JPH0252928B2 - - Google Patents
Info
- Publication number
- JPH0252928B2 JPH0252928B2 JP60088249A JP8824985A JPH0252928B2 JP H0252928 B2 JPH0252928 B2 JP H0252928B2 JP 60088249 A JP60088249 A JP 60088249A JP 8824985 A JP8824985 A JP 8824985A JP H0252928 B2 JPH0252928 B2 JP H0252928B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- bisphenol
- weight
- parts
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 58
- 239000003822 epoxy resin Substances 0.000 claims description 50
- 229920000647 polyepoxide Polymers 0.000 claims description 50
- 229920003986 novolac Polymers 0.000 claims description 37
- 230000001588 bifunctional effect Effects 0.000 claims description 22
- 239000011342 resin composition Substances 0.000 claims description 13
- 239000002075 main ingredient Substances 0.000 claims description 10
- 125000003342 alkenyl group Chemical group 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 6
- 239000003063 flame retardant Substances 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 125000002947 alkylene group Chemical group 0.000 claims description 4
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 125000006273 (C1-C3) alkyl group Chemical group 0.000 claims description 2
- 125000005843 halogen group Chemical group 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 description 10
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Description
産業上の利用分野
本発明は、塗工作業性に優れ、かつ耐熱性、耐
衝撃性が強い積層板用樹脂組成物および難燃性積
層板用樹脂組成物に関する。
従来の技術
電子機器の小型軽量化に伴なつてチツプ部品お
よびフラツトパツケージLSIが多用されてきてい
る。これらは積層板を絶縁基板としたものに搭載
され、そのため、積層板の耐熱性、耐湿性、耐ミ
ーズリング性など向上させることが望まれてい
る。
例えば、耐熱性を向上させるために、２官能の
エポキシ樹脂に、フエノールノボラツク型エポキ
シ樹脂、クレゾールノボラツク型エポキシ樹脂、
パラアミノフエノールのトリグリシジルエーテル
などの多官能エポキシ樹脂を添加することが行な
われている。しかし、これらの多官能エポキシ樹
脂を添加すると、積層板の耐熱性は向上するが、
急激に耐衝撃性が劣化して脆くなる。打抜き加工
のような大きな衝撃が加わると、打抜いた複数の
穴間にクラツクが発生し、高湿度雰囲気での絶縁
抵抗が劣化する。
発明が解決しようとする問題点
特に、フラツトパツケージLSI搭載に伴なう耐
熱性の向上と打抜き加工に伴なう耐衝撃性の向上
は必要不可欠な特性であるにも拘らず、これらの
特性は相反した特性であるため、解決が困難であ
つた。
本発明は、耐熱性と耐衝撃性の両者を備えた積
層板を得られる積層板用樹脂組成物および難燃性
の積層板用樹脂組成物を提供することを目的とす
る。
問題点を解決するための手段
上記目的を達成するための第１の発明は、分子
量500以下のビスフエノールＡ系２官能エポキシ
樹脂と次の一般式
INDUSTRIAL APPLICATION FIELD The present invention relates to a resin composition for laminates and a flame-retardant resin composition for laminates, which have excellent coating workability and strong heat resistance and impact resistance. Prior Art As electronic equipment becomes smaller and lighter, chip components and flat package LSIs are increasingly being used. These are mounted on a laminate as an insulating substrate, and therefore it is desired to improve the heat resistance, moisture resistance, measling resistance, etc. of the laminate. For example, in order to improve heat resistance, a bifunctional epoxy resin, a phenol novolak type epoxy resin, a cresol novolak type epoxy resin,
Addition of polyfunctional epoxy resins such as triglycidyl ether of para-aminophenol has been carried out. However, adding these polyfunctional epoxy resins improves the heat resistance of the laminate;
Impact resistance rapidly deteriorates and becomes brittle. When a large impact is applied during punching, cracks occur between the punched holes and the insulation resistance deteriorates in a high humidity atmosphere. Problems to be Solved by the Invention In particular, although improvements in heat resistance associated with mounting a flat package LSI and improvement in impact resistance associated with punching are essential characteristics, these characteristics It has been difficult to resolve these issues because they have contradictory characteristics. An object of the present invention is to provide a resin composition for a laminate that can obtain a laminate having both heat resistance and impact resistance, and a flame-retardant resin composition for a laminate. Means for Solving the Problems The first invention to achieve the above object consists of a bisphenol A-based bifunctional epoxy resin having a molecular weight of 500 or less and a bisphenol A-based bifunctional epoxy resin having the following general formula:
【式】（但し、R1は
C1〜C3の直鎖状のアルキレン基を示し、R2，R3
はC1〜C3のアルキル基またはアルケニル基を示
す）で示される２価フエノール類と次の一般式
（但し、R1，R2はC1〜C3のアルキル基または
アルケニル基を示し、ｎは１〜３の整数を示す）
で示されるビスフエノールＡノボラツク型多官能
エポキシ樹脂とを主剤とし、前記ビスフエノール
Ａ系２官能エポキシ樹脂とビスフエノールＡノボ
ラツク型多官能エポキシ樹脂の合計の配合量を
100重量部としたとき後者の配合量が５〜50重量
部であり、前記主剤に硬化剤としてノボラツク樹
脂を配合した積層板用樹脂組成物である。
また、上記目的を達成するための第２の発明
は、分子量500以下のビスフエノールＡ系２官能
エポキシ樹脂と次の一般式
[Formula] (However, R 1 represents a C 1 to C 3 linear alkylene group, R 2 , R 3
represents a C1 - C3 alkyl group or alkenyl group) and the following general formula (However, R 1 and R 2 represent a C 1 to C 3 alkyl group or alkenyl group, and n represents an integer of 1 to 3.)
A bisphenol A novolac type polyfunctional epoxy resin represented by the following is used as the main ingredient, and the total blending amount of the bisphenol A type bifunctional epoxy resin and bisphenol A novolac type polyfunctional epoxy resin is
This is a resin composition for a laminate, in which the amount of the latter is 5 to 50 parts by weight based on 100 parts by weight, and a novolac resin is blended as a curing agent in the main ingredient. In addition, a second invention for achieving the above object comprises a bisphenol A-based bifunctional epoxy resin having a molecular weight of 500 or less and the following general formula:
【式】（但し、R1は
C1〜C3の直鎖状のアルキレン基を示し、R2，R3
はC1〜C3のアルキル基またはアルケニル基を示
し、Ｘはハロゲンを示す）で示されるハロゲン化
２価フエノール類と次の一般式
（但し、R1，R2はC1〜C3のアルキル基または
アルケニル基を示し、ｎは１〜３の整数を示す）
で示されるビスフエノールＡノボラツク型多官能
エポキシ樹脂とを主剤とし、前記ビスフエノール
Ａ系２官能エポキシ樹脂とビスフエノールＡノボ
ラツク型多官能エポキシ樹脂の合計の配合量を
100重量部としたとき後者の配合量が５〜50重量
部であり、前記主剤に硬化剤としてノボラツク樹
脂を配合した難燃性の積層板用樹脂組成物であ
る。
作 用
本発明は、従来用いられていたような多官能エ
ポキシ樹脂に代えて、ビスフエノールＡノボラツ
ク型多官能エポキシ樹脂を添加することにより、
耐衝撃性を低下させることなく耐熱性の向上が図
れる。ここで、分子量500以下のビスフエノール
Ａ系２官能エポキシ樹脂とビスフエノールＡノボ
ラツク型多官能エポキシ樹脂の合計の配合量を
100重量部としたとき、後者の配合量が５重量部
末満であると耐熱性は向上せず、50重量部を越え
ると耐熱性は満足するが耐衝撃性が低下するの
で、目的を達成できない。
また、硬化剤としてノボラツク樹脂を用いるこ
とにより、積層板用基材に樹脂組成物を含浸し乾
燥する工程で、エポキシ樹脂と２価フエノール類
あるいはハロゲン化２価フエノール類との反応を
選択的に行なうことができ、積層板の耐熱性、耐
湿性、耐溶剤を向上させるのに有効に作用する。
実施例
次に、本発明の第１の発明について実施例を説
明する。
本発明で使用する硬化剤としてのノボラツク樹
脂は、フエノールノボラツク、クレゾールノボラ
ツク、ｐ−tert−ブチルフエノールノボラツク樹
脂などであり、特に限定しない。また、第３級ア
ミン系、イミダゾール系などの促進剤を併用して
もよい。さらに、無機充填剤を含ませることは、
積層板の寸法安定性が良好となり好ましい。
実施例１〜３、比較例１
分子量370、エポキシ当量189の２官能エポキシ
樹脂（商品名エピクロン850、大日本インキ製）、
ビスフエノールＡ、エポキシ当量205のビスフエ
ノールＡノボラツク型多官能エポキシ樹脂（商品
名エピクロンＮ−865、大日本インキ製）を第１
表に示す割合（重量部）で配合して主剤とし、こ
れにフエノールノボラツク樹脂（水酸基当量103）
20重量部、２−エチル−４−メチルイミダゾール
0.4重量部を混合し固型分65重量％の樹脂組成物
を得た（溶剤はメチルエチルケトン）。
これを、ガラス布に樹脂量40重量％になるよう
に含浸乾燥してプリプレグを得、該プレプレグを
所定枚数積層し、両表面に銅箔を配置して、加熱
加圧により1.2mm厚の両面銅張積層板を得た。そ
の特性を第１表に合せて示す。[Formula] (However, R 1 represents a C 1 to C 3 linear alkylene group, R 2 , R 3
represents a C 1 to C 3 alkyl group or alkenyl group, and X represents a halogen) and the following general formula: (However, R 1 and R 2 represent a C 1 to C 3 alkyl group or alkenyl group, and n represents an integer of 1 to 3.)
A bisphenol A novolac type polyfunctional epoxy resin represented by the following is used as the main ingredient, and the total blending amount of the bisphenol A type bifunctional epoxy resin and bisphenol A novolac type polyfunctional epoxy resin is
The latter is blended in an amount of 5 to 50 parts by weight based on 100 parts by weight, and is a flame-retardant resin composition for laminates in which a novolac resin is blended as a curing agent into the main ingredient. Function The present invention provides the following effects by adding a bisphenol A novolak type polyfunctional epoxy resin instead of the conventionally used polyfunctional epoxy resin.
Heat resistance can be improved without reducing impact resistance. Here, the total blending amount of bisphenol A type bifunctional epoxy resin and bisphenol A novolac type polyfunctional epoxy resin with a molecular weight of 500 or less is calculated.
When the amount of the latter is less than 5 parts by weight, the heat resistance will not improve, and if it exceeds 50 parts by weight, the heat resistance will be satisfied but the impact resistance will decrease, so the objective was not achieved. Can not. In addition, by using a novolac resin as a curing agent, the reaction between the epoxy resin and divalent phenols or halogenated divalent phenols can be selectively inhibited in the process of impregnating the base material for a laminate with the resin composition and drying it. It is effective in improving the heat resistance, moisture resistance, and solvent resistance of the laminate. Examples Next, examples of the first aspect of the present invention will be described. Novolak resins used as curing agents in the present invention include phenol novolaks, cresol novolaks, p-tert-butylphenol novolak resins, and are not particularly limited. Further, a tertiary amine type accelerator, an imidazole type accelerator, etc. may be used in combination. Furthermore, the inclusion of inorganic fillers
This is preferable since the dimensional stability of the laminate is good. Examples 1 to 3, Comparative Example 1 Bifunctional epoxy resin with a molecular weight of 370 and an epoxy equivalent of 189 (trade name Epicron 850, manufactured by Dainippon Ink),
Bisphenol A, a bisphenol A novolak type polyfunctional epoxy resin with an epoxy equivalent of 205 (trade name Epicron N-865, manufactured by Dainippon Ink) was used as the first
Blend in the proportions (parts by weight) shown in the table to form the main ingredient, and add phenol novolac resin (hydroxyl equivalent: 103)
20 parts by weight, 2-ethyl-4-methylimidazole
0.4 parts by weight were mixed to obtain a resin composition with a solid content of 65% by weight (the solvent was methyl ethyl ketone). This is impregnated into a glass cloth to a resin content of 40% by weight and dried to obtain a prepreg. A predetermined number of sheets of the prepreg are laminated, copper foil is placed on both surfaces, and heated and pressed to form a 1.2 mm thick double-sided prepreg. A copper-clad laminate was obtained. Its characteristics are shown in Table 1.
【表】
比較例 ２
実施例２において、２官能エポキシ樹脂を分子
量680、エポキシ当量340のものに代え、他は実施
例２と同様にして1.2mm厚の両面銅張積層板を得
た。その特性を第２表に示す。
従来例 １
実施例１において、２官能エポキシ樹脂を100重
量部としてビスフエノールＡノボラツク型多官能
エポキシ樹脂を０の配合とし、他は実施例１と同
様にして1.2mm厚の両面銅張積層板を得た。その
特性を第２表に示す。
従来例 ２
実施例２においてビスフエノールＡノボラツク
型多官能エポキシ樹脂の代りに、エポキシ当量
178のフエノールノボラツク型エポキシ樹脂（商
品名DER−438、ダウ・ケミカル製）を同量配合
し、他は実施例２と同様にして1.2mm厚の両面銅
張積層板を得た。その特性を第２表に示す。
従来例 ３
実施例２において、２官能エポキシ樹脂の代り
に、分子量1000、エポキシ量500の２官能エポキ
シ樹脂を、またビスフエノールＡノボラツク型多
官能エポキシ樹脂の代りに、従来例２のフエノー
ルノボラツク型エポキシ樹脂を同量配合し、他は
実施例２と同様にして1.2mm厚の両面銅張積層板
を得た。その特性を第２表に示す。
比較例 ３
実施例２において、フエノールノボラツク樹脂
の代りに、ジシアンアミド４重量部をメチルグリ
コソルブに溶解したものを硬化剤として用い、他
は実施例２と同様にして1.2mm厚の両面銅張積層
板を得た。その特性を第２表に示す。[Table] Comparative Example 2 A double-sided copper-clad laminate with a thickness of 1.2 mm was obtained in the same manner as in Example 2 except that the bifunctional epoxy resin was replaced with one having a molecular weight of 680 and an epoxy equivalent of 340. Its properties are shown in Table 2. Conventional Example 1 In Example 1, 100 parts by weight of bifunctional epoxy resin and 0 parts of bisphenol A novolac type polyfunctional epoxy resin were mixed, and the other conditions were the same as in Example 1 to prepare a 1.2 mm thick double-sided copper-clad laminate. I got it. Its properties are shown in Table 2. Conventional Example 2 In Example 2, instead of the bisphenol A novolak type polyfunctional epoxy resin, epoxy equivalent
A double-sided copper-clad laminate having a thickness of 1.2 mm was obtained in the same manner as in Example 2 except that the same amount of 178 phenol novolak type epoxy resin (trade name DER-438, manufactured by Dow Chemical) was blended. Its properties are shown in Table 2. Conventional Example 3 In Example 2, a bifunctional epoxy resin with a molecular weight of 1000 and an epoxy content of 500 was used instead of the bifunctional epoxy resin, and the phenol novolac of Conventional Example 2 was used instead of the bisphenol A novolac type polyfunctional epoxy resin. A double-sided copper-clad laminate with a thickness of 1.2 mm was obtained in the same manner as in Example 2 except that the same amount of mold epoxy resin was mixed. Its properties are shown in Table 2. Comparative Example 3 In Example 2, 4 parts by weight of dicyanamide dissolved in methyl glycosolve was used as a hardening agent instead of the phenol novolac resin, and the other conditions were the same as in Example 2, but a 1.2 mm thick double-sided copper-clad plate was prepared. A laminate was obtained. Its properties are shown in Table 2.
【表】【table】
【表】
次に、本発明の第２の発明について実施例を説
明する。
本発明においては、積層板用基材の種類などに
よつてハロゲン含率を適宜変えるが、２官能エポ
キシ樹脂とハロゲン化２価フエノール類の配合割
合を変えることによつて行なうことができる。
実施例４〜６、比較例４
分子量370、エポキシ当量189の２官能エポキシ
樹脂（商品名エピクロン850、大日本インキ製）、
テトラブロモビスフエノールＡ、エポキシ当量
205のビスフエノールＡノボラツク型多官能エポ
キシ樹脂（商品名エピクロンＮ−865、大日本イ
ンキ製）を第３表に示す割合（重量部）で配合し
て主剤とし、これにフエノールノボラツク樹脂
（水酸基当量103）20重量部、２−エチル−４−メ
チルイミダゾール0.4重量部を混合し固型分65重
量％の樹脂組成物を得た（溶剤はアセトン）。
これを、ガラス布に樹脂量38重量％になるよう
に含浸乾燥してプリプレグを得、該プリプレグを
５枚積層し、両表面に銅箔を配置して、加熱加工
により1.0mm厚の両面銅張積層板を得た。その特
性を第３表に合せて示す。[Table] Next, examples of the second aspect of the present invention will be described. In the present invention, the halogen content is appropriately changed depending on the type of substrate for the laminate, etc., and can be done by changing the blending ratio of the bifunctional epoxy resin and the halogenated dihydric phenols. Examples 4 to 6, Comparative Example 4 Bifunctional epoxy resin with a molecular weight of 370 and an epoxy equivalent of 189 (trade name Epicron 850, manufactured by Dainippon Ink),
Tetrabromobisphenol A, epoxy equivalent
205 bisphenol A novolak type polyfunctional epoxy resin (trade name Epicron N-865, manufactured by Dainippon Ink) was blended in the proportions (parts by weight) shown in Table 3 as the main ingredient, and this was mixed with phenol novolak resin (hydroxyl group). Equivalent: 103) 20 parts by weight and 0.4 parts by weight of 2-ethyl-4-methylimidazole were mixed to obtain a resin composition with a solid content of 65% by weight (the solvent was acetone). This was impregnated into a glass cloth to a resin content of 38% by weight and dried to obtain a prepreg. Five sheets of the prepreg were laminated, copper foil was placed on both surfaces, and a double-sided copper foil with a thickness of 1.0 mm was heated. A stretched laminate was obtained. Its characteristics are also shown in Table 3.
【表】【table】
【表】
比較例 ５
実施例５において、２官能エポキシ樹脂を分子
量680、エポキシ当量340のものに代え、他は実施
例５と同様にして1.0mm厚の両面銅張積層板を得
た。その特性を第４表に示す。
従来例 ４
実施例４において、２官能エポキシ樹脂を100
重量部としビスフエノールＡノボラツク型多官能
エポキシ樹脂を０の配合とし、他は実施例４と同
様にして1.0mm厚の両面銅張積層板を得た。その
特性を第４表に示す。
従来例 ５
実施例５において、ビスフエノールＡノボラツ
ク型多官能エポキシ樹脂の代りに、エポキシ当量
178のフエノールノボラツク型エポキシ樹脂（商
品名DER−438、ダウ・ケミカル製）を同量配合
し、他は実施例５と同様にして1.0mm厚の両面銅
張積層板得た。その特性を第４表に示す。
従来例 ６
実施例５において、２官能エポキシ樹脂の代り
に、分子量1000、エポキシ当量500の難熱性２官
能エポキシ樹脂（商品名EPON−1045、シエル化
学製）を、またビスフエノールＡノボラツク型多
官能エポキシ樹脂の代りに、従来例５のフエノー
ルノボラツク型エポキシ樹脂を同量配合し、他は
実施例５と同様にして1.0mm厚の両面銅張積層板
を得た。その特性を第４表に示す。
比較例 ６
実施例５において、フエノールノボラツク樹脂
の代りに、ジシアンジアミド４重量部をメチルセ
ロソルブに溶解したものを硬化剤として用い、他
は実施例５と同様にして1.0mm厚の両面銅張積層
板を得た。その特性を第４表に示す。[Table] Comparative Example 5 A double-sided copper-clad laminate with a thickness of 1.0 mm was obtained in the same manner as in Example 5 except that the bifunctional epoxy resin was replaced with one having a molecular weight of 680 and an epoxy equivalent of 340. Its properties are shown in Table 4. Conventional Example 4 In Example 4, the bifunctional epoxy resin was
A double-sided copper-clad laminate having a thickness of 1.0 mm was obtained in the same manner as in Example 4, except that the bisphenol A novolac type polyfunctional epoxy resin was blended at 0 parts by weight. Its properties are shown in Table 4. Conventional Example 5 In Example 5, instead of the bisphenol A novolak type polyfunctional epoxy resin, epoxy equivalent
A double-sided copper-clad laminate having a thickness of 1.0 mm was obtained in the same manner as in Example 5 except that the same amount of 178 phenol novolac type epoxy resin (trade name DER-438, manufactured by Dow Chemical) was blended. Its properties are shown in Table 4. Conventional Example 6 In Example 5, instead of the bifunctional epoxy resin, a heat-resistant bifunctional epoxy resin (trade name EPON-1045, manufactured by Shell Chemical) with a molecular weight of 1000 and an epoxy equivalent of 500 was used, and a bisphenol A novolac type polyfunctional A double-sided copper-clad laminate having a thickness of 1.0 mm was obtained in the same manner as in Example 5 except that the same amount of the phenol novolac type epoxy resin of Conventional Example 5 was blended instead of the epoxy resin. Its properties are shown in Table 4. Comparative Example 6 In Example 5, 4 parts by weight of dicyandiamide dissolved in methyl cellosolve was used as the curing agent instead of the phenol novolac resin, and the other conditions were the same as in Example 5, to form a 1.0 mm thick double-sided copper clad laminate. Got the board. Its properties are shown in Table 4.
【表】
発明の効果
上記の結果から明らかなように、本発明は、積
層板用基材への濡れ性が良好な積層板用樹脂組成
物および難燃性の積層板用樹脂組生物であり、耐
熱性および耐衝撃性のよい積層板および難燃性の
積層板の製造に寄与するものであり、その工業的
価値は極めて大なるものである。[Table] Effects of the Invention As is clear from the above results, the present invention provides a resin composition for laminates that has good wettability to the base material for laminates, and a flame-retardant resin composition for laminates. It contributes to the production of laminates with good heat resistance and impact resistance, and flame-retardant laminates, and its industrial value is extremely large.
Claims (1)
エポキシ樹脂と次の一般式
【式】（但し、R1は C1〜C3の直鎖状のアルキレン基を示し、R2，R3
はC1〜C3のアルキル基またはアルケニル基を示
す）で示される２価フエノール類と次の一般式 （但し、R1，R2はC1〜C3のアルキル基または
アルケニル基を示し、ｎは１〜３の整数を示す）
で示されるビスフエノールＡノボラツク型多官能
エポキシ樹脂とを主剤とし、前記ビスフエノール
Ａ系２官能エポキシ樹脂とビスフエノールＡノボ
ラツク型多官能エポキシ樹脂の合計の配合量を
100重量部としたとき後者の配合量が５〜50重量
部であり、前記主剤に硬化剤としてノボラツク樹
脂を配合した積層板用樹脂組成物。 ２ 分子量500以下のビスフエノールＡ系２官能
エポキシ樹脂と次の一般式
【式】（但し、R1は C1〜C3の直鎖状のアルキレン基を示し、R2，R3
はC1〜C3のアルキル基またはアルケニル基を示
し、Ｘはハロゲンを示す）で示されるハロゲン化
２価フエノール類と次の一般式 （但し、R1，R2はC1〜C3のアルキル基または
アルケニル基を示し、ｎは１〜３の整数を示す）
で示されるビスフエノールＡノボラツク型多官能
エポキシ樹脂とを主剤とし、前記ビスフエノール
Ａ系２官能エポキシ樹脂とビスフエノールＡノボ
ラツク型多官能エポキシ樹脂の合計の配合量を
100重量部としたとき後者の配合量が５〜50重量
部であり、前記主剤に硬化剤としてノボラツク樹
脂を配合した難燃性の積層板用樹脂組成物。[Claims] 1. A bisphenol A-based bifunctional epoxy resin with a molecular weight of 500 or less and the following general formula [Formula] (wherein R 1 represents a C 1 to C 3 linear alkylene group, and R 2 ,R 3
represents a C1 - C3 alkyl group or alkenyl group) and the following general formula (However, R 1 and R 2 represent a C 1 to C 3 alkyl group or alkenyl group, and n represents an integer of 1 to 3.)
A bisphenol A novolac type polyfunctional epoxy resin represented by the following is used as the main ingredient, and the total blending amount of the bisphenol A type bifunctional epoxy resin and bisphenol A novolac type polyfunctional epoxy resin is
A resin composition for a laminate, in which the amount of the latter is 5 to 50 parts by weight based on 100 parts by weight, and a novolak resin is blended as a curing agent in the main ingredient. 2 Bisphenol A-based bifunctional epoxy resin with a molecular weight of 500 or less and the following general formula [Formula] (where R 1 represents a C 1 to C 3 linear alkylene group, R 2 , R 3
represents a C1 to C3 alkyl group or alkenyl group, and X represents a halogen) and the following general formula: (However, R 1 and R 2 represent a C 1 to C 3 alkyl group or alkenyl group, and n represents an integer of 1 to 3.)
A bisphenol A novolac type polyfunctional epoxy resin represented by the following is used as the main ingredient, and the total blending amount of the bisphenol A type bifunctional epoxy resin and bisphenol A novolac type polyfunctional epoxy resin is
A flame-retardant resin composition for laminates, in which the latter is blended in an amount of 5 to 50 parts by weight based on 100 parts by weight, and a novolac resin is blended as a curing agent in the main ingredient.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8824985A JPS61246228A (en) | 1985-04-24 | 1985-04-24 | Resin composition for laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8824985A JPS61246228A (en) | 1985-04-24 | 1985-04-24 | Resin composition for laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61246228A JPS61246228A (en) | 1986-11-01 |
| JPH0252928B2 true JPH0252928B2 (en) | 1990-11-15 |
Family
ID=13937578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8824985A Granted JPS61246228A (en) | 1985-04-24 | 1985-04-24 | Resin composition for laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61246228A (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0717736B2 (en) * | 1987-02-17 | 1995-03-01 | 油化シエルエポキシ株式会社 | Epoxy resin composition |
| JPS63234014A (en) * | 1987-03-23 | 1988-09-29 | Shin Kobe Electric Mach Co Ltd | Production of laminate |
| JPS63234015A (en) * | 1987-03-23 | 1988-09-29 | Shin Kobe Electric Mach Co Ltd | Production of laminate |
| US5066735A (en) * | 1987-11-16 | 1991-11-19 | The Dow Chemical Company | Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol |
| US4959425A (en) * | 1987-11-16 | 1990-09-25 | The Dow Chemical Company | Laminating varnish composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol and a solvent |
| US4868059A (en) * | 1987-11-16 | 1989-09-19 | The Dow Chemical Company | Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol |
| US4874669A (en) * | 1988-08-15 | 1989-10-17 | The Dow Chemical Company | Curable compositions containing an epoxy resin, a difunctional phenol and a polyfunctional phenol |
| EP0394965A3 (en) * | 1989-04-25 | 1991-12-18 | Mitsubishi Denki Kabushiki Kaisha | Resin composition for laminate |
| US5661223A (en) * | 1989-04-25 | 1997-08-26 | Mitsubishi Denki Kabushiki Kaisha | Composition of phenolic resin-modified epoxy resin and straight chain polymer |
| JPH0641504B2 (en) * | 1989-04-25 | 1994-06-01 | 松下電工株式会社 | Curable epoxy resin composition |
| JPH0739463B2 (en) * | 1989-05-25 | 1995-05-01 | 三菱電機株式会社 | Resin composition for laminated board |
| JPH0676973B2 (en) * | 1989-05-30 | 1994-09-28 | 松下電工株式会社 | Circuit pattern inspection method |
| JPH0819213B2 (en) * | 1990-07-09 | 1996-02-28 | 三菱電機株式会社 | Epoxy resin composition and copper clad laminate |
| JPH0959346A (en) * | 1995-08-28 | 1997-03-04 | Matsushita Electric Works Ltd | Epoxy resin composition for laminate |
| JP4496591B2 (en) * | 2000-03-09 | 2010-07-07 | 住友ベークライト株式会社 | Epoxy resin composition, prepreg and laminate using the same |
| GB0619401D0 (en) | 2006-10-02 | 2006-11-08 | Hexcel Composites Ltd | Composite materials with improved performance |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5889614A (en) * | 1981-11-24 | 1983-05-28 | Shin Kobe Electric Mach Co Ltd | Resin composition for flame-retardant laminates |
| JPS5889615A (en) * | 1981-11-24 | 1983-05-28 | Shin Kobe Electric Mach Co Ltd | Resin composition for laminates |
| JPS58194916A (en) * | 1982-05-10 | 1983-11-14 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
| JPS60260627A (en) * | 1984-06-07 | 1985-12-23 | Hitachi Chem Co Ltd | Production of prepreg for printed wiring board |
| JPS61188413A (en) * | 1985-02-18 | 1986-08-22 | Dainippon Ink & Chem Inc | Epoxy resin composition |
-
1985
- 1985-04-24 JP JP8824985A patent/JPS61246228A/en active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5889614A (en) * | 1981-11-24 | 1983-05-28 | Shin Kobe Electric Mach Co Ltd | Resin composition for flame-retardant laminates |
| JPS5889615A (en) * | 1981-11-24 | 1983-05-28 | Shin Kobe Electric Mach Co Ltd | Resin composition for laminates |
| JPS58194916A (en) * | 1982-05-10 | 1983-11-14 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
| JPS60260627A (en) * | 1984-06-07 | 1985-12-23 | Hitachi Chem Co Ltd | Production of prepreg for printed wiring board |
| JPS61188413A (en) * | 1985-02-18 | 1986-08-22 | Dainippon Ink & Chem Inc | Epoxy resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61246228A (en) | 1986-11-01 |
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