JPH0338647A - Processing method for positive type photosensitive planographic printing plate - Google Patents
Processing method for positive type photosensitive planographic printing plateInfo
- Publication number
- JPH0338647A JPH0338647A JP17524989A JP17524989A JPH0338647A JP H0338647 A JPH0338647 A JP H0338647A JP 17524989 A JP17524989 A JP 17524989A JP 17524989 A JP17524989 A JP 17524989A JP H0338647 A JPH0338647 A JP H0338647A
- Authority
- JP
- Japan
- Prior art keywords
- acid
- replenisher
- weight
- developer
- soln
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003672 processing method Methods 0.000 title claims description 8
- 238000011161 development Methods 0.000 claims abstract description 20
- 239000004094 surface-active agent Substances 0.000 claims abstract description 15
- 229910052910 alkali metal silicate Inorganic materials 0.000 claims abstract description 12
- 238000012545 processing Methods 0.000 claims description 24
- 239000007864 aqueous solution Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 23
- 230000007423 decrease Effects 0.000 abstract description 4
- 238000010790 dilution Methods 0.000 abstract description 3
- 239000012895 dilution Substances 0.000 abstract description 3
- 230000001105 regulatory effect Effects 0.000 abstract 1
- -1 etc.) Chemical compound 0.000 description 66
- 229920005989 resin Polymers 0.000 description 28
- 239000011347 resin Substances 0.000 description 28
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 24
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 18
- 125000000217 alkyl group Chemical group 0.000 description 17
- 150000003839 salts Chemical class 0.000 description 15
- 239000004793 Polystyrene Substances 0.000 description 14
- 239000002253 acid Substances 0.000 description 14
- 150000002989 phenols Chemical class 0.000 description 14
- 125000004432 carbon atom Chemical group C* 0.000 description 13
- 150000001875 compounds Chemical class 0.000 description 13
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 12
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 10
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 10
- 239000002736 nonionic surfactant Substances 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 10
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 9
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 9
- 150000001299 aldehydes Chemical class 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 9
- 238000009833 condensation Methods 0.000 description 9
- 230000005494 condensation Effects 0.000 description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 9
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 7
- 235000014113 dietary fatty acids Nutrition 0.000 description 7
- 239000000194 fatty acid Substances 0.000 description 7
- 229930195729 fatty acid Natural products 0.000 description 7
- 150000007524 organic acids Chemical class 0.000 description 7
- 229930003836 cresol Natural products 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 229920002554 vinyl polymer Polymers 0.000 description 6
- 239000004115 Sodium Silicate Substances 0.000 description 5
- 239000003093 cationic surfactant Substances 0.000 description 5
- 150000004665 fatty acids Chemical class 0.000 description 5
- 229940093915 gynecological organic acid Drugs 0.000 description 5
- 235000005985 organic acids Nutrition 0.000 description 5
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 5
- 229910052913 potassium silicate Inorganic materials 0.000 description 5
- 235000019353 potassium silicate Nutrition 0.000 description 5
- 230000035945 sensitivity Effects 0.000 description 5
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 5
- 229910052911 sodium silicate Inorganic materials 0.000 description 5
- 125000001424 substituent group Chemical group 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- 239000004111 Potassium silicate Substances 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 4
- 150000003863 ammonium salts Chemical class 0.000 description 4
- 150000008064 anhydrides Chemical class 0.000 description 4
- 239000003638 chemical reducing agent Substances 0.000 description 4
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 4
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 4
- 150000002576 ketones Chemical class 0.000 description 4
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 4
- FBUKVWPVBMHYJY-UHFFFAOYSA-N nonanoic acid Chemical compound CCCCCCCCC(O)=O FBUKVWPVBMHYJY-UHFFFAOYSA-N 0.000 description 4
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 4
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 4
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 4
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 159000000000 sodium salts Chemical class 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 235000010233 benzoic acid Nutrition 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 235000021317 phosphate Nutrition 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 description 3
- 230000001235 sensitizing effect Effects 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 150000008054 sulfonate salts Chemical class 0.000 description 3
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 2
- BTLXPCBPYBNQNR-UHFFFAOYSA-N 1-hydroxyanthraquinone Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2O BTLXPCBPYBNQNR-UHFFFAOYSA-N 0.000 description 2
- VBICKXHEKHSIBG-UHFFFAOYSA-N 1-monostearoylglycerol Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 2
- UIAFKZKHHVMJGS-UHFFFAOYSA-N 2,4-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1O UIAFKZKHHVMJGS-UHFFFAOYSA-N 0.000 description 2
- XSXWOBXNYNULJG-UHFFFAOYSA-N 2-(2,4,4-trimethylpentan-2-yl)phenol Chemical compound CC(C)(C)CC(C)(C)C1=CC=CC=C1O XSXWOBXNYNULJG-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- WJQOZHYUIDYNHM-UHFFFAOYSA-N 2-tert-Butylphenol Chemical compound CC(C)(C)C1=CC=CC=C1O WJQOZHYUIDYNHM-UHFFFAOYSA-N 0.000 description 2
- UYEMGAFJOZZIFP-UHFFFAOYSA-N 3,5-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC(O)=CC(O)=C1 UYEMGAFJOZZIFP-UHFFFAOYSA-N 0.000 description 2
- XJMMNTGIMDZPMU-UHFFFAOYSA-N 3-methylglutaric acid Chemical compound OC(=O)CC(C)CC(O)=O XJMMNTGIMDZPMU-UHFFFAOYSA-N 0.000 description 2
- ALYNCZNDIQEVRV-UHFFFAOYSA-N 4-aminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 description 2
- WTQZSMDDRMKJRI-UHFFFAOYSA-N 4-diazoniophenolate Chemical class [O-]C1=CC=C([N+]#N)C=C1 WTQZSMDDRMKJRI-UHFFFAOYSA-N 0.000 description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- XZIIFPSPUDAGJM-UHFFFAOYSA-N 6-chloro-2-n,2-n-diethylpyrimidine-2,4-diamine Chemical compound CCN(CC)C1=NC(N)=CC(Cl)=N1 XZIIFPSPUDAGJM-UHFFFAOYSA-N 0.000 description 2
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 2
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 239000005639 Lauric acid Substances 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- 239000005643 Pelargonic acid Substances 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000005211 alkyl trimethyl ammonium group Chemical group 0.000 description 2
- 229960004050 aminobenzoic acid Drugs 0.000 description 2
- 239000003945 anionic surfactant Substances 0.000 description 2
- HRBFQSUTUDRTSV-UHFFFAOYSA-N benzene-1,2,3-triol;propan-2-one Chemical compound CC(C)=O.OC1=CC=CC(O)=C1O HRBFQSUTUDRTSV-UHFFFAOYSA-N 0.000 description 2
- QUKGYYKBILRGFE-UHFFFAOYSA-N benzyl acetate Chemical compound CC(=O)OCC1=CC=CC=C1 QUKGYYKBILRGFE-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 229940118056 cresol / formaldehyde Drugs 0.000 description 2
- MLUCVPSAIODCQM-NSCUHMNNSA-N crotonaldehyde Chemical compound C\C=C\C=O MLUCVPSAIODCQM-NSCUHMNNSA-N 0.000 description 2
- MLUCVPSAIODCQM-UHFFFAOYSA-N crotonaldehyde Natural products CC=CC=O MLUCVPSAIODCQM-UHFFFAOYSA-N 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 description 2
- QNVRIHYSUZMSGM-UHFFFAOYSA-N hexan-2-ol Chemical compound CCCCC(C)O QNVRIHYSUZMSGM-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- 150000002642 lithium compounds Chemical class 0.000 description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 2
- 150000002825 nitriles Chemical class 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- LPNBBFKOUUSUDB-UHFFFAOYSA-N p-toluic acid Chemical compound CC1=CC=C(C(O)=O)C=C1 LPNBBFKOUUSUDB-UHFFFAOYSA-N 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 2
- DJEHXEMURTVAOE-UHFFFAOYSA-M potassium bisulfite Chemical compound [K+].OS([O-])=O DJEHXEMURTVAOE-UHFFFAOYSA-M 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 235000010259 potassium hydrogen sulphite Nutrition 0.000 description 2
- 229940079877 pyrogallol Drugs 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 235000019795 sodium metasilicate Nutrition 0.000 description 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229940035044 sorbitan monolaurate Drugs 0.000 description 2
- 229940124530 sulfonamide Drugs 0.000 description 2
- YBBRCQOCSYXUOC-UHFFFAOYSA-N sulfuryl dichloride Chemical compound ClS(Cl)(=O)=O YBBRCQOCSYXUOC-UHFFFAOYSA-N 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
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- MIHINWMALJZIBX-UHFFFAOYSA-N cyclohexa-2,4-dien-1-ol Chemical compound OC1CC=CC=C1 MIHINWMALJZIBX-UHFFFAOYSA-N 0.000 description 1
- GCFAUZGWPDYAJN-UHFFFAOYSA-N cyclohexyl 3-phenylprop-2-enoate Chemical compound C=1C=CC=CC=1C=CC(=O)OC1CCCCC1 GCFAUZGWPDYAJN-UHFFFAOYSA-N 0.000 description 1
- YZFOGXKZTWZVFN-UHFFFAOYSA-N cyclopentane-1,1-dicarboxylic acid Chemical compound OC(=O)C1(C(O)=O)CCCC1 YZFOGXKZTWZVFN-UHFFFAOYSA-N 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- KTLZQSZGORXBED-UHFFFAOYSA-N dimethyl 2-methylidenepropanedioate Chemical group COC(=O)C(=C)C(=O)OC KTLZQSZGORXBED-UHFFFAOYSA-N 0.000 description 1
- VAYGXNSJCAHWJZ-UHFFFAOYSA-N dimethyl sulfate Chemical compound COS(=O)(=O)OC VAYGXNSJCAHWJZ-UHFFFAOYSA-N 0.000 description 1
- OREAFAJWWJHCOT-UHFFFAOYSA-N dimethylmalonic acid Chemical compound OC(=O)C(C)(C)C(O)=O OREAFAJWWJHCOT-UHFFFAOYSA-N 0.000 description 1
- YXXXKCDYKKSZHL-UHFFFAOYSA-M dipotassium;dioxido(oxo)phosphanium Chemical compound [K+].[K+].[O-][P+]([O-])=O YXXXKCDYKKSZHL-UHFFFAOYSA-M 0.000 description 1
- XBMOWLAOINHDLR-UHFFFAOYSA-N dipotassium;hydrogen phosphite Chemical compound [K+].[K+].OP([O-])[O-] XBMOWLAOINHDLR-UHFFFAOYSA-N 0.000 description 1
- ZRRLFMPOAYZELW-UHFFFAOYSA-N disodium;hydrogen phosphite Chemical compound [Na+].[Na+].OP([O-])[O-] ZRRLFMPOAYZELW-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 1
- 229940060296 dodecylbenzenesulfonic acid Drugs 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 150000002085 enols Chemical group 0.000 description 1
- DPUOLQHDNGRHBS-KTKRTIGZSA-N erucic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-KTKRTIGZSA-N 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- MLTWWHUPECYSBZ-UHFFFAOYSA-N ethene-1,1,2-triol Chemical group OC=C(O)O MLTWWHUPECYSBZ-UHFFFAOYSA-N 0.000 description 1
- MEGHWIAOTJPCHQ-UHFFFAOYSA-N ethenyl butanoate Chemical compound CCCC(=O)OC=C MEGHWIAOTJPCHQ-UHFFFAOYSA-N 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- OUGJKAQEYOUGKG-UHFFFAOYSA-N ethyl 2-methylidenebutanoate Chemical compound CCOC(=O)C(=C)CC OUGJKAQEYOUGKG-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 description 1
- ZLSPCFYPYRYKNF-UHFFFAOYSA-N formaldehyde;4-octylphenol Chemical compound O=C.CCCCCCCCC1=CC=C(O)C=C1 ZLSPCFYPYRYKNF-UHFFFAOYSA-N 0.000 description 1
- 125000002485 formyl group Chemical group [H]C(*)=O 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 229940074391 gallic acid Drugs 0.000 description 1
- 235000004515 gallic acid Nutrition 0.000 description 1
- YQEMORVAKMFKLG-UHFFFAOYSA-N glycerine monostearate Natural products CCCCCCCCCCCCCCCCCC(=O)OC(CO)CO YQEMORVAKMFKLG-UHFFFAOYSA-N 0.000 description 1
- SVUQHVRAGMNPLW-UHFFFAOYSA-N glycerol monostearate Natural products CCCCCCCCCCCCCCCCC(=O)OCC(O)CO SVUQHVRAGMNPLW-UHFFFAOYSA-N 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- NGAZZOYFWWSOGK-UHFFFAOYSA-N heptan-3-one Chemical compound CCCCC(=O)CC NGAZZOYFWWSOGK-UHFFFAOYSA-N 0.000 description 1
- MNWFXJYAOYHMED-UHFFFAOYSA-M heptanoate Chemical compound CCCCCCC([O-])=O MNWFXJYAOYHMED-UHFFFAOYSA-M 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229940079826 hydrogen sulfite Drugs 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- WYXXLXHHWYNKJF-UHFFFAOYSA-N isocarvacrol Natural products CC(C)C1=CC=C(O)C(C)=C1 WYXXLXHHWYNKJF-UHFFFAOYSA-N 0.000 description 1
- 229940039717 lanolin Drugs 0.000 description 1
- 235000019388 lanolin Nutrition 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 229940031993 lithium benzoate Drugs 0.000 description 1
- LDJNSLOKTFFLSL-UHFFFAOYSA-M lithium;benzoate Chemical compound [Li+].[O-]C(=O)C1=CC=CC=C1 LDJNSLOKTFFLSL-UHFFFAOYSA-M 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 229960002510 mandelic acid Drugs 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- GXHFUVWIGNLZSC-UHFFFAOYSA-N meldrum's acid Chemical compound CC1(C)OC(=O)CC(=O)O1 GXHFUVWIGNLZSC-UHFFFAOYSA-N 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- AWJZTPWDQYFQPQ-UHFFFAOYSA-N methyl 2-chloroprop-2-enoate Chemical compound COC(=O)C(Cl)=C AWJZTPWDQYFQPQ-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- ZIYVHBGGAOATLY-UHFFFAOYSA-N methylmalonic acid Chemical compound OC(=O)C(C)C(O)=O ZIYVHBGGAOATLY-UHFFFAOYSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- PJASPDPXLKIZHB-UHFFFAOYSA-N n-(3-nitrophenyl)prop-2-enamide Chemical compound [O-][N+](=O)C1=CC=CC(NC(=O)C=C)=C1 PJASPDPXLKIZHB-UHFFFAOYSA-N 0.000 description 1
- JEPAGMKWFWQECH-UHFFFAOYSA-N n-(4-chlorophenyl)prop-2-enamide Chemical compound ClC1=CC=C(NC(=O)C=C)C=C1 JEPAGMKWFWQECH-UHFFFAOYSA-N 0.000 description 1
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 1
- BXWNKGSJHAJOGX-UHFFFAOYSA-N n-hexadecyl alcohol Natural products CCCCCCCCCCCCCCCCO BXWNKGSJHAJOGX-UHFFFAOYSA-N 0.000 description 1
- BPCNEKWROYSOLT-UHFFFAOYSA-N n-phenylprop-2-enamide Chemical compound C=CC(=O)NC1=CC=CC=C1 BPCNEKWROYSOLT-UHFFFAOYSA-N 0.000 description 1
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 description 1
- 125000004957 naphthylene group Chemical group 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- 229920002114 octoxynol-9 Polymers 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 229940049964 oleate Drugs 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- NRZWYNLTFLDQQX-UHFFFAOYSA-N p-tert-Amylphenol Chemical compound CCC(C)(C)C1=CC=C(O)C=C1 NRZWYNLTFLDQQX-UHFFFAOYSA-N 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229960005323 phenoxyethanol Drugs 0.000 description 1
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- HKOOXMFOFWEVGF-UHFFFAOYSA-N phenylhydrazine Chemical compound NNC1=CC=CC=C1 HKOOXMFOFWEVGF-UHFFFAOYSA-N 0.000 description 1
- 229940067157 phenylhydrazine Drugs 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000005518 polymer electrolyte Substances 0.000 description 1
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 235000011181 potassium carbonates Nutrition 0.000 description 1
- BHZRJJOHZFYXTO-UHFFFAOYSA-L potassium sulfite Chemical compound [K+].[K+].[O-]S([O-])=O BHZRJJOHZFYXTO-UHFFFAOYSA-L 0.000 description 1
- 235000019252 potassium sulphite Nutrition 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 229940047670 sodium acrylate Drugs 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M sodium chloride Inorganic materials [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 1
- JVBXVOWTABLYPX-UHFFFAOYSA-L sodium dithionite Chemical compound [Na+].[Na+].[O-]S(=O)S([O-])=O JVBXVOWTABLYPX-UHFFFAOYSA-L 0.000 description 1
- 235000010267 sodium hydrogen sulphite Nutrition 0.000 description 1
- 235000019794 sodium silicate Nutrition 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 1
- 235000019345 sodium thiosulphate Nutrition 0.000 description 1
- AZXQLMRILCCVDW-UHFFFAOYSA-M sodium;5-propan-2-ylnaphthalene-1-sulfonate Chemical compound [Na+].C1=CC=C2C(C(C)C)=CC=CC2=C1S([O-])(=O)=O AZXQLMRILCCVDW-UHFFFAOYSA-M 0.000 description 1
- KIMPPGSMONZDMN-UHFFFAOYSA-N sodium;dihydrogen phosphite Chemical compound [Na+].OP(O)[O-] KIMPPGSMONZDMN-UHFFFAOYSA-N 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical class [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 description 1
- 150000003456 sulfonamides Chemical class 0.000 description 1
- 150000003459 sulfonic acid esters Chemical class 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- MGSRCZKZVOBKFT-UHFFFAOYSA-N thymol Chemical compound CC(C)C1=CC=C(C)C=C1O MGSRCZKZVOBKFT-UHFFFAOYSA-N 0.000 description 1
- 229940001496 tribasic sodium phosphate Drugs 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- NCPXQVVMIXIKTN-UHFFFAOYSA-N trisodium;phosphite Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])[O-] NCPXQVVMIXIKTN-UHFFFAOYSA-N 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- ROVRRJSRRSGUOL-UHFFFAOYSA-N victoria blue bo Chemical compound [Cl-].C12=CC=CC=C2C(NCC)=CC=C1C(C=1C=CC(=CC=1)N(CC)CC)=C1C=CC(=[N+](CC)CC)C=C1 ROVRRJSRRSGUOL-UHFFFAOYSA-N 0.000 description 1
- KOZCZZVUFDCZGG-UHFFFAOYSA-N vinyl benzoate Chemical compound C=COC(=O)C1=CC=CC=C1 KOZCZZVUFDCZGG-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
Landscapes
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
Description
〔産業上の利用分野〕
本発明はポジ型感光性平版印刷版(以下、「ポジ型13
版」という)の処理方法に関し、更に詳しくは、ポジ型
13版を自動現像機を用い補充液を補充してポジ専用現
像液で現像する処理方法に関する。
〔従来の技術〕
従来、自動現像機によるポジ型13版の現像処理におい
て、長期にわたる処理の場合、現像品質の安定化のため
に現像液に補充液を補充して現像処理することが知られ
ている。そして、現像液に対する補充液及び補充方法に
ついては、現像液よりもpHの高い補充液tm類を現像
液のpH,電気伝導度、処理するポジ型13版の枚数や
長手(搬送方向)の長さ等に応じて補充する方法が知ら
れている。
しかし、このような補充方法を採用しても、長期にわた
る現像により現像品質に変化が生じる。
〔発明の目的〕
本発明の目的は、ポジ型13版をポジ専用現像液で補充
液を補充して現像処理するポジ型13版の処理方法にお
いて、より長期にわたる処理において現像品質を安定に
維持できる現像補充方法を提供することである。
〔発明の構成〕
本発明の上記目的は、自動現像機を用い、現像補充液を
補充して繰り返し使用されるポジ専用現像液でポジ型P
S版を現像する現像処理方法において、該現像補充液が
下記(A)及び(B)からなることを特徴とするポジ型
PS版の処理方法によって達成される。
(A)ケイ酸アルカリを含有する水溶液。
(B)界面活性剤を含有する水溶液。
更に、本発明の好ましい態様は、上記処理方法において
、上記(A)及び(B)を、現像処理するポジ型PS版
の単位時間当たりの処理量、外気の気温及び自動現像機
のタイプにより決まる補充量で補充する態様である。
以下、本発明について詳述する。
本発明におけるポジ専用現像液(以下、単に「毛像液」
という)は、好ましくは、水を主たる溶媒とする(具体
的には溶媒の50重量%以上が水である)アルカリ性現
像液である。
上記アルカリ剤としては、例えばケイ酸アルカリ(ケイ
酸カリウム、ケイ酸ナトリウム、メタケイ酸ナトリウム
、メタケイ酸カリウム、ケイ酸アンモニウム等)、水酸
化カリウム、水酸化ナトリウム、水酸化リチウム、第三
リン酸ナトリウム、第ニリン酸ナトリウム、第三リン酸
カリウム、第ニリン酸カリウム、第三リン酸アンモニウ
ム、第ニリン酸アンモニウム、メタケイ酸ナトリウム、
重炭酸ナトリウム、炭酸ナトリウム、炭酸カリウム、炭
酸アンモニウムなどのような無機アルカリ剤、モノ−ジ
ー又はトリエタノールアミンおよび水酸化テトラアルキ
ルのような有機アルカリ剤及び有機ケイ酸アンモニウム
等が挙げられる。アルカリ剤の現像液中の含有量は06
05〜20重量%の範囲が好ましく、より好ましくは0
.1〜10重量%の範囲である。
該現像液には、繰り返し使用の開始時からアニオン界面
活性剤、ノニオン界面活性剤及びカチオン界面活性剤か
ら選ばれる少なくとも1種を含有させることが好ましい
。
アニオン界面活性剤としては、高級アルコール(08〜
C2□)硫酸エステル塩類[例えば、ラウリルアルコー
ルサルフェートのナトリウム塩、オクチルアルコールサ
ルフェートのナトリウム塩、ラウリルアルコールサルフ
ェートのアンモニウム塩、rTeepol−81J’
(商品名・シェル化学製)、第二ナトリウムアルキルサ
ルフェートなど]、脂肪族アルコールリン酸エステル塩
類(例えば、セチルアルコールリン酸エステルのナトリ
ウム塩など)、アルキルアリールスルホン酸塩類(例え
ば、ドデシルベンゼンスルホン酸のナトリウム塩、イソ
プロピルナフタレンスルホン酸のナトリウム塩、シナフ
タリンジスルホン酸のナトリム塩、メタニトロベンゼン
スルホン酸のナトリウム塩など)、アルキルアミドのス
ルホン酸塩類(例えば、CryHssCON(C)13
)CH,5o3Naなど)、二塩基性脂肪酸エステルの
スルホン酸塩類(例えば、ナトリウムスルホコハク酸ジ
オクチルエステル、ナトリウムスルホコハク酸ジヘキシ
ルエステルなど)がある。これらの中で特にスルホン酸
塩類が好適に用いられる。
ノニオン界面活性剤は大別するとポリエチレングリコー
ル型と多価アルコール型に分類することができ、どちら
も使用できるが、現像性能点からポリエチレングリコー
ル型のノニオン界面活性剤が好ましく、その中でもエチ
レンオキシ基(−CO。
CH,O−)を3以上有し、かつHLB値(HLBはH
ydroph口e−Lipophile Ba1anc
eの#!I)が5以上(より好ましくは8〜20)のノ
ニオン界面活性剤がより好ましい。
ノニオン界面活性剤のうち、エチレンオキシ基とプロピ
レンオキン基の両者を有するものが特に好ましく、その
なかでHLB値が8以上のものがより好ましい。
ノニオン界面活性剤の好ましい例として下記−般式(1
)〜〔8〕で表される化合物が挙げられる。
CI ) R−0−(CH2CH20)nH(3)
R−0−(CH,CHO)+++ −(C112CO
!O)d(6) lo(C2H,O)a (C3)
1eo)b (C2H,0)cH(7) H(OC
21(a)y (OCst(6)X\/(CjIIa
O)X−(CzH,0)yHl((Oc2H4)y
(OCIH6)X/\(CJaO)x (CzH+0
)yH(8) HO−(CH2CH20)nH〔1
〕〜〔8〕式において、Rは水素原子又は1価の有機基
を表す。該有機基としては、例えば直鎖もしくは分岐の
炭素数1〜30の、置換基(例えばアリール基(フェニ
ル等))を有していてもよいアルキル基、アルキル部分
が上記アルキル基であるアルキルカルボニル基、置換基
(例えばヒドロキシル基、上記のようなアルキル基等)
を有!2ていてもよいフェニル基等が挙げられる。al
l)%c、m、n、X及びyは各々1〜40の整数を表
す。
ノニオン界面活性剤の具体例を示す。
ポリエチレングリコール、ポリオキシエチレンラウリル
エーテル、ポリオキシエチレンノニルエーテル、ポリオ
キシエチレンセチルエーテル、ポリオキシエチレンステ
アリルエーテル、ポリオキシエチレンオレイルエーテル
、ポリオキシエチレンベヘニルエーテル、ポリオキシエ
チレンポリオキシプロピレンセチルエーテル、ポリオキ
シエチレンポリオキシプロピレンベヘニルエーテル、ポ
リオキシエチレンノニルフェニルエーテル、ポリオキシ
エチレンオクチルフェニルエーテル、ポリオキシエチレ
ンステアリルアミン、ポリオキシエチレンオレイルアミ
ン、ポリオキシエチレンステアリン酸アミド、ポリオキ
シエチレンオレイン酸アミド、ポリオキシエチレンヒマ
シ油、ポリオキシエチレンアビエチルエーテル、ポリオ
キシエチレンラノリンエーテル、ポリオキシエチレンモ
ノラウレート、ポリオキシエチレンモノステアレート、
ポリオキシエチレングリセリルモノオレート、ポリオキ
シエチレングリセルモノステアレート、ポリオキシエチ
レンプロピレングリコールモノステアレート、オキシエ
チレンオキシブロピレンプロツクボリマー ジスチレン
化フェノールポリエチレンオキシド付加物、トリベンジ
ルフェノールポリエチレンオキシド付加物、オクチルフ
ェノールポリオキシエチレンポリオキシプロピレン付加
物、グリセロールモノステアレート、ソルビタンモノラ
ウレート、ポリオキンエチレンソルビタンモノラウレー
ト等。
ノニオン界面活性剤の重量平均分子量は300〜100
00の範囲が好ましく、500〜5000の範囲が特に
好ましい。
カチオン界面活性剤はアミン型と第四アンモニウム塩型
に大別されるが、これらの何れをも用いることができる
。
アミン型の例としては、ポリオキシエチレンアルキルア
ミン、N−アルキルプロピレンアミン、 N−アルキル
ポリエチレンポリアミン
リエチレンポリアミンジメチル硫酸塩、アルキルビグア
ニド、長鎖アミンオキシド、アルキルイミダシリン、l
−ヒドロキシエチル−2−アルキルイミダシリン、■ー
アセチルアミノエチルー2ーアルキルイミダシリン、2
−アルキル−4−メチル−4−ヒドロキシメチルオキサ
ゾリン等がある。
また、第四アンモニウム塩型の例としては、長鎖第1ア
ミン塩、アルキルトリメチルアンモニウム塩、ジアルキ
ルジメチルエチルアンモニウム塩、アルキルジメチルア
ンモニウム塩、アルキルジメチルベンジルアンモニウム
塩、アルキルピリジニウム塩、アルキルキノリニウム塩
、アルキルイソキノリニウム塩、アルキルピリジニウム
硫酸塩、ステアラミドメチルピリジニウム塩、アシルア
ミノエチルジエチルアミン塩、アシルアミノエチルメチ
ルジエチルアンモニウム塩、アルキルアミドプロピルジ
メチルベンジルアンモニウム塩、脂肪酸ポリエチレンポ
リアミド、アシルアミノエチルピリジニウム塩、アシル
コラミノホルミルメチルピリジニウム塩、ステアロオキ
シメチルピリジニウム塩、脂肪酸トリエタノールアミン
、脂肪酸トリエタノールアミンギ酸塩、トリオキシエチ
レン脂肪酸トリエタノールアミン、脂肪酸ジブチルアミ
ノエタノール、セチルオキシメチルピリジニウム塩、p
−インオクチルフェノキシエトキシエチルジメチルベン
ジルアンモニウム塩等がある。(上記化合物の例の中の
「アルキル」とは炭素数6〜20の、直鎖または一部
置換されたアルキルを示し、具体的には、ヘキシル、オ
クチル、セチル、ステアリル等の直鎖アルキルが好まし
く用いられる。)これらの中では、特に水溶性の第四ア
ンモニウム塩型のカチオン界面活性剤が有効で、その中
でも、アルキルトリメチルアンモニウム塩、アルキルジ
メチルベンジルアンモニウム塩、エチレンオキシド付加
アンモニウム塩等が好適である。また、カチオン成分を
くり返し単位として有する重合体も広い意味ではカチオ
ン界面活性剤であり、本発明のカチオン界面活性剤に金
色される。特に、親油性モノマーと共重合して得られた
第四アンモニウム塩を含む重合体は好適に用いることが
できる。
該重合体の重量平均分子量は300〜50000の範囲
であり、特に好ましくは500〜5000の範囲である
。
これらの界面活性剤は0.05〜IO重量%の範囲で含
有させるのが好ましい。
本発明における現像液には有機カルボン酸を含有させる
ことが好ましい。該有機カルボン酸は、好ましくは炭素
原子数6〜20の脂肪族カルボン酸、およびベンゼン環
またはす7タレン環にカルボキシル基が置換した芳香族
カルボン酸である。
脂肪族カルボン酸としては炭素数6〜20のアルカン酸
が好ましく、具体的な例としては、カブロン酸、エナン
チル酸、カプリル酸、ペラルゴン酸、カプリン酸、ラウ
リン酸、ミスチリン酸、バルミチン酸、ステアリン酸等
があり、特に好ましいのは炭素数6〜12のアルカン酸
である。また炭素鎖中に二重結合を有する脂肪酸でも、
枝分れした炭素鎖のものでもよい。上記脂肪族カルボン
酸は水溶性を高めるt;めに、ナトリウムやカリウムの
塩又はアンモニウム塩として用いるのが好ましい。
芳香族カルボン酸の具体的な化合物としては、安息香酸
、0−クロロ安息香酸、p−クロロ安息香酸、0−ヒド
ロキシ安息香酸、p−ヒドロキシ安息香酸、p−ter
t−ブチル安息香酸、0−アミノ安息香酸、p−アミノ
安息香酸、2,4−ジヒドロキシ安息香酸、2゜5−ジ
ヒドロキシ安息香酸、2.3−ジヒドロキシ安息香酸、
2.3−ジヒドロキシ安息香酸、3,5−ジヒドロキシ
安息香酸、没食子酸、l−ヒドロキシ−2−ナフトエ酸
、3−ヒドロキシ−2−ナフトエ酸、2−ヒドロキシ−
1−ナフトエ酸、l−ナフトエ酸、2−ナフトエ酸等で
あるが、これらの中でも安息香酸類は特に有効である。
上記芳香族カルボン酸は水溶性を高めるtこめにナトリ
ウムやカリウムの塩またはアンモニウム塩として用いる
のが好ましい。
ポジ専用現像液に添加する脂肪族カルボン酸、芳香族カ
ルボン酸の含有量は格別な制限はないが0.1重量%よ
り低いと効果が十分でなく、また10重量%以上ではそ
れ以上の効果の改善が計れないばかりか、別の添加剤を
併用する時に溶解をさまたげることがある。従って好ま
しくは0.1〜10重量%の添加量であり、より好まし
くは0.5〜4重量%である。
ポジ専用現像液には、20°Cにおける水に対する溶解
度が10重量%以下の有機溶剤を含有させることができ
る。水に対する溶解度が10重量%以下の有機溶剤とし
ては、例えば酢酸エチル、酢酸プロピル、酢酸ブチル、
酢酸アミル、酢酸ベンジル、エチレングリコールモノブ
チルアセテート、乳酸ブチル、レブリン酸ブチルのよう
なカルボン酸エステル;エチルブチルケトン、メチルイ
ソブチルケトン、シクロヘキサノンのようなケトン類;
エチレングリコールモノブチルエーテル、エチレングリ
コールベンジルエーテル、エチレングリコールモノフェ
ニルエーテル、メチルフェニルカルビノール、n−アミ
ルアルコール、メチルアミルアルコールのようなアルコ
ール類;キシレンのようなアルキル置換芳香族炭化水素
;メチレンジクロライド、エチレンジクロライド、モノ
クロルベンゼンのようなハロゲン化炭化水素などがある
。これら有機溶媒は一種以上用いてもよい。
本発明の現像液には、水溶性又はアルカリ可溶性の有機
及び無機の還元剤を含有させることができる。
有機の還元剤としては、例えばハイドロキノン、メトー
ル、メトキシキノン等のフェノール化合物、フェニレン
ジアミン、フェニルヒドラジン等のアミン化合物があり
、無機の還元剤としては、例えば亜硫酸ナトリウム、亜
硫酸カリウム、亜硫酸アンモニウム、亜硫酸水素ナトリ
ウム、亜硫酸水素カリウム等の亜硫酸塩、亜リン酸ナト
リウム、亜リン酸カリウム、亜リン酸水素ナトリウム、
亜リン酸水素カリウム、亜リン酸二水素ナトリウム、亜
硫酸水素カリウム等のリン酸塩、ヒドラジン、チオ硫酸
ナトリウム、亜ジチオン酸ナトリウム等を挙げることが
できる。該還元剤は少なくとも0.1〜lO重量%の範
囲含有することができる。
又、本発明における現像液には更に現像性能を高めるた
めに以下のような添加剤を加えることができる。例えば
特開昭58−75152号公報記載のN a CQ x
KCQにBr等の中性等、特開昭59−190952号
公報記載のEDTA、 NTA等のキレート剤、特開昭
59−121336号公報記載の(Co(NH3))
*CQs等の錯体、特開昭56−1425284−公報
記載のビニルベンジルトリメチルアンモニウムクロライ
ドとアクリル酸ナトリウムの共重合体等の両性高分子電
解質、特開昭58−59444号公報記載の塩化リチウ
ム等の無機リチウム化合物、特公昭50−34442号
公報記載の安息香酸リチウム等の有機リチウム化合物、
特開昭59−75255号公報記載のSi、 Ti等を
含む有機金属界面活性剤、特開昭59−84241号公
報記載の有機硼素化合物が挙げられる。
次に、本発明に係る現像補充液について説明する。
本発明の現像補充液はケイ酸アルカリを含有する水溶液
(補充液(A))及び界面活性剤を含有する水溶液(補
充液(B))からなるが、その他に希釈用として水を用
いる構成であってもよい。本発明の現像補充液の一方を
構成する補充液(A)が含有するケイ酸アルカリとして
は、前述の現像液におけるケイ酸アルカリが挙げられる
。補充液(A)はそのpHが現像液のpHより高い方が
好ましい。また、補充液(A)中のケイ酸アルカリの濃
度は、補充液(B)(及び必要により希釈用水)と混合
された組成において現像液中に必要とされるケイ酸アル
カリの濃度を補充により維持できる濃度とするのが良い
。補充液(B)が含有する界面活性剤としては、前述し
た現像液における界面活性剤を用いることができる。補
充液(B)中の界面活性剤の濃度は0.05〜lO重量
%が好ましい。まt;、補充液(B)中における界面活
性剤の濃度は現像液中に必要とされる界面活性剤の濃度
を維持できる濃度とするのが良い。
補充液(A)及び補充液(B)には、前述した現像液の
添加剤を含有することができるが、゛この場合、溶解性
、安定性等の点を考慮して適宜含有させればよい。なお
、現像液に含有させた添加剤は、現像液の性能を維持す
るために、補充液にも添加しておことが好ましい。
本発明において、補充液(A)と補充液(B)は、現像
処理するポジ型PS版の単位時間当たりの処理量、外気
の気温及び自動現像機のタイプによって決まる浦充量で
補充することが好ましい。
例えば、現像液を取り巻く外気温度が高いほど補充液(
A)だけの補充量を多くし、処理量が少なくなるほど補
充液(A)の割合を多くする等である。
このような定性的関係を下記表1に示す。
(注)(1)■は現像液をシャワーでPS版に供給する
タイプ。
■は現像液中にPS版を浸漬するタイプ。
(2)/’は増大、′\は減少、−は増減なしを示す。
このように、本発明は、現像補充液を前記2液構成とし
たので、補充に対する変動要因に応じて適切な補充が可
能となり、長期にわt;る処理において良好な現像品質
を維持することを可能としたものである。
本発明に係るポジ型PS版、PS版の支持体として通常
用いられる支持体上に0−キノンジアジド化合物を感光
成分として含有する感光性組成物を塗設してなるもので
ある。該支持体としては、例えば特開昭62−1757
57号公報の第6頁右下欄第15行〜第7頁右上欄第1
1行に記載されているような支持体が挙げられる。
前記0−キノンジアジド化合物としては、例えば0−ナ
フトキノンジアジドスルホン酸と、フェノール類及びア
ルデヒド又はケトンの重縮合樹脂とのエステル化合物が
挙げられる。
前記フェノール類としては、例えば、フェノール、0−
クレゾール、m−クレゾール、p−クレゾール、3.5
−キシレノール、カルバクロールの一価フエノール、カ
テコール、レゾルシン、ヒドロキノン等の二価フェノー
ル、ピロガロール、70口グルシン等の三価フェノール
等が挙げられる。
前記アルデヒドとしてはホルムアルデヒド、ベンズアル
デヒド、アセトアルデヒド、クロトンアルデヒド、フル
フラール等が挙げられる。これらのうち好ましいものは
ホルムアルデヒド及びベンズアルデヒドである。又、前
記ケトンとしてはアセトン、メチルエチルケトン等が挙
げられる。
前記重縮合樹脂の具体的な例としては、フェノール・ホ
ルムアルデヒド樹脂、m−クレゾール・ホルムアルデヒ
ド樹脂、ill−、p−混合クレゾール・ホルムアルデ
ヒド樹脂、レゾルシン・ベンズアルデヒド樹脂、ピロガ
ロール・アセトン樹脂等が挙げられる。
前記0−ナフトキノンジアジド化合物のフェノール類の
OH基に対する0−す7トキノンジアジドスルホン酸の
縮合率(OH基1個に対する反応率)は、15〜80%
が好ましく、より好ましくは20〜45%である。
更に0−キノンジアジド化合物としては特開昭58−4
3451号公報に記載のある以下の化合物も使用できる
。即ち例えば1.2−ベンゾキノンジアジドスルホン酸
エステル、l,2−す7トキノンジアジドスルホン酸エ
ステル、1.2−ベンゾキノンジアジドスルホン酸アミ
ド、l,2−す7トキノンジアジドスルホン酸アミドな
どの公知の1.2・キノンジアジド化合物、更に具体的
にはジエイ・コサール( J.Kosar)著「ライト
・センシティブ・システムズJ (”Light−S
ensitive Systen+s”)第339−
352頁(、 1965年)ジョン・ウィリー・アンド
・サンズ(John WileV & Sons)社に
ューヨーク)やダブリュー◆ニス・デ(−’7オレスト
( W.S.De Forest)著「7オトレジスト
」 (“Photoresist”)第50巻。
( 1975年)、マグロ−ヒル(Me Gray−1
(ill)社にューヨーク)に記載されている1.2−
ベンゾキノンジアジド−4−スルホン酸フェニルエステ
ル、l。
2、1 ’.2 ’ージー(ベンゾキノンジアジド−4
−スルホニル)−ジヒドロキシビフェニル、1.2−ベ
ンゾキノンジアジド−4−(N−エチル−M−β−ナフ
チル)−スルホンアミド、1.2−ナフトキノンジアジ
ド−5−スルホン酸シクロヘキシルエステル、I− (
1.2−ナフトキノンジアジド−5−スルホニル)−3
.5−ジメチルピラゾール、1.2−ナフトキノンジア
ジド−5−スルホン*−4’−ヒドロキシジフェニル−
4′−アゾ−β−ナフトールエステル
アジド−5−スルホニル
7トキノンジアジドー5−スルホニルオキシ)−l〜ヒ
ドロキシ−アントラキノン、l,2−ナフトキノンジア
ジド−5−スルホン酸−2.4−ジヒドロキシベンゾフ
ェノンエステル、1.2−ナフトキノンジアジド−5−
スルホン酸−2.3.4− トリヒドロキシベンゾフェ
ノンエステル、1.2−ナフトキノンジアジド−5−ス
ルホン酸クロリド2モルと4.4′−ジアミノベンゾフ
ェノン1モルの縮合物、1,2−ナフトキノンジアジド
・5−スルホン酸クロリド2モルと4.4′−ジヒドロ
キシ−L12−ジフェニルスルホン1モルの縮合物、1
.2−す7トキノンジアジド・5−スルホン酸クロリド
1モルとプルプロガリン1モルの縮合物、1.2−す7
トキノンジアジドー5−(N−ジヒドロアビエチル)−
スルホンアミドなどの1.2−キノンジアジド化合物を
挙げることができる。又、特公昭37−1953号、同
37−3627号、同37−13109号、同40−2
6126号、同40−3801号、同45−5604号
、同45−27345号、同51−13013号、特開
昭48−96575号、同48−63802号、同48
−63802号各公報に記載された1.2−キノンジア
ジド化合物をも挙げることができる。
前記0−キノンジアジド化合物のうち、1.2−ベンゾ
キノンジアジドスルホニルクロリド又は1.2−ナフト
キノンジアジドスルホニルクロリドとピロガロール・ア
セトン縮合樹脂又は2,3.4− トリヒドロキシベン
ゾフェノンを反応させて得られるO−キノンジアジドエ
ステル化合物が特に好ましい。0−キノンジアジド化合
物は上記化合物を各々単独で用いてもよいし、2種以上
組合せて用いてもよい。
ポジ型15版の感光層におけるO−キノンジアジド化合
物の感光性組成物中に占める割合は、5〜60重量%が
好ましく、特に好ましくは、10〜50重量%である。
ポジ型15版の感光層は有機酸を含有することができる
。好ましい有機酸としては、25°Cにおけるpka値
が2以上の有機酸が挙げられる。
上記pka値を有する有機酸としては、例えば化学便覧
基礎編■、丸善(株) 1966年、第1054〜l0
58頁に記載されている有機酸で、上記pka値が2以
上である化合物をすべて挙げることができる。
pka値が2以上である化合物としては、例えば安息香
酸、アジピン酸、アゼライン酸、イソフタル酸、p−ト
ルイル酸、β−エチルグルタル酸、■−オキシ安息香酸
、p−オキシ安息香酸、3.5−ジメチル安息香酸、3
.4−ジメトキシ酸、グリセリン酸、グルタコン酸、ク
ルタル酸、p−アニス酸、コハク酸、セバシン酸、β、
β−ジエチルグルタル酸、1.1−シクロブタンジカル
ボン酸、l、3−シクロブタンジカルボン酸、 1.1
−シクロペンタンジカルボン酸、1゜2=シクロペンタ
ンジカルボン酸、l、3−シクロペンタンジカルボン酸
、β、β−ジメチルグルタル酸、ジメチルマロン酸、σ
−酒石酸、スペリン酸、テレフタル酸、ピメリン酸、フ
タル酸、フマル酸、β−プロピルグルタル酸、プロピル
マロン酸、マンデル酸、メソ酒石鹸、β−メチルグルタ
ル酒、β、β−メチルプロピルグルタル酸、メチルマロ
ン酸、リンゴ酸、1.l−シクロヘキサンジカルボン酸
、1.2−シクロヘキサンジカルボン酸、1.3−シク
ロヘキサンジカルボン酸、1.4−シクロヘキサンジカ
ルボン酸、シス−4−シクロヘキセン−1,2−ジカル
ボン酸、エルカ酸、ウンデセン酸、ラウリン酸、n−カ
プリン酸、ペラルゴン酸、n−ウンデカン酸等を挙げる
ことができる。その化メルドラム酸やアスコルビン酸な
どのエノール構造を有する有機酸も好ましく用いること
ができる。上記有機酸の感光層中に占める割合は0.0
5〜IO重量%が適当であり、好ましくは、0.1〜5
重量%である。
ポジ型15版の感光層は酸無水物を含有することができ
る。好ましくは環状酸無水物であり、このようなものと
して例えば、無水7タル酸、テトラヒドロ無水7タル酸
、ヘキサヒドロ無水フタル酸、3.6−ニンドオキシー
Δ4テトラヒドロ無水フタル酸、テトラクロル無水7タ
ル酸、無水グルタル酸、無水マレイン酸、タロル無水マ
レイン酸、α−フェニル無水マレイン酸、無水コノ\り
酸、ピロメリット酸等が挙げられる。これらの酸無水物
は感光層中に0.05〜lO重量%、特に0.1〜5重
量%含有されることが好ましい。
ポジ型15版において、0−キノンジアジド化合物を含
有する感光層にはアルカリ可溶性樹脂を含有させること
が好ましい。
このアルカリ可溶性樹脂としては、ノボラック樹脂、フ
ェノール性水酸基を有するビニル系重合体、特開昭55
−57841号公報に記載されている多価フェノールと
アルデヒド又はケトンとの縮合樹脂等が挙げられる。
上記ノボラック樹脂としては、例えばフェノール・ホル
ムアルデヒド樹脂、クレゾール・ホルムアルデヒド樹脂
、特開昭55−57841号公報に記載されているよう
なフェノール・クレゾール・ホルムアルデヒド共重縮合
体樹脂、特開昭55−127553号公報に記載されて
いるようなp・置換フェノールとフェノールもしくはク
レゾールとホルムアルデヒドとの共重縮合体樹脂等が挙
げられる。
前記ノボラック樹脂の分子量(ポリスチレン標準)は、
好ましくは数平均分子量IJnが3.00X 10”〜
7.50X 10”、 重量平均分子量Maカ1.OO
X 103〜3.00X 10’、より好ましくはMn
が5.00X 10” 〜4.00X 10”、Myが
3.00X 10” 〜2.00X to’である。
上記ノボラック樹脂は単独で用いてもよいし、2種以上
組合せて用いてもよい。
上記ノボラック樹脂の感光層中に占める割合は5〜95
重量%が適当である。
前記感光層にはフェノール性水酸基を有するビニル系重
合体を含有させることが好ましい。
このフェノール性水酸基を有するビニル系重合体として
は、フェノール性水酸基を有する単位を分子構造中に有
する重合体であり、下記一般式[Industrial Application Field] The present invention relates to a positive type photosensitive lithographic printing plate (hereinafter referred to as "Positive Type 13").
More specifically, it relates to a processing method of processing a positive type 13 plate using an automatic developing machine, replenishing a replenisher, and developing it with a positive developer. [Prior Art] Conventionally, in the development process of a positive type 13 plate using an automatic processor, it has been known that in the case of long-term processing, the developer is supplemented with a replenisher in order to stabilize the development quality. ing. Regarding the replenisher and replenishment method for the developer, we will use replenisher tm which has a higher pH than the developer. A method of replenishing according to the size is known. However, even if such a replenishment method is adopted, the development quality will change due to long-term development. [Object of the Invention] The object of the present invention is to stably maintain the development quality over a longer period of time in a processing method for a positive 13th plate in which the positive 13th plate is developed by replenishing the replenisher with a developer exclusively for positives. It is an object of the present invention to provide a development replenishment method that can be used. [Structure of the Invention] The above-mentioned object of the present invention is to produce a positive type P using an automatic developing machine and a positive-only developer that can be used repeatedly by replenishing the developer replenisher.
This is achieved by a method for processing a positive PS plate in which the development replenisher comprises the following (A) and (B) in a development processing method for developing an S plate. (A) Aqueous solution containing alkali silicate. (B) Aqueous solution containing a surfactant. Further, in a preferred embodiment of the present invention, in the processing method, the above (A) and (B) are determined by the processing amount per unit time of the positive PS plate to be developed, the outside air temperature, and the type of automatic developing machine. This is an embodiment in which the amount is replenished. The present invention will be explained in detail below. The positive-only developer in the present invention (hereinafter simply referred to as "hair image solution")
) is preferably an alkaline developer containing water as a main solvent (specifically, 50% by weight or more of the solvent is water). Examples of the alkali agents include alkali silicates (potassium silicate, sodium silicate, sodium metasilicate, potassium metasilicate, ammonium silicate, etc.), potassium hydroxide, sodium hydroxide, lithium hydroxide, tribasic sodium phosphate, etc. , sodium diphosphate, potassium diphosphate, potassium diphosphate, ammonium diphosphate, ammonium diphosphate, sodium metasilicate,
Examples include inorganic alkaline agents such as sodium bicarbonate, sodium carbonate, potassium carbonate, ammonium carbonate, etc., organic alkaline agents such as mono- or triethanolamine and tetraalkyl hydroxide, and organic ammonium silicates. The content of alkaline agent in the developer is 0.6
The range is preferably 05 to 20% by weight, more preferably 0
.. It ranges from 1 to 10% by weight. It is preferable that the developer contains at least one selected from anionic surfactants, nonionic surfactants, and cationic surfactants from the start of repeated use. As anionic surfactants, higher alcohols (08-
C2□) Sulfuric ester salts [e.g., sodium salt of lauryl alcohol sulfate, sodium salt of octyl alcohol sulfate, ammonium salt of lauryl alcohol sulfate, rTeepol-81J'
(trade name, manufactured by Shell Chemical Co., Ltd.), sodium chloride alkyl sulfate, etc.], aliphatic alcohol phosphate ester salts (e.g., sodium salt of cetyl alcohol phosphate ester, etc.), alkylaryl sulfonates (e.g., dodecylbenzenesulfonic acid) sodium salt of isopropylnaphthalene sulfonic acid, sodium salt of sinaphthalene disulfonic acid, sodium salt of metanitrobenzene sulfonic acid, etc.), sulfonate salts of alkylamides (e.g., CryHssCON(C)13
)CH, 5o3Na, etc.), sulfonate salts of dibasic fatty acid esters (eg, sodium sulfosuccinate dioctyl ester, sodium sulfosuccinate dihexyl ester, etc.). Among these, sulfonate salts are particularly preferably used. Nonionic surfactants can be broadly classified into polyethylene glycol type and polyhydric alcohol type, both of which can be used, but polyethylene glycol type nonionic surfactants are preferred from the viewpoint of development performance, and among them, ethylene glycol type nonionic surfactants ( -CO.CH,O-), and has an HLB value (HLB is H
hydroph mouth e-Lipophile Balanc
# of e! Nonionic surfactants having I) of 5 or more (more preferably 8 to 20) are more preferred. Among nonionic surfactants, those having both an ethyleneoxy group and a propylene oquine group are particularly preferred, and among these, those having an HLB value of 8 or more are more preferred. Preferred examples of nonionic surfactants include the following general formula (1
) to [8]. CI) R-0-(CH2CH20)nH(3)
R-0-(CH,CHO)+++-(C112CO
! O) d(6) lo(C2H,O)a (C3)
1eo) b (C2H,0)cH(7) H(OC
21(a)y (OCst(6)X\/(CjIIa
O)X-(CzH,0)yHl((Oc2H4)y
(OCIH6)X/\(CJaO)x (CzH+0
)yH(8) HO-(CH2CH20)nH[1
[8] In the formulas, R represents a hydrogen atom or a monovalent organic group. Examples of the organic group include a straight-chain or branched alkyl group having 1 to 30 carbon atoms that may have a substituent (for example, an aryl group (phenyl, etc.)), and an alkylcarbonyl group in which the alkyl moiety is the above-mentioned alkyl group. groups, substituents (e.g. hydroxyl groups, alkyl groups as mentioned above, etc.)
Yes! Examples include a phenyl group which may have 2 atoms. al
l) %c, m, n, X and y each represent an integer from 1 to 40. Specific examples of nonionic surfactants are shown below. Polyethylene glycol, polyoxyethylene lauryl ether, polyoxyethylene nonyl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene behenyl ether, polyoxyethylene polyoxypropylene cetyl ether, polyoxy Ethylene polyoxypropylene behenyl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene stearylamine, polyoxyethylene oleylamine, polyoxyethylene stearamide, polyoxyethylene oleate amide, polyoxyethylene castor oil, polyoxyethylene abiethyl ether, polyoxyethylene lanolin ether, polyoxyethylene monolaurate, polyoxyethylene monostearate,
Polyoxyethylene glyceryl monooleate, polyoxyethylene glycer monostearate, polyoxyethylene propylene glycol monostearate, oxyethylene oxypropylene polymer, distyrenated phenol polyethylene oxide adduct, tribenzylphenol polyethylene oxide adduct, octylphenol Polyoxyethylene polyoxypropylene adduct, glycerol monostearate, sorbitan monolaurate, polyquine ethylene sorbitan monolaurate, etc. The weight average molecular weight of the nonionic surfactant is 300 to 100
A range of 00 is preferred, and a range of 500 to 5000 is particularly preferred. Cationic surfactants are broadly classified into amine type and quaternary ammonium salt type, and any of these can be used. Examples of amine types include polyoxyethylene alkyl amines, N-alkyl propylene amines, N-alkyl polyethylene polyamines polyethylene polyamine dimethyl sulfate, alkyl biguanides, long chain amine oxides, alkylimidacillins, l
-Hydroxyethyl-2-alkylimidacyline, ■-acetylaminoethyl-2-alkylimidacyline, 2
-alkyl-4-methyl-4-hydroxymethyloxazoline and the like. Examples of quaternary ammonium salts include long-chain primary amine salts, alkyltrimethylammonium salts, dialkyldimethylethylammonium salts, alkyldimethylammonium salts, alkyldimethylbenzylammonium salts, alkylpyridinium salts, and alkylquinolinium salts. , alkylisoquinolinium salt, alkylpyridinium sulfate, stearamidemethylpyridinium salt, acylaminoethyldiethylamine salt, acylaminoethylmethyldiethylammonium salt, alkylamidopropyldimethylbenzylammonium salt, fatty acid polyethylene polyamide, acylaminoethylpyridinium salt , acylcolaminoformylmethylpyridinium salt, stearoxymethylpyridinium salt, fatty acid triethanolamine, fatty acid triethanolamine formate, trioxyethylene fatty acid triethanolamine, fatty acid dibutylaminoethanol, cetyloxymethylpyridinium salt, p
-inoctylphenoxyethoxyethyldimethylbenzylammonium salt and the like. (In the above compound examples, "alkyl" refers to a straight-chain or partially substituted alkyl having 6 to 20 carbon atoms, and specifically, straight-chain alkyl such as hexyl, octyl, cetyl, stearyl, etc.) (Preferably used.) Among these, water-soluble quaternary ammonium salt type cationic surfactants are particularly effective, and among these, alkyltrimethylammonium salts, alkyldimethylbenzylammonium salts, ethylene oxide addition ammonium salts, etc. are preferable. be. Further, a polymer having a cationic component as a repeating unit is also a cationic surfactant in a broad sense, and the cationic surfactant of the present invention has a golden color. In particular, a polymer containing a quaternary ammonium salt obtained by copolymerizing with a lipophilic monomer can be suitably used. The weight average molecular weight of the polymer is in the range of 300 to 50,000, particularly preferably in the range of 500 to 5,000. These surfactants are preferably contained in an amount of 0.05 to IO weight %. It is preferable that the developer in the present invention contains an organic carboxylic acid. The organic carboxylic acid is preferably an aliphatic carboxylic acid having 6 to 20 carbon atoms, or an aromatic carboxylic acid in which a benzene ring or a 7talene ring is substituted with a carboxyl group. The aliphatic carboxylic acid is preferably an alkanoic acid having 6 to 20 carbon atoms, and specific examples include cabroic acid, enantylic acid, caprylic acid, pelargonic acid, capric acid, lauric acid, mystylic acid, valmitic acid, and stearic acid. etc., and particularly preferred are alkanoic acids having 6 to 12 carbon atoms. Also, fatty acids with double bonds in their carbon chains,
It may also have a branched carbon chain. The above aliphatic carboxylic acid is preferably used as a sodium or potassium salt or an ammonium salt in order to increase water solubility. Specific compounds of aromatic carboxylic acids include benzoic acid, 0-chlorobenzoic acid, p-chlorobenzoic acid, 0-hydroxybenzoic acid, p-hydroxybenzoic acid, p-ter
t-butylbenzoic acid, 0-aminobenzoic acid, p-aminobenzoic acid, 2,4-dihydroxybenzoic acid, 2゜5-dihydroxybenzoic acid, 2.3-dihydroxybenzoic acid,
2.3-dihydroxybenzoic acid, 3,5-dihydroxybenzoic acid, gallic acid, l-hydroxy-2-naphthoic acid, 3-hydroxy-2-naphthoic acid, 2-hydroxy-
Among these, benzoic acids are particularly effective. The above-mentioned aromatic carboxylic acid is preferably used as a sodium or potassium salt or an ammonium salt in order to improve water solubility. There is no particular restriction on the content of aliphatic carboxylic acid and aromatic carboxylic acid added to the positive developer, but if it is lower than 0.1% by weight, the effect will not be sufficient, and if it is 10% by weight or more, the effect will be even lower. Not only is the improvement not measurable, but it may also hinder dissolution when used in combination with other additives. Therefore, the amount added is preferably 0.1 to 10% by weight, more preferably 0.5 to 4% by weight. The positive-only developer may contain an organic solvent having a solubility in water of 10% by weight or less at 20°C. Examples of organic solvents having a solubility in water of 10% by weight or less include ethyl acetate, propyl acetate, butyl acetate,
Carboxylic acid esters such as amyl acetate, benzyl acetate, ethylene glycol monobutyl acetate, butyl lactate, butyl levulinate; ketones such as ethyl butyl ketone, methyl isobutyl ketone, cyclohexanone;
Alcohols such as ethylene glycol monobutyl ether, ethylene glycol benzyl ether, ethylene glycol monophenyl ether, methylphenyl carbinol, n-amyl alcohol, methyl amyl alcohol; alkyl-substituted aromatic hydrocarbons such as xylene; methylene dichloride, ethylene Examples include halogenated hydrocarbons such as dichloride and monochlorobenzene. One or more of these organic solvents may be used. The developer of the present invention can contain water-soluble or alkali-soluble organic and inorganic reducing agents. Examples of organic reducing agents include phenolic compounds such as hydroquinone, methol, and methoxyquinone, and amine compounds such as phenylenediamine and phenylhydrazine. Examples of inorganic reducing agents include sodium sulfite, potassium sulfite, ammonium sulfite, and hydrogen sulfite. Sulfites such as sodium and potassium hydrogen sulfite, sodium phosphite, potassium phosphite, sodium hydrogen phosphite,
Examples include phosphates such as potassium hydrogen phosphite, sodium dihydrogen phosphite, and potassium hydrogen sulfite, hydrazine, sodium thiosulfate, and sodium dithionite. The reducing agent may be contained in a range of at least 0.1 to 10% by weight. Further, the following additives can be added to the developer in the present invention in order to further improve the developing performance. For example, N a CQ x described in JP-A-58-75152
Neutral agents such as Br for KCQ, chelating agents such as EDTA and NTA described in JP-A-59-190952, (Co(NH3)) as described in JP-A-59-121336
*Complexes such as CQs, amphoteric polymer electrolytes such as the copolymer of vinylbenzyltrimethylammonium chloride and sodium acrylate described in JP-A-56-1425284, lithium chloride as described in JP-A-58-59444, etc. Inorganic lithium compounds, organic lithium compounds such as lithium benzoate described in Japanese Patent Publication No. 50-34442,
Examples include organometallic surfactants containing Si, Ti, etc. described in JP-A-59-75255, and organoboron compounds described in JP-A-59-84241. Next, the developer replenisher according to the present invention will be explained. The developer replenisher of the present invention is composed of an aqueous solution containing an alkali silicate (replenisher (A)) and an aqueous solution containing a surfactant (replenisher (B)), but water may also be used for dilution. There may be. Examples of the alkali silicate contained in the replenisher (A) constituting one of the developer replenishers of the present invention include the alkali silicate in the developer described above. It is preferable that the pH of the replenisher (A) is higher than that of the developer. In addition, the concentration of alkali silicate in the replenisher (A) is determined by replenishing the concentration of alkali silicate required in the developer in the composition mixed with the replenisher (B) (and water for dilution if necessary). It is best to maintain a concentration that can be maintained. As the surfactant contained in the replenisher (B), the surfactant in the developer described above can be used. The concentration of surfactant in the replenisher (B) is preferably 0.05 to 10% by weight. The concentration of the surfactant in the replenisher (B) is preferably such that the concentration of the surfactant required in the developer can be maintained. The replenisher (A) and the replenisher (B) can contain the developer additives described above, but in this case, if they are added as appropriate in consideration of solubility, stability, etc. good. Note that the additives contained in the developer are preferably also added to the replenisher in order to maintain the performance of the developer. In the present invention, the replenisher (A) and the replenisher (B) are replenished at a rate determined by the processing amount per unit time of the positive PS plate to be developed, the outside temperature, and the type of automatic processor. is preferred. For example, the higher the outside air temperature surrounding the developer, the higher the replenisher (
For example, the amount of replenishment of only A) may be increased, and the proportion of replenisher (A) may be increased as the throughput decreases. Such qualitative relationships are shown in Table 1 below. (Note) (1) ■ is a type that supplies developer to the PS plate using a shower. ■ is a type in which the PS plate is immersed in the developer. (2) /' indicates an increase, '\' indicates a decrease, and - indicates no increase or decrease. As described above, in the present invention, since the developer replenisher has the above-mentioned two-liquid composition, it is possible to appropriately replenish the replenisher according to the fluctuation factors for replenishment, and to maintain good development quality during long-term processing. This made it possible. The positive-working PS plate according to the present invention is one in which a photosensitive composition containing an 0-quinonediazide compound as a photosensitive component is coated on a support commonly used as a support for a PS plate. As the support, for example, JP-A-62-1757
Publication No. 57, page 6, lower right column, line 15 to page 7, upper right column, line 1
Supports such as those listed in line 1 may be mentioned. Examples of the 0-quinonediazide compound include ester compounds of 0-naphthoquinonediazide sulfonic acid and polycondensation resins of phenols and aldehydes or ketones. Examples of the phenols include phenol, 0-
Cresol, m-cresol, p-cresol, 3.5
- Dihydric phenols such as xylenol, monohydric phenol of carvacrol, catechol, resorcinol, and hydroquinone, and trihydric phenols such as pyrogallol and 70-glucine. Examples of the aldehyde include formaldehyde, benzaldehyde, acetaldehyde, crotonaldehyde, and furfural. Preferred among these are formaldehyde and benzaldehyde. Further, examples of the ketone include acetone and methyl ethyl ketone. Specific examples of the polycondensation resin include phenol/formaldehyde resin, m-cresol/formaldehyde resin, ill-, p-mixed cresol/formaldehyde resin, resorcinol/benzaldehyde resin, pyrogallol/acetone resin, and the like. The condensation rate of 0-7toquinonediazide sulfonic acid with respect to the OH group of the phenol of the 0-naphthoquinonediazide compound (reaction rate with respect to one OH group) is 15 to 80%.
is preferable, and more preferably 20 to 45%. Furthermore, as an 0-quinonediazide compound, JP-A-58-4
The following compounds described in Publication No. 3451 can also be used. That is, for example, known 1, such as 1,2-benzoquinonediazide sulfonic acid ester, 1,2-7toquinonediazide sulfonic acid ester, 1,2-benzoquinonediazide sulfonic acid amide, 1,2-7toquinonediazide sulfonic acid amide, etc. .2. Quinonediazide compounds, more specifically, "Light-Sensitive Systems J" by J. Kosar.
339-
352 pages (1965), John Wiley & Sons (New York) and W.S. De Forest, ``7 Otresist'' (`` (1975), McGraw-Hill (Me Gray-1)
1.2-
Benzoquinonediazide-4-sulfonic acid phenyl ester, l. 2, 1'. 2'-G (benzoquinone diazide-4
-sulfonyl)-dihydroxybiphenyl, 1,2-benzoquinonediazide-4-(N-ethyl-M-β-naphthyl)-sulfonamide, 1,2-naphthoquinonediazide-5-sulfonic acid cyclohexyl ester, I-(
1.2-naphthoquinonediazide-5-sulfonyl)-3
.. 5-dimethylpyrazole, 1,2-naphthoquinonediazide-5-sulfone*-4'-hydroxydiphenyl-
4'-azo-β-naphthol ester azido-5-sulfonyl 7toquinonediazide-5-sulfonyloxy)-l~hydroxy-anthraquinone, l,2-naphthoquinonediazide-5-sulfonic acid-2,4-dihydroxybenzophenone ester, 1.2-Naphthoquinonediazide-5-
Sulfonic acid-2.3.4-trihydroxybenzophenone ester, condensate of 2 moles of 1,2-naphthoquinonediazide-5-sulfonic acid chloride and 1 mole of 4,4'-diaminobenzophenone, 1,2-naphthoquinonediazide 5 - condensate of 2 moles of sulfonic acid chloride and 1 mole of 4,4'-dihydroxy-L12-diphenylsulfone, 1
.. Condensate of 1 mol of 2-su7toquinonediazide/5-sulfonic acid chloride and 1 mol of purpurogalin, 1.2-su7
Toquinone diazido 5-(N-dihydroabiethyl)-
Mention may be made of 1,2-quinonediazide compounds such as sulfonamides. Also, Special Publication No. 37-1953, No. 37-3627, No. 37-13109, No. 40-2
No. 6126, No. 40-3801, No. 45-5604, No. 45-27345, No. 51-13013, JP-A-48-96575, No. 48-63802, No. 48
1,2-quinonediazide compounds described in each publication No. 63802 can also be mentioned. Among the O-quinonediazide compounds, O-quinonediazide obtained by reacting 1.2-benzoquinonediazide sulfonyl chloride or 1.2-naphthoquinonediazide sulfonyl chloride with a pyrogallol acetone condensation resin or 2,3.4-trihydroxybenzophenone. Ester compounds are particularly preferred. As the 0-quinonediazide compound, each of the above compounds may be used alone, or two or more thereof may be used in combination. The proportion of the O-quinonediazide compound in the photosensitive composition of the positive 15th plate is preferably 5 to 60% by weight, particularly preferably 10 to 50% by weight. The photosensitive layer of the positive type 15 plate can contain an organic acid. Preferred organic acids include those having a pka value of 2 or more at 25°C. Organic acids having the above pka value include, for example, Chemistry Handbook Basic Edition ■, Maruzen Co., Ltd., 1966, No. 1054-10.
Among the organic acids described on page 58, all compounds having the above pka value of 2 or more can be mentioned. Examples of compounds having a pka value of 2 or more include benzoic acid, adipic acid, azelaic acid, isophthalic acid, p-toluic acid, β-ethylglutaric acid, ■-oxybenzoic acid, p-oxybenzoic acid, and 3.5. -dimethylbenzoic acid, 3
.. 4-dimethoxy acid, glyceric acid, glutaconic acid, curtaric acid, p-anisic acid, succinic acid, sebacic acid, β,
β-diethylglutaric acid, 1,1-cyclobutanedicarboxylic acid, l,3-cyclobutanedicarboxylic acid, 1.1
-cyclopentanedicarboxylic acid, 1゜2=cyclopentanedicarboxylic acid, l,3-cyclopentanedicarboxylic acid, β, β-dimethylglutaric acid, dimethylmalonic acid, σ
-Tartaric acid, superric acid, terephthalic acid, pimelic acid, phthalic acid, fumaric acid, β-propylglutaric acid, propylmalonic acid, mandelic acid, meso alcohol soap, β-methylglutaric acid, β, β-methylpropylglutaric acid, Methylmalonic acid, malic acid, 1. l-Cyclohexanedicarboxylic acid, 1.2-cyclohexanedicarboxylic acid, 1.3-cyclohexanedicarboxylic acid, 1.4-cyclohexanedicarboxylic acid, cis-4-cyclohexene-1,2-dicarboxylic acid, erucic acid, undecenoic acid, lauric acid Examples include acids such as n-capric acid, pelargonic acid, and n-undecanoic acid. Organic acids having an enol structure such as Meldrum's acid and ascorbic acid can also be preferably used. The proportion of the organic acid in the photosensitive layer is 0.0
5 to IO weight percent is suitable, preferably 0.1 to 5
Weight%. The photosensitive layer of the positive type 15 plate can contain an acid anhydride. Preferred are cyclic acid anhydrides, such as 7-thalic anhydride, tetrahydro-7-thalic anhydride, hexahydrophthalic anhydride, 3,6-nindooxy-Δ4-tetrahydrophthalic anhydride, tetrachloro-7-thalic anhydride, and hexahydrophthalic anhydride. Examples thereof include glutaric acid, maleic anhydride, talol maleic anhydride, α-phenylmaleic anhydride, conozylic anhydride, pyromellitic acid, and the like. These acid anhydrides are preferably contained in the photosensitive layer in an amount of 0.05 to 10% by weight, particularly 0.1 to 5% by weight. In the positive type 15th plate, it is preferable that the photosensitive layer containing the 0-quinonediazide compound contains an alkali-soluble resin. Examples of the alkali-soluble resin include novolac resin, vinyl polymer having a phenolic hydroxyl group, and JP-A No. 55
Examples include condensation resins of polyhydric phenols and aldehydes or ketones described in JP-A-57841. Examples of the novolak resin include phenol-formaldehyde resin, cresol-formaldehyde resin, phenol-cresol-formaldehyde copolycondensate resin as described in JP-A-55-57841, and JP-A-55-127553. Examples include copolycondensate resins of p-substituted phenol and phenol or cresol and formaldehyde as described in publications. The molecular weight (polystyrene standard) of the novolak resin is:
Preferably, the number average molecular weight IJn is 3.00X 10”~
7.50X 10”, weight average molecular weight Ma: 1.OO
X 103 to 3.00X 10', more preferably Mn
is 5.00X 10'' to 4.00X 10'', and My is 3.00X 10'' to 2.00X to'. The above novolac resins may be used alone or in combination of two or more types. The proportion of the novolac resin in the photosensitive layer is 5 to 95%.
Weight % is appropriate. It is preferable that the photosensitive layer contains a vinyl polymer having a phenolic hydroxyl group. This vinyl polymer having a phenolic hydroxyl group is a polymer having a unit having a phenolic hydroxyl group in its molecular structure, and has the following general formula:
〔9〕〜〔13〕の少な
くとも1つの構造単位を含む重合体が好ましい。
一般式A polymer containing at least one structural unit of [9] to [13] is preferred. general formula
〔9〕 一般式 %式% 一般式 (11) 一般式 一般式 〔13〕 一般式[9] general formula %formula% general formula (11) general formula general formula [13] general formula
〔9〕〜〔13〕において、R3及びR2はそれ
ぞれ水素原子、アルキル基又はカルボキシル基を表し、
好ましくは水素原子である。R3は水素原子、ハロゲン
原子又はアルキル基を表し、好ましくは水素原子又はメ
チル基、エチル基等のアルキル基である。R4は水素原
子、アルキル基、アリール基又はアラルキル基を表し、
好ましくは水素原子である。Aは窒素原子又は酸素原子
と芳香族炭素原子とを連結する、置換基を有してもよい
アルキレン基を表し、mは0〜lOの整数を表し、Bは
置換基を有してもよいフェニレン基又は置換基を有して
もよいナフチレン基を表す。
前記感光層に用いられる重合体としては共重合体型の構
造を有するものが好ましく、前記一般式In [9] to [13], R3 and R2 each represent a hydrogen atom, an alkyl group or a carboxyl group,
Preferably it is a hydrogen atom. R3 represents a hydrogen atom, a halogen atom, or an alkyl group, preferably a hydrogen atom or an alkyl group such as a methyl group or an ethyl group. R4 represents a hydrogen atom, an alkyl group, an aryl group or an aralkyl group,
Preferably it is a hydrogen atom. A represents an alkylene group which may have a substituent and which connects a nitrogen atom or an oxygen atom and an aromatic carbon atom, m represents an integer from 0 to 1O, and B may have a substituent. Represents a phenylene group or a naphthylene group which may have a substituent. The polymer used in the photosensitive layer preferably has a copolymer type structure, and has the general formula
〔9〕〜〔13
〕でそれぞれ示される構造単位と組合せて用いることが
できる単量体単位としては、例えばエチレン、プロピレ
ン、インブチレン、ブタジェン、イソプレン等のエチレ
ン系不飽和オレフィンM、例、tばスチレン、α−メチ
ルスチレン、p−メチルスチレン、p−クロロスチレン
等のスチレン類、例えばアクリル酸、メタクリル酸等の
アクリル酸類、例えばイタコン酸、マレイン酸、無水マ
レイン酸等の不飽和脂肪族ジカルボン酸類、例えばアク
リル酸メチル、−アクリル酸エチル、アクリル酸n−ブ
チル、アクリル酸イソブチル、アクリル酸ドデシル、ア
クリル酸2−クロロエチル、アクリル酸フェニル、σ−
クロロアクリル酸メチル、メタクリル酸メチル、メタク
リル酸エチル、エタクリル酸エチル等のα−メチレン脂
肪族モノカルボン酸のエステル類、例えばアクリロニト
リル、メタアクリロニトリル等のニトリル類、例えばア
クリルアミド等のアミド類、例えばアクリルアニリド、
p−クロロアクリルアニリド、m−ニトロアクリルアニ
リド、−一メトキシアクリルアニリド等のアニリド類、
例えば酢酸ビニル、プロピオン酸ビニル、ベンジェ酸ビ
ニル、酪酸ビニル等のビニルエステル類、例えばメチル
ビニルエーテル、エチルビニルエーテル、インブチルビ
ニルエーテル、β−クロロエチルビニルエーテル等のビ
ニルエーテル類、塩化ビニル、ビニリデンクロライド、
ビニリデンシアナイド、例えばl−メチル−1−メトキ
シエチレン、1.1−ジメトキシエチレン、■、2−ジ
メトキシエチレン、1.1−ジメトキシカルボニルエチ
レン、■−メチルー1−二トロエチレン等のエチレン誘
導体類、例えばN−ビニルビロール、N−ビニルカルバ
ゾール、N−ヒニルインドール、N−1:”ニルピロリ
デン、N−ビニルピロリドン等のN−ビニル化合物、等
のビニル系単量体がある。これらのビニル系単量体は不
飽和二重結合が開裂した構造で高分子化合物中に存在す
る。
上記の単量体のうち、脂肪族モノカルボン酸のエステル
類、ニトリル類が本発明の目的に対して優れた性能を示
し、好ましい。
これらの単量体は重合体中にブロック又はランダムのい
ずれの状態で結合していてもよい。
上記ビニル系重合体の感光層中に占める割合は0.5〜
70重量%が好ましい。
上記ビニル系重合体は1種を用いてもよいし、又2種以
上組合せて用いてもよい。又、他の高分子化合物等と組
合せて用いることもできる。
本発明の感光層には、さらに下記一般式〔14〕で表さ
れる置換フェノール類を感脂化剤として含有させること
が好ましい。
さらにまた、ポジ型13版の感光層には下記一般式〔1
4〕で表される置換フェノール類とアルデヒド類との縮
合樹脂及び/又は該樹脂の。−キノンジアジドスルホン
酸エステル化合物を含有させることができる。
一般式〔14〕
H
一般式〔14〕において、R1及びR8は各々水素原子
、アルキル基又はハロゲン原子を表し、R3は炭素原子
数2以上のアルキル基又はシクロアルキル基を表す。
一般式〔14〕において、R1及びR2が表すアルキル
基は、炭素原子数1〜3のアルキル基が好ましく、炭素
原子数l〜2のいアルキル基が特に有用である。R1及
びR2が表すハロゲン原子は、例えばフッ素、塩素、臭
素、ヨウ素等で、特に塩素原子及び臭素原子が好ましい
。R1が表すアルキル基は好ましくは炭素原子数15以
下であり、炭素原子数3〜8のアルキル基が特に好まし
く、シクロアルキル基は炭素原子数3〜15のものが好
ましく、炭素原子数3〜8のものが特に有用である。
一般式〔14〕で表される置換フェノール類の例として
は、イソプロピルフェノール、tert−ブチルフェノ
ール、tert−アミルフェノール、ヘキシルフェノー
ル、tert−オクチルフェノール、シクロヘキシルフ
ェノール、3−メチル−4−クロロ−5−tert−ブ
チルフェノール、イソプロピルクレゾール、tert−
ブチルクレゾール、tert−アミルクレゾール、ヘキ
ンルクレゾール、tert−オクチルクレゾール、シク
ロヘキンルクレゾール等が挙げられ、そのうち特に好ま
しくはtert−オクチルフェノール及びtert−ブ
チルフェノールが挙げられる。
また、上記アルデヒド類の例としてはホルムアルデヒド
、ベンズアルデヒド、アセトアルデヒド、アクロレイン
、クロトンアルデヒド、7ルフラール等の脂肪族および
芳香族フ”ルデヒドが挙げられ、炭素原子数1ないし6
のもの2包含する。そのうち好ましくはホルムアルデヒ
ドおよびベンズアルデヒドである。
一般式〔14〕で表される置換フェノール類の感光層中
の含有量は0605〜15重量%の範囲が好ましい。
上記該置換フェノール類とアルデヒド類とを縮合させた
樹脂は、一般式〔14〕により表される置換フェノール
と、アルデヒド類とを酸性触媒の存在下で重縮合して合
皮される。使用される酸性触媒としては、塩酸、しゅう
酸、硫酸、リン酸等の無機酸や有機酸が用いられ、置換
フェノール類とアルデヒド類との配合比は、置換フェノ
ール類1モル部に対しアルデヒド類が0.7〜1.0モ
ル部用いられる。反応溶媒としては、アルコール類、ア
セトン、水、テトラヒドロフラン等が用いられる。
所定温度(−5〜120°C)、所定時間(3〜48時
間)反応後、減圧下加圧し、水洗いして脱水させて得る
か、又は水結析させて反応物を得る。
上記置換フェノ−2t・類とアルデヒド類との縮合樹脂
の0−す7トキノンジアジドスルホン酸工ステル化合物
は、上記縮合樹脂を適当な溶媒、例えば、ジオキサン等
に溶媒させて、これにO−ナフトキノンジアジドスルホ
ン酸クロライドを投入し、加圧撹拌しながら、炭酸アル
カリ等のアルカリを当量点まで滴下することによりエス
テル化させて得られる。
前記エステル化物において、フェノール類の水酸基に対
する0−ナフトキノンジアジドスルホン酸クロライドの
縮合率(水酸基1個に対する反応率%)は、5〜80%
が好ましく、より好ましくは20〜70%、更に好まし
くは30〜60%である。該縮合率は、元素分析により
スルホニル基の硫黄原子の含有量を求めて計算する。
前記感光層中に占める前記一般式〔14〕で表される置
換フエーノール類とアルデヒド類縮合させた樹脂および
該樹脂のO−ナフトキノンジアジドスルホン酸エステル
化合物(以下、これらを「感脂化剤(B)」という)の
量は0.05〜15重量%が好ましく、特に好ましくは
1−10重量%である。
感脂化剤(B)は、重量平均分子量Myが好ましくは、
5.OX 10”〜5.OX 103の範囲であり、更
に好ましくは、7.OX 10”〜3.OX 103の
範囲である。その数平均分子量Mnは3.OX 10”
〜2.5X10’の範囲であることが好ましく、更に好
ましくは4.OX 10”〜2、OX 10’の範囲で
ある。
感脂化剤(’B)の化合物例を次に挙げる。
−1
(m :
〜50:
50゜
Q′
を反応させる前の樹脂の
(m=n=50:
M w = 1300)
50、
Qを反応させる前の樹脂の
−3
H
前記感光層の中には、上記の素材の他、必要Cコ応じて
更に染料、顔料当の色素、可塑剤、界面活性剤、7ツ素
系界面活性剤、露光により酸を発生し得る化合物などを
添加することができる。
更に前記感光層には、該感光層の感脂性を向上するため
に例えば、p−tert−ブチルフェノールホルムアル
デヒド樹脂やp−n−オクチルフェノールホルムアルデ
ヒド樹脂や、これらがO−キノンジアジド化合物で部分
的にエステル化された樹脂などを添加することもできる
。
これらの各成分を通常用いられる溶媒に溶解させ、PS
版用の支持体表面に塗布し、乾燥させることにより感光
層を設けて、ポジ型13版を製造することができる。塗
布量は、乾燥後重量で好ましくは0.5〜7g/lの範
囲である。
〔実施例〕
以下、実施例により本発明を説明する。
実施例1
下記現像液(A)24αを第1図に示す自動現像機の現
像液タンク4に入れ、下記現像補充液(A1)及び(B
、)を準備した。
現像液(A)
ケイ酸カリウム水溶液 30重量部(SiOz
含有26重量%、K、0含有13重量%)水酸化カリウ
ム 16重量部エマルゲン147
0.1重量部(花王(株)製非イオン界
面活性剤)
水 900重量部現像補充
液(AI)
ケイ酸カリウム水溶液 30重量部(Sin
、含量26重量%、KzO含量13重量%)水酸化カリ
ウム 25重量部水
700重量部現像補充液(B1)
エマルデフ14フ2重量部
水 1000重量部
次に厚さ0.24mmのJIS−1050アルミニウム
板を2%の水酸化ナトリウム水溶液中に浸漬し、脱脂処
理を行った後に、希硝酸溶液中にて電気化学的に粗面化
し、よく洗浄した後に希硫酸溶液中で陽極酸化処理を行
って2.5g/+n”の酸化皮膜を上記アルミニウム板
表面上に形成させた。このように処理されたアルミニウ
ム板を水洗、乾燥後、下記組成の感光液を乾燥重量2.
5g/m’となるように塗布し、乾燥してポジ型15版
を得た。PS版のサイズは10010O3800m+a
とした。
感光性塗布液組成
ナフトキノン−(1,2)−ジアジド−(2)−5−ス
ルホン酸クロライドとピロガロール・アセトン樹脂との
エステル化合物(特開昭60−143345号公報合戊
例2に記載された化合物)
2重量部
フェノールとff1−+p−混合クレゾールとホルムア
ルデヒドとの共重縮合樹脂(合成時のフェノール、−ク
レゾール及びp−クレゾールの各々の仕込みモル比が2
0:48:32、重量平均分子量My−7400、数平
均分子量Mn−1400)6.5重量部
p−Lert−オクチルフェノールとホルムアルデヒド
より合成されたノボラック樹脂とす7トキノンー(1,
2)−ジアジド−(2)−5−スルホン酸クロライドと
のエステル化合物(縮合率:50モル%、M W−17
00) 0.1重量部ビクトリ
ア・ピュア・ブルーBOH0,08重量部(床土ケ谷化
学(株)製)
エチルセロソルブ aom t 部メチ
ルセロソルブ 20重量部こうして得ら
れたポジ型15版を多数枚用意し透明ポジティブフィル
ム及び感度測定用ステップタブレット(イーストマン・
ラダツク社製No。2、濃度差0.15ずつ21段階の
グレースケール)を密着して、2kWメタルハライドラ
ンプ(岩崎電気(株)製 アイドルフィン2000)を
光源として8.0mW/cm”の条件で70c111の
距離から60秒間露光を行った。
このようにして得られたポジ型PS版50枚を、準備し
た自動現像機にて27’C,20秒で処理した。処理は
10分間隔にPS版を挿入した。この時の室温は25°
Cであった。又、処理を行っている間23版1 m 2
現像したごとに補充液(A +)を59+a12.補充
液(B1)を30taQ添加した。電気疲労のために更
に30分毎に補充液(Δl)を5On+f2添加した。
50枚処理した後、最初の1枚目と最後の50枚目のス
テップタブレットを比較したが、両方共に全く同じ現像
品質であった。
なお、第1図において、lは現像処理を行う現像部、2
は水洗部、3はリンス液又は不感脂化液による処理を行
うリンス・ガム部、4は現像液タンク、5〜7はそれぞ
れ処理液供給ノズル、8〜IOはポンプ、SはPS版又
はその搬送経路である。
実施例2
実施例1と同様のポジ型15版、現像液、現像補充液及
び自動現像機を準備した。
処理は27°0.20秒で5分間隔に100枚行った。
処理を行っている間13版1m”現像したごとに補充液
(AI)を50IIQ、補充液(B1)を30mff添
加した。
空気疲労のため、さらに30分毎に補充液(A、)を1
00mff添加した。100枚処理した後、最初の1枚
目と最後の100枚目のステップタブレットを比較した
が、両方共に全く同じ現像品質であった。
実施例3
下記現像液(B)及び現像補充液(A、)及び(B2)
を用いた他は実施例1と同様に行った結果、最初の1枚
目と最後の50枚目のステップタブレットの現像品質に
差が見られなかった。
現像液(B)
ケイ酸ソーダ水溶液 30重量部(5i02
7Na20モル比1.8、Sin、含有量37.5重量
%)水酸化ナトリウム IO重量部ペレ
ックスNB−L O,2重量部(花王
(株)製界面活性剤)
水 900重量部現
像補充液(A、)
ケイ酸ソーダ水溶液(同上)30重量部水酸化ナトリウ
ム 15重量部水
900重量部現像補充液(Bり
ペレックスNB−L 3重量部水
1000重量部実施例
4
第2図に示す自動現像機を用い、実施例1と同様の現像
液、現像補充液及びポジ型15版を用い実施例1と同様
にあ理を行った。処理を行っている間ps版1 m 2
現像したごとに補充液(A2)を5011IQ、補充液
(B、)を30m12添加した。空気疲労のため、更に
30分毎に補充液(A2)を20m12添加した。50
枚処理した後、最初の1枚目と最後の50枚目のステッ
プタブレットを比較したが、現像品質に差が見られなか
った。
なお、第2図において、11は現像処理を行う現像部、
12は水洗部、13はリンス液又は不惑脂化液による処
理を行うリンス・ガム部、14は現像槽、15.16.
17は処理液供給ノズル、18.19.20はポンプ、
Sはポジ型15版又はその搬送路である。同図中、※l
と※1等は配管で接続されている。
比較例1
下記現像補充液(C)を用いた他は実施例1と同様の実
験を行い、処理を行っている間PS版1m2現像したご
とに補充液(C)を60m(l添加した。空気疲労のた
め、更に30分毎に補充液(C)を50mff添加した
。50枚処理した後、最初の1枚目と最後の50枚目の
ステップタブレットを比較した所、クリアー感度はほぼ
同等であったが、ベタ感度が大きく異なっていた。
現像補充液(C)
ケイ酸カリウム水溶液 30重量部(SiO2
含量26重量%、K、O含量13重量%)水酸化カリウ
ム 20重量部エマルゲン1471重
量部
水 700重量部比
較例2
現像補充液(C)を用い実施例4と同様の処理を行・っ
た。処理を行っている間、PS#L1m”現像したごと
に補充液(C)を6〇−添加した。空気疲労のため、更
に30分毎に補充液(C)を20m(2添加しI;。
50枚処理した後、最初の1枚目と最後の50枚目のス
テップタブレットを比較した所、クリア感度はほぼ同じ
であったが、ベタ感度が大きく異なっていた。
〔発明の効果〕
本発明によれば、長期にわたり補充液を補充して繰り返
し使用するポジ型13版専用の現像液でポジ型15版を
現像処理する処理方法において、より長い期間にわたっ
て現像品質を安定に維持することができる。[9] ~ [13]
Examples of monomer units that can be used in combination with the structural units shown in ] include ethylenically unsaturated olefins M such as ethylene, propylene, imbutylene, butadiene, and isoprene, examples of which include t-styrene, α-methyl Styrenes such as styrene, p-methylstyrene and p-chlorostyrene, acrylic acids such as acrylic acid and methacrylic acid, unsaturated aliphatic dicarboxylic acids such as itaconic acid, maleic acid and maleic anhydride, such as methyl acrylate , -ethyl acrylate, n-butyl acrylate, isobutyl acrylate, dodecyl acrylate, 2-chloroethyl acrylate, phenyl acrylate, σ-
Esters of α-methylene aliphatic monocarboxylic acids such as methyl chloroacrylate, methyl methacrylate, ethyl methacrylate, and ethyl ethacrylate; nitriles such as acrylonitrile and methacrylonitrile; amides such as acrylamide; e.g. acrylanilide; ,
Anilides such as p-chloroacrylanilide, m-nitroacrylanilide, -monomethoxyacrylanilide,
For example, vinyl esters such as vinyl acetate, vinyl propionate, vinyl benzoate, vinyl butyrate, vinyl ethers such as methyl vinyl ether, ethyl vinyl ether, inbutyl vinyl ether, β-chloroethyl vinyl ether, vinyl chloride, vinylidene chloride,
Vinylidene cyanide, ethylene derivatives such as l-methyl-1-methoxyethylene, 1,1-dimethoxyethylene, ■, 2-dimethoxyethylene, 1,1-dimethoxycarbonylethylene, ■-methyl-1-ditroethylene; Examples include vinyl monomers such as N-vinylpyrrole, N-vinylcarbazole, N-hynylindole, N-vinyl compounds such as N-1:'nylpyrrolidene, and N-vinylpyrrolidone. The monomers exist in polymer compounds with a structure in which unsaturated double bonds are cleaved. Among the above monomers, esters of aliphatic monocarboxylic acids and nitriles have excellent performance for the purpose of the present invention. These monomers may be bonded in the polymer in either a block or random state.The proportion of the vinyl polymer in the photosensitive layer is from 0.5 to
70% by weight is preferred. The above vinyl polymers may be used alone or in combination of two or more. Moreover, it can also be used in combination with other polymer compounds. It is preferable that the photosensitive layer of the present invention further contains a substituted phenol represented by the following general formula [14] as a fat-sensitizing agent. Furthermore, the photosensitive layer of the positive type 13 plate has the following general formula [1
4] A condensation resin of a substituted phenol and an aldehyde and/or the resin. - A quinonediazide sulfonic acid ester compound can be contained. General formula [14] H In general formula [14], R1 and R8 each represent a hydrogen atom, an alkyl group, or a halogen atom, and R3 represents an alkyl group or a cycloalkyl group having 2 or more carbon atoms. In the general formula [14], the alkyl group represented by R1 and R2 is preferably an alkyl group having 1 to 3 carbon atoms, and an alkyl group having 1 to 2 carbon atoms is particularly useful. The halogen atom represented by R1 and R2 is, for example, fluorine, chlorine, bromine, iodine, etc., and chlorine atom and bromine atom are particularly preferred. The alkyl group represented by R1 preferably has 15 or less carbon atoms, particularly preferably an alkyl group having 3 to 8 carbon atoms, and the cycloalkyl group preferably has 3 to 15 carbon atoms, and preferably has 3 to 8 carbon atoms. are particularly useful. Examples of substituted phenols represented by the general formula [14] include isopropylphenol, tert-butylphenol, tert-amylphenol, hexylphenol, tert-octylphenol, cyclohexylphenol, 3-methyl-4-chloro-5-tert -butylphenol, isopropylcresol, tert-
Examples include butyl cresol, tert-amyl cresol, hekyne lucresol, tert-octyl cresol, cyclohekyne lucresol, and the like, among which tert-octylphenol and tert-butylphenol are particularly preferred. Further, examples of the aldehydes include aliphatic and aromatic fuldehydes such as formaldehyde, benzaldehyde, acetaldehyde, acrolein, crotonaldehyde, and 7-fural, which have 1 to 6 carbon atoms.
Includes 2 things. Among them, formaldehyde and benzaldehyde are preferred. The content of the substituted phenol represented by the general formula [14] in the photosensitive layer is preferably in the range of 0.605 to 15% by weight. The resin obtained by condensing the substituted phenol and aldehyde is synthesized by polycondensing the substituted phenol represented by the general formula [14] and the aldehyde in the presence of an acidic catalyst. The acidic catalysts used are inorganic acids and organic acids such as hydrochloric acid, oxalic acid, sulfuric acid, and phosphoric acid. is used in an amount of 0.7 to 1.0 mole part. Alcohols, acetone, water, tetrahydrofuran, etc. are used as the reaction solvent. After reaction at a predetermined temperature (-5 to 120° C.) for a predetermined period of time (3 to 48 hours), the reaction product is obtained by pressurizing under reduced pressure and washing with water to dehydrate, or by allowing water to precipitate. The O-7-toquinonediazide sulfonic acid ester compound of the condensation resin of the substituted pheno-2t-2 and aldehydes can be obtained by dissolving the condensation resin in a suitable solvent such as dioxane, and adding O-naphtho It is obtained by adding quinonediazide sulfonic acid chloride and, while stirring under pressure, adding an alkali such as alkali carbonate dropwise to the equivalence point to cause esterification. In the esterified product, the condensation rate of 0-naphthoquinonediazide sulfonic acid chloride with respect to the hydroxyl group of the phenol (reaction rate % with respect to one hydroxyl group) is 5 to 80%.
is preferable, more preferably 20 to 70%, still more preferably 30 to 60%. The condensation rate is calculated by determining the content of sulfur atoms in the sulfonyl group by elemental analysis. A resin obtained by condensing a substituted phenol represented by the general formula [14] with an aldehyde and an O-naphthoquinonediazide sulfonic acid ester compound of the resin (hereinafter referred to as "sensitizing agent (B)") occupying the photosensitive layer. )") is preferably 0.05 to 15% by weight, particularly preferably 1 to 10% by weight. The fat sensitizing agent (B) preferably has a weight average molecular weight My,
5. OX 10" to 5.OX 103, more preferably 7.OX 10" to 3.OX. It is in the range of OX 103. Its number average molecular weight Mn is 3. OX 10”
It is preferably in the range of 2.5 x 10', more preferably 4. The range is OX 10" to 2, OX 10'. Examples of compounds of the oil sensitizing agent ('B) are listed below. -1 (m: ~50: 50° m=n=50: M w = 1300) 50, -3H of the resin before reacting with Q In the photosensitive layer, in addition to the above-mentioned materials, depending on the required C, dyes and pigments are added. , a plasticizer, a surfactant, a heptadium-based surfactant, a compound capable of generating an acid upon exposure to light, etc. may be added to the photosensitive layer.Furthermore, in order to improve the oil sensitivity of the photosensitive layer, For example, it is also possible to add p-tert-butylphenol formaldehyde resin, p-n-octylphenol formaldehyde resin, or a resin partially esterified with an O-quinonediazide compound. Dissolve in solvent, PS
A positive type 13 plate can be manufactured by applying the photosensitive layer to the surface of a plate support and drying it. The coating amount is preferably in the range of 0.5 to 7 g/l by weight after drying. [Example] The present invention will be explained below with reference to Examples. Example 1 The following developer (A) 24α was put into the developer tank 4 of the automatic processor shown in FIG. 1, and the following developer replenisher (A1) and (B
,) was prepared. Developer (A) Potassium silicate aqueous solution 30 parts by weight (SiOz
(Contains 26% by weight, K, 0 content 13% by weight) Potassium hydroxide 16 parts by weight Emulgen 147
0.1 parts by weight (nonionic surfactant manufactured by Kao Corporation) Water 900 parts by weight Developer replenisher (AI) Potassium silicate aqueous solution 30 parts by weight (Sin
, content 26% by weight, KzO content 13% by weight) Potassium hydroxide 25 parts by weight water
700 parts by weight Developer replenisher (B1) Emal Def 14F 2 parts by weight Water 1000 parts Next, a JIS-1050 aluminum plate with a thickness of 0.24 mm was immersed in a 2% aqueous sodium hydroxide solution to perform a degreasing treatment. Afterwards, the surface was electrochemically roughened in a dilute nitric acid solution, thoroughly washed, and then anodized in a dilute sulfuric acid solution to form an oxide film of 2.5 g/+n'' on the surface of the aluminum plate. After washing the aluminum plate thus treated with water and drying, a photosensitive solution having the following composition was added to the dry weight of 2.
It was coated at a concentration of 5 g/m' and dried to obtain a positive type 15 plate. PS version size is 10010O3800m+a
And so. Photosensitive coating liquid composition Ester compound of naphthoquinone-(1,2)-diazide-(2)-5-sulfonic acid chloride and pyrogallol acetone resin (described in Synthesis Example 2 of JP-A-60-143345) Compound) Copolycondensation resin of 2 parts by weight of phenol, ff1-+p-mixed cresol, and formaldehyde (the molar ratio of each of phenol, -cresol, and p-cresol during synthesis was 2
0:48:32, weight average molecular weight My-7400, number average molecular weight Mn-1400) 6.5 parts by weight p-Lert-octylphenol and formaldehyde synthesized novolac resin and 7 toquinone (1,
2) Ester compound with diazide-(2)-5-sulfonic acid chloride (condensation rate: 50 mol%, M W-17
00) 0.1 parts by weight Victoria Pure Blue BOH 0.08 parts by weight (manufactured by Toko Tsuchigaya Kagaku Co., Ltd.) Ethyl cellosolve aom t parts Methyl cellosolve 20 parts by weight Prepare a large number of 15 positive-type plates obtained in this way and transparent Positive film and step tablet for sensitivity measurement (Eastman)
No. manufactured by Radatsuk. 2, 21 levels of gray scale with a density difference of 0.15) in close contact, and a 2 kW metal halide lamp (Idol Fin 2000, manufactured by Iwasaki Electric Co., Ltd.) was used as the light source at 8.0 mW/cm'' from a distance of 70c111. Exposure was carried out for seconds. Fifty positive PS plates thus obtained were processed in a prepared automatic developing machine at 27'C for 20 seconds. During the process, PS plates were inserted at 10 minute intervals. The room temperature at this time is 25°
It was C. Also, while processing, 23 plates 1 m2
Add replenisher (A +) to 59+a12. 30 taQ of replenisher (B1) was added. For electrical fatigue, a replenisher (Δl) was further added every 30 minutes at 5On+f2. After processing 50 sheets, the first step tablet and the last 50th step tablet were compared, and both had exactly the same development quality. In FIG. 1, 1 is a developing section that performs the developing process, and 2 is
3 is a water washing part, 3 is a rinse/gum part for processing with a rinsing liquid or desensitizing liquid, 4 is a developer tank, 5 to 7 are processing liquid supply nozzles, 8 to IO are pumps, and S is a PS plate or its This is the transport route. Example 2 The same positive type 15 plate, developer, developer replenisher, and automatic processor as in Example 1 were prepared. The processing was carried out at 27° for 0.20 seconds for 100 sheets at 5 minute intervals. During processing, 50 IIQ of replenisher (AI) and 30 mff of replenisher (B1) were added for every 1 m'' of 13 plate developed. Due to air fatigue, 1 additional replenisher (A,) was added every 30 minutes.
00mff was added. After processing 100 sheets, the first step tablet and the last 100th step tablet were compared, and both had exactly the same development quality. Example 3 The following developer solution (B) and developer replenisher (A, ) and (B2)
As a result, no difference was observed in the development quality between the first step tablet and the last 50th step tablet. Developer (B) Sodium silicate aqueous solution 30 parts by weight (5i02
7Na20 molar ratio 1.8, Sin content 37.5% by weight) Sodium hydroxide IO parts by weight Perex NB-LO 2 parts by weight (surfactant manufactured by Kao Corporation) Water 900 parts by weight Developer replenisher ( A.) Sodium silicate aqueous solution (same as above) 30 parts by weight Sodium hydroxide 15 parts by weight Water
900 parts by weight developer replenisher (Bri Perex NB-L 3 parts by weight water
1000 parts by weight Example 4 Using the automatic developing machine shown in FIG. 2, processing was conducted in the same manner as in Example 1 using the same developer, developer replenisher, and positive type 15 plate as in Example 1. While processing, ps version 1 m 2
For each development, 5011 IQ of replenisher (A2) and 30 ml of replenisher (B) were added. Due to air fatigue, 20 ml of replenisher (A2) was added every 30 minutes. 50
After processing the sheets, the first step tablet and the last 50th step tablet were compared, and no difference was found in the development quality. In addition, in FIG. 2, 11 is a developing section that performs a developing process;
12 is a water washing section, 13 is a rinse/gum section that performs processing with a rinsing liquid or a nonfatting liquid, 14 is a developing tank, 15.16.
17 is a processing liquid supply nozzle, 18.19.20 is a pump,
S is a positive type 15 plate or its conveyance path. In the same figure, *l
and *1 are connected by piping. Comparative Example 1 The same experiment as in Example 1 was conducted except that the following developer replenisher (C) was used, and during the processing, 60 ml (l) of replenisher (C) was added for every 1 m2 of PS plate developed. Due to air fatigue, 50mff of replenisher (C) was added every 30 minutes.After processing 50 sheets, we compared the first step tablet and the last 50th step tablet, and found that the clear sensitivity was almost the same. However, the solid sensitivity was significantly different. Developer replenisher (C) Potassium silicate aqueous solution 30 parts by weight (SiO2
(content 26% by weight, K, O content 13% by weight) Potassium hydroxide 20 parts by weight Emulgen 1471 parts by weight Water 700 parts by weight Comparative Example 2 The same treatment as in Example 4 was carried out using developer replenisher (C). . During processing, 60 m of replenisher (C) was added for every 1 m of PS#L developed. Due to air fatigue, 20 m of replenisher (C) was added every 30 minutes. After processing 50 sheets, we compared the first step tablet with the last 50th step tablet, and found that the clear sensitivity was almost the same, but the solid sensitivity was significantly different. [Effects of the invention] Book According to the invention, in a processing method of developing a positive 15th plate with a developer exclusively for the positive 13th plate, which is repeatedly used by replenishing the replenisher over a long period of time, it is possible to maintain stable development quality over a longer period of time. can.
第1図及び第2図は実施例に用いた装置の例を示す断面
図である。
1%11・・・現像部 2.12・・・水洗部3
.13・・・リンス・ガム部FIGS. 1 and 2 are cross-sectional views showing an example of the apparatus used in the example. 1%11...Developing section 2.12...Water washing section 3
.. 13...Rinse/gum part
Claims (2)
し使用されるポジ専用現像液でポジ型感光性平版印刷版
を現像する現像処理方法において、該現像補充液が下記
(A)及び(B)からなることを特徴とするポジ型感光
性平版印刷版の処理方法。 (A)ケイ酸アルカリを含有する水溶液。 (B)界面活性剤を含有する水溶液。(1) In a development processing method in which a positive-working photosensitive lithographic printing plate is developed using an automatic developing machine with a positive-only developer that is repeatedly used after replenishing a developer replenisher, the developer replenisher is one of the following (A) and (B) A method for processing a positive-working photosensitive lithographic printing plate. (A) Aqueous solution containing alkali silicate. (B) Aqueous solution containing a surfactant.
光性平版印刷版の単位時間当たりの処理量、外気の気温
及び自動現像機のタイプにより決まる補充量で補充する
ことを特徴とする請求項(1)記載の処理方法。(2) The above (A) and (B) are replenished at a replenishment amount determined by the processing amount per unit time of the positive photosensitive lithographic printing plate to be developed, the outside temperature, and the type of automatic processor. The processing method according to claim (1).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17524989A JPH0338647A (en) | 1989-07-05 | 1989-07-05 | Processing method for positive type photosensitive planographic printing plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17524989A JPH0338647A (en) | 1989-07-05 | 1989-07-05 | Processing method for positive type photosensitive planographic printing plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0338647A true JPH0338647A (en) | 1991-02-19 |
Family
ID=15992867
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17524989A Pending JPH0338647A (en) | 1989-07-05 | 1989-07-05 | Processing method for positive type photosensitive planographic printing plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0338647A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5670294A (en) * | 1995-03-07 | 1997-09-23 | Imation Corp | Aqueous alkaline solution for developing offset printing plates |
JP2002318454A (en) * | 2001-04-23 | 2002-10-31 | Mitsubishi Chemicals Corp | Machine plate method for photosensitive planographic printing plate |
EP1273972A1 (en) * | 2001-07-04 | 2003-01-08 | Fuji Photo Film Co., Ltd. | Developer for photopolymerizable presensitized plate for use in making lithographic printing plate and method for preparing lithographic printing plate |
WO2003012550A1 (en) * | 2001-08-01 | 2003-02-13 | Kodak Polychrome Graphics Company Ltd. | Method for developing lithographic printing plate precursors using a coating attack-suppressing agent |
JP2003107683A (en) * | 2001-09-28 | 2003-04-09 | Mitsubishi Chemicals Corp | Method for making photosensitive lithographic printing plate |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5462004A (en) * | 1977-10-24 | 1979-05-18 | Fuji Photo Film Co Ltd | Method of developing flat positive printing plate |
JPS5522759A (en) * | 1978-08-08 | 1980-02-18 | Fuji Photo Film Co Ltd | Developing method of positive type photosensitive lithographic printing plate |
JPS6255658A (en) * | 1985-09-03 | 1987-03-11 | Konishiroku Photo Ind Co Ltd | Processing method for photosensitive lithographic printing plate |
JPS6273271A (en) * | 1985-09-26 | 1987-04-03 | Konishiroku Photo Ind Co Ltd | Processing method for photosensitive lithographic printing plate |
-
1989
- 1989-07-05 JP JP17524989A patent/JPH0338647A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5462004A (en) * | 1977-10-24 | 1979-05-18 | Fuji Photo Film Co Ltd | Method of developing flat positive printing plate |
JPS5522759A (en) * | 1978-08-08 | 1980-02-18 | Fuji Photo Film Co Ltd | Developing method of positive type photosensitive lithographic printing plate |
JPS6255658A (en) * | 1985-09-03 | 1987-03-11 | Konishiroku Photo Ind Co Ltd | Processing method for photosensitive lithographic printing plate |
JPS6273271A (en) * | 1985-09-26 | 1987-04-03 | Konishiroku Photo Ind Co Ltd | Processing method for photosensitive lithographic printing plate |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5670294A (en) * | 1995-03-07 | 1997-09-23 | Imation Corp | Aqueous alkaline solution for developing offset printing plates |
JP2002318454A (en) * | 2001-04-23 | 2002-10-31 | Mitsubishi Chemicals Corp | Machine plate method for photosensitive planographic printing plate |
JP4633295B2 (en) * | 2001-04-23 | 2011-02-16 | コダック株式会社 | Printing plate method for photosensitive lithographic printing plate |
EP1273972A1 (en) * | 2001-07-04 | 2003-01-08 | Fuji Photo Film Co., Ltd. | Developer for photopolymerizable presensitized plate for use in making lithographic printing plate and method for preparing lithographic printing plate |
US6641980B2 (en) | 2001-07-04 | 2003-11-04 | Fuji Photo Film Co., Ltd. | Developer for photopolymerizable presensitized plate for use in making lithographic printing plate and method for preparing lithographic printing plate |
WO2003012550A1 (en) * | 2001-08-01 | 2003-02-13 | Kodak Polychrome Graphics Company Ltd. | Method for developing lithographic printing plate precursors using a coating attack-suppressing agent |
US6562555B2 (en) | 2001-08-01 | 2003-05-13 | Kodak Polychrome Graphics Llc | Method for developing lithographic printing plate precursors using a coating attack-suppressing agent |
JP2003107683A (en) * | 2001-09-28 | 2003-04-09 | Mitsubishi Chemicals Corp | Method for making photosensitive lithographic printing plate |
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