JPH03202327A - Cleaning process of mold face for molding resin, sheet member for cleaning used in same process and continuous automatic resin-molding process - Google Patents

Abstract

PURPOSE:To remove effectively and surely the extraneous matter adhere to the molding face to be filled with molding resin material and the molding face of said periphery by a method in which a cleaning sheet member is set on the molding face, and after mold-clamping, cleaning resin solution is injected thereinto under pressure. CONSTITUTION:The sheet member 20 for cleaning is composed of the sheet member such as e.g. paper, resin or rubber, etc., having heat resistance and the liquid-absorbing property for cleaning resin solution. The path 201 guiding heated and molten cleasing resin solution to a transferring path 7, up and down both cavities 11, 21 and an air vent 12 from the position of a pot 5, is provided, and then the depression 20 guiding cleaning resin solution into the part to be filled with resin material and the necessary range of the peripheral mold face, is provided. After mold releasing process has been finished, while the sheet member 20 is fed and set so that the sheet member 20 is superimposed on the prescribed position of the face of a bottom force 2, the cleaning material 21 of e.g. melamin resin is fed into the pot 5, and mold clamping is carried out, and further heated and molten cleaning resin solution is injected under pressure into the part to be filled with resin material. Next, the mold is opened and mold release is carried out.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is applicable to mold surfaces for sealing and molding electronic components such as ICs with resin materials, or other mold surfaces for resin molding. The present invention relates to a cleaning method, a cleaning sheet member used in this method, and a continuous automatic resin molding method using this method.

[Conventional technology]

For example, as a mold for sealing electronic components such as ICs, diodes, and capacitors with thermosetting resin materials such as epoxy resin, transfer resin sealing molding as shown in FIGS. 7 to 9 is used. Molds for this purpose are known.

The mold includes a fixed upper mold 1, a movable lower mold 2 disposed opposite to the fixed upper mold 1, and P and L of both the upper and lower molds (1 and 2).
cavities 11 and 21 for resin-sealing molding of the electronic component 3 placed opposite to each other on the parting line) surface, a pot 5 for supplying the resin material (tablet) 4 placed on the side of the lower mold 2, and a pot 5 fitted in the pot. a plunger 6 for pressurizing the resin material;
A passage 7 for transferring the molten resin material consisting of a cull part 71, a gate part 72, etc. that communicates the pot 5 with the upper mold cavity 11 side, and a heating passage provided in both the upper and lower molds (1 and 2), respectively. A heater 8 etc. are provided.

Resin sealing molding of the electronic component 3 using this mold is performed as follows.

First, when both the upper and lower molds (l and 2) shown in FIG. At the same time, the resin material 4 is supplied into the pot 5.

Next, as shown in FIG. 10, the lower mold 2 is moved upward to clamp both the upper and lower molds (1 and 2), and in this state, the resin material 4 in the pot 5 is pressurized by the plunger 6. . At this time, the resin material is heated and melted by the heater 8, and is pressed by a force a by the plunger 6, and is passed from the bot 5 to the upper and lower cavities (11, 21) through the passage 7.
Filled with injection.

Further, the molten resin material injected and filled into the two cavities (11, 21) discharges residual air in the two cavities to the outside through the air vent 12 provided on the upper mold surface.

Therefore, both the molds (1 and 2) are opened again after the required curing time, and the cured resin in both the cavities (11 and 2+) and the passage 7 is removed by the upper and lower ejector mechanisms 10.
By simultaneously releasing the molds at step 10, the electronic components 3 in both cavities 11 and 21 can be sealed and molded into a mold package corresponding to the shape of both cavities.

During resin encapsulation molding of electronic components as described above, or other resin molding, a portion of the molten resin material infiltrates the P and L surfaces of the mold and hardens, forming a resin barrier. There are general problems in resin molding, and there is also the problem that foreign matter (hereinafter simply referred to as foreign matter) such as deposits of mold release agent tends to remain in the cavity and the like. And mold P
If such foreign matter remains on the L side, it is a serious problem in resin molding that the molds cannot be completely clamped during the next resin molding process, resulting in defective molded products. In particular, when a thermosetting resin material is used as the resin material, when the mold is clamped, the mold P and L surfaces may be damaged by hardened foreign matter, or the mold itself may be damaged. There is a serious risk of

Therefore, conventionally, every time a resin molding process is completed, a cleaning operation is performed to peel off and remove foreign matter remaining on the mold surface.

As conventional cleaning methods, for example, a method using a special brush member, a method of blowing highly compressed air, etc. are known.

In addition, there is a method in which foreign matter on the mold surface is adhered to the molten resin material by performing normal transfer molding using a melamine resin-based cleaning resin material, and this is removed from the mold surface together with the resin material. has also been proposed.

[Problem that the invention seeks to solve]

However, in the above-mentioned methods of using a brush member or blowing highly compressed air, the removal efficiency and removal efficiency of foreign matter adhering to the mold surface are low and extremely insufficient because the peeling and removal effect is not uniform. there were.

In particular, when a thermosetting resin material is used as the resin material, such as when molding electronic parts with resin, the adhesiveness of the resin to the mold (metal) is high, so foreign substances must be completely peeled off and removed. Therefore, even if these cleaning methods are adopted, it is still necessary to perform manual cleaning work in which the worker uses a cleaning spatula or the like to reliably peel off and remove foreign substances. Met.

As a result, the overall productivity decreases, as well as the quality and reliability of the molded product.Furthermore, since the above-mentioned spatula etc. contain abrasive grains, they may even damage the mold surface. There was a problem.

In addition, in the method using a melamine resin-based cleaning resin material, the adhesive effect with foreign matter on the mold surface filled with the cleaning resin solution, that is, in the passage for transporting the resin solution, in both the upper and lower cavities, and in the air vent. However, no peeling or removal effect can be expected at all for foreign matter that has entered the mold surfaces such as the recess for setting the lead frame or the P and L surfaces of the mold from these filled parts and hardened. It was something. Therefore, in this case, foreign matter will still remain attached to the pot and the area around the transfer passage, the entire surface of the setting recess, the area around the air vent, etc., so even if this cleaning method is adopted, , it is necessary to perform a separate cleaning operation for the purpose of peeling off and removing foreign matter remaining on the other mold surfaces mentioned above. Therefore, this cleaning method also has the same problem as mentioned above, that is, the overall productivity, quality, and reliability are reduced.

Furthermore, in the conventional cleaning method, as mentioned above, manual labor by the operator is practically indispensable, so it is necessary to carry out the entire resin molding process continuously or There was a problem that continuous automation could not be achieved.

The present invention efficiently removes foreign matter remaining and adhering not only to the mold surface where molding resin material such as thermosetting resin is filled, but also to the surrounding areas and other mold surfaces with a single cleaning operation. Another object of the present invention is to provide a method for cleaning the surface of a mold for resin molding that allows reliable peeling and removal, a cleaning sheet member used in this method, and a continuous automatic resin molding method using this method. It is.

Another object of the present invention is to improve overall productivity and the quality and reliability of molded products by providing a continuous automatic resin molding method using this cleaning method.

[Means for solving problems]

The mold surface cleaning method according to the present invention includes a step of setting a required cleaning sheet member on the mold surface for resin molding, a step of clamping the mold after the setting step, and a step of clamping the mold after the mold clamping step. A step of injecting a necessary cleaning resin solution under pressure into the part filled with the molding resin material on the mold surface and adhering the resin solution to the foreign matter remaining in the part filled with the molding resin material, and after the above adhesion step. The step of opening the mold, and the step of removing the sheet member from the mold surface after the mold opening step, and forming a solidified molded body of the cleaning resin that has been absorbed and integrated into the sheet member, and is bonded and integrated with the solidified molded body. This method is characterized by comprising a step of peeling off and removing the formed foreign matter from the mold surface.

Furthermore, the method for cleaning the mold surface according to the present invention includes setting the clamping pressure in the mold clamping process of the mold to be slightly lower than the predetermined mold clamping pressure, thereby reducing the cleaning resin solution in the bonding process. The sheet member for cleaning the mold surface for resin molding according to the present invention is characterized in that it guides the filling part of the resin material for molding and its surrounding area within a required range of the mold surface. This sheet member is interposed between mold surfaces, and is characterized in that it is configured to be integrated with a cleaning resin material that is pressurized and injected into the mold surface.

Further, the sheet member for cleaning the surface of a resin molding mold according to the present invention is formed with a necessary resin solution passage portion for guiding the cleaning resin solution to the filling part of the molding resin material provided on the mold surface. It is characterized by this.

Moreover, the sheet member for cleaning the surface of a mold for resin molding according to the present invention is provided with a cleaning resin solution for guiding the cleaning resin solution within a required range of the filling portion of the molding resin material provided on the mold surface and the surrounding mold surface. It is characterized by having a shaped recess formed therein.

Further, in the sheet member for cleaning the surface of a resin molding mold according to the present invention, the surface shape of the sheet member is formed in a shape corresponding to the shape of the filling part of the molding resin material provided on the mold surface. This is a characteristic feature.

Further, the sheet member for cleaning the surface of a mold for resin molding according to the present invention is characterized in that the sheet member is formed of a material having a required elasticity.

Further, the continuous automatic resin molding method according to the present invention includes a resin molding step in which a resin molding mold is clamped and a molten resin material is injected under pressure into the mold surface to perform the desired resin molding, and A continuous automatic resin molding method comprising the following steps: a mold release step of opening the mold and taking out the resin molded object from the mold surface after the molding step, and a mold surface cleaning step performed after the mold release step. The cleaning step includes:
The mold is clamped with the cleaning sheet member set on the mold surface, and then the required cleaning resin solution is injected under pressure into the molding resin material filled portion on the mold surface. Then, by opening the mold and taking out the sheet member from the mold surface, the cleaning resin is bonded to the solidified molded body integrated with the sheet member and the solidified molded body. This method is characterized by peeling and removing the integrated foreign matter from the mold surface.

Further, the continuous automatic resin molding method according to the present invention includes a resin molding step in which a resin molding mold is clamped and a molten resin material is injected under pressure into the mold surface to perform the desired resin molding, and A mold release process of opening the mold after the molding process and taking out the resin molded body from the mold surface, a mold surface cleaning process performed after the mold release process, and a mold surface cleaning process performed after the cleaning process. A continuous automatic resin molding method consisting of a release film forming step and a mold release film forming step, in which the cleaning step involves clamping the mold with a cleaning sheet member set on the mold surface, and then A necessary cleaning resin solution is injected under pressure into the molding resin material filled part on the mold surface to adhere to foreign matter remaining in the filled part, and then the mold is opened and the sheet is removed from the mold surface. By taking out the member, the solidified molded body of the cleaning resin integrated with the sheet member and the foreign matter adhesively integrated with the solidified molded body are peeled off and removed from the mold surface.

Further, in the continuous automatic resin molding method according to the present invention, the mold clamping pressure of the mold in the above-mentioned cleaning step is set to be slightly lower than the predetermined mold clamping pressure, so that the cleaning resin solution is applied to the molding resin material. It is characterized by guiding the filling part and its surrounding area within a required range of the mold surface.

[Effect]

According to the present invention, a required cleaning resin solution is injected under pressure into the mold surface after the mold clamping step, and the resin solution can be bonded to foreign matter remaining on the mold surface. Further, at this time, the cleaning resin solution can be absorbed by the sheet member set on the mold surface, or the two can be engaged and integrated. Therefore, foreign matter remaining on the mold surface is removed when the sheet member is taken out from the mold surface.
Through the sheet member, it is simultaneously, efficiently and reliably peeled off and removed.

Further, according to the present invention, since the cleaning process of the resin molding mold surface can be carried out in succession to the resin molding process and the mold release process of the molded product, continuous automation of the entire resin molding process can be achieved. be.

〔Example〕

Next, the present invention will be explained based on embodiment figures.

FIGS. 1(4) and 1(B) show a schematic structure of a cleaning sheet member, and FIG. 2 shows a state in which the cleaning sheet member is set on the surface of a mold for resin molding.

This cleaning sheet member 20 is supplied to the mold during the cleaning process of the mold surface for resin molding through an appropriate automation mechanism 30 that automatically performs the action of supplying and setting the sheet member and taking it out from the set position. It is interposed between the upper mold 1 and the lower mold 2. The sheet member 20 is made of a material having a required heat resistance and a required liquid absorbency capable of absorbing a cleaning resin solution that is pressurized and injected into the mold surface after the mold is clamped, for example. It is formed from a sheet member made of paper, resin, rubber, etc., and its shape, size, etc. are formed to correspond to the above-mentioned mold surface.

In addition, a cleaning resin such as melamine resin is applied to the filling part of the molding resin material provided on the mold surface, that is, from the position of the bot 5 to the transfer passage 7, both the upper and lower cavities lr, 21, and the air vent 12. Required passage portion 20 for guiding the resin solution obtained by heating and melting the material 21.
is formed.

In addition, within the required range of the above-mentioned filling part of the resin material for molding and its surrounding mold surface, that is, the periphery of the pot 5, the periphery of the transfer passage 7, and the periphery of the recess 22 for setting the lead frame 9. - A recess 202 of a desired shape for guiding the cleaning resin solution is formed in the periphery of both cavities 11 and 21, the periphery of the air vent 12, and other surfaces of the mold P and L.

Further, on both side edges of the sheet member 20, there are holes 20 for hooking the detachable arm 30□ of the above-described automated machine m30. is drilled.

Note that the positions and shapes of the resin solution guide passage 201, recess 202, hole 203, and the pilot bottle fitting hole provided on the mold surface are determined by the resin molding. They can be set and formed as desired depending on the configuration of the mold surface. Further, the size thereof can be formed to correspond to an arbitrary range such as the cavity portion (cavity block surface) on the mold surface.

Hereinafter, the cleaning sheet member 20 having the above configuration will be described.
A case will be described in which the surface of a mold for resin molding is cleaned using the following method.

This cleaning process is carried out after the molded product release process, in which the resin molding molds (upper and lower molds 1 and 2) are opened and the resin molded body is taken out from the mold surface, is completed after the normal resin molding process. It will be done.

First, in the mold open state after the mold release process described above, the sheet member 20 is transferred to the lower mold 2 via the automated mechanism 30.
At the same time, the cleaning resin material 21 is supplied into the bot 5 so as to be overlapped at a predetermined position on the surface. Next, in this state, the lower mold 2 is moved upward to form both upper and lower molds (1 and 2).
) (see Figure 2). Furthermore, at this time,
Since both molds are heated by the heater 8, the bot 5
The cleaning resin material 21 inside is gradually heated and melted.

Next, a heated and melted cleaning resin solution is injected under pressure into the molding resin material filled portion on the mold surface. This pressurized injection of the cleaning resin solution can be carried out by, for example, a normal transfer molding method, so that the cleaning resin material in the heated and melted state in the bot 5 is transferred to the plunger 6 in the same way as in the case of resin molding. Pressure can be applied. The pressurized cleaning resin solution flows through the passage portion 201 and the recess 2 in the sheet member 20.
0□, the molding resin material is injected and filled into the filling portion, that is, the transfer passage 7, the upper and lower cavities (h 21), and the air vent 12 in the mold.

In addition, this cleaning resin has an affinity with the above-mentioned filling part of the mold surface and foreign substances that have penetrated from the filling part into the mold surfaces such as the lead frame setting recess 22 and the mold P and L surfaces and hardened. It will be strongly bonded. Further, at this time, since the sheet member 20 is made of a material having the required liquid absorbency and heat resistance, it absorbs a portion of the cleaning resin solution and solidifies it in that portion. Furthermore, the above-mentioned foreign matter on the mold surface is bonded and integrated with the sheet member via the solidified molded body of the cleaning resin.

Next, the mold is opened, and the cleaning sheet member 20 and the solidified molded body of the cleaning resin bonded and integrated therewith are released by the upper and lower ejector mechanisms 10. It is possible to efficiently, smoothly and reliably peel and remove foreign matter that has been bonded and integrated with the sheet member 20 via the solidified molded body of the cleaning resin from the mold surface.

In addition, in the above mold clamping step, the clamping pressure may be set to be slightly lower than a predetermined clamping pressure. In this case, there is an advantage that the cleaning resin solution in the above-mentioned bonding process can be guided more efficiently and smoothly within the required range of the filling part of the molding resin material and the surrounding mold surface.

In addition, the above-mentioned cleaning process, as mentioned above,
Because it can be adapted to automation and continuity of work,
It can be incorporated into the entire process of resin molding.

Therefore, there is a resin molding process in which the resin molding mold is clamped and a molten resin material is injected under pressure into the mold surface to perform the desired resin molding, and after the resin molding process, the mold is opened and the mold is molded. A mold release process for taking out the resin molded body from the mold surface;
It is possible to realize a continuous automatic resin molding method in which each step including the mold surface cleaning step performed after the mold release step is performed continuously and automatically. Furthermore, in the cleaning process of this continuous automatic resin molding method,
Even if the mold clamping pressure of the mold is set to be slightly lower than the predetermined mold clamping pressure, the cleaning resin solution is guided within the required range of the filling part of the molding resin material and the surrounding mold surface. No problem.

It should be noted that the present invention is not limited to the embodiments described above, and can be arbitrarily and appropriately selected and adopted as necessary without departing from the spirit of the present invention. .

For example, as shown in FIG. 3, the passage for the cleaning resin solution in the cleaning sheet member described above may be formed by embossing, or as shown in FIG. It is also possible to use a material in which a plurality of materials having holes formed therein are laminated and bonded together as appropriate.

In addition, as shown in FIG.
Alternatively, one formed of a net-like material may be used. In this case, since the passage portion for the cleaning resin solution described above is substantially formed in the material itself, there is an advantage that the formation of the passage portion can be omitted.

Further, the surface shape of the cleaning sheet member described above may be formed into a shape corresponding to the shape of the filling part of the molding resin material provided on the mold surface, as shown in FIG. In this case, cavities and other recesses in the mold configuration 1
There is an advantage that the cleaning resin solution can be efficiently adhered to the foreign matter remaining and attached inside the container.

Further, the cleaning sheet member described above may be formed of a material having the required elasticity (or softness). Note that the sheet member may be made thin to provide the required elasticity. In this case, for example, when the sheet member and the dummy lead frame are set at the same time in the setting recess of the lead frame, There is an advantage that the sheet member can be bent and brought into close contact with the inner surface of the recess.

Furthermore, if the cleaning resin solution passage section in the cleaning sheet member described above is bored at a position corresponding to the gate section in the mold, the cleaning resin solution can be guided to both the upper and lower cavities, respectively. The passage portion in the cavity may be omitted.

Further, the passage portion of the cleaning resin solution in the cleaning sheet member can also serve as a retention hole for integrating the sheet member with the resin solution that hardens (solidifies) after being heated and melted. . Therefore, since the two can be integrated and held together through this passage, a material that does not absorb the resin solution can be used for this cleaning sheet member.

Furthermore, after the cleaning process of the mold surface for resin molding in the continuous automatic resin molding method described above, that is, before the next resin molding process, a mold release film is applied to the mold surface to improve the mold release efficiency of the molded product. A forming step may also be performed. In addition, in the step of cleaning the surface of the resin molding mold in this method, the mold clamping pressure of the mold is set to be slightly lower than a predetermined mold clamping pressure, and the cleaning resin solution is applied to the filling part of the molding resin material. And the surrounding area may be guided within a required range of the mold surface.

[Effects of the Invention] According to the present invention, it is possible to clean not only the mold surface where molding resin material such as thermosetting resin is filled, but also the foreign matter remaining and attached to the surrounding area and other mold surfaces. Provided is a method for cleaning a mold surface for resin molding that can be efficiently and reliably peeled off in multiple cleaning operations, a cleaning sheet member used in this method, and a continuous automatic resin molding method using this method. It has excellent practical effects.

Further, according to the continuous automatic resin molding method using the cleaning method of the present invention, the overall productivity can be improved, and the quality and reliability of molded products can be improved. It is effective.

[Brief explanation of drawings]

FIG. 1 shows an outline of the cleaning sheet member according to the present invention. Fig. 2 is a longitudinal cross-sectional end view taken along the line 2. Fig. 2 is an explanatory view of the operation of the method of the present invention, showing the main part of the mold, showing a state in which the sheet member is set on the mold surface for resin molding and the mold is clamped. FIG. 3 to FIG. 5 show other embodiments of the sheet member according to the present invention, and are all partially cutaway enlarged longitudinal front views thereof. The figure is a partially cutaway enlarged vertical cross-sectional end view showing another embodiment of the sheet member according to the present invention. 9 is a partially cutaway bottom view and a partially cutaway plan view showing the resin molding mold in an open state. FIG. 10 corresponds to FIG. 9. It is a partially cutaway vertical front view showing the mold clamping state of the mold. [Explanation of symbols] ... Fixed upper mold ... Cavity ... Air vent ... Movable lower mold ... Cavity ... Recess for setting...Electronic parts...Molding resin material...Pot...Plunger...Transfer passage...Cull part...Gate part...Heater...Lead frame...・・Ejector mechanism・Concave area・Cleaning sheet member・Passage area・Concave area・Latching hole・Cleaning resin material・Automation mechanism・Detachable arm

Claims (10)

[Claims] (1) A process of setting a required cleaning sheet member on the mold surface for resin molding, a process of clamping the mold after the above-mentioned setting process, and a process of molding resin material on the mold surface after the above-mentioned mold clamping process. a step of injecting a required cleaning resin solution under pressure into the filled portion of the molding resin material and adhering the resin solution to foreign matter remaining and adhering to the filled portion of the molding resin material; and a step of opening the mold after the bonding step; By taking out the sheet member from the mold surface after the mold opening step, the solidified molded body of the cleaning resin that has been absorbed and integrated into the sheet member and the foreign matter that has been bonded and integrated with the solidified molded body are removed from the mold surface. A method for cleaning the surface of a mold for resin molding, the method comprising the step of removing further peeling. (2) By setting the mold clamping pressure in the mold clamping process to be slightly lower than the predetermined mold clamping pressure, the cleaning resin solution in the bonding process can be applied to the filling part of the molding resin material and the surrounding mold surface. 2. The method for cleaning a surface of a resin molding mold according to claim 1, wherein the cleaning method comprises guiding the resin mold surface within a required range. (3) A resin molding mold, which is a sheet member interposed between surfaces of a resin molding mold, and configured to be integrated with a cleaning resin material injected under pressure into the mold surface. A sheet member for cleaning the mold surface. (4) A cleaning sheet according to claim (3), wherein a required resin solution passage portion for guiding a cleaning resin solution is formed in a filling portion of a molding resin material provided on a mold surface. Element. (5) A claim characterized in that a recess of a predetermined shape for guiding a cleaning resin solution is formed within a predetermined range of the filling portion of the molding resin material provided on the mold surface and the surrounding mold surface. (3) or the cleaning sheet member according to claim (4). (6) Claims (3) to (5) characterized in that the surface shape of the sheet member is formed in a shape corresponding to the shape of the filling part of the molding resin material provided on the mold surface. Cleaning sheet member described. (7) The cleaning sheet member according to any one of claims (3) to (6), wherein the sheet member is made of a material having required elasticity. (8) A resin molding step in which the resin molding mold is clamped and a molten resin material is injected under pressure into the mold surface to perform the desired resin molding, and after the resin molding step, the mold is opened and A continuous automatic resin molding method comprising the following steps: a mold release step for taking out the resin molded object from the mold surface, and a mold surface cleaning step performed after the mold release step, the cleaning step being The mold is clamped with the cleaning sheet member set on the mold surface, and then the required cleaning resin solution is injected under pressure into the molding resin material filled portion on the mold surface. By adhering to the remaining adhering foreign matter, then opening the mold and taking out the sheet member from the mold surface, the solidified molded body of the cleaning resin integrated with the sheet member and the solidified molded body are bonded together. A continuous automatic resin molding method characterized by peeling off and removing foreign matter from the mold surface. (9) A resin molding step in which the resin molding mold is clamped and a molten resin material is injected under pressure into the mold surface to perform the desired resin molding, and after the resin molding step, the mold is opened and Each step of a molded product release process in which the resin molded body is taken out from the mold surface, a mold surface cleaning process performed after the above mold release process, and a mold release film forming process on the mold surface performed after the above cleaning process. A continuous automatic resin molding method comprising: in the cleaning step, the mold is clamped with a cleaning sheet member set on the mold surface, and then the mold surface is filled with a molding resin material. The required cleaning resin solution is injected under pressure into the filled part to adhere to foreign matter remaining in the filled part, and then the mold is opened and the sheet member is taken out from the mold surface to be integrated with the sheet member. 1. A continuous automatic resin molding method characterized by peeling and removing a solidified molded body of a cleaning resin and foreign matter that has been bonded and integrated with the solidified molded body from a mold surface. (10) By setting the mold clamping pressure of the mold in the cleaning process to be slightly lower than the predetermined mold clamping pressure, the cleaning resin solution is applied within the required range of the filling part of the molding resin material and the surrounding mold surface. The continuous automatic resin molding method according to claim (8) or claim (9), characterized in that the continuous automatic resin molding method is guided by.