JPH0311786A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH0311786A JPH0311786A JP14508889A JP14508889A JPH0311786A JP H0311786 A JPH0311786 A JP H0311786A JP 14508889 A JP14508889 A JP 14508889A JP 14508889 A JP14508889 A JP 14508889A JP H0311786 A JPH0311786 A JP H0311786A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- board
- groove
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 2
- 230000003287 optical effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 101100136092 Drosophila melanogaster peng gene Proteins 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
Landscapes
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は、プリント配線板同士を接続するために改良
されたプリント配線板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed wiring board improved for connecting printed wiring boards to each other.
［従来の技術］
第７図は、従来のプリント配線板同士をコネクタで接続
した場合の構造を示す図であ６図において、（１）はプ
リント配線板、（２）はコネクタ。[Prior Art] Fig. 7 is a diagram showing a structure when conventional printed wiring boards are connected to each other by a connector. In Fig. 6, (1) is a printed wiring board, and (2) is a connector.
（３）はケーブルである。第７図（ａ）は、各プリント
配線板（１）にコネクタ（２）をそれぞれ設け、各コネ
クタ（２）をケーブル（３）で接続してプリント配線板
同士を接続した場合を示す。第７図（ｂ）は。(3) is a cable. FIG. 7(a) shows a case where each printed wiring board (1) is provided with a connector (2), and each connector (2) is connected with a cable (3) to connect the printed wiring boards. FIG. 7(b) is.
各プリント配線板（１）にコネクタ（２）をそれぞれ設
け、コネクタ（２）同士を直接接続してプリント配線板
同士を接続した場合を示す。A case is shown in which each printed wiring board (1) is provided with a connector (2), and the connectors (2) are directly connected to each other to connect the printed wiring boards.
第８図は、フレキシブルプリント配線板（４）を設け、
これに各プリント配線板（１）を貼り合わせて接続した
場合を示す。FIG. 8 shows a flexible printed wiring board (4) provided,
The case where each printed wiring board (1) is bonded and connected to this is shown.
［発明が解決しようとする課題］
上記のような従来のプリント配線板では、以下のような
問題点があった。[Problems to be Solved by the Invention] The conventional printed wiring board as described above has the following problems.
（１）プリント配線板同士を接続する時、コネクタを使
用する場合、（ａ）プリント配線板にコネクタを実装す
る面積が必要である。（ｂ）コネクタの体積が大きいた
め、大きな空間スペースが必要になる。（Ｃ）コネクタ
により導通を取るため−に接触抵抗の発生やプリント配
線板と材質が変わることにより反射波等が生じる。すな
わちノイズの発生源となり、電気特性が悪くなる。（ｄ
）コネクタを使用するため高価になる。（ｅ）接続する
プリント配線板をそれぞれ作らなければならない。(1) When using a connector to connect printed wiring boards, (a) an area for mounting the connector on the printed wiring board is required. (b) Since the volume of the connector is large, a large space is required. (C) Reflected waves are generated due to the generation of contact resistance due to the conduction achieved by the connector and the change in material from the printed wiring board. In other words, it becomes a source of noise and deteriorates electrical characteristics. (d
) Uses a connector, which makes it expensive. (e) Each printed wiring board to be connected must be made.
（２）プリント配線板同士にフレキシブルブリント配線
板で貼り合わせまたは半田付けによる実装を行って湾曲
部の接続を行う場合、（ａ）プリント配線板にフレキシ
ブルプリントを貼り合わせるための面積または実装する
ための面積が必要である。（ｂ）プリント配線板とフレ
キシブルプリント配線板を個々に作成を行い、その後貼
り合わせまたは実装を行うため高価になる。（ｃ）プリ
ント配線板とフレキシブルプリント配線板の接続部分は
。(2) When connecting curved parts by bonding printed wiring boards together with flexible printed wiring boards or mounting them by soldering, (a) Area for bonding flexible prints to printed wiring boards or mounting space area is required. (b) The printed wiring board and the flexible printed wiring board are manufactured individually and then bonded or mounted, which is expensive. (c) The connection part between the printed wiring board and the flexible printed wiring board.
半田付けを行うため、信号の反射波が生じるノイズ源と
なり、電気特性が悪くなる。Since it is soldered, it becomes a noise source that generates signal reflection waves, which deteriorates the electrical characteristics.
この発明は、かか、る問題点を解決するためになされた
もので、耐久性があり、電気的特性が良好で安価なプリ
ント配線板を得ることを目的とする。The present invention was made to solve these problems, and aims to provide a printed wiring board that is durable, has good electrical characteristics, and is inexpensive.
［課題を解決するための手段］
この発明に係るプリント配線板は１両面もしくは多層に
印刷配線回路を有する基板の任意の箇所に少なくとも一
つの突起状の溝を設けたものである。[Means for Solving the Problems] A printed wiring board according to the present invention has at least one protruding groove provided at an arbitrary location on a board having printed wiring circuits on one side or in multiple layers.
［作用］
この発明においては、プリント配線板の任意の箇所にに
少なくとも一つの突起状を設けることにより、耐久性お
よび電気的特性が向上する。[Function] In the present invention, durability and electrical characteristics are improved by providing at least one protrusion at any location on the printed wiring board.
「実施例］
第１図はこの発明の一実施例によるプリント配線板の構
造を示す図である０図において、（１）はプリント配線
板で、（５）はプリント配線板（１）に設けられている
導体、（６）はプリント配線板（１）の任意の箇所に設
けられた単一の溝である。Embodiment FIG. 1 is a diagram showing the structure of a printed wiring board according to an embodiment of the present invention. In FIG. 0, (1) is a printed wiring board and (5) is a printed wiring board (1). The conductor (6) is a single groove provided at an arbitrary location on the printed wiring board (1).
このように単一の１（６）を設けることにより。By providing a single 1 (6) in this way.
従来のものに比べて下記のような効果がある。It has the following effects compared to the conventional one.
（１）コネクタの実装面積、空間スペースが不要になる
。(1) The mounting area and space for the connector are no longer required.
（２）一体導体のため電気的特性が良くなる。(2) Since it is an integrated conductor, electrical characteristics are improved.
（３）コネクタ等の部品を使用しないためコストダウン
になる。(3) Costs are reduced because parts such as connectors are not used.
（４）接続するプリント配線板は同時に作ることができ
るためコストダウンができる。(4) Since the printed wiring boards to be connected can be manufactured at the same time, costs can be reduced.
第２図は、この発明の他の実施例によるプリント配線板
の構造を示す図である。図において（１）、（５）は第
１図のものと同様である。（６′）はプリント配線板（
１）の任意の箇所に設けられた複数の清である。FIG. 2 is a diagram showing the structure of a printed wiring board according to another embodiment of the invention. In the figure, (1) and (5) are the same as those in FIG. (6') is a printed wiring board (
1) is a plurality of gates provided at any location.
このように複数の溝（６′）を設けることにより、従来
のものに比べて下記のような効果がある。By providing a plurality of grooves (6') in this way, the following effects can be obtained compared to the conventional one.
（１）強度が上がる。(1) Strength increases.
（２）溝幅と深さの設定により曲げ角度を調整でき、ま
たこれにより曲げ部の破損を防ぐことができる。(2) The bending angle can be adjusted by setting the groove width and depth, and this can prevent damage to the bent portion.
次に、第１図に示す単一の溝を設けたプリント配線板の
製造方法について述べる。Next, a method for manufacturing a printed wiring board provided with a single groove as shown in FIG. 1 will be described.
最初に接続されるプリント配線板（１）を一体形成で作
る（第３図（ａ）参照）０次に、湾曲部（接続部）（８
）に溝加工（ザグリ加工、電気ノコ加工等）する（第３
図（ｂ）参照）、また、多層プリント配線板に溝を設け
る場合は、第４図に示すように多層プリント配線板のプ
レス時にスペーサ（７）を入れて一体形成後にスペーサ
を取り除いくことにより形成する。First, the printed wiring board (1) to be connected is made in one piece (see Figure 3 (a)). Next, the curved part (connection part) (8
) to grooves (spot facing, electric saw machining, etc.) (3rd
(See Figure (b)).Also, when creating grooves in a multilayer printed wiring board, as shown in Figure 4, spacers (7) are inserted during pressing of the multilayer printed wiring board, and the spacers are removed after integral formation. Form.
なお、第１図に示した単一の湧（６）を設けてプリント
配線板同士を接続した場合の構造を第５図に示す。また
、第２図に示したプリント配線板同士を接続した場合の
構造を第６図に示す。Incidentally, FIG. 5 shows a structure in which printed wiring boards are connected to each other by providing a single well (6) shown in FIG. 1. Further, FIG. 6 shows a structure when the printed wiring boards shown in FIG. 2 are connected to each other.
［発明の効果コ
この発明は以上説明したとおり１両面もしくは多層に印
刷配線回路を有する基板の任意の箇所に少なくとも一つ
の突起状の溝を設けたので１耐久性が有り、電気的特性
が良好で安価にできる効果がある。[Effects of the Invention] As explained above, this invention provides at least one protruding groove at any location on a board having printed wiring circuits on one side or in multiple layers, so it is durable and has good electrical characteristics. It has the effect of being inexpensive.
第１図はこの発明の一実施例によるプリント配線板の構
造図、第２図はこの発明の他の実施例によるプリント配
線板の構造図、第３図および第４図はこの発明のプリン
ト配線板の製造過程を示す図、第５図および第６図はこ
の発明のプリント配線板同士を接続した場合のｉ遣図、
第７図および第８図は従来のプリント配線板同士を接続
した場合の構造図である。
図において、（１）・・・プリント配線板、（５）・・
導体、（６）、（６’）・・・溝、（７）・・・スペー
サ、（８）・・・湾曲部である。
なお。
各図中同一符号は同−又は相当部分を示す。
第
図
第
２図
第３図
鵬
図
第７図
（０）FIG. 1 is a structural diagram of a printed wiring board according to one embodiment of the invention, FIG. 2 is a structural diagram of a printed wiring board according to another embodiment of the invention, and FIGS. 3 and 4 are printed wiring diagrams of the invention. Figures 5 and 6 are diagrams showing the manufacturing process of the board, and are diagrams of the printed wiring boards of this invention when they are connected to each other.
FIG. 7 and FIG. 8 are structural diagrams when conventional printed wiring boards are connected to each other. In the figure, (1)...printed wiring board, (5)...
Conductor, (6), (6')...groove, (7)...spacer, (8)...curved portion. In addition. The same reference numerals in each figure indicate the same or corresponding parts. Figure 2 Figure 3 Peng Figure 7 (0)
Claims (1)
の箇所に少なくとも一つの突起状の溝を設けたことを特
徴とするプリント配線板。1. A printed wiring board, characterized in that at least one protruding groove is provided at any location on a substrate having printed wiring circuits on both sides or in multiple layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14508889A JPH0311786A (en) | 1989-06-09 | 1989-06-09 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14508889A JPH0311786A (en) | 1989-06-09 | 1989-06-09 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0311786A true JPH0311786A (en) | 1991-01-21 |
Family
ID=15377105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14508889A Pending JPH0311786A (en) | 1989-06-09 | 1989-06-09 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0311786A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6646622B1 (en) * | 1999-08-31 | 2003-11-11 | Mannesmann Vdo Ag | Combination instrument |
| JP2009302343A (en) * | 2008-06-13 | 2009-12-24 | Denso Corp | Multilayer substrate, and method of manufacturing the same |
| WO2010064364A1 (en) * | 2008-12-01 | 2010-06-10 | 日本発條株式会社 | Printed wiring board, method for manufacturing same, and printed wiring board semi-finished-product-linked object |
| WO2011043318A1 (en) * | 2009-10-05 | 2011-04-14 | 株式会社村田製作所 | Circuit board |
| JP2011523863A (en) * | 2008-05-23 | 2011-08-25 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | A substrate layer adapted to carry a sensor, actuator or electrical component |
| JP2012209383A (en) * | 2011-03-29 | 2012-10-25 | Murata Mfg Co Ltd | Multilayer substrate and method of manufacturing the same |
| JP2014192384A (en) * | 2013-03-27 | 2014-10-06 | Murata Mfg Co Ltd | Resin multilayer substrate and manufacturing method of resin multilayer substrate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS501816A (en) * | 1973-04-16 | 1975-01-09 | ||
| JPS60193396A (en) * | 1984-03-15 | 1985-10-01 | ソニー株式会社 | Method of producing rigid flexible composite circuit board |
| JPS6285167A (en) * | 1985-10-09 | 1987-04-18 | Toyota Motor Corp | Double fuel feeding device |
-
1989
- 1989-06-09 JP JP14508889A patent/JPH0311786A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS501816A (en) * | 1973-04-16 | 1975-01-09 | ||
| JPS60193396A (en) * | 1984-03-15 | 1985-10-01 | ソニー株式会社 | Method of producing rigid flexible composite circuit board |
| JPS6285167A (en) * | 1985-10-09 | 1987-04-18 | Toyota Motor Corp | Double fuel feeding device |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6646622B1 (en) * | 1999-08-31 | 2003-11-11 | Mannesmann Vdo Ag | Combination instrument |
| JP2011523863A (en) * | 2008-05-23 | 2011-08-25 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | A substrate layer adapted to carry a sensor, actuator or electrical component |
| JP2009302343A (en) * | 2008-06-13 | 2009-12-24 | Denso Corp | Multilayer substrate, and method of manufacturing the same |
| WO2010064364A1 (en) * | 2008-12-01 | 2010-06-10 | 日本発條株式会社 | Printed wiring board, method for manufacturing same, and printed wiring board semi-finished-product-linked object |
| JP2010129984A (en) * | 2008-12-01 | 2010-06-10 | Nhk Spring Co Ltd | Printed circuit board and method of manufacturing the same, and printed circuit board semi-fabricated item chain |
| KR101224997B1 (en) * | 2008-12-01 | 2013-01-22 | 닛폰 하츠죠 가부시키가이샤 | Printed wiring board, method for manufacturing same, and printed wiring board semi-finished-product-linked object |
| WO2011043318A1 (en) * | 2009-10-05 | 2011-04-14 | 株式会社村田製作所 | Circuit board |
| CN102577647A (en) * | 2009-10-05 | 2012-07-11 | 株式会社村田制作所 | Circuit board |
| JP5360223B2 (en) * | 2009-10-05 | 2013-12-04 | 株式会社村田製作所 | Circuit board |
| US8975527B2 (en) | 2009-10-05 | 2015-03-10 | Murata Manufacturing Co., Ltd. | Circuit board |
| JP2012209383A (en) * | 2011-03-29 | 2012-10-25 | Murata Mfg Co Ltd | Multilayer substrate and method of manufacturing the same |
| JP2014192384A (en) * | 2013-03-27 | 2014-10-06 | Murata Mfg Co Ltd | Resin multilayer substrate and manufacturing method of resin multilayer substrate |
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