JPH028886B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for cutting hard and brittle members into flakes.

Conventionally, the following two methods have been generally adopted for manufacturing thin wafers by cutting a cylindrical semiconductor member with a grindstone. In the first method, as shown in Fig. 1, a rod-shaped fixing member 2 made of ceramics or the like is adhered to a workpiece 1 made of a cylindrical semiconductor member, and the workpiece is held at one end without being rotated. In this method, the material is moved to the other end and cut into thin pieces using an internal cutting grindstone 5. In this method, the contact area between the side surface of the grindstone 5 and the cut portion 7 during cutting is large, and the contact line with the cutting edge 8 is also long, resulting in a large cutting resistance. However, there is a major drawback in that the coolant does not reach the cutting edge 8 sufficiently due to the high-speed rotation of the grinding wheel 5, etc., and as the diameter of the workpiece 1 increases, a correspondingly larger grinding wheel 5 is required, and the cutting conditions are The problem is that it gets worse and worse.
The second method solves the above-mentioned drawbacks,
As shown in FIG. 2, the grindstone 5 is rotated, and the workpiece 1 is rotated at a low speed, and the workpiece 1 is simultaneously fed in the direction of the arrow 6 to cut and cut the workpiece to obtain a flaky wafer. In this method, the diameter of the grinding wheel 5 is smaller than in the first method, the contact between the cutting edge 8 and the workpiece 1 is shortened in a point-like manner, and the cutting resistance is also much lower than in the former method. Become. However, as shown in FIG. 3, the hard and brittle workpiece 1, such as a semiconductor component, breaks just before the cutting is completed, that is, when the uncut portion 9 (see FIG. 2) has become extremely small in diameter. As a result, an uneven portion is formed in the center of the wafer. There is an inconvenience that a great deal of labor is required in the next process to remove this uneven broken part 10. As shown in FIG. 4, as a method for eliminating these inconveniences, the upper end of the workpiece 1 is rotatably held by a holder 11, and the lower end is held by suction with a holder 12 having a suction surface. Both holders 11 and 12 are rotated synchronously, and arrow 1
Cutting is performed while moving in three directions, and when the diameter of the uncut portion 9 becomes small, the rotation of the workpiece 1 is stopped, and the workpiece 1 is only fed in the direction of the arrow 13 while holding the upper and lower ends respectively. This is a method of cutting and separating. In this method, if the upper and lower holders 11 and 12 rotate in complete synchronization and feed is applied, it should theoretically be possible to obtain a product without any broken parts 9. However, perfect synchronization is difficult, and a returning force acts repeatedly on the uncut portion 9. Also, even if the centers of both rotating shafts are slightly deviated, various forces repeatedly act on the uncut portion 9, and the broken portion 10 This was an inconvenience that often occurred.

The present invention has been made in view of the above-mentioned circumstances, and it holds one end and the other end of a workpiece rotatably, rotates the workpiece only through one end, and rotates the workpiece relative to a cutting wheel. Cutting of hard and brittle materials by feeding the workpiece and supporting the workpiece at the other end so that it can rotate freely and move freely in the feeding direction, thereby preventing the occurrence of broken parts caused by mismatched rotation of the holding mechanisms at both ends. It is a device.

The details of the present invention will be explained below using examples with reference to the drawings.

5 to 7 show a cutting device for hard and brittle members according to this embodiment. The main body 21 rotatably supports a cup-shaped rotary body 22 on which a whetstone 5 is stretched, and the shaft end of the body 22 is rotated at high speed by a motor 23 via a belt and a pulley. It constitutes 24. Main body 21
A hydraulic feed device (not shown) is built in the frame 25 of the holder. A cross-feeding body 26 is slidably fitted into a guide groove provided on the upper surface of the frame body 25, and is moved left and right by the above-mentioned hydraulic feed device. A guide block 27 having a guide groove extending perpendicularly thereto is provided upright at the end of the cross-feeding body 26, and a sliding plate moves vertically up and down along this guide groove. 28 are fitted. This sliding plate 2
8 is moved up and down by the rotation of a vertical feed motor 29 attached to the upper surface of the guide block 27 via a feed screw 29a. A feed mechanism 30 is constituted by the hydraulic feed device, the lateral feed body 26, the sliding plate 28, the vertical feed motor 29, the feed screw 29a, and the like. A motor 35 is attached to the vertical sliding plate 28, and a universal joint 36 is attached to the tip of the rotary shaft of the motor 35, which protrudes downward.
A rotation mechanism 37 is configured by a universal joint 36 and the like. A drive holding mechanism 38 is further attached to the sliding plate 28, on which a holding shaft 40 is rotatably mounted, the upper end of which is connected to the above-mentioned universal joint 36, and the lower end of which is connected to the flange. 41, and one end surface of the workpiece 1 is adhered and held rotatably. The other end of the workpiece 1 is held by a driven holding mechanism 43. As shown in FIG. 6, this consists of an adsorbent 44 and a holder 4 that rotatably holds the adsorbent 44 via a ball bearing 44a.
5, and a support 47 fixed to the main body and having a guide path 46 having a groove for supporting and guiding the holder 45.
Then, one end is formed into a suction groove 50 on the suction surface 48 of the suction body 44.
It consists of a decompression path 50 which is open as a and whose other end is connected to a vacuum source via a holder 45. The suction surface 48 attracts the lower end surface 1c of the workpiece 1 due to the reduced pressure in the depressurization path 50, and moves in the groove of the guide path 46 as the workpiece 1 moves. The holding body 45 is a ball bearing 44a into which an adsorption body 44 is inserted.
It consists of an annular elastic member, such as an elastic joint 45a made of rubber, which is fitted over this, and a holder main body 45b which holds these members in a recessed portion on its upper surface. Note that the support body 47 is fixed to the main body 21 by a support tube 49 extending below the guide path 46.
Further, in order to provide effective suction, an elastic member such as rubber having suction grooves is bonded to the suction surface 48 that suctions the workpiece 1.

Next, regarding the operation, the end surface of one end portion 1a of the workpiece 1 is bonded to the flange portion 41 of the drive holding mechanism 38. Next, the motor 29 is rotated to lower the workpiece 1, and the workpiece 1 is brought into contact with the suction surface 48, and the end surface of the other end portion 1b is suctioned and held by vacuum. Next, the grindstone 5 is rotated, and the workpiece 1 is rotated at low speed by the motor 35 via the drive holding mechanism 38. Next, the workpiece 1 is moved to the right in FIG. 5 by the transverse feeder 26. As a result, cutting is started and the cut gradually becomes deeper, and the uncut portion 9 becomes smaller in diameter. When the diameter becomes several mm, the rotation of the workpiece 1 is stopped. Next, the cutting is completed using only horizontal feed. From the start to the completion of this cutting, the workpiece 1 is held by the drive holding mechanism 3.
Rotation and feed are given only from 8. During this time, the suction surface 48 is moved to the lower end surface 1 of the workpiece 1 by vacuum.
c, the holder 45 is attached to the workpiece 1.
is rotated with this by the rotation of . When the workpiece 1 moves due to lateral feeding, the workpiece 1 moves accordingly. Therefore, there is no difference in the angular velocity between the upper part and the lower part with respect to the notch. The pressing force generated in the direction perpendicular to the feeding direction due to the friction generated by the rotation of the grindstone 5 is supported by the grooves of the guide path 46, and does not adversely affect the workpiece 1. Furthermore, since an elastic joint 45a is provided on the outer periphery of the ball bearing 44a, even if there is eccentricity between the workpiece 1 and the suction body 44, there will be a gap between the suction body 44 and the holding body main body 45a. Elastic joint 4
5a, the driven holding mechanism 43 rotates smoothly.

Next, another embodiment shown in FIG. 8 will be described. This embodiment differs from the above embodiments only in the insertion position of the elastic joint 45a, but otherwise has the same configuration, so only the main parts will be described. The holder 45 of this embodiment is an adsorbent 44
A ball bearing 44a in which a ball bearing 44a is inserted, a holder main body 45b that holds these in a recessed part on the upper surface, an elastic joint 45a made of an elastic member such as rubber bonded to the bottom surface of this, and a sliding joint bonded to this child 45c. The elastic joint 45 is used for eccentric rotation and oscillating rotation of the workpiece 1.
a absorbs it and supports it for smooth rotation. The force is supported by the groove of the guide path 46 and does not affect the workpiece 1.

As described in detail above, in the present invention, both ends of the workpiece are held from the start of cutting, and rotation and feed are applied from only one end, so that the angular velocity does not differ between the top and bottom of the notch, and as a result, there is no error. The desired twisting force is no longer applied to the workpiece. In addition, since it is held until the end, it can be cut without causing any breakage. Further, in the present invention, an elastic joint is inserted between the adsorbent that adsorbs the other end of the workpiece and the holder that holds the adsorbent, so that the elastic joint is inserted between the workpiece and the adsorbent. Even if eccentric rotation or oscillating rotation occurs,
It is absorbed by the elastic joint, promotes smooth follow-up movement of the driven holding mechanism toward the workpiece, and greatly contributes to improving cutting quality.

[Brief explanation of drawings]

Figures 1 and 2 are front views of main parts explaining a conventional cutting method, Figure 3 is a diagram explaining a broken part of a workpiece, and Figure 4 is a front view of main parts explaining another conventional cutting method. , FIG. 5 is a cross-sectional front view of essential parts showing one embodiment of the device of the present invention, FIG. 6 is a cross-sectional view of the same essential parts, FIG. 7 is a side view of the same, and FIG. 8 is another embodiment of the present invention. It is a partially sectional front view showing the main part of an example. DESCRIPTION OF SYMBOLS 1... Workpiece, 1a... One end, 1b... Other end, 5... Cutting wheel, 9... Uncut part, 9a...
... Rotation axis, 24 ... Grindstone device, 30 ... Feeding mechanism, 37 ... Rotation mechanism, 38 ... Drive holding mechanism,
43... Driven holding mechanism, 44... Adsorption body, 45...
... Holding body, 45a... Elastic joint, 47... Support body, 50... Decompression path.

Claims (1)

[Claims] 1. A drive holding mechanism that rotatably holds one end of a columnar workpiece, a rotation mechanism that rotates the workpiece via the drive holding mechanism, and a rotation mechanism that rotates the drive holding mechanism in the direction of the rotational axis of the rotation. a feeding mechanism that moves in a direction substantially perpendicular to the direction of movement; a grindstone device that has a cutting grindstone that rotates in a plane parallel to the direction of movement; An adsorbent having a suction surface corresponding to the end surface of the end portion, a holder that rotatably supports the adsorbent, and a support that supports the holder and has a guide path that guides the holder movably in the feeding direction. and a driven holding mechanism consisting of a depressurizing path with one end opening on the suction surface and the other end communicating with a vacuum source via the holding body, and an elastic joint between the holding body and the suction body. A cutting device for a hard and brittle member, characterized in that a cutting device is inserted therein.