JPH03208221A - Film-coated molding for electronic component sealing - Google Patents

Abstract

PURPOSE:To obtain sealed electronic components with no sealing failure and with a smooth surface by covering one side of an epoxy resin composite layer before hardening with an epoxy resin filming sheet, and punching it according to the shape of the electronic components, and sealing them with the punched layer. CONSTITUTION:5-50 weight portion of thermoplastics of 5000 or more in mean molecular weight, 5-300 weight portion of inorganic fillers, and hardeners are added to and mixed with 100 weight portion of epoxy resin to make a resin capable of hardening. Before hardening of the resin, one side of the resin layer is covered with an epoxy resin filming sheet consisting of plastic film of 20-200mum in thickness, and the layer is punched according to the shape of electronic components to be sealed. For the epoxy resin, bisphenol A type epoxy resin or the like is used, for, the thermoplastics, polyamide resin or the like is used, for the inorganic filler mica or the like is used and for the hardener, amine hardener or the like is used. By laminating these sealing members, excellent effect can be brought.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to sealing and sealing materials for v'rc and electronic components (switches, relay potentiometers, transformers, capacitor sensors, etc.).

(Jubei's technology) As a method for sealing and sealing electronic components (hereinafter simply referred to as electronic components), for example, one-component epoxy resin is poured onto the top surface of the electronic component case using a dispenser and cured by heat. Method ■There is a method in which a solid epoxy resin molding, which is solid at room temperature and in a substantially uncured state, is placed on top of the case of the part and once melted with heat and hardened.

However, method (■) is difficult to handle, and if the nozzle becomes clogged, the viscosity may change, resulting in inconsistent quality.

Compared to method (2), method (2) is easier to handle because the solid epoxy resin body is simply placed on the case of the part to be sealed, and problems such as viscosity changes do not occur if the nozzle becomes clogged. However, compared to a one-component epoxy resin, the epoxy resin composition has poor flowability when melted, and for example, the vicinity of the lead bin or the corners of the case may not be completely sealed.

Furthermore, once the epoxy resin is melted by applying heat, it aggregates, causing a large amount of creeping onto the lead pins, causing sealing and sealing defects.

(ROM to be Solved by the Invention) The purpose of the present invention is to provide a ROM that has good flowability when melted and has little creeping up of electronic components to terminals, etc., so that it can be used for sealing electronic components without sealing or sealing defects. The goal is to provide form.

Another object of the present invention is to provide a compact body for encapsulating electronic components that is easy to handle, has a certain quality, has an excellent appearance because it is coated with a film, and has a smooth surface.

(Means for Solving the Problems) The present invention contains 5 to 50 parts by weight of a thermoplastic resin having a number average molecular weight of 5000 or more, 5 to 300 parts by weight of an inorganic filler, and a curing agent for 100 parts by weight of an epoxy resin. The curable, substantially uncured epoxy resin material scraps to a thickness of 2
A film-coated sheet for encapsulating electronic components obtained by punching a sheet of film-applied epoxy resin on one side of a 0-200μ plastic film into the shape of the electronic component to be sealed and sealed. It concerns the form.

The Evokin resin used in the present invention includes screws 7 and 7.
-Le Afi epoxy resin [Yuka Ciel Epoxy Co., Ltd. 9
l, shrimp foot 828, 834. 1001, +0
02, +003, 1004, 1005, 1007
．． 1010, IIOOL etc.], brominated vinyl 7/-
Le A type epoxy resin [manufactured by Yuka Ciel Epoxy Co., Ltd., Ebifuto 5050. 505]. , 5051 8th grade]
, 0-cresol/borac type epoxy resin [Sumitomo Chemical Co., Ltd. 9I, E S C N -2201-, ES
CN-220F, ESCN-220H, ESCN-22
0HH, etc.], brominated/borac type epoxy resin [manufactured by Nippon Kayaku Co., Ltd., BREN-S, etc.], 7 enol/borac type epoxy resin [manufactured by Sumitomo Chemical Co., Ltd., ESPN-180]
etc.] and epoxy resins modified with these.

These epoxy resins can also be used in combination. In addition, even if it is a liquid epoxy resin at room temperature or a B-stage epoxy resin, it is possible to use this mixture as long as the mixture is solid at room temperature (25°C). It is preferable to adjust the melting point of the mixture to 50-120°Cl.

Number average molecule used in the present invention! Examples of thermoplastic resins having a molecular weight of 5,000 or more (hereinafter simply referred to as molecular weight) include polyamide resins, polycarbonate resins, polyurethane resins, and polyester i? ! ．． Resin, silicone P. resin, 7
Thermoplastic resins such as polyethylene resin, polyvinyl chloride resin, polystyrene resin, ABS resin, polyvinyl alcohol resin, Io77 resin, methacrylic resin, poly7enylene oxide resin, chlorinated polyethylene, etc. Elastomer, natural rubber, imprene rubber, butanoene rubber, styrene butanoene rubber, nitrile rubber,
Examples include rubbers such as chloroprene rubber, silicone rubber, and/rubornene polymer.

The thermoplastic resin used in the present invention is intended to improve the mechanical strength of the sheet in an uncured state, and has a molecular weight of 5.
If the molecular weight is less than 100,000, the improvement effect will be small and the sheet will be very brittle, while if the molecular weight is over 100,000, the melting point and melt viscosity will be high, resulting in a high mixing temperature and a large energy loss, and the sheet will not be formed into a sheet. Since it is difficult to melt by heating, what is the molecular weight? 00000 or less is desirable. If the amount added is less than 5 parts by weight, the mechanical strength of the sheet in the uncured state (particularly the mechanical strength in the punching process) will be low, and if it exceeds 50 parts by weight, the properties such as heat resistance and solvent resistance of the epoxy resin will be deteriorated. spoil.

Inorganic fillers used in the present invention include Myriki, silica, glass fiber, glass flakes, glass powder, carbon II &
fiber, talc, calcium carbonate and VI-i■o・A1
203.SiO2 etc. are exemplified. The blending amount of the N filler is 5 to 300 parts, preferably 30 to 100 parts, per 100 parts of the epoxy resin. If the blending amount is less than 5 parts, the coefficient of thermal expansion cannot be expected to decrease much, and the film may warp due to the difference in coefficient of thermal expansion with the film.

3001! If the amount exceeds 1, the apparent viscosity increases and the curing reaction progresses due to the heat generated during mixing, making it virtually impossible to achieve an uncured state, and the adhesive force with the adhered object also decreases.

In the present invention, examples of the curing agent include amine-based curing agents, acid anhydride-based curing agents, 7-functional resin-based curing agents, catalyst-based curing agents, etc., especially as long as they are curing agents that can undergo a curing reaction with epoxy resins. There are no limitations.

Specific examples of Aminotide 7 include diethylenetriamine, 1
Liethylenetetramine, bis(hexanonalene)triamine, trimethylhexamethylenenoamine, menzendiamine, isophoronenoamine, metaxylylenediamine, 3,9-bis(3-ami/brobyl)-2.4.8-
Tetraspirone[5.5]un7'f)one, meta7enylenediamine, diamino7enylmethane, diami7di7enylsulfone, 4,4'-methylenebis(2-chloroaniline) and V:reto epoxy resin Examples of anhydride compounds include talic anhydride, trimetic anhydride, biromellitic anhydride, benzo-7-tetracarboxylic anhydride, maleic anhydride, and tetrahydro-7 anhydride.
As examples of conjugates of 7-oles, tarlic acid, hexahydro-7-talic anhydride, methylnadic anhydride, methylcyclohexenetetracarboxylic anhydride, tetrachlor-a-7-talic anhydride, tetrabromo-7-tallic anhydride, etc. /-le, 0-
Examples include cresol/borac, phenol novolac, and phenol aralkyl. [For example, benzyldimethylamine, 2,4.6-
Tertiary amines such as tris(dimethylamino/methyl)7enol, biverinone, birinone, and vicolin, imigsols represented by 2-ethyl-4-methylimiguzole, and other 1,8-noazavinchlo[5,4.0 ) Lewis acids such as undecene and BF3, dicyanonamide, amine imide, ceramic acid hydrazide, mixtures of these, salts, complexes, etc. can be mentioned. The amount of the curing agent to be blended is usually 0.1 to 20 phr based on 100 phr of the epoxy resin in the case of a catalytic curing agent, and preferably in the range of 0.5 to 2 in equivalent ratio to the epoxy group in other cases.

In the present invention, fillers, flame retardants, reinforcing materials, lubricants, dispersants, surfactants, pigments, dyes, coupling agents, and the like are used as compounding agents and additives as necessary. As a filler! ＃． Organic fillers such as aramid fibers and nylon #l fibers other than mechanical fillers; flame retardant materials such as antimony trioxide, aluminum hydroxide, red phosphorus, and ferrous compounds; lubricants, dispersants, and interfaces. Activators include wax, zinc stearate, silicone oil, etc. Pigments and dyes include carbon black, red iron, titanium white, cyanine blue, etc. Coupling agents include Silan Katsu 7 ring agent,
Examples include titanium coupling agents.

In the present invention, the desired thermosetting sheet is obtained by forming a substantially uncured layer of the epoxy resin composition on one side of a plastic film having a thickness of 20 to 200 microns. Plastic films include polyimide film, polyamideimide film, polyamide film, polyester film, polycarbonate film, poly7enylene sulfide 7 film, borisl 7on film, boribara 7enylene 7on film, polyethersul 7on film, Boli 7 Enylene containing Ru 7
On-film, poly7-related film, etc. Preferably, a film that exhibits strong adhesion to the epoxy resin composition used in the present invention, has W1 flammability, and has small warpage is suitable.

Furthermore, by previously subjecting the surface of the film to surface treatment such as corona discharge treatment or chemical treatment, it is possible to improve the adhesion to the epoxy resin composition. Incidentally, the term "substantially uncured state" means a state where crosslinking has partially progressed but has not been completed.

Methods for forming the layer of epoxy resin compound include creating a film or sheet of epoxy resin compound and fusing it to the surface of the plastic film, or applying an epoxy resin layer or material to the surface of the plastic film. You can learn how to do it. Punching the epoxy resin sheet obtained in the present invention according to the shape of the part to be sealed or sealed in an electronic component means that the part to be sealed or sealed has a radius of 1 c as shown in FIG. When sealing and sealing an electronic component with the size of a circle with a thickness of 0.5 cm, a sheet of film-covered epoxy resin composition with a thickness of 0.5 cm is preferably used with a radius of 0.90 cm or more, Ies. It is as follows.

When sealing or sealing the part where the terminal protrudes as shown in Fig. 2, punch out a sheet of epoxy resin covered with a film so that the terminal can be inserted as shown in Fig. 3. Process.

By using the thermosetting film-attached sealing material for electronic components of the present invention, it is possible to control the flowability during melting.

For example, take a coil with terminals as shown in Figure 2 (.)
Figure @4 is a cross-sectional view of the case where the sealing material with 7 ilm and (7(b) without 7 ilm) of the present invention are installed and cured on the sealing surface of the coil. a), (b
). In the case of film pasting 9 shown in (.), the epoxy resin does not creep up onto the terminal due to the surface tension of the film, whereas in the case of no film shown in (b), the terminal creeps up significantly, which can cause poor conductivity. Become.

Also, as a punched product similar to the sealing surface of the relay, (a)
When (b) without film is placed on the sealing surface of the relay and cured, the film (a) (q) will flow out without agglomerating due to the surface tension of the film when melted, resulting in better flowability. is hot. On the other hand, if the film (b) is not present, the epoxy resin will aggregate toward the center during melting, resulting in poor flowability and poor sealing at the corners of the case.

(Effects of the invention) By using the 7-ilm-covered epoxy resin composite body of the present invention, ■ Since the film is laminated, it is possible to control the flowability during melting, and the sealing and sun-sealing It also reduces the amount of water that crawls into the lead bin.

■Since the film is laminated, the surface of the cured product is smooth and has excellent durability.

■Film pasted Evokin a {The sheet of resin composition has the mechanical strength to punch out complex and minute shapes, and it is also possible to use automated equipment such as Part 7 Egu and robots, automating the process and reducing costs. It exhibits excellent effects. In addition, it is resistant to handling and vibration during transportation, so it will not be damaged and will not stain electronic components.

(Example) Examples and comparative examples will be described below.

Examples 1 to 10 The ingredients shown in Table IIJ1 were melted and mixed at 100°C for 1 minute, and then placed on the lower plate surface of a press with a press temperature of 70°C to a thickness of 50μ in Table 1. The above molten mixture was placed on top of the various films shown, followed by release paper and pressed. At this time, add the baser again and the wall thickness will be 0.7 mm.
I set it to 1.

The above film pasted sheet cooled to room temperature is punched out according to the part to be sealed and sealed to seal the coil.
It was placed in the sealing part and cured at 120°C and 3br. After curing, sealing properties, creeping into terminals, and appearance were observed.

Regarding the sealability, a case with good sealing was rated as ×, and a case with complete sealing was rated as ○. As for crawling into the lead bin, it is 60.5 or higher based on the appearance of the case.
t % L J n) L ”1/
8 E-- } n t a. , 7-
y length - /"). Regarding the appearance, the smoothness of the surface, glossiness, and warpage of the film were determined by R.
We inspected the items and marked the ones with no problems as ○ and the ones with large warping as ×.
And so.

Table 1 Epoxy resin Bis 7/A type epoxy resin Epoxy equivalent weight 614 Thermoplastic resin (1) Polyester resin with a molecular weight of 10,000 Thermoplastic resin (2) Polyamide resin with a molecular weight of 50,000 Inorganic filler Material Fused silica curing agent (1) Amine curing agent curing agent (2)
Thickness of imiguzol hardener film: 50μ PS: Polysul 7-on film P■: Polyimide film P A R: Polyarylate film P P S
: Poly7 Enylene Sur7 Id Film Comparative Examples 1 to 8 Epoxy resin molded bodies with or without film were made in the same manner as in the examples except that the predetermined precepts shown in Table 2 were used in the predetermined proportions. There was.

Each precept used is the same as in the example. For Comparative Examples 1 to 4, tests were also conducted on solvent resistance, wire crosstalk, blocking property, and sheet strength of the uncured epoxy resin.

Solvent resistance: The cured product was wiped with M E K. Those whose surfaces were stained were rated ×, and those whose surfaces were not stained were rated ○.

Crosstalk property: Those with high screw abrasion were rated as ×.

Blocking property: A score of "×" indicates that the punched product sticks to the product at room temperature (23° C.), and a score of "○" indicates that the punched product does not stick.

Uncured epoxy O And so.

No. table

[Brief explanation of drawings]

1 and 2 show an example of an electronic part crystal to be sealed, and FIG. 3 shows an example of a film-coated molded article for sealing an electronic part of the present invention. Figure 4 (.) is a cross-sectional view of the sealing material of the present invention placed on the sealing surface and cured, and Figure 4 (b) is 7
FIG. 3 is a cross-sectional view of a case where a sealing material without an ilm is used and cured. (Above) Applicant: Toyo Rubber Industries Co., Ltd. Agent: Patent Attorney Iwao Tamura

Claims (2)

[Claims] (1) A curable, substantially uncured material containing 5 to 50 parts by weight of a thermoplastic resin with a number average molecular weight of 5,000 or more, 5 to 300 parts by weight of an inorganic filler, and a curing agent per 100 parts by weight of an epoxy resin. The thickness of the layer of epoxy resin composition is 20~
A film-coated molded article for sealing electronic components obtained by punching a film-attached epoxy resin sheet formed on one side of a 200 μm plastic film according to the shape of the electronic component to be sealed and sealed. (2) The thickness of the above film-attached epoxy resin sheet is 0.
．． The molded article according to claim 1, which has a thickness of 1 to 2 mm.