JPH03215966A - Power transistor mounting device - Google Patents
Power transistor mounting deviceInfo
- Publication number
- JPH03215966A JPH03215966A JP1134690A JP1134690A JPH03215966A JP H03215966 A JPH03215966 A JP H03215966A JP 1134690 A JP1134690 A JP 1134690A JP 1134690 A JP1134690 A JP 1134690A JP H03215966 A JPH03215966 A JP H03215966A
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- power transistor
- printed circuit
- circuit board
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 7
- 239000011889 copper foil Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 6
- 210000000078 claw Anatomy 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005336 cracking Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電気機器等に用いられる電力用トランジスタの
取付装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a mounting device for power transistors used in electrical equipment and the like.
従来の技術
従来、電力用トランジスタを放熱のためシャーシに取付
け、その電力用トランジスタのリード足を回路接続のた
め、プリント基板に取付けるには、リード足を直接、シ
ャーシで保持されるプリン１一基板のリード孔に挿入し
、半田付け固定する方法を用いていた。Conventional technology In the past, when a power transistor was mounted on a chassis for heat dissipation and the lead legs of the power transistor were attached to a printed circuit board for circuit connection, the lead legs were directly attached to a printed circuit board held by the chassis. The method used was to insert it into the lead hole and fix it by soldering.
以下、図面を参照しながら従来の電力用トランジスタの
取付け構造について説明する。Hereinafter, a conventional power transistor mounting structure will be described with reference to the drawings.
第５図及び第６図は従来の電力用トランジスタ取付け構
造を説明するためのもので１は電力用１・ランジスタ、
２はシャーシ、３はフ゜リント基｝反、４は電力用トラ
ンジスタ固定用のネジである。5 and 6 are for explaining the conventional power transistor mounting structure, and 1 is a power transistor 1;
2 is a chassis, 3 is a print base}, and 4 is a screw for fixing a power transistor.
このような従来例では、通常、プリント基板３に半田デ
ィンプ（自動半田）を用いて電力用１・ランジスタ１の
リード足１ａを半田付け固定した後、ネジ４を用いてシ
ャーシ２のネジ孔２ａへ締イ」けて固定していた。一方
、ネジ固定する際には電力用トランジスタ１がネジの回
転する方向５へ回転する動きをするので固定及びネジ締
め作業上シャシ２に切り起し爪２ｂ等を設けていた。In such a conventional example, the lead legs 1a of the power supply 1 and transistor 1 are usually soldered and fixed to the printed circuit board 3 using solder dips (automatic soldering), and then the screw holes 2a of the chassis 2 are inserted using the screws 4. It was fixed by tightening it. On the other hand, when fixing the power transistor 1 with the screw, the power transistor 1 rotates in the direction 5 in which the screw rotates, so a cutting claw 2b or the like is provided on the chassis 2 for fixing and tightening the screw.
発明が解決しようとする課題
従来例によれば電力用Ｉ・ランジスタ１をネジ４でシャ
ーシ２に固定する際の回転力５は、シャーン２に設けた
切り起し爪２ｂを用いて止めるか、切り起し爪２ｂを用
いない時は治具又は手で回転力５に抗する力で電力用ト
ランジスタ１を押えながら行なっていた。ところが電力
用トランジスタ１のリード足１ａは柔軟性がないためプ
リント基板３のバクーン（銅箔面）３ａで半田付されて
いる個所に直接、力が加わりやすくパターン３ａの銅箔
の剥離や、半田付け個所に割れを生じたりして電気回路
に課題を生じやすかった。又これを防止するためリード
足１ａとパターン３ａとの半田付けをディンプによる一
括ではなく後付け、即ちプリント基板３のシャーシ２へ
の固定と電力用トランジスタ１のシャーシ２への固定後
、半田付けしてネジ４の回転力５の影響を防止していた
が、この方法によるとバクーン３ａに後から半田付けで
きる空間を設けるなどの構造を考慮しなければならず不
便であった。Problems to be Solved by the Invention According to the conventional example, the rotational force 5 when fixing the power I transistor 1 to the chassis 2 with the screw 4 can be stopped by using the cut-out claw 2b provided on the shear 2, or When the cutting claw 2b is not used, the cutting is performed while holding the power transistor 1 with a force that resists the rotational force 5 using a jig or by hand. However, since the lead leg 1a of the power transistor 1 is not flexible, force is easily applied directly to the part soldered on the copper foil surface 3a of the printed circuit board 3, which may cause the copper foil of the pattern 3a to peel off or cause soldering. It was easy for cracks to occur at the attachment points, causing problems with the electrical circuit. In addition, in order to prevent this, the soldering of the lead leg 1a and the pattern 3a is not done all at once by dipping, but is done later, that is, after the printed circuit board 3 is fixed to the chassis 2 and the power transistor 1 is fixed to the chassis 2, the soldering is done. Although the influence of the rotational force 5 of the screw 4 was prevented, this method was inconvenient because it required consideration of the structure such as providing a space for soldering to the back cover 3a later.
本発明は、このような課題乙こ鑑メてなされたもので、
プリント基板のパターン銅箔の剥離や半田付け個所の割
れを心配することなく、一括ディノプ式の半田付けを可
能とする電力用１・ランジスク取付装置を提供すること
を目的としている。The present invention was made in view of these problems.
The object of the present invention is to provide a power 1/Landisk mounting device that enables batch dino soldering without worrying about peeling of patterned copper foil on a printed circuit board or cracking of soldered points.
課題を解決するための手段
このような従来の課題を解決するため、本発明は一方の
プリント基板に電力用トランジスタを有する２個のプリ
ン１・基板との間に溝を設け、且つ該溝の一部を丸孔を
適切な間隔でミシン目状に設けたつなぎ部、もしくは■
字形状でのつなぎ部で分離前に接続したプリント基板の
一体化部に溝幅より若干長い自動挿入（インザート）可
能な複数の可とう電線を接続した電力用１・ランジスク
取イ」装置である。Means for Solving the Problems In order to solve these conventional problems, the present invention provides a groove between the two printed circuit boards 1 and the substrate each having a power transistor on one printed circuit board, and also provides a groove in the groove. Part of the joint has round holes perforated at appropriate intervals, or ■
This is a device for power use that connects multiple flexible wires that can be automatically inserted (inserted) slightly longer than the groove width to the integrated part of the printed circuit board that is connected before separation at the joint part in the shape of a letter. .
作用
この構成により、電力用１・ランジスクのリード足のブ
リン１・基板への半田付けを後付けではなく、−括ディ
ップ式の半田付りで行なうことができる。Function: With this configuration, the lead legs of the power supply unit 1 and the power switch can be soldered to the lead 1 and the board by dip-type soldering, rather than by subsequent soldering.
実施例
以下、本発明の実施例について図面を参照しながら詳細
に説明する。EXAMPLES Hereinafter, examples of the present invention will be described in detail with reference to the drawings.
第１図〜第４図は本発明の−実施例を示すもので６は電
力用トランジスタ、７はシャーン、８は第１のプリント
基板、９は第２のプリン１−１板、１０は可とう電線、
１１はネジである。ここにおいて、シャーシ７のプリン
ト基板８が固定されている部分（図示せず）と電力用ト
ランジスタ６が固定されている。第１図に示すシャーシ
７のＬ型部は底面で一体化されている。一方、第２のプ
リント基板９は、第１のプリント基板８が主回路を構成
するのに対し補助的役目を果すものである。第１のプリ
ント基板８と第２のプリント基板９は当初第３図のごと
く一定の溝８ａを設け、且つ該溝８ａの一部を丸孔８ｂ
を適切な間隔８Ｃでミシン目状に設けたつなぎ部８ｄに
よって接続してある。第４図はつなぎ部８ｄをミシン目
形状による接続でなく■字形状溝８ｅによる方法で示し
てある。電力用トランジスタ６の通常３本のリード足６
ａは第２プリント基板９に設けたリード孔９ａに差すと
共に第２のプリント基板９のもう一方のリード孔９ｂと
第１のプリント基板８のリード孔８ｆを可とう電線１０
が自動挿入できる間隔すなわち溝８ａより２〜４Ｍ程度
長い位置に設けて可とう電線１０を自動挿入して通常は
手半田ではな《一括ディップによる半田付けをして効果
を一段と上げた接続をしてある。尚、可とう電線１０は
自動挿入上、通常は平行で且つ同し長さが用いられる。1 to 4 show embodiments of the present invention, in which 6 is a power transistor, 7 is a circuit board, 8 is a first printed circuit board, 9 is a second printed circuit board 1-1, and 10 is a power transistor. electric wire,
11 is a screw. Here, a portion of the chassis 7 to which the printed circuit board 8 is fixed (not shown) and the power transistor 6 are fixed. The L-shaped portion of the chassis 7 shown in FIG. 1 is integrated at the bottom surface. On the other hand, the second printed circuit board 9 plays an auxiliary role while the first printed circuit board 8 constitutes the main circuit. The first printed circuit board 8 and the second printed circuit board 9 were initially provided with a certain groove 8a as shown in FIG.
are connected by connecting portions 8d provided in the form of perforations at appropriate intervals 8C. In FIG. 4, the connecting portion 8d is not connected by a perforation but by a ■-shaped groove 8e. Normally three lead legs 6 of power transistor 6
The flexible electric wire 10 a is inserted into the lead hole 9a provided in the second printed circuit board 9, and the other lead hole 9b of the second printed circuit board 9 and the lead hole 8f of the first printed circuit board 8.
The flexible wire 10 is automatically inserted at a distance that can be automatically inserted, that is, at a position about 2 to 4 M longer than the groove 8a, and the connection is made by soldering by batch dip, which is not normally done by hand soldering, to further improve the connection effect. There is. Note that the flexible electric wires 10 are usually parallel and of the same length for automatic insertion.
一方、ここでは可とう電線１０は自動挿入を前提とした
が手挿入でも作業性を犠牲にするならかまわない。On the other hand, although the flexible electric wire 10 is assumed to be inserted automatically here, it may be inserted manually as long as workability is sacrificed.
電ノノ用トランジスタ６のネジ固定は、まずプリント基
板８とプリント基板９を分離後に行なうが、その際ネジ
１１の回転力１２が電力用トランジスタ６に伝わり、リ
ード足６ａを介して第２のプリント基板９に伝わる。一
方、従来例のごとく回転力１２を止めるためにはシャー
シ７の１７型部には切り起しを設けたり、治具又は手で
押えながら行なうが、第２のプリント基板９の動きは第
１のプリント基板８に当然伝わろうとするが、第１のプ
リンＩ・基板８と第２のプリント基板９との間は可とう
電線１０により柔軟性を有するため直接的に伝わらす第
２のプリント基板９の動きを吸収して第１のプリント基
板８のパターン（銅箔面）８ｇに力が伝わらず保護でき
る構造とすることができる。尚本実施例は電力トランジ
スタをプリント基板と同じ水平状態で説明したが、電力
用トランジスタの取付面方向は水平に限定されない。The power transistor 6 is fixed with the screws after the printed circuit board 8 and the printed circuit board 9 are separated. At that time, the rotational force 12 of the screw 11 is transmitted to the power transistor 6, and the second printed circuit board is fixed via the lead leg 6a. It is transmitted to the board 9. On the other hand, in order to stop the rotational force 12 as in the conventional example, a cut-out is provided in the 17-shaped part of the chassis 7, or the movement is carried out while being held down with a jig or by hand, but the movement of the second printed circuit board 9 is Naturally, the information is transmitted to the printed circuit board 8, but since the flexible electric wire 10 has flexibility between the first printed circuit board 8 and the second printed circuit board 9, the transmission is directly transmitted to the second printed circuit board. It is possible to provide a structure that absorbs the movement of the first printed circuit board 8 and protects the pattern (copper foil surface) 8g of the first printed circuit board 8 from being transmitted with force. Although the present embodiment has been described with the power transistor in the same horizontal state as the printed circuit board, the mounting surface direction of the power transistor is not limited to the horizontal direction.
発明の効果
以上、説明したように、本発明による電力用トランジス
タ取付装置を用いると主回路を構成するブリンＩ−基板
と電力用トランジスタが直接取付けられるプリント基板
間の可とう電線により各々のリード足なり、可とう電線
を一括ディップによる半田｛｛けを行なっても、電力用
トランジスタのネジ止めに際して防ぎきれない回転力を
直接、主回路を構成するプリント基板の可とう電線取付
け部のパターンに伝えることがないため、パターン銅箔
の剥離や半田付部の割れを生じることがなく、且つネジ
止めの際、電力用トランジスタのリード足取付け部へか
かる作用力による割れ発生等、電力用トランジスタ取付
けに際しての品質と生産性に対する課題を解決し、その
効果は著しいものがある。Effects of the Invention As explained above, when the power transistor mounting device according to the present invention is used, each lead leg can be connected by the flexible electric wire between the Brin I board that constitutes the main circuit and the printed circuit board to which the power transistor is directly mounted. Even if the flexible wires are soldered by dipping all at once, the rotational force that cannot be prevented when screwing down the power transistor is directly transmitted to the pattern of the flexible wire attachment part of the printed circuit board that makes up the main circuit. This prevents peeling of the patterned copper foil and cracking of the soldered parts, and also prevents cracks from occurring due to the force applied to the lead foot attachment part of the power transistor when screwing it in. It has solved problems with quality and productivity, and its effects are remarkable.
第１図は本発明の一実施例における電力用１・ランジス
ク取付装置の外観斜視図、第２図は本実施例装置をプリ
ント基板のパターン側からみた平面図、第３図は２個の
プリント基板分離前の接続部にミシン目形状を用いた場
合の外観斜視図、第４図は２個のプリン１・基板分離前
の接続部に■字形状溝を用いた場合の外観斜視図、第５
図は従来例の外観斜視図、第６図は従来例をブリン１・
基板パターン側からみた平面図である。
６・・・・・・電力用トランジスタ、６ａ・・・・・・
リード足、７・・・・・・シャーシ、８・・・・・・プ
リント基板Ａ、８ａ・・・・・・溝、８ｂ・・・・・・
丸孔、８ｃ・・・・・・丸孔間隔、８ｄ・・・・・つな
ぎ部、８ｅ・・・・・・■字形状、８ｆ・・・・・・リ
ード孔、８ｇ・・・・・・パターン、９・・・・・・プ
リント基板Ｂ、９ａ・・・・・・リード孔、９ｂ・・・
・・・リード孔、１０・・・・・・可とう電線、１１・
・・・・・ネジ、１２・・・・・・回転力。Fig. 1 is a perspective view of the external appearance of a power 1/randisk mounting device according to an embodiment of the present invention, Fig. 2 is a plan view of the device of this embodiment as seen from the pattern side of the printed circuit board, and Fig. 3 shows two printed circuit boards. Figure 4 is a perspective view of the external appearance when a perforation shape is used in the connection part before the board is separated. 5
The figure is an external perspective view of the conventional example, and Figure 6 shows the conventional example.
FIG. 3 is a plan view seen from the substrate pattern side. 6...Power transistor, 6a...
Lead foot, 7...Chassis, 8...Printed circuit board A, 8a...groove, 8b...
Round hole, 8c...Round hole spacing, 8d...Connection, 8e...■-shaped, 8f...Lead hole, 8g...・Pattern, 9...Printed board B, 9a...Lead hole, 9b...
...Lead hole, 10...Flexible wire, 11.
...Screw, 12...Rotating force.
Claims (1)
ャーシに取付けられ、上記電力用トランジスタのリード
足に電気的に接続される第１のプリント基板を有し、こ
の第１のプリント基板と電力用トランジスタの間に第２
のプリント基板を配置し、この第２のプリント基板に電
力用トランジスタのリード足を接続し、第２のプリント
基板と第１のプリント基板との間を可とう電線で接続し
てなる電力用トランジスタ取付装置。a chassis on which a power transistor is mounted; a first printed circuit board mounted on the chassis and electrically connected to the lead leg of the power transistor; and between the first printed circuit board and the power transistor. second to
A power transistor is constructed by arranging a printed circuit board, connecting the lead leg of the power transistor to the second printed circuit board, and connecting the second printed circuit board and the first printed circuit board with a flexible wire. Mounting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1134690A JPH03215966A (en) | 1990-01-19 | 1990-01-19 | Power transistor mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1134690A JPH03215966A (en) | 1990-01-19 | 1990-01-19 | Power transistor mounting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03215966A true JPH03215966A (en) | 1991-09-20 |
Family
ID=11775478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1134690A Pending JPH03215966A (en) | 1990-01-19 | 1990-01-19 | Power transistor mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03215966A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100829794B1 (en) * | 2007-01-23 | 2008-05-16 | 아주대학교산학협력단 | Method of identifying radio frequency tag in rfid system |
| AT521763A1 (en) * | 2018-09-28 | 2020-04-15 | Franz Stoeger | Electronic device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5722260B2 (en) * | 1974-12-18 | 1982-05-12 |
-
1990
- 1990-01-19 JP JP1134690A patent/JPH03215966A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5722260B2 (en) * | 1974-12-18 | 1982-05-12 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100829794B1 (en) * | 2007-01-23 | 2008-05-16 | 아주대학교산학협력단 | Method of identifying radio frequency tag in rfid system |
| AT521763A1 (en) * | 2018-09-28 | 2020-04-15 | Franz Stoeger | Electronic device |
| AT521763B1 (en) * | 2018-09-28 | 2020-10-15 | Franz Stoeger | Electronic device |
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