JPH03101863A - Device for applying viscous material - Google Patents

Abstract

PURPOSE:To control the threading of a viscous material by providing a recess having a sufficient volume to store a specified amt. of the viscous material at the tip of a nozzle, moving the nozzle with the recess filled with the viscous material close to a material to be coated and then separating the nozzle from the material. CONSTITUTION:A viscous material is discharged from the nozzle 21 in the amt. to be stored in the tip 21a, and the nozzle 21 is moved close to a material 1 to be coated and then separated. As a result, the viscous material in the nozzle tip 21a is deposited on the material 1. In this case, the recess 21b having the volume to store the specified amt. of the viscous material is provided at the tip 21a of the nozzle 21. The nozzle 21 with the recess 21b filled with the viscous material is moved close to the material 1 and then separated. Consequently, the viscous material deposited on the material 1 and that remaining at the nozzle are hardly threaded, and the viscous material is quickly cut. Accordingly, the splash of the viscous material to its surroundings is minimized, and the viscous material is not deposited on the undesired part.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for applying a viscous material to a narrow area using a nozzle.

Figure 4 (A). As shown in (B), in order to protect the surface 1a of the semiconductor chip 1 from the arriving resin at the stage after the wire bonding is completed and before the resin sealing is performed,
The circuit prevention resin 2 is applied to the chip surface 1al. :if+clothing.

Since the chip surface 1a is narrow, a coating device with a nozzle 3 is used, and the tip of the nozzle 3 is used to apply the resin 2 as shown in FIG.
As shown in A), a constant ffi {t
Let me do it. After this, the resin 2 spreads, as shown in Fig. 4 (B).
A protective film 4 is formed as shown in FIG.

In a coating device equipped with this nozzle, it is desirable that when the nozzle 3 is raised 23 times, the resin 2 is less likely to become stringy and the resin can be easily cut. This is because when stringing occurs, minute particles of resin that are generated when the strings are cut are scattered around and unnecessarily adhere to, for example, the stage 5, causing trouble.

[Conventional technology]

FIG. 5 shows a schematic configuration of a conventional viscous material coating device 10. As shown in FIG.

11 is a nozzle, 12 is a resin supply device that supplies a fixed amount of resin to the tip of the nozzle, and 13 is a nozzle drop device that moves the nozzle 11 up and down.

The tip ra1 1a of the nozzle 11 is a flat surface.

The resin application operation starts with the feeding of a predetermined amount of resin 2 by the coating 12. The resin 2 is discharged from the nozzle hole 1lb, becomes a ball shape as shown by the dot 28 in FIG.

Thereafter, the nozzle lowering device 13 operates, and the nozzle 11 is first lowered in the direction of arrow Z10,000 to approach the semiconductor chip 1, and then upwardly moved in the direction of arrow Z2 to move away from the semiconductor chip 1.

When the nozzle 11 approaches the semiconductor chip 1, as shown in FIG.
), a ball-shaped resin 2a is attached to the chip surface 1a.

When the nozzle 11 is turned over, as shown in FIGS. 6(C) and (D), the central part gradually constricts to remove the fat 2b attached to the bop surface 1a and the resin attached to the nozzle tip 11a. 2C, and a long string is generated as shown by the symbol 2d in FIG.
After rising from 1a to a high level of about 10 #1, the threaded part 2d is cut off at the end hole 18, and a predetermined amount of resin shown by reference numeral 2b remains attached to the chip surface 1a, and is applied there. be done.

[Problem to be solved by the invention] Since a long string 2d occurs, the height at which it breaks is 1.
, is also about 5 m high from the chip surface 1a.

For this reason, the minute resin particles 2e generated when the resin is cut tend to fly off to the surroundings and unnecessarily adhere to other parts (such as the stage 5 in FIG. 4).

SUMMARY OF THE INVENTION An object of the present invention is to provide a viscous material coating device that can suppress the occurrence of stringiness of a viscous material.

[Means to solve the problem]

In the present invention, the viscous material is sent out from a nozzle to a predetermined position while remaining at the tip thereof, the nozzle is brought close to the object to be coated, and then separated, thereby causing the viscous material at the tip of the nozzle to adhere to the object to be coated. In a viscous material coating device, the nozzle marked + has a shape having a recessed portion at its tip with a volume capable of accommodating the predetermined amount, and the nozzle applies the viscous material to the object to be applied with the recessed portion filled with the viscous material. A viscous material application device characterized in that it is configured to be brought close to an object.

[Effect]

The recess increases the force with which the recess tends to cause the viscous material to remain when the nozzle is separated from the object to be coated.

As a result, the viscous material adhering to the object to be coated and the viscous material remaining at the tip of the nozzle can be quickly cut off with almost no stringing.

〔Example〕

FIG. 1 shows a viscous material coating device 20 according to an embodiment of the present invention. In the figure, parts corresponding to the constituent parts shown in FIG. 5 are marked with the same symbol.

21 is a nozzle, which is shown in FIG.
), a substantially hemispherical recess 2lb is formed at the tip 21a. The nozzle hole 21c opens at the center of the recess 21d.

The diameter D of the nozzle 21 is approximately 2M, and the diameter V of the recess 2lb is approximately 2M.
is about 7#3.

This volume V is set to a value corresponding to a star of resin supplied by the resin supply device 12 at one time.

Next, the motion of applying the resin will be explained.

When the resin 2 is supplied in a predetermined amount by the device 12, the resin 2 is ejected into the recess 21b from the nozzle hole 21G.

The resin 2 adheres to the inner wall 21 of the recess 2lb and remains within the recess 21b without protruding outside the recess 2Ib, as shown in Fig. 3 (A> with 2 m added). Due to the surface tension A, the portion facing the opening of the recess 2lb has a downwardly convex, nearly horizontal surface as indicated by reference numeral 211.

After this, the device 13 is activated and the nozzle 21 is first moved in the direction of the arrow Z.
It is lowered in the + direction to get very close to the semiconductor chip 1, and then raised in the direction of arrow Z2 and separated from the semiconductor chip 1.

When the nozzle 21 approaches the semiconductor chip 1, as shown in FIG.
), the lower surface 2m-1 of the resin 2m is attached to the chip surface 1a.

When the nozzle 21 is raised, as shown in FIG. 3(C), some of the resin 2n adheres to the chip surface 1a and tends to remain there, and the remaining resin 20 tends to remain in the recess 21b. , a constriction indicated by the symbol 2p occurs.

The force that causes the resin 20 to remain in the recess 21b is the resultant force of the surface tension A, and this force is stronger than when the nozzle tip is a flat surface.

Therefore, as the nozzle 21 moves upward, the constriction 2p
The process progresses rapidly as shown by the middle mark S 2 G in Figure 3 (D), with almost no stringing as shown in Figure 3 (E),
The resins 20 and 2n are cut sharply.

The height 2 of the nozzle tip 21 from the chip surface 1a when the resins 2o and 2n are cut is approximately half that of the conventional case, and the height opening 28 is also lowered when the resins 20 and 2n are cut.

As mentioned above, since there is almost no stringing, there is hardly a single tiny particle of resin when it is cut. Moreover, even if it does occur, its height is low, so the range in which it spreads around is narrow, limited to the area of the chip surface 1a, and does not spread beyond that.

Therefore, the resin does not adhere to other parts around the semiconductor chip 1, and the conventional inconvenience can be reliably avoided.

The shape of the recessed portion 21b is not limited to a hemispherical shape, and may be, for example, a semi-elliptical shape.

Furthermore, the present invention is applicable not only to the above semiconductor manufacturing but also to other uses.

Moreover, the material to be applied is not limited to resin, and any material having viscosity may be used.

〔Effect of the invention〕

As explained above, according to the present invention, when the nozzle is separated from the object to be coated, the viscous material stuck to the object to be coated and the viscous material remaining at the tip of the nozzle are quickly removed without causing stringiness. It can be cut. Therefore, scattering of the viscous material to the surroundings can be minimized, and adhesion of the viscous material to unnecessary parts can be eliminated.

[Brief explanation of drawings]

Fig. 1 is a diagram showing a viscous coating system according to an embodiment of the present invention, Fig. 2 is an enlarged view of the tip of the nozzle in Fig. 1, and Fig. 3 is a diagram showing the apparatus shown in Fig. 1. FIG. 4 is a diagram illustrating an application example of the apparatus of the present invention, FIG. 5 is a diagram illustrating a conventional example, and FIG. 6 is a diagram illustrating a coating operation by reinstallation of the conventional example. In the figure, 1 is a semiconductor chip, 1a is a surface, 2 is a circuit prevention resin, 12 is a resin supply device, 13 is a nozzle lifting device, 20 is a viscous material coating device, 21 is a nozzle, 21a is a tip, 21b is a recess, 2l b-1 is the inner wall, and 21C is the nozzle hole. （A） （B） （C） １ （D） （E） Tani 3 Figure 2 (A) (B) Amount of dispute/) Rapid rough example Figure 4, and a total of 1 figure Figure 5

Claims (1)

[Scope of Claims] A predetermined amount of the viscous material (2) is sent out from the nozzle so that it can remain at the tip, and the nozzle is brought close to the object to be coated (1, 1a), and then moved away, thereby displacing the viscous material at the tip of the nozzle. In the viscous material coating device that applies the viscous material by adhering it to the object to be coated, the nozzle (21) has a shape having a recess (21b) at its tip with a volume capable of accommodating the predetermined amount of the viscous material (2), and the viscous material (2) A viscous material coating device characterized in that the nozzle is arranged to be close to and separated from the object to be coated when the recess (21b) is filled.