JPH03273655A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To enable wireless bonding with high density easily even when a normal Al electrode is used as a terminal electrode in the semiconductor element substrate of an IC, an LSI, etc., by forming a conductor projection on the wiring electrode side of a circuit board and connecting the circuit board and a semiconductor element. CONSTITUTION:A circuit board 12, on which a plurality of wiring electrodes 11 are formed, is fixed to a support table heated at 150 deg.C, tip spherical Au wires having 30mumphi are thermocompression-bonded successively onto the wiring electrodes 11, and columnar thermocompression-bonded Au projections 13 are formed. Thermocompression bonding is executed by applying ultrasonic vibrations to the tip spherical Au wires in the direction parallel with the surface of the circuit board and applying pressure to the tip spherical Au wires in the vertical direction, and the columnar thermocompression-bonded Au projections 3 can easily and continuously be formed. Semiconductor element substrates 15, on which Al terminal electrodes 14 are shaped, are placed onto the circuit board 12, in which the columnar thermocompression-bonded Au projections 13 are formed onto the wiring electrodes 11, and connecting sections, on which the columnar thermocompression-bonded Au projections 13 and the Al terminal electrodes 14 are put oppositely, are bonded through thermocompression bonding.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a hybrid integrated circuit device in which a semiconductor element substrate such as an IC or an LSI is mounted on a circuit board.

[Conventional technology]

In recent years, the development of multi-chip hybrid integrated circuits that mount many semiconductor elements on one substrate and miniaturized circuit boards that are formed extremely thin has progressed, and among them, thermal heads used in facsimile machines, image sensors, LCDs, El
Displays, IC cards, etc. have been put into practical use. These devices meet the demands for lower cost and higher performance as semiconductor technology progresses, and the connection between the semiconductor element and the fine wiring electrodes formed on the circuit board determines the size and performance of the device. are doing.

In hybrid integrated circuit devices mainly used in the past, semiconductor elements and circuit boards are connected by wire bonding using thin wires.

However, the number of terminals increases further, and there is a limit to how thin the entire device can be made. On the other hand, the flip-chip method and the TAB method, in which metal bumps are formed and mounted on the terminal electrodes of semiconductor elements, have attracted attention and are being used as effective means. These have the advantage of being able to mount multiple semiconductor elements in succession on a circuit board or film tape, making it easier to inspect the characteristics after connecting terminals, and realizing thinner devices. This is because there are many.

[Problem to be solved by the invention]

However, the terminal electrodes of the semiconductor elements used for this,
Ti-Pt, Ti-W, Ti on aluminum material
-Cu.

Vapor deposition process of barrier metals such as Cr-cn and Cr-m.

Seven steps of patterning using photosensitive resin.

Because complex processes such as Au plating and etching processes are added to form bumps, special manufacturing equipment is required, and since these processes are mounted on almost completed semiconductor wafers, yields are low. This has the disadvantage that the total cost of the semiconductor element chip becomes very high.

An object of the present invention is to solve the above-mentioned problems, and to provide a low-cost hybrid integrated circuit.

(Means for Solving !Ili) The hybrid integrated circuit device of the present invention includes a circuit board on which a plurality of wiring electrodes are formed, and one circuit board formed by sequentially crimping thin wires with spherical tips on the wiring electrodes. The above cylindrical crimp conductor projection has a terminal electrode at the same position as the crimp conductor projection, and the terminal electrode is connected to the crimp conductor projection at vA.
and a semiconductor element substrate facing the circuit board.

[Effect]

By forming a PJ simple conductor protrusion on the wiring electrode side of the circuit board,
Since the circuit board and the conductive element are connected, a low-cost hybrid integrated circuit device is obtained.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic sectional view showing a hybrid integrated circuit device according to a first embodiment of the present invention.

The hybrid integrated circuit device of this embodiment has a plurality of wiring electrodes 11
The circuit board 12 on which is formed, and the cylindrical thermo-pressure WALI formed by sequentially thermo-compressing the spherical wire at the tip onto the wiring electrode 11.
It consists of a protrusion 13 and a semiconductor element substrate 15 having an M terminal electrode 14 at the same position as the thermocompression protrusion 13, the M terminal electrode 14 being fixed to the thermocompression protrusion and facing the circuit board 12. .

Next, 1M3! of the hybrid integrated circuit device of this embodiment! [Explain the method.]

The circuit board 12 on which a plurality of wiring electrodes 11 are formed is fixed to a support table heated to, for example, 150°C, and the wiring electrodes 1
Thin wires with a spherical tip of 301j11φ were sequentially bonded by thermocompression onto 1.
A cylindrical hot pressure protrusion 13 is formed. For thermocompression bonding, it is sufficient to apply ultrasonic vibration in a direction parallel to the surface of the circuit board and pressure in a vertical direction to the spherical tip ALIII, and the cylindrical thermocompression protrusion 13 can be easily formed in a continuous manner. , the semiconductor element substrate 15 on which the A11fi element electrode 14 is formed is placed on the circuit board 12 on which the cylindrical thermocompression IAu protrusion 13 is formed on the wiring electrode 11, and the cylindrical thermocompression bonded protrusion 13 and the M terminal electrode are placed. 14 are placed facing each other and are connected by thermocompression bonding.

In the hybrid integrated circuit device having such a structure, there is no need to create bumps in the terminal electrodes of the semiconductor element substrate 15 through a complicated process, and the M terminal electrodes that are normally used for general purposes can be used as they are. Therefore, only good quality semiconductor element substrates 15 that are inspected at the time of wafer processing can be used. Furthermore, it is no longer necessary to selectively perform the cylindrical thermocompression bonding to the formation of the protrusions 13 on the circuit board 12 for defective circuit boards, so there is no waste. Overall, an ultra-thin hybrid integrated circuit device can be obtained at an extremely low cost.

In addition, in the above example, ~30 pigeons φ, a! degree 15
Although the temperature was set at 0° C., the temperature is not limited to this, and may be freely selected depending on the shape, pitch, compatibility with the circuit board material, etc. of the disc-shaped thermocompression bonding. Further, the material of this thin wire may be any other material, such as Cu or M, as long as it can be bonded to the wiring electrode.

When connecting by wire bonding, the arrangement of the M terminal electrode 14 is limited to the periphery of the semiconductor element substrate 15, but since the M terminal electrode 14 can also be placed in the center of the semiconductor element 15, it is more convenient. Many terminal electrodes can be connected in 5 degrees.

FIG. 2 is a schematic cross-sectional view showing a hybrid 111 integrated circuit snow system according to a second embodiment of the present invention.

The structure in which the cylindrical thermocompression protrusion 13 is formed on the wiring electrode 11 on the circuit board 12 by thermocompression bonding is the same as the structure shown in the first embodiment. In this embodiment, a conductive adhesive 16 such as ^O paste is roughly applied onto the cylindrical thermocompression bonding protrusion 13. This can easily be done by transfer or dispenser. Thereafter, the semiconductor element substrate 15 is attached to the Ai strip electrode 14 and the cylindrical thermocompression protrusion 13.
are placed facing each other, and the conductive adhesive 16 is heated and cured to connect them.

According to such a structure, the effects shown in the first embodiment can be obtained in the same way, and an extremely large pressing force is not required when the cylindrical thermocompression bonding protrusion 13 and the M terminal electrode 14 are fixed together. . Therefore, damage caused by microphone cracks on the semiconductor element substrate 15 that occurs when both terminal portions are pressed is eliminated, and stable connection can be achieved at high density.

In addition, in the above explanation, the terminal electrode of the semiconductor element substrate is M
Although only the terminal electrode 111 was used, it is clear from the structure that it can be applied to a terminal electrode having solder bumps or Au bumps formed thereon, although it is possible to use many similar ones and it will be expensive. It's not something you do.

〔Effect of the invention〕

As explained above, the present invention connects the circuit board and the semiconductor element by forming conductor protrusions on the wiring electrode side of the circuit board, so that semiconductor element boards such as ICs and LSIs can be connected to the terminal electrodes of ordinary Ml! High-density wireless connections are easily possible even when using wires, so if such a configuration is implemented in a functional device such as the TAB method using film carrier mounting or the flip chip method, it will be possible to reduce the size of equipment devices, iI type, etc. This has the effect of realizing higher performance, higher performance, and lower cost.

[Brief explanation of drawings]

1 and 2 are schematic sectional views showing a hybrid integrated circuit device according to an embodiment of the present invention. 11... Wiring electrode, 12... Circuit board, 13
. . . Cylindrical hot pressure @ ~ protrusion, 14 . . M terminal electrode, 15 . . . semiconductor element substrate, 16 . . . conductive adhesive.

Claims (1)

[Claims] 1. A circuit board on which a plurality of wiring electrodes are formed, one or more cylindrical crimped conductor protrusions formed by successively crimping spherical thin wires on the wiring electrodes, and positions equivalent to the crimped conductor protrusions. 1. A hybrid integrated circuit device comprising: a semiconductor element substrate facing the circuit board; the terminal electrode being fixed to the crimp conductor protrusion;