JPH0246853U - - Google Patents
Info
- Publication number
- JPH0246853U JPH0246853U JP12602088U JP12602088U JPH0246853U JP H0246853 U JPH0246853 U JP H0246853U JP 12602088 U JP12602088 U JP 12602088U JP 12602088 U JP12602088 U JP 12602088U JP H0246853 U JPH0246853 U JP H0246853U
- Authority
- JP
- Japan
- Prior art keywords
- cooling device
- helium gas
- vapor deposition
- deposition apparatus
- metal vapor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims description 4
- 239000001307 helium Substances 0.000 claims description 4
- 229910052734 helium Inorganic materials 0.000 claims description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 4
- 238000007740 vapor deposition Methods 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims 2
- 238000001704 evaporation Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Description
第１図は本考案の実施例を示す図、第２図は従
来の技術を示す図である。
６……蒸着容器、３０……冷却装置、４０……
ヘリウムガス循環ループ、５０……間接熱交換器
。
FIG. 1 is a diagram showing an embodiment of the present invention, and FIG. 2 is a diagram showing a conventional technique. 6... Vapor deposition container, 30... Cooling device, 40...
Helium gas circulation loop, 50...Indirect heat exchanger.
Claims (1)
において、蒸着容器の壁面部にヘリウムガスを循
環させて、壁温度を制御する冷却装置を設け、該
冷却装置に連結されるヘリウムガス循環ループ管
路を設け、該回路の中にヘリウムガスの熱回収を
行なう熱交換器を設置したことを特徴とする金属
蒸気蒸着装置。 In a metal vapor deposition apparatus having a cooling device for an evaporation container, a cooling device is provided for circulating helium gas on the wall surface of the evaporation container to control the wall temperature, and a helium gas circulation loop pipe connected to the cooling device is provided. 1. A metal vapor deposition apparatus, characterized in that a heat exchanger for recovering heat from helium gas is installed in the circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12602088U JPH0246853U (en) | 1988-09-27 | 1988-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12602088U JPH0246853U (en) | 1988-09-27 | 1988-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0246853U true JPH0246853U (en) | 1990-03-30 |
Family
ID=31377149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12602088U Pending JPH0246853U (en) | 1988-09-27 | 1988-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0246853U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021503546A (en) * | 2017-11-16 | 2021-02-12 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Methods for cooling the source, chambers for cooling the source, and sedimentation systems |
-
1988
- 1988-09-27 JP JP12602088U patent/JPH0246853U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021503546A (en) * | 2017-11-16 | 2021-02-12 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Methods for cooling the source, chambers for cooling the source, and sedimentation systems |
| JP2023002533A (en) * | 2017-11-16 | 2023-01-10 | アプライド マテリアルズ インコーポレイテッド | Method and chamber for cooling deposition source, and deposition system |
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