JPH0264158A - Polyarylene sulfide resin composition - Google Patents
Polyarylene sulfide resin compositionInfo
- Publication number
- JPH0264158A JPH0264158A JP21372788A JP21372788A JPH0264158A JP H0264158 A JPH0264158 A JP H0264158A JP 21372788 A JP21372788 A JP 21372788A JP 21372788 A JP21372788 A JP 21372788A JP H0264158 A JPH0264158 A JP H0264158A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- talc
- polyarylene sulfide
- magnesium hydroxide
- pts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 title claims abstract description 17
- 229920000412 polyarylene Polymers 0.000 title claims abstract description 17
- 239000011342 resin composition Substances 0.000 title claims description 8
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims abstract description 23
- 239000000454 talc Substances 0.000 claims abstract description 23
- 229910052623 talc Inorganic materials 0.000 claims abstract description 23
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 22
- 239000000347 magnesium hydroxide Substances 0.000 claims abstract description 21
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims abstract description 21
- 239000003365 glass fiber Substances 0.000 claims abstract description 11
- 239000000835 fiber Substances 0.000 abstract description 29
- 239000000203 mixture Substances 0.000 abstract description 18
- XWUCFAJNVTZRLE-UHFFFAOYSA-N 7-thiabicyclo[2.2.1]hepta-1,3,5-triene Chemical group C1=C(S2)C=CC2=C1 XWUCFAJNVTZRLE-UHFFFAOYSA-N 0.000 abstract description 3
- 239000002245 particle Substances 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 description 4
- 239000006087 Silane Coupling Agent Substances 0.000 description 4
- 235000021355 Stearic acid Nutrition 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 4
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 4
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 description 4
- 239000008117 stearic acid Substances 0.000 description 4
- -1 stearyl alcohol Chemical compound 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000012763 reinforcing filler Substances 0.000 description 3
- 239000012779 reinforcing material Substances 0.000 description 3
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 2
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 2
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 2
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000005642 Oleic acid Substances 0.000 description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- MASNVFNHVJIXLL-UHFFFAOYSA-N ethenyl(ethoxy)silicon Chemical compound CCO[Si]C=C MASNVFNHVJIXLL-UHFFFAOYSA-N 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 2
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 2
- 239000005050 vinyl trichlorosilane Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229920013633 Fortron Polymers 0.000 description 1
- 239000004738 Fortron® Substances 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical class C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ポリアリーレンサルファイド樹脂、ガラス繊
維、タルクおよび水酸化マグネシウムを特定の組成比で
含むことを特徴とする樹脂組成物であって、良好な成形
品表面外観を得ることのできる、耐アーク性に優れたポ
リアリーレンサルファイド樹脂組成物に関するものであ
る。本発明の組成物は、電気・電子部品、自動車部品な
どの広い分野で使用される。Detailed Description of the Invention [Industrial Application Field] The present invention is a resin composition characterized by containing a polyarylene sulfide resin, glass fiber, talc and magnesium hydroxide in a specific composition ratio, The present invention relates to a polyarylene sulfide resin composition with excellent arc resistance and which can provide a good surface appearance of a molded product. The composition of the present invention is used in a wide range of fields such as electric/electronic parts and automobile parts.
ポリフェニレンサルファイド樹脂(PPS樹脂)に代表
されるポリアリーレンサルファイド樹脂は、耐熱性、耐
薬品性、剛性、寸法安定性などに儲れていることから、
近年、電気・電子部品や自動車部品など、耐熱性や寸法
精度の要求される分野で用途開発が試みられている。Polyarylene sulfide resin, represented by polyphenylene sulfide resin (PPS resin), has advantages such as heat resistance, chemical resistance, rigidity, and dimensional stability.
In recent years, attempts have been made to develop applications for them in fields that require heat resistance and dimensional accuracy, such as electrical/electronic parts and automobile parts.
しかし、該樹脂単独では耐衝撃性や機械的強度が劣るた
め、これらの性質を改良する目的で、該樹脂に各種の無
機物質を配合した樹脂組成物に関する各種の提案がなさ
れている。更に、特に電気電子部品や自動車部品に使用
される目的で、耐アーク性などを改良した組成物が提案
されている(例えば、特開昭53−5252号公報、特
開昭54−162752号公報、特開昭59−1316
53号公報など)。However, since this resin alone has poor impact resistance and mechanical strength, various proposals have been made regarding resin compositions in which various inorganic substances are blended with the resin in order to improve these properties. Furthermore, compositions with improved arc resistance etc. have been proposed especially for use in electrical and electronic parts and automobile parts (for example, Japanese Patent Laid-Open Nos. 53-5252 and 162752-1989). , Japanese Patent Publication No. 59-1316
Publication No. 53, etc.).
この目的で使用されるこれまで提案されてきたものは、
主にタルク、クレーなどの無機充填材を含む組成物であ
ったが、これらは大きな成形品を、特に射出成形機によ
り成形した場合、成形品表面に無機充填材が集まり、成
形品表面外観を悪くする傾向にあった。Those that have been proposed so far for this purpose are:
These compositions mainly contained inorganic fillers such as talc and clay, but when large molded products are molded, especially with injection molding machines, the inorganic fillers gather on the surface of the molded product, which affects the surface appearance of the molded product. It tended to get worse.
このため、耐アーク性などの特性はそのままにして、成
形品表面外観を改良することが望まれた。Therefore, it was desired to improve the surface appearance of the molded product while leaving properties such as arc resistance unchanged.
本発明の目的を達成するため、鋭意種々の組成を検討し
た結果、特定の組成でタルクと水酸化マグネシウムを配
合することにより問題を解決することができることを見
出し、本発明に到達した。In order to achieve the object of the present invention, as a result of intensive study of various compositions, it was discovered that the problem could be solved by blending talc and magnesium hydroxide in a specific composition, and the present invention was achieved.
すなわち、本発明の目的は、ポリアリーレンサルファイ
ド樹脂100重量部に対し、ガラス繊維20〜120重
量部、タルク30〜80重量部及び水酸化マグネシウム
10〜50重量部を含有させることによって達成できる
。That is, the object of the present invention can be achieved by containing 20 to 120 parts by weight of glass fiber, 30 to 80 parts by weight of talc, and 10 to 50 parts by weight of magnesium hydroxide to 100 parts by weight of polyarylene sulfide resin.
本発明に使用されるポリアリーレンサルファイド+3(
脂は、耐熱性、耐薬品性、機械的特性の点から、その繰
り返し単位の70モル%以上が、構造式r◎S−1で表
されるp−フェニレンサルファイド単位であることが好
ましい。このp〜フェニレンサルファイド単位が70モ
ル%未満では、耐熱性が低下するので好ましくない。残
りの30%未満の成分としては、m−フェニレンサルフ
ァイド結合上◎S寸、ジフェニルエーテル結合(−◎O
e)刊、ジフェニルスルフォン!、−h 合−f−◎S
O□◎→、ビフェニル結合(−◎◎→、ナフチル結合上
〇〇s寸、置換バラフェニレンサルファイド結合(−%
S 十(ここで、Rは炭素数12以下のアルキル基およ
びニトロ基からなる群れから選ばれる)、三官能基フェ
ニルサルファイド結合などがある。Polyarylene sulfide +3 used in the present invention (
From the viewpoint of heat resistance, chemical resistance, and mechanical properties, it is preferable that 70 mol% or more of the repeating units of the fat are p-phenylene sulfide units represented by the structural formula r◎S-1. If the p-phenylene sulfide unit is less than 70 mol %, heat resistance decreases, which is not preferable. The remaining components less than 30% include ◎S dimension on m-phenylene sulfide bond, diphenyl ether bond (-◎O
e) Published by Diphenylsulfone! , -h combination-f-◎S
O□◎→, biphenyl bond (-◎◎→, 〇〇s dimension above naphthyl bond, substituted paraphenylene sulfide bond (-%
S 10 (wherein R is selected from the group consisting of an alkyl group having up to 12 carbon atoms and a nitro group), a trifunctional phenyl sulfide bond, and the like.
本発明では、上記構造のポリアリーレンサルファイド樹
脂であって、ASTM D 1238で定めるメル
トフローテスターを使用して、3I5°C1荷重5 k
gの条件で測定したメルトフローレイトが、5〜100
00g/10分のもの、好ましくは、15〜5000g
/10分のものが使用される。また、特に流動性が要求
される用途の場合には、ポリアリーレンサルファイド樹
脂として、前記条件におけるメルトフローレイトが5〜
300g/10分のものと、400〜10000g/1
0分のものとを、重量比で5/95〜9515の割合で
混合することにより得られる樹脂混合物を使用すること
が好ましい。In the present invention, a polyarylene sulfide resin having the above structure is tested at 3I5°C1 under a load of 5k using a melt flow tester specified in ASTM D 1238.
Melt flow rate measured under g conditions is 5 to 100
00g/10 minutes, preferably 15-5000g
/10 minutes is used. In addition, for applications where fluidity is particularly required, polyarylene sulfide resins with a melt flow rate of 5 to 5 under the above conditions may be used.
300g/10 minutes and 400-10000g/1
It is preferable to use a resin mixture obtained by mixing 0 minutes with 0 minutes at a weight ratio of 5/95 to 9515.
ポリアリーレンサルファイド樹脂の具体例としては、ラ
イドン(PPS樹脂の商品名、フィリップスベトローリ
アム社製)、トープレン(pps樹脂の商品名、トープ
レン社製)、フォートロン(PPS樹脂の商品名、呉羽
化学社製)、サスティール(PPStA(脂の商品名、
東ソー・サスティール社製)などがある。Specific examples of polyarylene sulfide resins include Rydon (trade name of PPS resin, manufactured by Phillips Vetroleum), Toprene (trade name of pps resin, manufactured by Toprene), Fortron (trade name of PPS resin, manufactured by Kureha Chemical Co., Ltd.) ), Susteel (PPStA (product name of fat),
manufactured by Tosoh Sasteel Co., Ltd.).
本発明で用いられるガラス繊維は繊維径が5〜20al
、特に6〜15pm、繊維長が1.0〜20 mm、特
に1.5〜6mmのものが好ましい。繊維径が5 pm
より小さいものは混練がむづかしく、また繊維が折れや
すくなることがある。繊維径が20μmより大きいもの
は、組成物の機械的強度が劣るようになる。繊維長が1
.0mmより短いものは、組成物の機械的強度が低下す
るようになる。また、繊維長が20mmより長いものは
、混練が難しくなることもある。The glass fiber used in the present invention has a fiber diameter of 5 to 20 al.
In particular, those having a fiber length of 6 to 15 pm and a fiber length of 1.0 to 20 mm, especially 1.5 to 6 mm are preferable. Fiber diameter is 5 pm
Smaller fibers may be difficult to knead and the fibers may break easily. If the fiber diameter is larger than 20 μm, the mechanical strength of the composition will be poor. Fiber length is 1
.. If it is shorter than 0 mm, the mechanical strength of the composition will decrease. Further, if the fiber length is longer than 20 mm, kneading may become difficult.
このガラス繊維は、ガラス繊維100部に対して0.0
5〜3部のシラン系カンプリング剤で表面処理したもの
が好ましい。シラン系カップリング剤には、ビニルエト
キシシラン、ビニルトリクロロシラン、T−グリシドキ
シプロピルトリメトキシシラン、T−アミノプロビルト
リエI・キシシラン、T−メタクロキシプロピルトリメ
トキシンラン、N−β−(アミノエチル)−T−アミノ
プロピルトリエトキシシラン、N−β−(アミノエチル
)−丁−アミノプロピルメチルジェトキシシランなどの
アミノシラン化合物が使用できる。また、適当な量のウ
レタン系および/あるいはエポキシ系の収束剤で収束し
たものを使用することが好ましい。This glass fiber is 0.0 parts per 100 parts of glass fiber.
Preferably, the surface is treated with 5 to 3 parts of a silane camping agent. Silane coupling agents include vinyl ethoxysilane, vinyl trichlorosilane, T-glycidoxypropyltrimethoxysilane, T-aminopropyltrie I xysilane, T-methacroxypropyltrimethoxysilane, N-β-( Aminosilane compounds such as (aminoethyl)-T-aminopropyltriethoxysilane and N-β-(aminoethyl)-di-aminopropylmethyljethoxysilane can be used. Further, it is preferable to use a material bound with an appropriate amount of urethane type and/or epoxy type binder.
ガラス繊維の配合割合はポリアリーレンサルファイド樹
脂100重量部に対し20〜120重量部の範囲、好ま
しくは40〜100重量部の範囲である。20重量部よ
り少ないと機械的強度が著しく劣り、実用に耐えない。The blending ratio of glass fiber is in the range of 20 to 120 parts by weight, preferably in the range of 40 to 100 parts by weight, per 100 parts by weight of the polyarylene sulfide resin. If it is less than 20 parts by weight, the mechanical strength will be extremely poor and it will not be practical.
また、120重型部より多い場合には、脆くなりやはり
実用に耐えない。Moreover, if the number is more than 120 heavy parts, it becomes brittle and cannot be put to practical use.
本発明では、耐アーク性をタルクおよび水酸化マグネシ
ウムにより発現させているが、タルクおよび水酸化マグ
ネシウムの配合割合は、ポリアリーレンサルファイド樹
脂100重量部に対して、タルク30〜80重量部、好
ましくは40〜70重量部、また、水酸化マグネシウム
10〜50重量部、々Tましくは15〜40重量部であ
る。更に、この発明の組成物において、好ましい組成は
、タルクと水酸化マグネシウムの合計量がポリアリーレ
ンサルファイド樹脂100重量部に対して、50〜10
0重量部、特に好ましくは55〜95重量部の範囲であ
る。タルクの量が少なくなり過ぎると耐アーク性が劣る
ようになる。タルクが余り多くなり過ぎたりすると、得
られた組成物が脆くなるので適当でない。また、タルク
と水酸化マグネシウムの合計量が余りに多くなり過ぎる
と組成物が脆くなることがある。さらに、水酸化マグネ
シウムの量が余り少なくなり過ぎると、射出成形品表面
外観が著しく悪くなる。In the present invention, arc resistance is expressed by talc and magnesium hydroxide, and the blending ratio of talc and magnesium hydroxide is 30 to 80 parts by weight, preferably 30 to 80 parts by weight of talc to 100 parts by weight of polyarylene sulfide resin. 40 to 70 parts by weight, and 10 to 50 parts by weight of magnesium hydroxide, preferably 15 to 40 parts by weight. Furthermore, in the composition of the present invention, a preferable composition is such that the total amount of talc and magnesium hydroxide is 50 to 10 parts by weight based on 100 parts by weight of the polyarylene sulfide resin.
0 parts by weight, particularly preferably in the range from 55 to 95 parts by weight. If the amount of talc becomes too small, arc resistance will become poor. Too much talc is not suitable because the resulting composition becomes brittle. Furthermore, if the total amount of talc and magnesium hydroxide is too large, the composition may become brittle. Furthermore, if the amount of magnesium hydroxide is too small, the surface appearance of the injection molded product will be significantly deteriorated.
ここで使用するタルクおよび水酸化マグネシウムは平均
粒子径が0.1n〜10μlのものが好ましい。平均粒
子径が0.1 plより小さくなると、ポリアリーレン
サルファイド樹脂との混合性が悪くなったり、電気的特
性が不安定になったり、機械的強度も低下することがあ
るので好ましくない。The talc and magnesium hydroxide used here preferably have an average particle size of 0.1 nm to 10 μl. If the average particle size is smaller than 0.1 pl, it is not preferable because the miscibility with the polyarylene sulfide resin may deteriorate, the electrical properties may become unstable, and the mechanical strength may also decrease.
また、平均粒子径が10P重を越えると、成形品の表面
外観が悪くな、す、電気的特性も低下し、機械的強度も
低下するようになることがあるので好ましくない。Furthermore, if the average particle diameter exceeds 10 P weight, it is not preferable because the surface appearance of the molded product may deteriorate, the electrical properties may deteriorate, and the mechanical strength may also decrease.
ここで使用するタルクおよび水酸化マグネシウムは、ス
テアリン酸、オレイン酸などの脂肪酸およびその塩、ス
テアリルアルコールなどの表面処理剤および/またはビ
ニルエトキシシラン、ビニルトリクロロシラン、T−グ
リシドキシプロピルトリメトキシシラン、T−アミノプ
ロピルトリエトキシシラン、T−メタクロキシプロピル
トリメトキシシラン、N−β−(アミノエチル)−γア
ミノプロピルトリエトキシシラン、N−β(アミノエチ
ル)−T−アミノプロピルメチルジェトキシシランなど
のシラン系カップリング剤で表面処理したものを使用す
るのが、組成物の分散性向上において、好ましい。処理
量はタルクおよび水酸化マグネシウム100重量部に対
して0.05〜3重量部であることが好ましい。The talc and magnesium hydroxide used here are fatty acids and their salts such as stearic acid and oleic acid, surface treatment agents such as stearyl alcohol, and/or vinyl ethoxysilane, vinyl trichlorosilane, and T-glycidoxypropyltrimethoxysilane. , T-aminopropyltriethoxysilane, T-methacroxypropyltrimethoxysilane, N-β-(aminoethyl)-γaminopropyltriethoxysilane, N-β(aminoethyl)-T-aminopropylmethyljethoxysilane In order to improve the dispersibility of the composition, it is preferable to use a material whose surface has been treated with a silane coupling agent such as silane coupling agent. The amount to be treated is preferably 0.05 to 3 parts by weight per 100 parts by weight of talc and magnesium hydroxide.
タルクの具体例としては、CHC−1I P、CHC−
13P、CHC−13AO3(林化成社製) 、TAL
CKUP (富士タルク工業社製)などがある。Specific examples of talc include CHC-1I P, CHC-
13P, CHC-13AO3 (manufactured by Hayashi Kasei Co., Ltd.), TAL
Examples include CKUP (manufactured by Fuji Talc Industries).
水酸化マグネシウムの具体例としては、キスマ5A、キ
スマ5B(協和化学工業社製)、D5、D7L(宇部化
学工業社製)などがある。Specific examples of magnesium hydroxide include Kisuma 5A, Kisuma 5B (manufactured by Kyowa Chemical Industries, Ltd.), D5, and D7L (manufactured by Ube Chemical Industries, Ltd.).
本発明の樹脂組成物には本発明の目的を損なわない範囲
で、ヒンダードフェノール、ハイドロキノン、チオエー
テル類、ホスファイト類およびこれらの置換体などの酸
化防止剤や熱安定剤、レゾルシノール、サリシレート、
ベンゾトリアゾール、ベンゾフェノンなどの紫外線吸、
収剤、ステアリン酸・オレイン酸などの脂肪酸及びその
塩、ステアリルアルコールなどの離型剤、ドデシルベン
ゼンスルホン酸ナトリウム、ポリアルキレングリコール
などの帯電防止剤、結晶化促進剤、結晶化遅延剤、染料
、顔料などの添加剤を1種以上添加することができる。The resin composition of the present invention contains antioxidants and heat stabilizers such as hindered phenol, hydroquinone, thioethers, phosphites and substituted products thereof, resorcinol, salicylate,
Ultraviolet absorption of benzotriazole, benzophenone, etc.
Absorbing agents, fatty acids and their salts such as stearic acid and oleic acid, mold release agents such as stearyl alcohol, antistatic agents such as sodium dodecylbenzenesulfonate and polyalkylene glycol, crystallization promoters, crystallization retarders, dyes, One or more additives such as pigments can be added.
また、少量のポリエチレン、ポリプロピレン、エチレン
・酢酸ビニル共重合体、エチレン・プロピレン共重合体
、ポリスチレン、ポリアミド、ポリエステル、ポリアセ
タール、ポリカーボネート、ポリスルホン、ポリフェニ
レンエーテル、ボリアリレートなどの熱可塑性樹脂や、
フェノール樹脂、メラミン樹脂、シリコーン樹脂、エポ
キシ樹脂などの熱硬化性樹脂、またはスチレン・ブクジ
エン共重合体、水添ブタジェンスチレンブロック共重合
体、ポリエステル系エラストマー、ポリアミド系エラス
トマーなとの熱可塑性エラストマーなどを添加すること
もできる。In addition, small amounts of thermoplastic resins such as polyethylene, polypropylene, ethylene/vinyl acetate copolymer, ethylene/propylene copolymer, polystyrene, polyamide, polyester, polyacetal, polycarbonate, polysulfone, polyphenylene ether, and polyarylate,
Thermosetting resins such as phenol resins, melamine resins, silicone resins, and epoxy resins, and thermoplastic elastomers such as styrene-butadiene copolymers, hydrogenated butadiene styrene block copolymers, polyester elastomers, and polyamide elastomers. can also be added.
さらに、本発明の目的を損なわない範囲で種々の強化材
、充填材を添加することができる。強化材および充填材
の具体例としてば、アスベス)tilt維、炭素繊維、
シリカ繊維、シリカアルミナ繊維、アルミナ繊維、ジル
コニア繊維、窒化ホウ素繊維、窒化ケイ素繊維、ホウ素
繊維、ステンレス、アルミニウム、チタン、銅、真鍮、
マグネシウムなどの金属繊維、および、ポリアミド繊維
、フッ素樹脂繊維、ポリエステル繊維、アクリル樹脂繊
維などの有機質繊維、銅、鉄、ニッケル、亜鉛、錫、鉛
、ズテンレス鋼、アルミニウム、金、銀、マグネシウム
などの金属粉末、ヒユームドシリカ、けい酸アルミニウ
ム、ガラスピーズ、ガラスフレーク、カーボンブラック
、石英粉末、タルク、酸化チタン、酸化鉄、炭酸カルシ
ウム、ケイソウ土、雲母粉末などがある。これらのうち
繊維状物質は平均繊維径が3〜501、繊維長が50μ
m〜30mmのものが使用できる。また、°これらの強
化材および充填材は、公知のシランカップリング剤やチ
タネート系カップリング剤で表面処理したものも使用で
きる。Furthermore, various reinforcing materials and fillers can be added as long as they do not impair the purpose of the present invention. Specific examples of reinforcing materials and fillers include asbestos) tilt fibers, carbon fibers,
Silica fiber, silica alumina fiber, alumina fiber, zirconia fiber, boron nitride fiber, silicon nitride fiber, boron fiber, stainless steel, aluminum, titanium, copper, brass,
Metal fibers such as magnesium, organic fibers such as polyamide fibers, fluororesin fibers, polyester fibers, acrylic resin fibers, copper, iron, nickel, zinc, tin, lead, stainless steel, aluminum, gold, silver, magnesium, etc. Examples include metal powder, fumed silica, aluminum silicate, glass beads, glass flakes, carbon black, quartz powder, talc, titanium oxide, iron oxide, calcium carbonate, diatomaceous earth, and mica powder. Among these, fibrous substances have an average fiber diameter of 3 to 501 and a fiber length of 50μ.
30 mm to 30 mm can be used. Further, these reinforcing materials and fillers may be surface-treated with a known silane coupling agent or titanate coupling agent.
本発明の樹脂組成物の製造は、押出機などの連続式混練
機や、バンバリーミキサ−、ニーダ−などのパンチ式混
練機などの、通常の溶融混練加工装置によって行うこと
ができ、さらに、射出成形、圧縮成形、押出成形などに
よって、各種用途の成形品に加工することができる。The resin composition of the present invention can be produced using ordinary melt-kneading processing equipment such as a continuous kneader such as an extruder, or a punch-type kneader such as a Banbury mixer or a kneader. It can be processed into molded products for various uses by molding, compression molding, extrusion molding, etc.
以下に実施例によって本発明を説明する。The present invention will be explained below by way of examples.
実施例および比較例に記載する耐アーク性、曲げ強さ、
曲げ弾性率、成形品表面外観の評価は、下記の方法で行
った。Arc resistance, bending strength, and
Evaluation of the bending elastic modulus and the surface appearance of the molded product was performed by the following method.
(1)耐アーク性
ASTM D 495に準拠し、日正電機製作所製
耐アーク性試験装置を用いて試験した。(1) Arc resistance Tested in accordance with ASTM D 495 using an arc resistance tester manufactured by Nissho Denki Seisakusho.
(2)曲げ強さ、曲げ弾性率 ASTM D 790に準拠して測定した。(2) Bending strength, bending modulus Measured in accordance with ASTM D790.
(単位 Kgf/cm”)
(3)成形品表面外観
厚さ3mm、直径100mmの円板を射出成形し、表面
を目視にて観察した。(Unit: Kgf/cm") (3) Surface appearance of molded product A disk with a thickness of 3 mm and a diameter of 100 mm was injection molded, and the surface was visually observed.
実施例1〜4、比較例1〜6
トープレンT−4(トープレン社製)、タルク1(平均
粒子径5μl、アミノシラン化合物処理品)、タルク2
(平均粒子径5μ璽、ステアリン酸処理品)水酸化マグ
ネシウム(フレーク状、平均粒子径1.5μm、ステア
リン酸処理品)、ガラス繊維(繊維径13μl、繊維長
3mm、シラン処理収束品)を表1に示す割合で、31
0°Cに設定した二軸混練機に投入し、溶融混合してペ
レットを製造した。このペレットを射出成形機を用いて
、シリンダ温度300°C1金型温度150°Cの条件
で各種試験片を作成し、所定の条件下で評価を行った。Examples 1 to 4, Comparative Examples 1 to 6 Toprene T-4 (manufactured by Toprene), Talc 1 (average particle size 5 μl, aminosilane compound treated product), Talc 2
(average particle size 5 μm, stearic acid treated product) Magnesium hydroxide (flake form, average particle size 1.5 μm, stearic acid treated product), glass fiber (fiber diameter 13 μl, fiber length 3 mm, silane treated product) 31 at the rate shown in 1.
The mixture was put into a twin-screw kneader set at 0°C and melted and mixed to produce pellets. Various test pieces were prepared from the pellets using an injection molding machine under the conditions of a cylinder temperature of 300° C. and a mold temperature of 150° C., and evaluations were performed under predetermined conditions.
また、水酸化マグネシウムを用いないで(比較例1)、
水酸化マグネシウムの配合割合を多くして(比較例2)
、水酸化マグネシウムのかわりに炭酸カルシウム(平均
粒子径1.8ps)(比較例3)、水酸化アルミニウム
(合成品、平均粒子径1.5)(比較例4)、水酸化カ
ルシウム(日本石灰社製、150メツシユ全量パス)(
比較例5)を用いて、更には、ガラス繊維の配合割合を
少なくして(比較例6)、同様の条件で混合、成形、評
価を行って、タルク/水酸化マグネシウム系組成物との
比較を行った。結果を第1表に示した。Also, without using magnesium hydroxide (Comparative Example 1),
Increase the blending ratio of magnesium hydroxide (Comparative Example 2)
, calcium carbonate (average particle size 1.8 ps) (comparative example 3), aluminum hydroxide (synthetic product, average particle size 1.5) (comparative example 4), calcium hydroxide (Nippon Lime Co., Ltd.) instead of magnesium hydroxide made, 150 mesh full pass) (
Using Comparative Example 5), and further reducing the blending ratio of glass fiber (Comparative Example 6), mixing, molding, and evaluation were performed under the same conditions to compare with the talc/magnesium hydroxide-based composition. I did it. The results are shown in Table 1.
本発明によれば、充分な機械的強度、高い耐熱性、耐ア
ーク性を備え、しかも、成形品外観に優れた、電気・電
子部品もしくは自動車部品分野に使用できるポリアリー
レンサルファイド樹脂組成物を提供することができる。According to the present invention, there is provided a polyarylene sulfide resin composition that has sufficient mechanical strength, high heat resistance, and arc resistance, and has excellent molded product appearance and can be used in the field of electrical/electronic parts or automobile parts. can do.
Claims (1)
ガラス繊維20〜120重量部、タルク30〜80重量
部及び水酸化マグネシウム10〜50重量部を含有する
樹脂組成物。For 100 parts by weight of polyarylene sulfide resin,
A resin composition containing 20 to 120 parts by weight of glass fiber, 30 to 80 parts by weight of talc, and 10 to 50 parts by weight of magnesium hydroxide.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63213727A JPH0759666B2 (en) | 1988-08-30 | 1988-08-30 | Polyarylene sulfide resin composition |
US07/613,941 US5021497A (en) | 1988-06-17 | 1990-11-08 | Polyarylene sulfide resin composition |
US07/672,949 US5252633A (en) | 1988-06-17 | 1991-03-21 | Polyarylene sulfide resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63213727A JPH0759666B2 (en) | 1988-08-30 | 1988-08-30 | Polyarylene sulfide resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0264158A true JPH0264158A (en) | 1990-03-05 |
JPH0759666B2 JPH0759666B2 (en) | 1995-06-28 |
Family
ID=16643999
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63213727A Expired - Lifetime JPH0759666B2 (en) | 1988-06-17 | 1988-08-30 | Polyarylene sulfide resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0759666B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04304264A (en) * | 1991-04-02 | 1992-10-27 | Polyplastics Co | Polyarylene sulfide resin composition improved in adhesion to epoxy resin and composite epoxy resin molding |
JP2008260830A (en) * | 2007-04-11 | 2008-10-30 | Idemitsu Kosan Co Ltd | Heat-conductive resin composition |
JP2010043229A (en) * | 2008-08-18 | 2010-02-25 | Idemitsu Kosan Co Ltd | Thermally conductive resin composition and resin molding of the composition |
CN111741841A (en) * | 2018-02-20 | 2020-10-02 | 提克纳有限责任公司 | Thermally conductive polymer composition |
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JPS57202344A (en) * | 1981-06-08 | 1982-12-11 | Shin Etsu Chem Co Ltd | Polyphenylene sulfide resin composition |
JPS62109850A (en) * | 1985-11-08 | 1987-05-21 | Kureha Chem Ind Co Ltd | Corrosion-protection of melt-molding apparatus for polyarylene thioether |
JPS62115048A (en) * | 1985-11-13 | 1987-05-26 | Idemitsu Petrochem Co Ltd | Polyolefin resin composition |
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1988
- 1988-08-30 JP JP63213727A patent/JPH0759666B2/en not_active Expired - Lifetime
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JPS57202344A (en) * | 1981-06-08 | 1982-12-11 | Shin Etsu Chem Co Ltd | Polyphenylene sulfide resin composition |
JPS62109850A (en) * | 1985-11-08 | 1987-05-21 | Kureha Chem Ind Co Ltd | Corrosion-protection of melt-molding apparatus for polyarylene thioether |
JPS62115048A (en) * | 1985-11-13 | 1987-05-26 | Idemitsu Petrochem Co Ltd | Polyolefin resin composition |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04304264A (en) * | 1991-04-02 | 1992-10-27 | Polyplastics Co | Polyarylene sulfide resin composition improved in adhesion to epoxy resin and composite epoxy resin molding |
JP2008260830A (en) * | 2007-04-11 | 2008-10-30 | Idemitsu Kosan Co Ltd | Heat-conductive resin composition |
JP2010043229A (en) * | 2008-08-18 | 2010-02-25 | Idemitsu Kosan Co Ltd | Thermally conductive resin composition and resin molding of the composition |
CN111741841A (en) * | 2018-02-20 | 2020-10-02 | 提克纳有限责任公司 | Thermally conductive polymer composition |
CN111741841B (en) * | 2018-02-20 | 2023-05-30 | 提克纳有限责任公司 | Thermally conductive polymer composition |
Also Published As
Publication number | Publication date |
---|---|
JPH0759666B2 (en) | 1995-06-28 |
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