JPH0236265Y2 - - Google Patents
Info
- Publication number
- JPH0236265Y2 JPH0236265Y2 JP16964884U JP16964884U JPH0236265Y2 JP H0236265 Y2 JPH0236265 Y2 JP H0236265Y2 JP 16964884 U JP16964884 U JP 16964884U JP 16964884 U JP16964884 U JP 16964884U JP H0236265 Y2 JPH0236265 Y2 JP H0236265Y2
- Authority
- JP
- Japan
- Prior art keywords
- fuse metal
- capacitor element
- capacitor
- external electrode
- external
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- 239000003990 capacitor Substances 0.000 claims description 20
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000003985 ceramic capacitor Substances 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 17
- 230000009993 protective function Effects 0.000 description 4
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Fuses (AREA)
Description
【考案の詳細な説明】
［産業上の利用分野］
本案は積層セラミツクコンデンサに関し、特に
コンデンサエレメントの外部電極にヒユーズ金属
を直列接続する際の付設性を改善する外部電極構
造に関するものである。[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to a multilayer ceramic capacitor, and in particular to an external electrode structure that improves the attachment property when connecting a fuse metal in series to the external electrode of a capacitor element.
［従来技術］
一般にこの種積層セラミツクコンデンサは例え
ば第４図（実開昭53−157342号公報）に示すよう
に、セラミツク層、内部電極を交互に積層してな
るコンデンサエレメントＡの両端に第１、第２の
外部電極Ｂ，Ｃを、内部電極に対して電気的な接
続関係を有するように、第１、第２の外部電極
Ｂ，Ｃ間に第３の外部電極Ｄを内部電極に対して
電気的な接続関係を有しないようにそれぞれ形成
し、第１、第３の外部電極Ｂ，Ｄに第１、第２の
外部リード部材Ｅ，Ｆを半田付けすると共に、第
２、第３の外部電極Ｃ，Ｄに線状のヒユーズ金属
Ｇを接続し、かつコンデンサエレメントＡの全周
面を樹脂材Ｈにて被覆して構成されている。[Prior Art] In general, this type of multilayer ceramic capacitor has first capacitors at both ends of a capacitor element A, which is made up of alternately laminated ceramic layers and internal electrodes, as shown in FIG. , a third external electrode D is connected to the internal electrode between the first and second external electrodes B and C so that the second external electrode B and C are electrically connected to the internal electrode. The first and second external lead members E and F are soldered to the first and third external electrodes B and D, respectively. A linear fuse metal G is connected to the external electrodes C and D of the capacitor element A, and the entire circumferential surface of the capacitor element A is covered with a resin material H.
この構成によれば、コンデンサ自身ないしこの
コンデンサの組み込まれたセツトに何らかの異常
が生じてコンデンサに過大電流が流れても、ヒユ
ーズ金属の溶断によつてコンデンサの発熱、発火
などによる周辺の電子部品への影響を防止するこ
とができるものである。 According to this configuration, even if an abnormality occurs in the capacitor itself or in the set in which this capacitor is incorporated and an excessive current flows through the capacitor, the fuse metal melts and the capacitor generates heat and ignites, causing damage to surrounding electronic components. It is possible to prevent the effects of
［考案が解決しようとする問題点］
しかし乍ら、このコンデンサにおいて、ヒユー
ズ金属Ｇは線状のものが用いられ、第２、第３の
外部電極Ｃ，Ｄに半田付けされるのであるが、こ
の際に、不所望に半田付け時間が長くなつたり、
半田付け温度が高くなつたりすると、ヒユーズ金
属Ｇが溶融し、それの断面積が縮少化されたり、
時には溶断されたりすることがある。このため
に、ヒユーズ金属Ｇによる保護機能が阻害される
という問題がある。[Problems to be solved by the invention] However, in this capacitor, the fuse metal G is wire-shaped and is soldered to the second and third external electrodes C and D. In this case, the soldering time may become undesirably long.
When the soldering temperature becomes high, the fuse metal G melts and its cross-sectional area decreases.
Sometimes it gets fused. For this reason, there is a problem that the protective function of the fuse metal G is inhibited.
それ故に、本案の目的は簡単な構成によつてヒ
ユーズ金属の外部電極への接続時における溶断な
どのトラブルを皆無にできる上、保護機能の信頼
性を高めうる積層セラミツクコンデンサを提供す
ることにある。 Therefore, the purpose of the present invention is to provide a multilayer ceramic capacitor that has a simple structure that can eliminate troubles such as melting when connecting the fuse metal to the external electrode, and can also improve the reliability of the protective function. .
［問題を解決するための手段］
従つて、本案は上述の目的を達成するために、
セラミツク層、内部電極を交互に積層一体化して
なるコンデンサエレメントの両端に外部電極を、
内部電極に対して電気的な接続関係を有するよう
に形成し、一方の外部電極よりコンデンサエレメ
ントの周面上にヒユーズ金属を延在させると共
に、ヒユーズ金属の一部を除くヒユーズ金属及び
外部電極を絶縁層にて被覆し、かつ絶縁層上に導
電層を、絶縁層より露呈するヒユーズ金属に対し
て電気的な接続関係を有するように形成したもの
である。[Means for solving the problem] Therefore, in order to achieve the above-mentioned purpose, the present proposal takes the following measures:
External electrodes are placed on both ends of the capacitor element, which is made by laminating ceramic layers and internal electrodes in an integrated manner.
The fuse metal is formed to have an electrical connection relationship with the internal electrode, and the fuse metal extends from one external electrode onto the circumferential surface of the capacitor element, and the fuse metal and the external electrode except for a part of the fuse metal are The fuse metal is covered with an insulating layer, and a conductive layer is formed on the insulating layer so as to have an electrical connection relationship with the fuse metal exposed from the insulating layer.
［作用］
この考案によれば、外部電極からコンデンサエ
レメントの周面上にヒユーズ金属が蒸着、塗布な
どによつて延在形成され、直接的な加熱処理が伴
なわないために、ヒユーズ金属の不所望な溶融、
溶断を皆無にできる。このために、ヒユーズ金属
の保護機能が損なわれることなく、充分の信頼性
を確保できる。[Function] According to this invention, the fuse metal is formed extending from the external electrode onto the circumferential surface of the capacitor element by vapor deposition, coating, etc., and direct heat treatment is not involved, so that the fuse metal is not damaged. desired melting,
Can completely eliminate fusing. Therefore, sufficient reliability can be ensured without impairing the protective function of the fuse metal.
［実施例］
次に本案の一実施例について第１図〜第２図を
参照して説明する。[Example] Next, an example of the present invention will be described with reference to FIGS. 1 and 2.
図において、１は例えばセラミツクよりなる保
護層間にセラミツク層、内部電極を交互に積層一
体化して構成されたコンデンサエレメントであつ
て、それの両端には第１、第２の外部電極２，３
がそれぞれの内部電極に電気的な接続関係を有す
るように形成されている。そして、第２の外部電
極３よりコンデンサエレメント１の周面上にはヒ
ユーズ金属４が帯状に延在形成されている。この
ヒユーズ金属４としては例えば鉛−錫合金などが
好適し、蒸着、塗布などによつて形成される。そ
して、このヒユーズ金属４の第１の外部電極２側
の端部を除くヒユーズ金属４及び外部電極３上に
は樹脂などの絶縁層５が形成されている。さらに
この絶縁層５上には導電層６が、絶縁層５より露
呈するヒユーズ金属４に対して電気的な接続関係
を有するように形成されている。尚、この導電層
６としては銀ペーストのように半田付け性に優れ
た導電部材にて構成することが好ましい。 In the figure, reference numeral 1 denotes a capacitor element constructed by laminating ceramic layers and internal electrodes alternately between protective layers made of ceramic, and has first and second external electrodes 2 and 3 at both ends.
are formed to have an electrical connection relationship with each internal electrode. A fuse metal 4 is formed extending from the second external electrode 3 onto the circumferential surface of the capacitor element 1 in a band shape. The fuse metal 4 is preferably made of a lead-tin alloy, for example, and is formed by vapor deposition, coating, or the like. An insulating layer 5 made of resin or the like is formed on the fuse metal 4 and the external electrode 3 except for the end of the fuse metal 4 on the first external electrode 2 side. Furthermore, a conductive layer 6 is formed on this insulating layer 5 so as to have an electrical connection relationship with the fuse metal 4 exposed from the insulating layer 5. The conductive layer 6 is preferably made of a conductive material with excellent solderability, such as silver paste.
第３図は本案の他の実施例を示すものであつ
て、第１図〜第２図に示す積層セラミツクコンデ
ンサの第１の外部電極２、導電層６に第１、第２
の外部リード部材７，８が半田付けされており、
さらにコンデンサエレメント１の全周面は樹脂材
９にて被覆されている。 FIG. 3 shows another embodiment of the present invention, in which the first external electrode 2 and the conductive layer 6 of the multilayer ceramic capacitor shown in FIGS.
external lead members 7 and 8 are soldered,
Further, the entire circumferential surface of the capacitor element 1 is covered with a resin material 9.
［考案の効果］
以上のように本案によれば、ヒユーズ金属が外
部電極よりコンデンサエレメントの周面上に延在
形成されており、その際に加熱処理を伴なわない
ために、ヒユーズ金属の溶融、溶断を皆無にでき
る。従つて、ヒユーズ金属による保護機能を高め
ることができる。[Effects of the invention] As described above, according to the present invention, the fuse metal is formed extending from the external electrode onto the circumferential surface of the capacitor element. , completely eliminates fusing. Therefore, the protective function of the fuse metal can be enhanced.
又、ヒユーズ金属はその大部分が絶縁層にて被
覆されているので、プリント板への組み込み時の
半田付けによるヒユーズ金属に対する熱的影響を
緩和できる。 Further, since most of the fuse metal is covered with an insulating layer, the thermal influence on the fuse metal due to soldering during assembly into a printed circuit board can be alleviated.
第１図は本案の一実施例を示す側断面図、第２
図は絶縁層形成前の平面図、第３図は本案の他の
実施例を示す側断面図、第４図は従来例の側断面
図である。
図中、１はコンデンサエレメント、２，３は外
部電極、４はヒユーズ金属、５は絶縁層、６は導
電層である。
Figure 1 is a side sectional view showing one embodiment of the present invention, Figure 2
The figure is a plan view before forming an insulating layer, FIG. 3 is a side sectional view showing another embodiment of the present invention, and FIG. 4 is a side sectional view of a conventional example. In the figure, 1 is a capacitor element, 2 and 3 are external electrodes, 4 is a fuse metal, 5 is an insulating layer, and 6 is a conductive layer.
Claims (1)
てなるコンデンサエレメントの両端に外部電極
を、内部電極に対して電気的な接続関係を有する
ように形成し、一方の外部電極よりコンデンサエ
レメントの周面上にヒユーズ金属を延在させると
共に、ヒユーズ金属の一部を除くヒユーズ金属及
び外部電極を絶縁層にて被覆し、かつ絶縁層上に
導電層を、絶縁層より露呈するヒユーズ金属に対
して電気的な接続関係を有するように形成したこ
とを特徴とする積層セラミツクコンデンサ。 External electrodes are formed at both ends of a capacitor element formed by laminating and integrating ceramic layers and internal electrodes in an electrically connected manner to the internal electrodes, and one external electrode is formed on the circumferential surface of the capacitor element. In addition to extending the fuse metal to A multilayer ceramic capacitor characterized by being formed to have a connection relationship.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16964884U JPH0236265Y2 (en) | 1984-11-07 | 1984-11-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16964884U JPH0236265Y2 (en) | 1984-11-07 | 1984-11-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6185134U JPS6185134U (en) | 1986-06-04 |
| JPH0236265Y2 true JPH0236265Y2 (en) | 1990-10-03 |
Family
ID=30727367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16964884U Expired JPH0236265Y2 (en) | 1984-11-07 | 1984-11-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0236265Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0831393B2 (en) * | 1989-05-29 | 1996-03-27 | 株式会社村田製作所 | Multilayer ceramic capacitor with fuse |
-
1984
- 1984-11-07 JP JP16964884U patent/JPH0236265Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6185134U (en) | 1986-06-04 |
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