JPH0276111A - Thin film magnetic head - Google Patents

Abstract

PURPOSE:To improve yield and to decrease uneven wear by sticking the rear parts of both the front cores and back core of a 1st substrate on which the two front cores respectively consisting of thin magnetic films are formed and a 2nd substrate on which the back core is formed. CONSTITUTION:The two front cores 3, 4 consisting of the thin magnetic films joined via a gap regulating film 5 are formed on the 1st substrate 1 and the back core 8 consisting of the thin magnetic film is formed on the 2nd substrate 2. The two projecting parts 8a of the back core 8 are formed flush with an interlayer insulating film 10, by which the back core 8 and the rear parts of the front cores 3, 4 are joined. The constituting elements of the one thin-film magnetic head are divided on the two substrates and are formed separately in such a manner and, therefore, the wafer process is decreased and the yield is improved. Since the sliding surface is formed in the form of holding the front cores 3, 4 in place between the 1st and 2nd substrates 1 and 2 on top and bottom thereof, the unequal wear is decreased if the materials having nearly the same wear characteristics are used.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thin-film magnetic head in which a magnetic core, a conductive coil, and an interlayer insulating film are formed using thin-film forming technology.

[Conventional technology]

With the recent increase in recording density of magnetic recording media, compared to conventional ferrite bulk type magnetic heads.

Thin film magnetic heads that have low inductance and can easily realize narrow track widths are being put into practical use.

Examples of such conventional thin film magnetic heads include:

As shown in Japanese Unexamined Patent Publication No. 55-84019, a lower magnetic core, a coil embedded in an interlayer insulating film, an upper magnetic core, an S protection film, etc. are sequentially formed on a substrate by thin film formation technology and photolithography technology. It was a film.

On the other hand, a magnetic head in which a magnetic thin film is used only in the magnetic core is also known, for example, in Japanese Patent Laid-Open No. 188704/1988, and this kind of magnetic head has two cores that are half-dormant and have an operating gap. It was fabricated by winding a coil around the winding window after bonding to the winding window.

[Problem to be solved by the invention]

In the former thin film magnetic head described above, it is possible to form a highly accurate working gap and pattern. However, in conventional LT-film magnetic heads, multiple wafer processes such as thin film formation and photolithography are sequentially performed on one substrate, resulting in a long manufacturing process for one substrate. It takes a long time to complete the process, which increases manufacturing costs. Further, since many wafer processes are performed for one substrate, the yield is likely to be low due to process defects. Furthermore, in conventional thin-film magnetic heads, the sliding surface with the magnetic recording medium is composed of three different materials: a non-magnetic substrate, a magnetic core, and a protective film, which causes uneven wear on the sliding surface. The problem was that it was easy.

On the other hand, the latter, described above, which is manufactured by bonding two core halves together, which is essentially a bulk type magnetic head using a magnetic thin film, can be manufactured relatively inexpensively and in a short time. Since it is necessary to secure the affected part of the winding for winding the coil, the magnetic path length cannot be shortened and high efficiency cannot be achieved, and the operating gap is 2.
Because it is formed by pasting together two cores and a half.

There was a problem that it was difficult to obtain gap accuracy.

Therefore, the technical ays to be solved by the present invention is to solve the problems of the above-mentioned prior art, and its purpose is to create magnetic cores, conductor coils, interlayer insulating films, etc. using thin film forming technology. It is an object of the present invention to provide a thin film magnetic head that can shorten the wafer process for one substrate, improve yield, and has less risk of uneven wear.

[Means to solve the problem]

In order to achieve the above-mentioned object, the thin film magnetic head of the present invention has a first substrate formed with two front cores made of magnetic thin films bonded via a gap regulating film, and a back core made of magnetic thin films. The second substrate is bonded and integrated so that the rear portions of both the front cores and the back cores are joined to each other.

[For production]

Two front cores made of magnetic thin films bonded via a gap regulating film are formed on the first substrate, and a back core made of magnetic thin films and a back core made of magnetic thin films, for example, embedded in an interlayer insulating film are formed on the second substrate. A thin film coil is formed. In this way, the components of one thin-film magnetic head are divided and formed separately on two substrates, so the wafer process for one substrate can be significantly reduced compared to conventional thin-film magnetic heads. The yield can also be improved and the manufacturing time can be shortened.

In addition, since the operating gap is formed between two front cores made of a magnetic thin film whose shape is defined using photolithography via a gap regulating film formed using thin film technology, the track width, gap length, and gear Depth etc. can be maintained with high accuracy.

Furthermore, since the sliding surface is formed by the first and second substrates sandwiching the front core between them, the possibility of uneven wear is eliminated by making both substrates of materials with almost the same wear characteristics. This can be significantly reduced.

[Example] The present invention will be explained below with reference to illustrated embodiments.

1 to 4 relate to a first embodiment of the present invention, in which FIG. 1 is a perspective view of a thin film magnetic head, FIG. 2 is a sectional view taken along line A-A in FIG. 1, and FIGS. Each figure is an explanatory diagram showing the manufacturing process.

In FIGS. 1 and 2, 1 is a first substrate which is an upper substrate; 2 is a first substrate which is an upper substrate;
1.2 is a second substrate serving as a lower substrate, and both substrates 1.2 are made of a non-magnetic material such as ceramic.
2 are made of the same material to have the same wear characteristics. 3 and 4 are front cores made of a magnetic thin film formed on the first substrate 1; one front core 3 and 4;
are joined to each other via a gap regulating film 5 at the front thereof to form an operating gap 6. Reference numeral 7 denotes a non-magnetic thin film formed on the first substrate 1, which is flush with both the front cores 3 and 4. Second
A material has been selected that has approximately the same wear characteristics as the substrate 1.2. The front cores 3 and 4 are made of an amorphous magnetic alloy or a crystalline magnetic alloy with high magnetic permeability and high saturation magnetic flux density, and the former amorphous magnetic alloy is made of iron, nickel, and cobalt. An alloy consisting of one or more selected elements and one or more elements selected from the group of phosphorus, carbon, boron, and silicon, or aluminum containing this as the main component.

Germanium, beryllium, tin, molybdenum.

Appropriate materials can be selected from alloys containing elements such as indium, tungsten, titanium, manganese, chromium, zirconium, hafnium, and niobium, or alloys containing cobalt, zirconium, etc. as main components and the above-mentioned additive elements. In addition, as the latter crystalline alloy, iron-aluminum-silicon alloy, iron-silicon alloy, iron-nickel alloy, etc. can be selected, but in this example, CoNbZr amorphous magnetic alloy is used. It is being

Reference numeral 8 denotes a back core made of a magnetic thin film formed on the second substrate 2, and made of the same magnetic material as the flons 1 to 3.4, and its protrusion 8a (see FIG. It is magnetically and physically connected to the rear portions of the cores 3 and 4. 9 is a thin film coil disposed on the back core 8 of the second substrate 2 so as to be embedded in the interlayer insulating film 10;
Both ends of the thin film coil 9 are connected to bonding pads 11 for external connection formed on the rear part of the second substrate 2, respectively. The thin film coil 9 is made of, for example, Afi, and the interlayer insulating film 10 is made of, for example, SiOz.
etc.

Reference numeral 2a denotes a jetty portion formed along the front edge of the second substrate 2, and the upper surface of the jetty portion 2a and the upper surface of the interlayer insulating film 10 are flush with each other.

Two protrusions 8a of the back core 8 penetrate through this interlayer insulating film 10, as will be described later.

It is formed flush with the upper surface of the glabellar insulating film 10, so that the bag core 8 and the rear portions of the front cores 3 and 4 are joined together.

In addition, in FIGS. 1 and 2, 12 indicates a bonding/fixing surface between the first substrate l side and the second substrate 2 side, and the bonding/fixing surface 12 is bonded with, for example, low melting point glass. ing.

Next, a method of manufacturing the thin film magnetic head having the above structure will be explained with reference to FIGS. 3 and 4. Figures 3(a) to (f) are
FIG. 3 is an explanatory diagram showing the steps of forming the front cores 3 and 4 and the nonmagnetic thin film 7 formed on the first substrate 1 side.

First, as shown in FIG. 3(a), a first magnetic thin film 13 is deposited to a thickness of approximately 20 μm on one side of a first substrate 1 made of non-magnetic ceramic by, for example, a DC facing sputtering method.
The entire surface is coated to a certain thickness. Subsequently, after removing half of the first magnetic thin film 13 by photolithography as shown in FIG.
is deposited and formed to a desired thickness by, for example, magnetron sputtering.

Subsequently, as shown in FIG. 3(c), the second magnetic thin film 14 is
A second magnetic thin film 14 is formed on the first magnetic thin film 13 and the first substrate l to a thickness of about 20 μm by a C facing sputtering method or the like, and then a second magnetic thin film 14 is formed by photolithography as shown in FIG. Only half of the first and second magnetic thin films 13 and 14 are deposited and formed on the first substrate I with approximately the same thickness.

Thereafter, as shown in FIG. 2(e), the first and second magnetic thin films 13 and 14 are etched by photolithography.
While forming the front cores 3 and 4 described above, forming the working gap 6 with a desired gap depth,
Subsequently, as shown in FIG. 5(f), the nonmagnetic thin film 7 made of 1, for example, 5iOz is deposited and formed using magnetron sputtering or the like in a step size of about 20μ, making both front cores 3.4 nonmagnetic. Embedded in thin film 7, and finally front core 3
．． By lapping the surfaces of 4 and the nonmagnetic thin film 7 so that they are flush with each other, the wafer process on the first substrate l side is completed.

FIGS. 4(a) to 4(f) show the back core 8, thin film coil 91, and interlayer insulating film 10 formed on the second substrate 2 side.
It is explanatory drawing which shows the formation process of etc., respectively.

First, as shown in FIG. 4(a), a flat depression 2b and a groove for the back core are formed on one side of the second substrate 2 by photolithography, ion milling, or dicer processing. 2C and thereby form the above-mentioned jetty portion 2a on the front edge of the second substrate 2. In this embodiment, the depth of the recess 2b is approximately 12 μm from the upper surface of the jetty portion 2a (the upper surface of the original substrate), and the depth of the back core groove 2c is approximately 20 μm from the recess 2b.

Next, on the second substrate 2 processed as described above, as shown in FIG. After adhering, the third magnetic thin film 15 is polished to the original substrate height by a lapping method or the like, so that the surface of the third magnetic thin film 15 is flush with the surface of the jetty portion 2a, as shown in FIG. Make it one.

Subsequently, the third magnetic thin film 15 is etched by photolithography, as shown in FIGS.
A back core 8 is formed having the two protrusions 8a described above that are joined to the rear portions of the front cores 3 and 4.

Subsequently, as shown in FIG. 3(f), a SiOz film and an AΩ film are formed using magnetron sputtering and EB evaporation, respectively, and processed by photolithography to form the thin film coil 9 (the corresponding one). In the embodiment, a two-layer structure) and an interlayer insulating film 10 are formed, and at the same time, the bonding pad 11 is also formed.

Thereafter, the bonding pad 11 is exposed using an appropriate method, and the interlayer insulating film 1 is removed using an appropriate planarization technique.
By planarizing 0, the wafer process on the second substrate 2 side is completed.

The first and second substrates 1.2 on which various thin films have been deposited and formed as described above are aligned and butted together using an appropriate jig, and the first and second substrates 1.2 are bonded with low melting point glass or the like.
2. They are joined and integrated as shown in the figure. As a result, the front cores 3, 4 and the back core 8 are magnetically joined, and the three members 3. ．． 4°8 will form a closed loop.

The thin film magnetic head of this example manufactured in this way has 1
Since fewer thin film formation and processing processes (wafer processes) are required for one substrate, yields can be improved and manufacturing time can also be shortened. In addition, there is an operating gap 6 on the first substrate 1 side.
Since the front cores 3 and 4 are formed of a magnetic thin film having the following characteristics, the track width, gap length, gear depth, etc. can be maintained at high precision. Furthermore, even when forming a thin film coil 9 with 20 turns, the magnetic path length is approximately 500 μm.
The length can be reduced to about 1/4 of that of a bulk type magnetic head, and the reproduction efficiency can be greatly improved by 3 to 6 dB compared to a bulk type magnetic head. Furthermore, as shown in the first diagram, when viewed from the working gap 6, the sliding surface with the magnetic recording medium is symmetrically arranged with materials having almost the same wear characteristics on the upper and lower sides and on the left and right sides, resulting in uneven wear. Good sliding characteristics can be obtained over a long period of time.

5 to 7 relate to a second embodiment of the present invention.

Fig. 5 is a perspective view of the thin film magnetic head, and Fig. 6 is B of Fig. 5.
-B sectional view and FIG. 7 are explanatory diagrams showing the manufacturing process.

In addition, in each case, the same reference numerals are given to the same members and parts as those in the above-described embodiments, and the explanation thereof will be omitted to avoid duplication.

As is clear from FIGS. 5 and 6, the configuration on the second substrate 2 side in this embodiment is completely the same as that in the first embodiment. In the figure, reference numerals 15 and 16 denote front cores formed on the first substrate l and made of a magnetic thin film made of the same material as in the embodiment, and both front cores 15 and 16 are connected to the gap regulating film 5 at the front portion thereof. are joined to form an operating gap 17. However, in the above embodiment, the membrane end surfaces of the front cores were joined together via a gap regulating membrane to form an operating gap, whereas in this embodiment, the front membranes of the front cores 17 and 18 Plane comrades regulate gap [1! They are joined via i5 to form a working gap 17.

Next, the wafer process on the first substrate 1 side will be explained with reference to FIG.

First, as shown in FIG. 7(a), a first magnetic thin film 18 is deposited on one surface of the first substrate 1 to a thickness of about 10 μm by, for example, DC facing sputtering. Subsequently, the first magnetic thin film 18 is etched by photolithography, as shown in FIG. 3(b), to form a front core single film 15a forming a part of the front cores 15 and 16, respectively.

16a is formed. Subsequently, as shown in FIG.
The front core half [115a,
16a is buried, and then the surface is flattened if necessary. Then, the gap regulating film 5 is deposited on the region of the front core single film 15a where the working gap is to be formed by magnetron sputtering or the like.

Subsequently, as shown in FIG. 3(d), the second magnetic thin film 19 is
After coating the entire surface to a thickness of approximately 10 μm by C facing sputtering method, a second layer is deposited using photolithography.
The magnetic thin film 19 is etched to form front core single films 15b and 16b, as shown in FIG. 2(e). As a result, one of the front cores 15 with the front core single films 15a and 15b has a front core half gj 16
The other front core 16 is formed by a and 16b, and at the same time, an operating gap 17 having a desired gap depth is also formed.

Subsequently, as shown in FIG. 6(f), a nonmagnetic thin film 7 is deposited and formed in a step of about 10μ by magnetron sputtering, and both front cores 15 and 16 are embedded in the nonmagnetic thin film 7.
Finally, by wrapping the surface flush, the first
The wafer process on the substrate l side is completed.

The first substrate 1 on which various thin films were formed as described above and the second substrate 2 on which various thin films were formed using the same method as in the first embodiment described above are: As described above, they are aligned and butted together using an appropriate jig, and then joined and integrated using low melting point glass or the like as shown in FIGS. 5 and 6. As a result, the front cores 15, 16 and the back core 8 are magnetically joined, and a closed loop is formed by the three members 15, 16°8.

The thin film magnetic head of the second embodiment manufactured in this manner can also exhibit the same effects as those of the first embodiment.

Here, the above-mentioned 1. In the second embodiment, the back core 8
Although the height of the protrusion 8a of the back core 8 was explained as being flush with the joining/fixing surface 12, as in the third embodiment shown in FIG.・Fixed surface 12
It may be made higher than that and joined to the rear portions of the front cores 20 and 21. (The planar shape of the front core 20.21 of the third embodiment is approximately the same as that of the second embodiment, and only the portion where the operating gap 22 is formed is formed in two layers with a gap regulating film interposed therebetween. ) Alternatively, as in a fourth embodiment shown in FIG. 9, a front core 3' having a structure substantially the same as that of the first embodiment except that the back core 8' is shaped without a protrusion.

The front cores 3', 4' and the back core 8' may be joined by forming protrusions 3a', 4a' at the rear of the core 4'. Although the second substrates 1 and 2 are made of the same material, the first substrate 1 and the second substrate 2 may be made of different materials as long as they have approximately the same wear characteristics. good.

Although the present invention has been described above with reference to the illustrated embodiments, those skilled in the art will be able to make various modifications without departing from the spirit of the present invention.

[Effect of the invention] As described above, according to the present invention, the magnetic core, the conductor coil,
In thin-film magnetic heads, in which interlayer insulating films and other materials are created using thin-film technology, the magnetic path length is short, playback efficiency is good, and operating gap accuracy is high, the wafer process for one substrate can be shortened and the yield can be significantly improved. Therefore, this kind of thin film magnetic head has great industrial value. Further, since the first and second substrates can have substantially the same wear characteristics, there is no risk of uneven wear, and stable sliding characteristics can be guaranteed over a long period of time.

[Brief explanation of the drawing]

1 to 4 relate to a first embodiment of the present invention, in which FIG. 1 is a perspective view of a thin film magnetic head, FIG. 2 is a sectional view taken along line A-A in FIG. 1, and FIGS. The figures are explanatory diagrams showing the manufacturing process,
5 to 7 relate to a second embodiment of the present invention, in which FIG. 5 is a perspective view of a thin film magnetic head, FIG. 6 is a sectional view taken along line B-B in FIG. 5, and FIG. 7 is a manufacturing process. FIG. 8 is a cross-sectional view of a thin-film magnetic head according to a third embodiment of the present invention, and FIG. 9 is a cross-sectional view of a thin-film magnetic head according to a fourth embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...First substrate, 2...Second substrate, 2a... Jetty portion, 2b... Depression, 2
c...Back core groove, 3, 4.3', 4'1
5, 16, 20. 21...Front core, 3
aI, 4 aI...protrusion, 5...
Gap regulating film, 6, 17.22... Working gap, 7... Non-magnetic thin film, 8.8'...
・Back core, 8a... Protrusion, 9...
Thin film coil, 10... Interlayer insulating film, 11...
...Ponding pad, 12...Bonding/fixing surface. Figure 2 81g Figure 3 (a) (b) (e)
(f) 4/14 Figure 4 2
lFigure 5Figure 6Figure 7Figure 8Figure 9

Claims (1)

[Claims] 1. A first substrate on which two front cores made of a magnetic thin film are formed and a second substrate on which a back core made of a magnetic thin film is formed, which are bonded via a gap regulating film. A thin film magnetic head characterized in that the rear parts of both the front cores and the back cores are bonded and integrated so as to be joined to each other. 2. In claim 1, a thin film coil is formed in the second substrate in a form embedded in an interlayer insulating film, and a thin film coil is formed in the second substrate in a form that penetrates the interlayer insulating film and connects the rear parts of the front cores and the back core. A thin film magnetic head characterized in that: 3. The thin-film magnetic head according to claim 1, wherein the two front cores are bonded at their film end surfaces via the gap regulating film. 4. The thin-film magnetic head according to claim 1, wherein the two front cores have front film planes joined to each other via the gap regulating film. 5. The thin-film magnetic head according to claim 1, wherein the first and second substrates are made of non-magnetic materials having substantially the same wear characteristics. 6. In claim 1, a jetty portion at a front edge of the second substrate is in close contact with at least one of the front cores of the first substrate near the working gap, and the front end surface of the jetty portion is in close contact with at least one of the front cores of the first substrate. 1. A thin-film magnetic head characterized in that: forms part of a sliding surface with a magnetic recording medium.