JPH03187295A - Head supporting arm - Google Patents
Head supporting armInfo
- Publication number
- JPH03187295A JPH03187295A JP32696289A JP32696289A JPH03187295A JP H03187295 A JPH03187295 A JP H03187295A JP 32696289 A JP32696289 A JP 32696289A JP 32696289 A JP32696289 A JP 32696289A JP H03187295 A JPH03187295 A JP H03187295A
- Authority
- JP
- Japan
- Prior art keywords
- support arm
- integrated circuit
- heat
- arm
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims description 12
- 239000000565 sealant Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 abstract description 19
- 239000011347 resin Substances 0.000 abstract description 19
- 239000004020 conductor Substances 0.000 abstract description 13
- 230000005855 radiation Effects 0.000 abstract description 9
- 239000000853 adhesive Substances 0.000 abstract description 6
- 230000001070 adhesive effect Effects 0.000 abstract description 6
- 238000007789 sealing Methods 0.000 abstract description 5
- 239000003566 sealing material Substances 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000010949 copper Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000009291 secondary effect Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
磁気ディスク装置等において記録再生用ヘッドを支持し
、かつヘッドに対する記録・再生信号を処理する集積回
路を実装した小型化に有利なヘッド支持アームに関し、
支持アームに設けたフレキシブル印刷配線板上にチップ
状の集積回路を直接的に実装し、しかも該集積回路で発
生する熱を支持アームより外部へ効率良く放散させる構
成により小型化を可能にすることを目的とし、
記録再生用ヘッドを保持したジンバルアームを一端部に
支持し、かつ該ヘッドに対する信号の制御及び増幅用の
集積回路が実装されたフレキシブル印刷配線板を一生面
に備えたヘッド支持アームにおいて、上記フレキシブル
印刷配線板は集積回路の実装領域に貫通穴を有し、チ・
ノブ状の集積回路は熱伝導手段と共に該貫通穴を通して
上記支持アームの一生面上に貼設した状態で封止材によ
り封止して実装され、該支持アームは集積回路実装面と
対応する背面側に放熱手段を設けるように構戒する。[Detailed Description of the Invention] [Summary] This invention relates to a head support arm that supports a recording/reproducing head in a magnetic disk device, etc. and is advantageous for miniaturization and is equipped with an integrated circuit that processes recording/reproducing signals for the head. A chip-shaped integrated circuit is directly mounted on a flexible printed circuit board provided on an arm, and the heat generated by the integrated circuit is efficiently dissipated from the support arm to the outside, thereby making it possible to downsize. In a head support arm that supports a gimbal arm holding a recording/reproducing head at one end and is equipped with a flexible printed wiring board on one side on which an integrated circuit for controlling and amplifying signals for the head is mounted. , the above flexible printed wiring board has a through hole in the integrated circuit mounting area, and
The knob-shaped integrated circuit is mounted together with a heat conduction means through the through hole and pasted on the whole surface of the support arm and sealed with a sealing material, and the support arm is mounted on the back surface corresponding to the integrated circuit mounting surface. Make sure to provide heat dissipation means on the side.
本発明は磁気ディスク装置等において記録再４用ヘッド
を支持し、かつヘッドに対する記録・両生信号を処理す
る集積回路を実装した小型化に有利なヘッド支持アーム
に関するものである。The present invention relates to a head support arm that supports a recording/reproducing head in a magnetic disk device or the like, and is equipped with an integrated circuit for processing recording and reproducing signals for the head, and is advantageous for miniaturization.
磁気ディスク装置において磁気記録媒体の記Ｕ情報を磁
気ヘッドにより再生する信号は非常に衛弱であり、かか
る再生信号を増幅する集積回路は磁気へ・ノドより離れ
た位置に設置すると外乱ノイズの影響を受は易いため、
該集積回路はでき得る限り磁気ヘッドの近くに設けるこ
とが要求され、通例として前記へラド支持アーム上に実
装している。しかし近来、磁気ディスク装置の小型化、
遺速化に伴って磁気ヘッド及びヘッド支持アーム薯も小
型、軽量化が進められ、該ヘッド支持アームへの前記集
積回路の実装構造も小型化すること力・必要とされる。In a magnetic disk drive, the signal used to reproduce the recorded information on a magnetic recording medium using a magnetic head is extremely weak, and if the integrated circuit that amplifies such a reproduced signal is installed at a position away from the magnetic field, it will be affected by disturbance noise. Because it is easy to receive
The integrated circuit is required to be placed as close to the magnetic head as possible and is typically mounted on the helad support arm. However, in recent years, magnetic disk devices have become smaller and
As speeds increase, magnetic heads and head support arms are becoming smaller and lighter, and there is a need to downsize the structure for mounting the integrated circuits on the head support arms.
従来の集積回路を実装した磁気ヘッド支持アームは第５
図に示すように、磁気ヘッド１がジンバルアーム２を介
して支持された支持アーム３上に印刷配線板、例えば第
６図に示すように配線導体４ｂヲベース樹脂フイルム４
ａとカバー樹脂フィルム４ｃにより挟着一体としたフレ
キシブル印刷配線板４が配置され、そのフレキシブル印
刷配線板４上の所定領域に、磁気ヘッド１への記録信号
の制御及び咳へ・７ド１で再生した信号を増幅するフラ
ットパッケージ形集積回路５が実装されている。The magnetic head support arm mounted with a conventional integrated circuit is the fifth
As shown in the figure, a printed wiring board, for example, a wiring conductor 4b and a base resin film 4 as shown in FIG.
A flexible printed wiring board 4 which is integrally sandwiched between a and a cover resin film 4c is arranged, and in a predetermined area on the flexible printed wiring board 4, a recording signal is controlled to the magnetic head 1 and a signal is transmitted to the magnetic head 1. A flat package integrated circuit 5 for amplifying the reproduced signal is mounted.
即ち、該フラットパッケージ形集積回路５は、第６図に
示すように例えばＩＣ，ＬＳＩ等からなるチップ５ａが
放熱性の良いセラミック基体５ｂと電磁ノイズをシール
ドする金属カバー５０とからなるパッケージ内に配設さ
れ、そのセラミック基体５ｂから導出する複数本の接続
リード５ｂ＋が、前記フレキシブル印刷配線板４上の所
定領域にカバー樹脂フィルム４ｃより露出するようにベ
ース樹脂フィルム４ａ上に形成された配線導体４ｂによ
る電極パターン上に半田付は等により接続された形で実
装されている。That is, in the flat package integrated circuit 5, as shown in FIG. 6, a chip 5a made of, for example, an IC, an LSI, etc. is housed in a package made of a ceramic base 5b with good heat dissipation and a metal cover 50 that shields electromagnetic noise. A wiring conductor formed on the base resin film 4a such that a plurality of connection leads 5b+, which are arranged and led out from the ceramic substrate 5b, are exposed from the cover resin film 4c in a predetermined area on the flexible printed wiring board 4. The electrode pattern 4b is connected by soldering or the like.
ところで磁気ディスク装置の小型化及び高速化に伴って
上記したような構成の磁気ヘッド支持アームを小型にす
る場合、前記フラットパッケージ形集積回路５の実装構
造も小型にする必要がある。Incidentally, in order to downsize the magnetic head support arm having the above-mentioned configuration as magnetic disk drives become smaller and faster, the mounting structure of the flat package integrated circuit 5 also needs to be downsized.
しかし、該フラットパッケージ形の集積回路５の容積及
び質量はパッケージの形状が規格化されているため、そ
のような集積回路５の実装構造を適用することにより前
記磁気ヘッド支持アームの小型化は極めて困難であった
。However, since the volume and mass of the flat package type integrated circuit 5 are standardized by the shape of the package, it is extremely difficult to miniaturize the magnetic head support arm by applying such a mounting structure for the integrated circuit 5. It was difficult.
そこで上記した問題を解決するため、前記フラットパッ
ケージ形の集積回路５内に配設されている該パッケージ
の十数分の一程度の小さいＩＣ，ＬＳＩ等からなるチッ
プ５ａを、前記フレキシブル印刷配線板４上の所定領域
に直接的に実装する構造を用いることにより磁気ヘッド
支持アームの小型、軽量化が可能となるが、その反面、
前記ＩＣ，ＬＳＩ等からなる千ツブ５ａで発生する熱を
放散させるための放熱を配慮したパンケージがないため
、そのようなチップ５ａの放熱が不十分となる問題があ
る。Therefore, in order to solve the above-mentioned problem, a chip 5a consisting of a small IC, LSI, etc., which is about one-tenth of the size of the package arranged in the flat package type integrated circuit 5, is mounted on the flexible printed wiring board. By using a structure in which the magnetic head is directly mounted in a predetermined area on the magnetic head support arm 4, it is possible to make the magnetic head support arm smaller and lighter; however, on the other hand,
Since there is no heat-radiating pancage for dissipating the heat generated in the chip 5a made of the IC, LSI, etc., there is a problem that the heat dissipation of the chip 5a is insufficient.
本発明は上記した従来の問題点に鑑み、支持アームに設
けたフレキシブル印刷配線板上にチップ状の集積回路を
直接的に実装し、しかも該集積回路で発生する熱を支持
アームより外部へ効率良く放散させる構成により小型化
を可能にしたヘッド支持アームを提供することを目的と
するものである。In view of the above-mentioned conventional problems, the present invention is designed to directly mount a chip-shaped integrated circuit on a flexible printed wiring board provided on a support arm, and efficiently transfer the heat generated by the integrated circuit from the support arm to the outside. It is an object of the present invention to provide a head support arm that can be miniaturized by having a configuration that allows good radiation.
本発明は上記した目的を達成するため、記録再生用ヘッ
ドを保持したジンバルアームを一端部に支持し、かつ該
ヘッドに対する信号の制御及び増幅用の集積回路が実装
されたフレキシブル印刷配線板を一生面に備えたヘッド
支持アームにおいて、上記フレキシブル印刷配ｗＡｖｉ
は集積回路の実装領域に貫通穴を有し、チップ状の集積
回路は熱伝導手段と共に該貫通穴を通して上記支持アー
ムの一主面上に貼設した状態で封止材により封止して実
装され、該支持アームは集積回路実装面と対応する背面
側に放熱手段を設けるように構成する。In order to achieve the above-mentioned object, the present invention provides a flexible printed wiring board that supports a gimbal arm holding a recording/reproducing head at one end and is equipped with an integrated circuit for controlling and amplifying signals for the head. In the head support arm provided on the surface, the flexible printing arrangement wAvi
has a through hole in the integrated circuit mounting area, and the chip-shaped integrated circuit is pasted on one main surface of the support arm through the through hole together with a heat conduction means, and is sealed with a sealing material and mounted. The support arm is configured to provide heat dissipation means on the back side corresponding to the integrated circuit mounting surface.
本発明では支持アーム上のフレキシブル印刷配線板にお
ける集積回路の実装領域に貫通穴を設け、該貫通穴に前
記支持アームより突出した熱伝導用突起部及び熱伝導性
の良い接着剤等からなる熱伝導手段を介してチップ状集
積回路を貼設し、かつ封止材により封止した実装構成と
することにより、支持アームの小型化が可能となる。ま
た該チップ状集積回路で発生する熱が該支持アーム側へ
容易に伝導され、その伝導された熱は更に該支持アーム
の集積回路実装面と対応する背面側に設けた放熱フィン
等からなる放熱手段によって効率良く放熱される。In the present invention, a through hole is provided in the mounting area of the integrated circuit on the flexible printed wiring board on the support arm, and a heat conduction protrusion protruding from the support arm and a heat conduction material made of adhesive or the like with good thermal conductivity are provided in the through hole. By adopting a mounting configuration in which a chip-shaped integrated circuit is attached via a conductive means and sealed with a sealing material, it is possible to downsize the support arm. In addition, the heat generated in the chip-shaped integrated circuit is easily conducted to the support arm side, and the conducted heat is further dissipated by heat dissipation fins etc. provided on the back side of the support arm that corresponds to the integrated circuit mounting surface. Heat is efficiently dissipated by this means.
以下図面を用いて本発明の実施例について詳細に説明す
る。Embodiments of the present invention will be described in detail below with reference to the drawings.
第１図は本発明に係るヘッド支持アームの第１実施例を
示す要部断面図である。FIG. 1 is a sectional view of a main part of a first embodiment of a head support arm according to the present invention.
図において、１１は記録再生用ヘッドをジンバルアーム
を介して支持するアルミニウム（Ａ Ｎ ）等からなる
軽量な支持アームであり、該支持アーム１１の集積回路
を実装する一方の面には熱伝導用突起部１２と、またそ
の突起部１２を設けた面と反対側の他方の面に放熱フィ
ン１３が一体に設けられている。In the figure, reference numeral 11 denotes a lightweight support arm made of aluminum (AN) or the like that supports the recording/reproducing head via a gimbal arm. A radiation fin 13 is integrally provided on the protrusion 12 and the other surface opposite to the surface on which the protrusion 12 is provided.
また、該支持アーム１１の熱伝導用突起部１２を設けた
一方の面上には、ベース樹脂フィルム１４ａ上の配線導
体１４ｂがカバー樹脂フィルム１４ｃより露出した電極
パターンと、該ベース樹脂フィルム１４ａの電極パター
ンの中心に貫通穴１４ｄを設けたフレキシブル印刷配線
板１４が、該貫通穴１４ｄを前記突起部１２に嵌合させ
た状態で接着剤等により貼設されている。Further, on one surface of the support arm 11 on which the heat conduction protrusion 12 is provided, there is an electrode pattern in which the wiring conductor 14b on the base resin film 14a is exposed from the cover resin film 14c, and an electrode pattern on the base resin film 14a. A flexible printed wiring board 14 having a through hole 14d provided in the center of the electrode pattern is pasted with an adhesive or the like with the through hole 14d fitted into the protrusion 12.
更に、該突起部１２上には、ヘッドへの記録信号の制御
及ヘッドで再生した信号を増幅するための例えばＩＣ，
ＬＳＩ等からなるチップ状集積回路１５を直接的に熱伝
導性の良い導電性銀銅系ペーストなどからなる接着剤に
より固着すると共に、該チップ状集積回路１５の複数の
接続端子と前記フレキシブル印刷配線基板１４の各配線
導体１４ｂからなる電極パターンとをワイヤリード１６
によりワイヤボンディングや半田付は等によって接続し
た状態に実装し、その実装したチップ状の集積回路１５
は耐湿性、耐熱性の良い、例えばエポキシ樹脂、或いは
シリコーン樹脂などにシリカ等の充填剤を配合した熱放
散性の良好な封止樹脂材１７により図示のように封止し
た構成としている。Further, on the protrusion 12, there is provided an IC, for example, for controlling recording signals to the head and amplifying signals reproduced by the head.
A chip-shaped integrated circuit 15 made of an LSI or the like is directly fixed with an adhesive made of a conductive silver-copper paste with good thermal conductivity, and a plurality of connection terminals of the chip-shaped integrated circuit 15 and the flexible printed wiring are bonded together. The electrode pattern consisting of each wiring conductor 14b of the substrate 14 is connected to the wire lead 16.
The mounted chip-shaped integrated circuit 15 is mounted in a connected state by wire bonding, soldering, etc.
As shown in the figure, it is sealed with a sealing resin material 17 having good moisture resistance and heat dissipation properties, such as epoxy resin or silicone resin mixed with a filler such as silica.
従って、かかる本実施例の構成にあっては、チップ状集
積回路１５の直接的な実装構造によりヘッド支持アーム
の小型化が容易となり、かつ該チップ状集積回路１５で
発生する熱は、直接固着された熱伝導用突起部１２を通
して該支持アーム１１へ放散され、更に放熱フィン１３
より効率良く放熱される。Therefore, in the configuration of this embodiment, the head support arm can be easily miniaturized due to the structure in which the chip-shaped integrated circuit 15 is directly mounted, and the heat generated in the chip-shaped integrated circuit 15 is directly mounted. The heat is radiated to the support arm 11 through the heat conduction protrusion 12 , and is further dissipated through the heat dissipation fins 13
Heat is dissipated more efficiently.
なお、該放熱フィン１３の配設により前記支持アーム１
１の捩じり方向への応力等に対する剛性が高められるな
どの副次的な効果も有している。Note that, due to the arrangement of the radiation fins 13, the support arm 1
It also has secondary effects such as increased rigidity against stress in the torsional direction of the structure 1.
第２図は本発明に係るヘッド支持アームの第２実施例を
示す要部断面図であり、第１図と同等部分には同一符号
を付している。FIG. 2 is a cross-sectional view of a main part showing a second embodiment of the head support arm according to the present invention, and parts equivalent to those in FIG. 1 are given the same reference numerals.
この図で示す実施例が第１図の実施例と異なる点は、記
録再生用ヘッドをジンバルアームを介して支持するへ１
等からなる軽量な支持アーム２１の集積回路を実装する
一方の面とは反対側の他方の面に放熱フィン１３のみが
一体に設けられており、該集積回路を実装する一方の面
に貼設された前記フレキシブル印刷配線板１４のベース
樹脂フィルム１４ａに穿設された貫通穴１４ｄに熱伝導
の良好な導電性銀銅系ペーストなどからなる熱伝導材２
２を充填すると共に、その充填した熱伝導材２２上にチ
ップ状集積回路１５を直接固着して実装したことである
。The embodiment shown in this figure differs from the embodiment shown in FIG. 1 in that the recording/reproducing head is supported via a gimbal arm.
Only the radiation fins 13 are integrally provided on the other side of the lightweight support arm 21, which is opposite to the one side on which the integrated circuit is mounted, and are attached to the one side on which the integrated circuit is mounted. A thermally conductive material 2 made of a conductive silver-copper paste or the like having good thermal conductivity is inserted into the through hole 14d formed in the base resin film 14a of the flexible printed wiring board 14.
2, and the chip-shaped integrated circuit 15 is directly fixed and mounted on the filled thermally conductive material 22.
この実施例の構成によっても第１図による実施例と同様
にヘッド支持アームの小型化が容易となり、かつ該チッ
プ状集積回路１５で発生する熱は、直接固着され、前記
貫通穴１４ｄに充填された熱伝導性の良い熱伝導材２２
層及び該支持アーム２１を通して放熱フィン１３より効
率良く放熱される。The configuration of this embodiment also makes it easy to downsize the head support arm as in the embodiment shown in FIG. Thermal conductive material 22 with good thermal conductivity
Heat is radiated more efficiently through the layer and the support arm 21 than the heat radiating fins 13.
なお、本実施例での支持アーム２１では、第１図で示す
第１実施例の支持アームに一体的に設けている熱伝導用
突起部がないので、その分だけ該支持アーム２１の加工
が容易で、低コストとなる。Note that the support arm 21 of this embodiment does not have the heat conduction protrusion that is integrally provided on the support arm of the first embodiment shown in FIG. Easy and low cost.
また、第３図は本発明に係るヘッド支持アームの第３実
施例を示す要部断面図であり、第２図と同等部分には同
一符号を付している。Further, FIG. 3 is a sectional view of a main part showing a third embodiment of the head support arm according to the present invention, and the same parts as in FIG. 2 are given the same reference numerals.
この図で示す実施例が第２図の実施例と異なる点は、他
方の面に放熱フィン１３が一体に設けられたＡ／等から
なる軽量な支持アーム２１の集積回路を実装する一方の
面に、熱伝導用銅（Ｃｕ）箔３１を介してベース樹脂フ
ィルム１４ａ上の配線導体１４ｂがカバー樹脂フィルム
１４ｃより露出した電極パターンとその電極パターンで
囲まれたベース樹脂フィルム１４ａ部分に実装するチッ
プ状集積回路１５が遊嵌する貫通穴３２とを設けたフレ
キシブル印刷配線板１４が接着剤等により貼設されてお
り、該チップ状集積回路１５は、前記ベース樹脂フィル
ム１４ａに穿設された貫通穴３２内に露出する熱伝導用
銅箔３１部分に熱伝導性の良い導電性根銅系ペーストな
どの接着剤により直接固着して実装したことである。The difference between the embodiment shown in this figure and the embodiment shown in FIG. 2 is that one surface on which an integrated circuit is mounted is a lightweight support arm 21 made of A/, etc., with heat dissipation fins 13 integrally provided on the other surface. The wiring conductor 14b on the base resin film 14a is exposed through the heat conductive copper (Cu) foil 31 from the cover resin film 14c, and the chip is mounted on the part of the base resin film 14a surrounded by the electrode pattern. A flexible printed wiring board 14 is attached with an adhesive or the like, and is provided with a through hole 32 into which a chip-shaped integrated circuit 15 is loosely fitted. The heat conductive copper foil 31 is directly adhered to the portion of the heat conductive copper foil 31 exposed in the hole 32 using an adhesive such as a conductive copper paste with good heat conductivity.
この実施例の構成によっても第１図、第２図による実施
例と同様にヘッド支持アームの小型化が容易となり、か
つ該チップ状集積回路１５で発生する熱は、直接固着さ
れた熱伝導用銅箔３１を介して前記支持アーム２１へ効
果的に伝導され、放熱フィン１３より効率良く放熱され
る。The configuration of this embodiment also makes it easy to downsize the head support arm as in the embodiments shown in FIGS. The heat is effectively conducted to the support arm 21 via the copper foil 31, and is radiated more efficiently than the heat radiation fins 13.
更に、第４図は本発明に係るヘッド支持アームの第４実
施例を示す要部断面図であり、第３図と同等部分には同
一符号を付している。Further, FIG. 4 is a sectional view of a main part showing a fourth embodiment of the head support arm according to the present invention, and the same parts as in FIG. 3 are given the same reference numerals.
この図で示す実施例が第３図の実施例と異なる点は支持
アーム２１上に熱伝導用銅箔３１を介して貼設されたフ
レキシブル印刷配線板１４の集積回路実装領域に配設さ
れたチップ状集積回路１５の周囲を、銅（Ｃｕ）等から
なる金属薄板枠４１でその一部が前記熱伝導用銅′ｙｔ
１３１とのみ電気的に導通するように配設され、この金
属薄板枠４１内に前記した耐湿性、耐熱性の良い、例え
ばエポキシ樹脂、或いはシリコーン樹脂などにシリカ等
の充填剤を配合した熱放散性の良好な封止樹脂材４３を
充填して封止し、更にその金属薄板枠４Ｉ上を同様な金
属薄板カバー４２で覆った実装構成としたことである。The difference between the embodiment shown in this figure and the embodiment shown in FIG. The chip-shaped integrated circuit 15 is surrounded by a metal thin plate frame 41 made of copper (Cu), a part of which is covered with the heat-conducting copper 'yt.
131, and inside this thin metal plate frame 41, a heat dissipating material having good moisture resistance and heat resistance, such as epoxy resin or silicone resin mixed with a filler such as silica, is used. The mounting structure is such that a sealing resin material 43 with good properties is filled and sealed, and the metal thin plate frame 4I is further covered with a similar metal thin plate cover 42.
この実施例の構成によっても第３図による実施例と同様
にヘッド支持アームの小型化が容易となり、かつ該チッ
プ状集積回路１５で発生する熱は、直接固着された熱伝
導用１ｉｉＪ箔３１を介して前記支持アーム２１へ効果
的に伝導され、放熱フィン１３より効率良く放熱される
。更にチップ状集積回路１５の封止樹脂材４３による封
止が金属薄板枠４１の配設により容易となると共に、該
金属薄板枠４１と金属薄板カバー４２とにより前記チッ
プ状集積回路１５に対する外部からの電磁ノイズをシー
ルドすることが可能となる等の種々の利点を有している
。Similarly to the embodiment shown in FIG. 3, the configuration of this embodiment also facilitates miniaturization of the head support arm, and the heat generated in the chip-shaped integrated circuit 15 is transferred to the heat conduction 1iiJ foil 31 directly fixed. The heat is effectively conducted to the support arm 21 through the heat dissipating fins 13, and is radiated more efficiently than the heat dissipating fins 13. Further, the chip-shaped integrated circuit 15 can be easily sealed with the sealing resin material 43 by the thin metal plate frame 41, and the chip-shaped integrated circuit 15 can be easily sealed from the outside by the metal thin plate frame 41 and the metal thin plate cover 42. It has various advantages such as being able to shield electromagnetic noise.
以上の説明から明らかなように、本発明に係るヘッド支
持アームによれば、フレキシブル印刷配線板が貼設され
た放熱フィン付の支持アーム上に熱伝導材を介してチッ
プ状集積回路を封止樹脂材により封止した状態に実装し
た構成とすることにより、該ヘッド支持アームの小型化
、軽量化が可能となる。またチップ状集積回路で発生す
る熱は、直接固着された熱伝導材を介して支持アーム側
へ効果的に伝導され、放熱フィンより効率良く放熱され
る等、実用上優れた利点を有し、小型化、高速化する磁
気ディスク装置、光磁気ディスク装置、或いは光デイス
ク装置等のヘッド支持アームに適用して極めて有利であ
る。As is clear from the above description, according to the head support arm according to the present invention, a chip-shaped integrated circuit is sealed on the support arm with heat dissipation fins to which a flexible printed wiring board is attached via a thermally conductive material. By configuring the head support arm to be mounted in a sealed state using a resin material, the head support arm can be made smaller and lighter. In addition, the heat generated in the chip-shaped integrated circuit is effectively conducted to the support arm side through the directly fixed thermal conductive material, and the heat is radiated more efficiently than the heat dissipation fins, which has excellent practical advantages. It is extremely advantageous to apply it to head support arms of magnetic disk devices, magneto-optical disk devices, optical disk devices, etc., which are becoming smaller and faster.
第１図は本発明に係るヘッド支持アームの第１実施例を
示す要部断面図、
第２図は本発明に係るヘッド支持アームの第２実施例を
示す要部断面図、
第３図は本発明に係るヘッド支持アームの第３実施例を
示す要部断面図、
第４図は本発明に係るヘッド支持アームの第４実施例を
示す要部断面図、
第５図は従来の磁気ヘッド支持アームを説明するための
斜視図、
第６図は従来の支持アームへの集積回路の実装構造を示
す要部断面図である。
第１図〜第４図において、
１１、２１は支持アーム、１２は熱伝導用突起部、１３
は放熱フィン、１４はフレキシブル印刷配線板、１４ａ
はベース樹脂フィルム、１４ｂは配線導体、１４ｃはカ
バー樹脂フィルム、１４ｄ、３２は貫通穴、１５はチッ
プ状集積回路、１６はワイヤリード、１７．４３は封止
樹脂材、２２は熱伝導材、３１は熱伝導用銅箔、４１は
金属薄板枠、４２は金属薄板カバーをそれぞれ示す。
木かｌｉｓ’ｘＪｔ朴７−１．ａ剃宅絶例会ぶＴ拳野訝
面■ｆＪＡ１ 図
第
図
第
図FIG. 1 is a cross-sectional view of a main part showing a first embodiment of a head support arm according to the present invention, FIG. 2 is a cross-sectional view of a main part showing a second embodiment of a head support arm according to the present invention, and FIG. FIG. 4 is a cross-sectional view of main parts showing a third embodiment of a head support arm according to the present invention. FIG. 4 is a cross-sectional view of main parts showing a fourth embodiment of a head support arm according to the present invention. FIG. 5 is a conventional magnetic head. FIG. 6 is a perspective view for explaining the support arm. FIG. 6 is a cross-sectional view of a main part showing a conventional mounting structure of an integrated circuit on the support arm. In FIGS. 1 to 4, 11 and 21 are support arms, 12 is a heat conduction protrusion, and 13 is a support arm.
14 is a heat dissipation fin, 14 is a flexible printed wiring board, 14a
14b is a base resin film, 14b is a wiring conductor, 14c is a cover resin film, 14d, 32 are through holes, 15 is a chip-shaped integrated circuit, 16 is a wire lead, 17.43 is a sealing resin material, 22 is a heat conductive material, 31 is a copper foil for thermal conduction, 41 is a metal thin plate frame, and 42 is a metal thin plate cover. Wood or lis'x Jt Park 7-1. a Shaved home regular meeting T Kenno question face ■fJA1 Figure Figure Figure
Claims (1)
に支持し、かつ該ヘッドに対する信号の制御及び増幅用
の集積回路（１５）が実装されたフレキシブル印刷配線
板（１４）を一主面に備えたヘッド支持アームにおいて
、 上記フレキシブル印刷配線板（１４）は集積回路（１５
）の実装領域に貫通穴（１４ｄ）を有し、チップ状の集
積回路（１５）は熱伝導手段（１２）と共に該貫通穴（
１４ｄ）を通して上記支持アーム（１１）の一主面上に
貼設した状態で封止材（１７）により封止して実装され
、該支持アーム（１１）は集積回路実装面と対応する背
面側に放熱手段（１３）を設けたことを特徴とするヘッ
ド支持アーム。[Claims] A flexible printed wiring board (14) that supports a gimbal arm holding a recording/reproducing head at one end and is mounted with an integrated circuit (15) for controlling and amplifying signals for the head. In the head support arm provided on one main surface, the flexible printed wiring board (14) is connected to the integrated circuit (15).
) has a through hole (14d) in the mounting area of the through hole (
14d) on one main surface of the support arm (11) and is sealed and mounted with a sealant (17), and the support arm (11) is mounted on the back side corresponding to the integrated circuit mounting surface. A head support arm characterized in that a heat dissipation means (13) is provided at the head support arm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32696289A JP2762639B2 (en) | 1989-12-15 | 1989-12-15 | Head support arm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32696289A JP2762639B2 (en) | 1989-12-15 | 1989-12-15 | Head support arm |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03187295A true JPH03187295A (en) | 1991-08-15 |
| JP2762639B2 JP2762639B2 (en) | 1998-06-04 |
Family
ID=18193734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32696289A Expired - Fee Related JP2762639B2 (en) | 1989-12-15 | 1989-12-15 | Head support arm |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2762639B2 (en) |
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5272599A (en) * | 1993-03-19 | 1993-12-21 | Compaq Computer Corporation | Microprocessor heat dissipation apparatus for a printed circuit board |
| US5367193A (en) * | 1993-06-17 | 1994-11-22 | Sun Microsystems, Inc. | Low cost, thermally efficient, and surface mountable semiconductor package for a high applied power VLSI die |
| JPH07302419A (en) * | 1994-05-02 | 1995-11-14 | Nec Corp | Magnetic head positioning mechanism and magnetic disk device having the same |
| EP0911812A1 (en) * | 1997-10-20 | 1999-04-28 | Fujitsu Limited | Head slider supporting device, disk device and suspension |
| WO1999023644A1 (en) * | 1997-10-31 | 1999-05-14 | Questek Innovations, Inc. | Chip on actuator arm of a disk drive |
| US6144530A (en) * | 1997-12-24 | 2000-11-07 | Tdk Corporation | Magnetic head apparatus with head IC chip |
| US6266213B1 (en) | 1998-03-20 | 2001-07-24 | Fujitsu Limited | Suspension having an IC chip and a head slider on opposite surfaces |
| US6437944B2 (en) | 1997-10-20 | 2002-08-20 | Fujitsu Limited | Head slider supporting device, disk device and suspension |
| WO2002065469A1 (en) * | 2001-02-09 | 2002-08-22 | Tdk Corporation | Suspension and head gimbal assembly |
| WO2002065470A1 (en) * | 2001-02-09 | 2002-08-22 | Tdk Corporation | Suspension, head gimbal assembly, and method of manufacturing head gimbal assembly |
| US6483669B1 (en) * | 1999-09-17 | 2002-11-19 | Hutchinson Technology Incorporated | Integrated lead suspension with IC chip and method of manufacture |
| US6498702B1 (en) * | 1999-02-22 | 2002-12-24 | Hitachi, Ltd. | Magnetic head supporting apparatus having thermally insulated read/write IC mounted on arm portions thereof |
| US6665148B2 (en) | 2000-08-09 | 2003-12-16 | Tdk Corporation | Magnetic head apparatus with IC chip mounted on suspension for increased heat diffusion and magnetic disk apparatus having magnetic head apparatus |
| US6762896B2 (en) * | 2001-02-28 | 2004-07-13 | Hitachi, Ltd. | Storage media reading writing system |
| US6909582B2 (en) | 2002-01-31 | 2005-06-21 | Kabushiki Kaisha Toshiba | Head suspension assembly and disk drive provided with the same |
| US6970326B2 (en) * | 2001-07-02 | 2005-11-29 | Alps Electric Co., Ltd. | Magnetic head provided with resin-molded IC bare-chip between height-restriction plate and suspension and method for manufacturing magnetic head |
| CN1296896C (en) * | 1998-11-11 | 2007-01-24 | Tdk株式会社 | Magnetic head device |
| JP2007036050A (en) * | 2005-07-28 | 2007-02-08 | Shin Kobe Electric Mach Co Ltd | Process for producing multilayer circuit board |
| JP2007036172A (en) * | 2005-11-28 | 2007-02-08 | Shin Kobe Electric Mach Co Ltd | Multilayer circuit board |
| JP2008042162A (en) * | 2006-08-04 | 2008-02-21 | Yiguang Electronic Ind Co Ltd | Method of manufacturing circuit board having heat radiating function |
| CN100376127C (en) * | 2004-05-14 | 2008-03-19 | 欧姆龙株式会社 | Heating element radiating structure |
| JP2010506419A (en) * | 2006-10-11 | 2010-02-25 | 日東電工株式会社 | Heat transfer device for wire bond preamplifier of hard drive |
| US7969826B2 (en) | 2006-11-16 | 2011-06-28 | Hitachi, Ltd. | Thermally assisted magnetic recording head having movable mirror for optical switching |
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|---|---|---|---|---|
| US6885522B1 (en) | 1999-05-28 | 2005-04-26 | Fujitsu Limited | Head assembly having integrated circuit chip covered by layer which prevents foreign particle generation |
| WO2003054524A1 (en) | 2001-12-11 | 2003-07-03 | Sau Lan Tang Staats | Microfluidic devices and methods for two-dimensional separations |
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-
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Cited By (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5272599A (en) * | 1993-03-19 | 1993-12-21 | Compaq Computer Corporation | Microprocessor heat dissipation apparatus for a printed circuit board |
| US5367193A (en) * | 1993-06-17 | 1994-11-22 | Sun Microsystems, Inc. | Low cost, thermally efficient, and surface mountable semiconductor package for a high applied power VLSI die |
| JPH07302419A (en) * | 1994-05-02 | 1995-11-14 | Nec Corp | Magnetic head positioning mechanism and magnetic disk device having the same |
| US6583962B2 (en) | 1997-10-20 | 2003-06-24 | Fujitsu Limited | Head slider supporting device, disk device and suspension having thermal protection for head IC chip |
| EP0911812A1 (en) * | 1997-10-20 | 1999-04-28 | Fujitsu Limited | Head slider supporting device, disk device and suspension |
| US6437944B2 (en) | 1997-10-20 | 2002-08-20 | Fujitsu Limited | Head slider supporting device, disk device and suspension |
| WO1999023644A1 (en) * | 1997-10-31 | 1999-05-14 | Questek Innovations, Inc. | Chip on actuator arm of a disk drive |
| US5956211A (en) * | 1997-10-31 | 1999-09-21 | Questek Innovations, Inc. | Chip attached to actuator arm having heat conducting fibers |
| US6144530A (en) * | 1997-12-24 | 2000-11-07 | Tdk Corporation | Magnetic head apparatus with head IC chip |
| SG97772A1 (en) * | 1997-12-24 | 2003-08-20 | Tdk Corp | Magnetic head apparatus with head ic chip |
| US6266213B1 (en) | 1998-03-20 | 2001-07-24 | Fujitsu Limited | Suspension having an IC chip and a head slider on opposite surfaces |
| CN1296896C (en) * | 1998-11-11 | 2007-01-24 | Tdk株式会社 | Magnetic head device |
| US6498702B1 (en) * | 1999-02-22 | 2002-12-24 | Hitachi, Ltd. | Magnetic head supporting apparatus having thermally insulated read/write IC mounted on arm portions thereof |
| US6944936B2 (en) | 1999-09-17 | 2005-09-20 | Hutchinson Technology Incorporated | Method for manufacturing an integrated lead suspension |
| US6483669B1 (en) * | 1999-09-17 | 2002-11-19 | Hutchinson Technology Incorporated | Integrated lead suspension with IC chip and method of manufacture |
| US6665148B2 (en) | 2000-08-09 | 2003-12-16 | Tdk Corporation | Magnetic head apparatus with IC chip mounted on suspension for increased heat diffusion and magnetic disk apparatus having magnetic head apparatus |
| WO2002065470A1 (en) * | 2001-02-09 | 2002-08-22 | Tdk Corporation | Suspension, head gimbal assembly, and method of manufacturing head gimbal assembly |
| WO2002065469A1 (en) * | 2001-02-09 | 2002-08-22 | Tdk Corporation | Suspension and head gimbal assembly |
| US7239467B2 (en) | 2001-02-28 | 2007-07-03 | Hitachi, Ltd. | Storage media reading writing system |
| US6762896B2 (en) * | 2001-02-28 | 2004-07-13 | Hitachi, Ltd. | Storage media reading writing system |
| US6970326B2 (en) * | 2001-07-02 | 2005-11-29 | Alps Electric Co., Ltd. | Magnetic head provided with resin-molded IC bare-chip between height-restriction plate and suspension and method for manufacturing magnetic head |
| US6909582B2 (en) | 2002-01-31 | 2005-06-21 | Kabushiki Kaisha Toshiba | Head suspension assembly and disk drive provided with the same |
| CN100376127C (en) * | 2004-05-14 | 2008-03-19 | 欧姆龙株式会社 | Heating element radiating structure |
| JP2007036050A (en) * | 2005-07-28 | 2007-02-08 | Shin Kobe Electric Mach Co Ltd | Process for producing multilayer circuit board |
| JP2007036172A (en) * | 2005-11-28 | 2007-02-08 | Shin Kobe Electric Mach Co Ltd | Multilayer circuit board |
| JP2008042162A (en) * | 2006-08-04 | 2008-02-21 | Yiguang Electronic Ind Co Ltd | Method of manufacturing circuit board having heat radiating function |
| JP2010506419A (en) * | 2006-10-11 | 2010-02-25 | 日東電工株式会社 | Heat transfer device for wire bond preamplifier of hard drive |
| US7969826B2 (en) | 2006-11-16 | 2011-06-28 | Hitachi, Ltd. | Thermally assisted magnetic recording head having movable mirror for optical switching |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2762639B2 (en) | 1998-06-04 |
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