JPH0294211A - Flat wire harness and manufacture thereof - Google Patents
Flat wire harness and manufacture thereofInfo
- Publication number
- JPH0294211A JPH0294211A JP63243904A JP24390488A JPH0294211A JP H0294211 A JPH0294211 A JP H0294211A JP 63243904 A JP63243904 A JP 63243904A JP 24390488 A JP24390488 A JP 24390488A JP H0294211 A JPH0294211 A JP H0294211A
- Authority
- JP
- Japan
- Prior art keywords
- wire harness
- substrate
- flat wire
- shape
- circuit body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000012781 shape memory material Substances 0.000 claims abstract description 10
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 11
- 238000005452 bending Methods 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 239000004033 plastic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 230000001012 protector Effects 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 2
- 230000003014 reinforcing effect Effects 0.000 abstract 2
- 229920001169 thermoplastic Polymers 0.000 abstract 1
- 239000004416 thermosoftening plastic Substances 0.000 abstract 1
- 239000002699 waste material Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 8
- 239000004020 conductor Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000007639 printing Methods 0.000 description 3
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910001000 nickel titanium Inorganic materials 0.000 description 1
- 229920000636 poly(norbornene) polymer Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Insulated Conductors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は車両等の配線に使用されるワイヤハ−ネスに関
し、特に配索部に沿った形状を有するフラットワイヤハ
ーネスに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wire harness used for wiring in vehicles, etc., and particularly to a flat wire harness having a shape that follows the wiring portion.
自動車等には多種の電送品が取付けられており、これら
の配線のために使用される大量の電線を、車両内の限ら
れたスペース内に配索す°る必要がある。そのために、
多数の電線を束にしたワイヤハーネスや、フラットワイ
ヤハーネスが使用され、配線作業の合理化が図られてい
る。2. Description of the Related Art Various types of electrical transmission products are installed in automobiles and the like, and it is necessary to route a large amount of electrical wires used for wiring them within a limited space inside the vehicle. for that,
Wire harnesses made of a large number of wires bundled together and flat wire harnesses are used to streamline wiring work.
しかし車載される電装品の多様化に伴い、これらワイヤ
ハーネス等の配索経路も複雑となり、他の部品等と干渉
し易い。そのため、第１）図に示すように、ワイヤハー
ネス６の屈曲部をプロテクタ７で覆い、クランプ８で要
所を固定している。However, with the diversification of electrical components mounted on vehicles, the wiring routes of these wire harnesses and the like have become complicated and are likely to interfere with other components. Therefore, as shown in Figure 1), the bent portion of the wire harness 6 is covered with a protector 7, and important points are fixed with clamps 8.
このようにして所定の収容空間からはみ出すのを押さえ
るばかりでなく、配索されたワイヤハーネスが車両の振
動等によって騒音を発したり、損傷を受けるのを防止し
ている。なおプロテクタ７にも不図示のクランプが設け
られており、車両のボディ等に固定出来るようになって
いる。In this way, it is not only possible to prevent the wire harness from protruding from the predetermined storage space, but also to prevent the wire harness from emitting noise or being damaged by vibrations of the vehicle. Note that the protector 7 is also provided with a clamp (not shown) so that it can be fixed to the body of a vehicle or the like.
しかし、上記の従来技術にあっては、プロテクタ７を取
付けるために、ワイヤハーネス６の重量増および肥大化
を招いており、配線のためのスペースの確保が難しくな
ってきている。However, in the above-mentioned conventional technology, attaching the protector 7 increases the weight and enlargement of the wire harness 6, making it difficult to secure space for wiring.
本発明は上記の事実に鑑みてなされたもので、プロテク
タを用いなくても所定の収容空間からはみ出すことがな
く、収容空間も少なくて済むフラットワイヤハーネスと
その製造方法を提供することを目的としている。The present invention has been made in view of the above facts, and an object of the present invention is to provide a flat wire harness that does not protrude from a predetermined storage space without using a protector and requires less storage space, and a method for manufacturing the same. There is.
上記の目的を達成するために本発明のフラットワイヤハ
ーネスば、三次元的に折曲形成された絶縁性樹脂からな
る基板とく該基板に固設された回路体とからなる構成と
している。または、絶縁性の柔軟な基板に、回路体を固
設し、該基板の所望の位置に、所望の形状で折曲した剛
体を固設した構成としている。または、所望の折曲した
形状を記憶した形状記憶素材からなる基板に、該基板と
絶縁されて固設された回路体とからなる構成としている
。In order to achieve the above object, the flat wire harness of the present invention includes a three-dimensionally bent substrate made of insulating resin, and a circuit body fixed to the substrate. Alternatively, the circuit body is fixed to an insulating flexible substrate, and a rigid body bent in a desired shape is fixed to a desired position on the substrate. Alternatively, the circuit body may be configured to include a circuit body that is insulated and fixed to a substrate made of a shape memory material that memorizes a desired bent shape.
又、本発明のフラットワイヤハーネスを製造する方法と
しては、熱可塑性樹脂からなる基板に回路体を固定する
工程と、上記樹脂基板を加熱状態で折曲する工程とから
なる製造方法としている。Further, the method for manufacturing the flat wire harness of the present invention includes a step of fixing a circuit body to a substrate made of thermoplastic resin, and a step of bending the resin substrate in a heated state.
また他の方法として絶縁性の柔軟な基板に回路体を固定
する工程と、上記基板に可塑性剛体を固定する工程と、
該可塑性剛体を折曲加工する工程とからなる製造方法と
している。さらに他の方法として、形状記憶素材からな
る基板に所望の折曲した形状を記憶させる工程と、該基
板に回路体を固設する工程とからなる製造方法としてい
る。Another method includes a step of fixing a circuit body to an insulating flexible substrate, a step of fixing a plastic rigid body to the substrate,
The manufacturing method includes a step of bending the plastic rigid body. Still another method is a manufacturing method comprising a step of memorizing a desired bent shape on a substrate made of a shape memory material, and a step of fixing a circuit body to the substrate.
以下に本発明の実施例を図面によって説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第１図は本発明の１実施例のフラットワイヤハーネスを
示す図である。この図において、ｌは基板で、絶縁性の
硬質塩化ビニール等の熱可塑性樹脂から形成されている
。２は回路体で、平行な導電部を基板１に接着等によっ
て固定されている。３はコネクタで、車両に載せられた
不図示の各種の電装品側のコネクタと接続される。８部
は本発明の要部となる折曲部で立体的に折曲されている
。FIG. 1 is a diagram showing a flat wire harness according to one embodiment of the present invention. In this figure, 1 is a substrate, which is made of insulating hard thermoplastic resin such as vinyl chloride. Reference numeral 2 denotes a circuit body, in which parallel conductive parts are fixed to the substrate 1 by adhesive or the like. A connector 3 is connected to connectors on various electrical components (not shown) mounted on the vehicle. Part 8 is three-dimensionally bent at the bending part which is the essential part of the present invention.
この折曲形状は、フラットワイヤハーネスの配索される
部位の形状に沿うように決められる。第１図（ｂ）は（
ａｌのＡ−Ａ線での断面図である。回路体２は、単線、
平角導体、撚り線等種々の材料によって形成され、基板
１に接着等によって固設される。This bending shape is determined so as to follow the shape of the portion of the flat wire harness to be wired. Figure 1(b) is (
FIG. 3 is a sectional view taken along line A-A of al. The circuit body 2 is a single wire,
It is formed of various materials such as rectangular conductors and stranded wires, and is fixed to the substrate 1 by adhesive or the like.
または、エツチング処理、印刷などによって形成される
印刷回路とすることもできる。Alternatively, it may be a printed circuit formed by etching, printing, or the like.
第２図ｆａｔ 、 （ｂ）は上記８部の形成方法を示す
図である。（ａ）のように平板状の熱可塑性樹脂の絶縁
基板１上に上述した方法で回路体２を固設する。こうし
て形成されたフラットワイヤハーネスを熱プレス加工、
あるいは加熱状態にして折り曲げ、立体的な加工を施し
、同図（ｂｌに示すような立体的な屈曲部を有するフラ
ットワイヤハーネスに形成する。FIG. 2(b) is a diagram showing a method of forming the above-mentioned 8 parts. As shown in (a), the circuit body 2 is fixedly mounted on the flat insulating substrate 1 made of thermoplastic resin by the method described above. The flat wire harness thus formed is heat pressed,
Alternatively, it is heated, bent, and subjected to three-dimensional processing to form a flat wire harness having three-dimensional bent parts as shown in the same figure (bl).
加熱によって柔軟になっていた熱可塑性樹脂は、温度の
低下とともに硬化し、室温状態では完全に固形化し、フ
ラットワイヤハーネスを所望の形状に保持することがで
きる。The thermoplastic resin, which has become flexible due to heating, hardens as the temperature decreases and becomes completely solid at room temperature, allowing the flat wire harness to be held in the desired shape.
第３図から第６図は基板が柔らかい場合の実施例を示し
た図である。第３図において、１′は基板で二枚の基板
１’、１’で回路体２をサンドイッチ状に挾んでいる。FIGS. 3 to 6 are diagrams showing embodiments in which the substrate is soft. In FIG. 3, 1' is a board, and the circuit body 2 is sandwiched between two boards 1', 1'.
３はコネクタで、前述した実施例と同様である。基板１
′は絶縁性の樹脂等によって柔軟なシートまたはフィル
ム状に形成されている。従って、基板１′自身では立体
的な形状を維持できない。そこで、金属等の板状で塑性
加工可能な剛体４を回路体２と一緒に挟み込み、剛体４
に曲げ加工を施す。そして剛体４の剛性によって立体形
状を保持させることとしている。回路体２としては第１
図で説明した種々のものが使用される。第４図（ａ）は
、サンドインチ形状ではなく、−枚の基板に回路体２と
剛体４を固定した場合の実施例である。第４図に示す実
施例では、回路体２として印刷配線基板を使用している
。同図（ｂ）は＋１）１のＢ−Ｂ線での断面図である。3 is a connector, which is similar to the embodiment described above. Board 1
' is formed into a flexible sheet or film of insulating resin or the like. Therefore, the substrate 1' itself cannot maintain its three-dimensional shape. Therefore, a plate-shaped rigid body 4 made of metal or the like that can be plastically worked is sandwiched together with the circuit body 2, and the rigid body 4 is
Bending process is applied to. The three-dimensional shape is maintained by the rigidity of the rigid body 4. As the circuit body 2, the first
The various ones described in the figures can be used. FIG. 4(a) shows an example in which the circuit body 2 and the rigid body 4 are fixed to two substrates instead of a sandwich-shaped circuit board. In the embodiment shown in FIG. 4, a printed wiring board is used as the circuit body 2. Figure (b) is a sectional view taken along line BB of +1)1.
このようにフラットワイヤハーネスの折り曲げ位置に剛
体を設けて、折り曲げ等の３次元加工をすることによっ
て立体的な形状を維持している。In this way, a rigid body is provided at the bending position of the flat wire harness, and the three-dimensional shape is maintained by performing three-dimensional processing such as bending.
第５図は第３図に示すフラットワイヤハーネスの製造方
法を示す図である。同図ｆａｔに示すように上下の基板
１’、１’の間に回路体２と剛体４を挟む。これらを（
ｂｌに示すようにサンドインチ状に接着等の手段によっ
て固定する。これを（Ｃ）に示すように折り曲げて３次
元加工する。第６図（ａｌは第５図（ｂ）のＣ−Ｃ線で
の断面図、第６図（ｂ）は第５図ｆｃ）のＤ−Ｄ線での
断面図である。符号５は接着剤層で、回路体２を基板１
′に固設するためのものである。なお、この剛体４は前
述の実施例に使用された硬質の熱可塑性樹脂であっても
よし＼。FIG. 5 is a diagram showing a method of manufacturing the flat wire harness shown in FIG. 3. As shown in the figure fat, a circuit body 2 and a rigid body 4 are sandwiched between upper and lower substrates 1', 1'. these(
As shown in bl, it is fixed in a sandwich shape by adhesive or other means. This is bent as shown in (C) and processed three-dimensionally. FIG. 6 (al is a sectional view taken along line CC in FIG. 5(b), and FIG. 6(b) is a sectional view taken along line DD in FIG. 5f). Reference numeral 5 is an adhesive layer that connects the circuit body 2 to the substrate 1.
’. Incidentally, this rigid body 4 may be made of the hard thermoplastic resin used in the above embodiment.
第７図から第９図は、形状を記憶する素材を用いた実施
例である。第７図において、１“は基板で、形状記憶樹
脂（例えばポリノルボルネン、商品名「ノーソレックス
」日本ゼオン■）または絶縁コーティングされた形状記
憶合金（例えばＮｉ−Ｔｉ合金等）に予め所望の立体形
状を記憶させておいたものである。通常の使用状態にお
ける温度になると、第７図（ａ）のように記憶した形状
に戻るようになっている。この形状は、前述したように
配索部位の形状に合わせて形成されている。２は回路体
、３はコネクタでこれらは前述した実施例と同様である
。第７図（ｂ）は（ａｌのＥ −Ｅ ｖＡでの断面図で
ある。FIGS. 7 to 9 show examples using a material that remembers shape. In FIG. 7, 1" is a substrate, in which a desired three-dimensional shape is preliminarily formed on a shape memory resin (e.g. polynorbornene, trade name "Nosolex" Nippon Zeon ■) or an insulating coated shape memory alloy (e.g. Ni-Ti alloy, etc.). The shape has been memorized. When the temperature reaches the normal usage condition, the shape returns to the memorized shape as shown in FIG. 7(a). This shape is formed to match the shape of the wiring portion, as described above. 2 is a circuit body, and 3 is a connector, which are the same as in the embodiment described above. FIG. 7(b) is a cross-sectional view of (al) at E-E vA.
第８図はこのフラットワイヤハーネスの製造方法を示し
た図である。先ず（ａ）に示すように、形状記憶樹脂ま
たは絶縁コーティングされた形状記憶合金に予め常温時
の所望の折曲形状を記憶させておく。次に、このような
基板ｌ“を（ｂｌに示すように平滑な形状になる高温下
あるいは低温下におき、回路体２を固設する。この際の
温度は、通常の使用条件では起こり得ない＋６０℃以上
または、６０℃以下が好ましいが、各使用個所の条件に
合わせて適宜設定すればよい。回路体２は前記と同様に
、単線、撚線、平角導体あるいは導電ペースト等による
印刷回路等種々のものが使用できる。FIG. 8 is a diagram showing a method of manufacturing this flat wire harness. First, as shown in (a), a desired bent shape at room temperature is memorized in advance in a shape memory resin or a shape memory alloy coated with an insulating material. Next, the circuit body 2 is fixed by placing the circuit board 2 under a high temperature or a low temperature under which the substrate l'' becomes smooth as shown in (bl). The temperature is preferably +60°C or higher or 60°C or lower, but it may be set as appropriate depending on the conditions of each location.The circuit body 2 is a printed circuit made of a single wire, twisted wire, rectangular conductor, conductive paste, etc., as described above. Various types can be used.
また、回路体２の配索方法としては自動布綿機。Also, as a method of wiring the circuit body 2, an automatic cloth cotton machine is used.
エツチング処理または印刷等の従来から用いられている
方法で行う。配索後必要に応じ接着剤等によって回路体
２を基板１“に固設する。このように形成されたフラッ
トワイヤハーネスを常温に戻すと、予め記憶させておい
た折曲形状に復帰し、３次元加工されたフラットワイヤ
ハーネスが容易に形成される。なお、フラットワイヤハ
ーネスの屈曲部分のみを形状記憶素材によって形成する
構成としてもよい。This is done by a conventional method such as etching or printing. After wiring, the circuit body 2 is fixed to the board 1'' using an adhesive or the like if necessary. When the flat wire harness thus formed is returned to room temperature, it returns to the pre-memorized bent shape, A three-dimensionally processed flat wire harness can be easily formed. Note that only the bent portion of the flat wire harness may be formed of a shape memory material.
第９図の実施例は、形状記憶合金の平角材または形状記
憶樹脂に導電性メツキ或いはコーティングした平角材を
導電材２′として回路体２を形成したものである。第９
図（ａ）は立体的に屈曲させた導電材２′の図で、これ
らを高温または低温下の平滑な状態下でまとめて回路体
２とし、（ｂｌのように絶縁性のシートからなる基板１
′に固設する。In the embodiment shown in FIG. 9, the circuit body 2 is formed using a rectangular shape-memory alloy or a rectangular shape-memory resin plated or coated with conductive material as the conductive material 2'. 9th
Figure (a) shows a three-dimensionally bent conductive material 2', which is assembled into a circuit body 2 under a smooth condition at high or low temperatures (a board made of an insulating sheet as shown in bl). 1
’.
このように形成されたフラットワイヤハーネスを常温に
戻すと、（Ｃ）に示すように、３次元加工されたフラッ
トワイヤハーネスが容易に形成される。When the flat wire harness thus formed is returned to room temperature, a three-dimensionally processed flat wire harness is easily formed as shown in (C).
第１０図に示す実施例は、絶縁フィルム等の基板１′に
印刷等からなる回路２を形成したフラットワイヤハーネ
スにおいて、屈曲部のみに形状記憶素材からなる基板１
“を固設したものである。The embodiment shown in FIG. 10 is a flat wire harness in which a circuit 2 consisting of printing or the like is formed on a substrate 1' such as an insulating film.
“is a fixed installation.
以上説明したように本発明によれば、フラットワイヤハ
ーネスが薄型となり、しかも配索部位に沿った形状に容
易に形成できるため、プロテクタ無しでも狭い収納場所
に配索できる。また構造が節車なため、加工も容易であ
る。As explained above, according to the present invention, the flat wire harness is thin and can be easily formed into a shape that follows the wiring area, so that the wiring can be placed in a narrow storage space without a protector. Also, since the structure is labor-saving, it is easy to process.
第１図は本発明の１実施例の図で（ａ）は斜視図、（ｂ
ｌは（ａ）のＡ−Ａ線での断面図、第２図（ａ） 、
（ｂｌは第１図のフラットワイヤハーネスの製造工程を
示す斜視図、
第３図は屈曲部に剛体を使用した実施例の斜視図、
第４図は回路体２に印刷配線基板を使用した実施例で（
ａｌは斜視図、（ｂｌは（ａ）のＢ−Ｅ線での断面図、
第５図（ａ）〜ＴＣ）は第３図のフラットワイヤハーネ
スの製造工程を示す斜視図、
第６図（ａｌは第５図（ｂ）のＣ−Ｃ線での断面図、（
ｂｌは第５図（Ｃ）のＤ−Ｄ線での断面図、第７図は形
状記憶素材を使用したフラットワイヤハーネスの実施例
の図で（ａ）は斜視図、（ｂｌは（ａ）のＥ−Ｅ線での
断面図、第８図（ａ）〜ＩＣ）は第７図のフラットワイ
ヤハーネスの製造工程を示す斜視図、
第９図（ａｌ〜（Ｃ）は形状記憶素材で回路体を形成し
た実施例の製造方法を示す斜視図、
第１０図は形状記憶素材を屈曲部にのみ使用した実施例
の斜視図、
第１）図は従来のプロテクタを使用したワイヤハーネス
の図である。
１・・・熱可塑性樹脂の基板、１′・・・絶縁性の柔軟
な基板、１“・・・形状記憶素材からなる基板、２・・
・回路体、４・・・剛体。Figure 1 is a diagram of one embodiment of the present invention, (a) is a perspective view, (b)
l is a cross-sectional view taken along line A-A in (a), Figure 2 (a),
(bl is a perspective view showing the manufacturing process of the flat wire harness shown in Fig. 1, Fig. 3 is a perspective view of an embodiment using a rigid body for the bent part, Fig. 4 is an embodiment using a printed wiring board for the circuit body 2) In the example (
al is a perspective view, (bl is a sectional view taken along the line B-E in (a), Figures 5 (a) to TC) are perspective views showing the manufacturing process of the flat wire harness in Figure 3, Figure 6 ( al is a cross-sectional view taken along the line C-C in FIG. 5(b), (
bl is a sectional view taken along line D-D in FIG. 5(C), FIG. 7 is a diagram of an embodiment of a flat wire harness using a shape memory material, and (a) is a perspective view; 8(a) to IC) are perspective views showing the manufacturing process of the flat wire harness in FIG. Figure 10 is a perspective view of an example in which the shape memory material is used only in the bent portion, and Figure 1) is a diagram of a wire harness using a conventional protector. be. 1... Thermoplastic resin substrate, 1'... Insulating flexible substrate, 1''... Substrate made of shape memory material, 2...
・Circuit body, 4... Rigid body.
Claims (6)
基板と、該基板に固設された回路体とからなることを特
徴とするフラットワイヤハーネス。(1) A flat wire harness comprising a three-dimensionally bent substrate made of insulating resin and a circuit body fixed to the substrate.
板の所望の位置に、所望の形状で折曲した剛体を固設し
たことを特徴とするフラットワイヤハーネス。(2) A flat wire harness characterized in that a circuit body is fixed to an insulating flexible substrate, and a rigid body bent in a desired shape is fixed to a desired position of the substrate.
らなる基板に、該基板と絶縁されて固設された回路体と
からなることを特徴とするフラットワイヤハーネス。(3) A flat wire harness comprising a substrate made of a shape memory material that memorizes a desired bent shape, and a circuit body that is insulated and fixed to the substrate.
工程と、上記樹脂基板を加熱状態で折曲する工程とから
なることを特徴とするフラットワイヤハーネスの製造方
法。(4) A method for manufacturing a flat wire harness, comprising the steps of fixing a circuit body to a substrate made of thermoplastic resin, and bending the resin substrate under heating.
、上記基板に可塑性剛体を固定する工程と、該可塑性剛
体を折曲加工する工程とからなることを特徴とするフラ
ットワイヤハーネスの製造方法。(5) A flat wire harness comprising the steps of fixing a circuit body to an insulating flexible substrate, fixing a plastic rigid body to the substrate, and bending the plastic rigid body. Production method.
状を記憶させる工程と、該基板に回路体を固設する工程
とからなることを特徴とするフラットワイヤハーネスの
製造方法。(6) A method for manufacturing a flat wire harness, comprising the steps of: memorizing a desired bent shape on a substrate made of a shape memory material; and fixing a circuit body to the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63243904A JP2744957B2 (en) | 1988-09-30 | 1988-09-30 | Flat wire harness and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63243904A JP2744957B2 (en) | 1988-09-30 | 1988-09-30 | Flat wire harness and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0294211A true JPH0294211A (en) | 1990-04-05 |
| JP2744957B2 JP2744957B2 (en) | 1998-04-28 |
Family
ID=17110731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63243904A Expired - Fee Related JP2744957B2 (en) | 1988-09-30 | 1988-09-30 | Flat wire harness and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2744957B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5071294A (en) * | 1989-01-24 | 1991-12-10 | Aisan Kogyo Kabushiki Kaisha | Burnishing drill |
| US5154550A (en) * | 1990-02-20 | 1992-10-13 | Sumitomo Electric Industries, Ltd. | Throw-away tipped drill bit |
| US5888324A (en) * | 1996-05-09 | 1999-03-30 | Sumitomo Wiring Systems, Inc. | Wiring harness a method for producing a wiring harness and a wiring harness producing apparatus |
| JP2000207944A (en) * | 1999-01-12 | 2000-07-28 | Yazaki Corp | Circuit body, manufacture of molded circuit body and mounting structure of circuit body |
| US6101695A (en) * | 1996-05-09 | 2000-08-15 | Sumitomo Wiring Systems, Ltd. | Apparatus for producing a wiring harness |
| JP2008118773A (en) * | 2006-11-02 | 2008-05-22 | Yazaki Corp | Protector structure and manufacturing method for protector |
| WO2012008365A1 (en) * | 2010-07-12 | 2012-01-19 | 矢崎総業株式会社 | Wire harness, method for transporting wire harness with devices, and method for connecting devices using wire harness |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6148607U (en) * | 1984-08-31 | 1986-04-01 | ||
| JPS6391114U (en) * | 1986-12-04 | 1988-06-13 | ||
| JPS63128626U (en) * | 1987-02-16 | 1988-08-23 |
-
1988
- 1988-09-30 JP JP63243904A patent/JP2744957B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6148607U (en) * | 1984-08-31 | 1986-04-01 | ||
| JPS6391114U (en) * | 1986-12-04 | 1988-06-13 | ||
| JPS63128626U (en) * | 1987-02-16 | 1988-08-23 |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5071294A (en) * | 1989-01-24 | 1991-12-10 | Aisan Kogyo Kabushiki Kaisha | Burnishing drill |
| US5154550A (en) * | 1990-02-20 | 1992-10-13 | Sumitomo Electric Industries, Ltd. | Throw-away tipped drill bit |
| US5888324A (en) * | 1996-05-09 | 1999-03-30 | Sumitomo Wiring Systems, Inc. | Wiring harness a method for producing a wiring harness and a wiring harness producing apparatus |
| US6101695A (en) * | 1996-05-09 | 2000-08-15 | Sumitomo Wiring Systems, Ltd. | Apparatus for producing a wiring harness |
| US6230404B1 (en) | 1996-05-09 | 2001-05-15 | Sumitomo Wiring Systems, Ltd. | Method and apparatus for producing a wiring harness |
| JP2000207944A (en) * | 1999-01-12 | 2000-07-28 | Yazaki Corp | Circuit body, manufacture of molded circuit body and mounting structure of circuit body |
| JP2008118773A (en) * | 2006-11-02 | 2008-05-22 | Yazaki Corp | Protector structure and manufacturing method for protector |
| WO2012008365A1 (en) * | 2010-07-12 | 2012-01-19 | 矢崎総業株式会社 | Wire harness, method for transporting wire harness with devices, and method for connecting devices using wire harness |
| US10522266B2 (en) | 2010-07-12 | 2019-12-31 | Yazaki Corporation | Wire harness, method for transporting wire harness with device, and method for connecting devices with wire harness |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2744957B2 (en) | 1998-04-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |