a key strobe signal output terminal and a key input terminal of the one-chip microcomputer 10. 11
~13 are the optional and easily removable modules mentioned above, such as language ROM, language ROM, etc.
and language ROM, which contains sentences and words used in electronic translators. In this example, 1
two ROMs correspond to one language (i.e.
For example, the language ROM is English, the language ROM is Japanese, the language ROM is Japanese, etc.) The language ROM (English ROM) can be a ROM that is built into the set and cannot be replaced, or the language ROM and the language ROM can each be a module that can be replaced as desired. language
The ROMs 11 to 13 are connected to a one-chip microcomputer 10 by an address bus 14 and a data bus 15, and a predetermined language ROM 1 is selected by chip select signals 1 of CE ₁ , CE ₂ , and CE ₃ .
If you select one of 1, 12, or 13, you can read sentences or words from the selected language ROM.
It can be read out to the chip microcomputer 10. Note that _CE4 is a chip select signal of the display drive control IC8. Further, R/W is a read/write signal that specifies whether to read or write. Conventionally, a circuit network such as a storage device (for example, ROM) is formed in the above-mentioned device, and an LSi element itself having a plurality of terminals, especially a flat package type LSI element, is directly connected to the main body 1 of the device as shown in Fig. 2. If the terminals of the LSi element were to be attached to the opening 5 of the main body in surface contact with the external contacts of the main body, there were problems such as the terminals of the LSi element being fragile and being broken or bent by external force. In view of this, conventional modules have been used in which the LSi element is housed and held in a package to protect the element, as shown in FIG. 4 and FIG. 5.

That is, the module shown in FIG.
A plurality of terminals 22 for wiring are provided in the package 20 of
22... is housed, and the terminals 24, 24... of the LSi element 23 are installed on this wiring board 21.
are electrically connected by soldering, the board 21 and the LSi element 23 are covered with a second protective package 25, and the board terminals 22,
22 through the through holes 26, 26 formed by the first and second packages 20, 25, the board terminals 22, 22 are connected to the contacts 29, 29 of the external body 28.
Springs 27, 27 are provided so that they are in surface contact with each other.

In the case of the module shown in FIG. 5, the wiring board 31 is housed in the package 30, and the LSi is placed on the board.
The elements 32 are electrically connected by soldering and the board 31 is extended so that the board terminals 36 are located outside the package 30 to form a module. By inserting the contact spring 35 and the main body 33, the module and the main body can be electrically attached. That is, all of these modules are modules that can be detachably attached to a device as shown in FIG. 2, for example.

However, the conventional modules described above both require wiring boards 21 and 31 to support the LSi elements 23 and 30, and require soldering to electrically connect the LSi elements to the boards.
The cost increases due to the wiring board, and since the board space is required, the module becomes larger and thicker.Furthermore, the manufacturing process becomes complicated due to the soldering work, which significantly reduces the work efficiency of module manufacturing. Also, the board terminal 2 in FIG.
Spring 27, 27 for electrically connecting 2 and external contact 29 through through holes 26, 26 decreases in elastic force, that is, contact force due to aging, and becomes deformed.
Moreover, it has drawbacks such as lack of stability and resulting in a module that is difficult to sit on. The same thing happened when the connection spring 35 in FIG. 5 was used.

The present invention was made in order to eliminate the drawbacks of the conventional modules described above, and provides a module structure suitable for constructing a thin and small module that does not require a wiring board, has a small number of parts, is inexpensive, and has high work efficiency. This is what we intend to provide.

Hereinafter, one embodiment of the module of the present invention will be described in detail with reference to the drawings.

FIG. 6 is a sectional view showing one embodiment of the module of the present invention, and FIG. 7 is a plan view thereof. here,
The module according to the present invention is understood in a broad sense to include cassettes and cartridges.

In the figure, 40 and 43 are packages for protecting the LSi element 41, and are made of, for example, a plastic material. The LSi element 41 is a storage device (for example,
A large-scale integrated circuit element that forms a circuit network such as ROM) constitutes the language ROM or audio ROM of the electronic translator described above.

Both the packages 40 and 43 form a space in which the LSi element 41 is housed, and the package 40 is provided with a 40a on which the terminals 42, 42... of the LSi element 41 are placed, and each terminal 4 on the stepped portion 40a
A through hole 45 is formed between both the packages 40, 43 through which a part of the packages 2, 42, . . . are exposed to the outside.

44 is a conductive rubber having a substantially L-shaped cross section;
A part to be inserted between each terminal 42, 42... on 0a and the inner surface 40b of the package 40 facing thereto,
The LSi element 41 has an external end surface of the conductive rubber 40 facing a plurality of external contacts 46, 46, etc. of an external body (for example, a translator). By contacting
Each terminal 42, 42... is electrically connected to an external contact 46, 46....

The method for assembling such a module is to first accommodate and place the LSi element 41 in a first package (or case) 40 made of plastic or the like, and then place a second package 43 (for example, plastic) on the LSi element 41. In this case, the package 43 may be used as the element 41, or the package 43 may be placed as is. A conductive rubber 44 having a substantially L-shaped rear section is press-fitted to fix the LSi element 41 and packages 40 and 43 to each other to form an integrated module.

The conductive rubber 44 described above may be a single body or a plurality of bodies, and since rubber acts as a connector, zebra rubber, which is obtained by cutting a stack of conductive rubber and insulating rubber in the vertical direction, can be used; Anisotropically conductive connectors that conduct electrically only in the vertical direction can be used.

In the case of Fig. 7, elastic rubber 4 as a connector
For example, zebra rubber is used for 4, and a linear zebra rubber is made into a ring shape to form a package (or case) 4.
The module can be formed simply by press-fitting it between 3 and 40, and it is extremely easy to work with. Therefore, when the above-mentioned module is used as a language or audio module for a translator, simultaneous translation between different languages can be achieved simply by placing it in the opening of the main body as shown in Figure 2. By adding or replacing them, various purposes can be met.

In the above embodiment, the module used in the translation machine was explained, but this module is not limited to the translation machine in any way. Of course, it can be applied to various other devices.

Particularly in the case of equipment that uses a plurality of modules, the small and thin module according to the present invention is extremely advantageous. Further, the shape of the module can be arbitrarily designed depending on the purpose.

As described above, according to the present invention, a chip-shaped LSi element having a plurality of terminals is housed in a package, and is detachably attached to an electronic device, so that each terminal of the LSi element can be connected to an electronic device. In a module that is electrically connected to each terminal on the equipment side, the package has a space for accommodating the LSi element, and also forms a stepped portion on which the terminal of the LSi element rests, and a portion of each terminal on the stepped portion. A cross section consisting of a portion inserted between each terminal on the stepped portion of the package and the opposing inner surface of the package, and a portion exposed to the outside through the through hole. A substantially L-shaped conductive rubber is provided, and the conductive rubber and the LSi element are fixed in the package, and the conductive rubber comes into surface contact with the terminals of the electronic device when attached to the electronic device. By electrically connecting each terminal of the LSi element and each terminal on the electronic equipment side, the wiring board can be omitted when storing the LSi element in the package, reducing the number of parts and improving the configuration. In addition to simplifying and improving workability, the module can be made thinner,
It is possible to achieve miniaturization, there is no risk of the conductive rubber falling off, and a stable contact state can be obtained between the conductive rubber and each terminal of the LSi element.
Since the terminals of the LSi element do not face the outside of the package,
There is no risk of damage or damage when handling the module alone, and it also has the advantage of being easier to handle.

[Brief explanation of drawings]

Figure 1 is an external view of an electronic translator that can adopt the module according to the present invention, Figure 2 is a diagram showing how the module is installed on the back of the translator, and Figure 3 is an illustration of the same electronic translator that uses the module. FIGS. 4 and 5 are sectional views of a conventional module, FIG. 6 is a sectional view of an example of a module according to the present invention, and FIG. 7 is a plan view of the same. In the figure, 40: first package, 41: LSi element, 42: element terminal, 43: second package, 44: conductive rubber, 45: through hole, 46: external contact.

Claims (1)

[Scope of Claims] 1. A chip-shaped LSi element having a plurality of terminals is housed in a package, and is detachably attached to an electronic device, so that each terminal of the LSi element can be connected to the opposite side of the electronic device. In a module that is electrically connected to each terminal, the package has a space for accommodating the LSi element, and also forms a stepped part on which the terminal of the LSi element rests, and a part of each terminal on the stepped part is exposed to the outside. It has a structure with a through hole that faces the package, and has a cross section approximately L consisting of each terminal on the step part of the package, a part inserted between the inner surface of the package opposing this, and a part exposed to the outside through the through hole.
A conductive rubber in the shape of a letter is provided, and the conductive rubber and the LSi element are fixed in the package, and when the conductive rubber is attached to the electronic device, it comes into surface contact with the terminal on the electronic device side, and the conductive rubber and the LSi element are fixed in the package. A module that electrically connects each terminal of an LSi element to each terminal of an electronic device.