JPH0325275U - - Google Patents
Info
- Publication number
- JPH0325275U JPH0325275U JP8614589U JP8614589U JPH0325275U JP H0325275 U JPH0325275 U JP H0325275U JP 8614589 U JP8614589 U JP 8614589U JP 8614589 U JP8614589 U JP 8614589U JP H0325275 U JPH0325275 U JP H0325275U
- Authority
- JP
- Japan
- Prior art keywords
- board
- holes
- sub
- pair
- main board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 claims 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の第１実施例の側面を断面にて
示す図、第２図は本考案の第２実施例の側面を断
面にて示す図、第３Ａ図は従来の基板接続構造を
上から見た斜視図、第３Ｂ図は従来の基板接続構
造を下から見た斜視図、第３Ｃ図は第３Ａ図のＣ
−Ｃ断面図である。
図において、１……主基板、２……副基板、３
……半田接続部、４……補強ロツド、１１……第
１ランド・スルーホール、１２……第２ランド・
スルーホール。
FIG. 1 is a cross-sectional side view of the first embodiment of the present invention, FIG. 2 is a cross-sectional side view of the second embodiment of the present invention, and FIG. 3A is a conventional board connection structure. FIG. 3B is a perspective view of a conventional board connection structure seen from below, and FIG. 3C is a perspective view of C of FIG. 3A.
-C sectional view. In the figure, 1... Main board, 2... Sub board, 3
...Solder connection part, 4...Reinforcement rod, 11...1st land/through hole, 12...2nd land/
Through hole.
Claims (1)
を差し込み、半田を介して前記副基板２を前記主
基板１に取り付けるための基板接続構造において
、 前記主基板１は、前記副基板２を挾んでほぼ対
称の位置に第１ランド・スルーホール１１の対を
有し、 前記副基板２は、前記主基板１を挾んでほぼ対
称の位置に第２ランド・スルーホール１２の対を
有し、 前記第１ランド・スルーホール１１の対および
前記第２ランド・スルーホール１２の対を、前記
半田を介して一体に接続するほぼリング状をなす
半田接続部３を設けることを特徴とする基板接続
構造。 ２ 前記第２ランド・スルーホール１２の対のう
ち、前記主基板１の裏面に位置する側の該第２ラ
ンド・スルーホール１２に貫通して挿入される補
強ロツド４を有する請求項１記載の基板接続構造
。[Claims for Utility Model Registration] 1. From the front side of the main board 1 to the back side, the sub board 2
In the board connection structure for attaching the sub-board 2 to the main board 1 via solder, the main board 1 has first land through-holes 11 at substantially symmetrical positions with the sub-board 2 in between. The sub-board 2 has a pair of second lands and through-holes 12 at substantially symmetrical positions with the main board 1 in between, and the pair of first lands and through-holes 11 and the 1. A board connection structure characterized in that a substantially ring-shaped solder connection part 3 is provided to integrally connect a pair of two lands and through holes 12 via the solder. 2. The reinforcing rod 4 is inserted through the second land/through hole 12 of the pair of second land/through holes 12 located on the back surface of the main board 1. Board connection structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989086145U JPH0745977Y2 (en) | 1989-07-22 | 1989-07-22 | Board connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989086145U JPH0745977Y2 (en) | 1989-07-22 | 1989-07-22 | Board connection structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0325275U true JPH0325275U (en) | 1991-03-15 |
| JPH0745977Y2 JPH0745977Y2 (en) | 1995-10-18 |
Family
ID=31635589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989086145U Expired - Lifetime JPH0745977Y2 (en) | 1989-07-22 | 1989-07-22 | Board connection structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0745977Y2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54126068U (en) * | 1978-02-23 | 1979-09-03 | ||
| JPS578772U (en) * | 1980-06-16 | 1982-01-18 | ||
| JPS61127672U (en) * | 1985-01-28 | 1986-08-11 |
-
1989
- 1989-07-22 JP JP1989086145U patent/JPH0745977Y2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54126068U (en) * | 1978-02-23 | 1979-09-03 | ||
| JPS578772U (en) * | 1980-06-16 | 1982-01-18 | ||
| JPS61127672U (en) * | 1985-01-28 | 1986-08-11 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0745977Y2 (en) | 1995-10-18 |