JPH0234185B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a structure for mounting a plurality of IC chips on a substrate using a film carrier.

A conventional mounting structure of an IC chip on a board will be explained with reference to FIG.

In the figure, 1 is an IC chip, 2 is a plurality of connection lands formed on this IC chip 1, 3 is a finger lead, 4 is a plurality of wires formed in parallel and meandering on the substrate, and 5 is each wire. This is a terminal lead wire provided at one end of 4.

Each connection land 2 formed on the IC chip 1
and the finger leads 3 are aligned and connected by inner bonding, and each finger lead 3 and the corresponding wiring 4 on the board are aligned and connected by outer bonding. are arranged substantially linearly and mounted at predetermined positions on the wiring 4, respectively.

Note that 6 in the figure indicates a connection point between the finger lead 3 and the wiring 4 on the board.

However, in general, the pitch of wiring formed on a board is rougher than the pitch of connection lands formed on an IC chip, so in the conventional mounting structure described above, the more connections there are for one IC chip, the more There is a problem that the area occupied by the wiring becomes large, and since the terminal lead wire cannot be drawn out from any arbitrary position, there is also a problem that the pitch is small and the wire length becomes long.

The object of the present invention is to obtain a mounting structure in which the area of wiring on a board can be kept to a minimum, common wiring is possible for multiple IC chips, and terminal lead-out lines can be drawn out in short lengths with a large pitch. do.

Therefore, the present invention provides an IC chip mounting structure for mounting a plurality of IC chips by connecting them to wiring on a board, in which the plurality of IC chips are arranged substantially in a straight line. In the upper area, at least one
A plurality of U-shaped wiring blocks are formed by a plurality of connection lands of a different type and a plurality of corresponding wirings, and a plurality of U-shaped wiring blocks corresponding to the plurality of wirings and a plurality of connection lands of the IC chip are formed. Equipped with a film carrier with finger leads,
It is characterized in that a plurality of connection lands of each IC chip are connected to the wiring of the corresponding wiring block through the finger leads of the film carrier, and that adjacent wiring blocks are connected in series by the finger leads.

The plurality of wires formed on the substrate have terminal lead lines.

Further, the connection lands of the IC chip have only a plurality of true connection lands, and the connection lands are connected to the wiring of the corresponding wiring block via the finger leads of the film carrier, or
The connecting land of the IC chip has multiple true connecting lands and multiple dummy connecting lands, and the true connecting lands are connected to the wiring of the corresponding wiring block via the finger leads of the film carrier. In addition, a dummy connection land is connected to the wiring of a wiring block adjacent to the wiring block via the finger lead.

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 2 is a partial plan view showing the first embodiment of the present invention. In the figure, 7 is an IC chip, and 8 is this IC chip.
A plurality of connection lands are formed on the chip 7, 9 is a film, and 10 is a plurality of finger leads formed on the film 9 and having a U-shaped planar shape. Forms the film carrier used in

Reference numeral 11 denotes a plurality of U-shaped wiring blocks formed on the board, each wiring block 11 consisting of a plurality of wires 12 corresponding to the finger leads 10, and a terminal drawn out from any one of these wires 12. Line 13 is drawn out.

Therefore, in this embodiment, each connection land 8 of the IC chip 7 and the finger lead 10 on the film 9 are aligned and connected by inner bonding, and each IC chip 7 is placed substantially straight on the substrate. The finger leads 10 and the wiring 12 of the wiring block 11 are arranged in a meandering pattern on each wiring block 11, and connections are made by outer bonding in the normal arrangement order. In addition, connections are made in the reverse order, and each IC chip 7 is mounted on a substrate, and the wirings 12 of adjacent wiring blocks 11 are connected in series by finger leads 10.

Note that 14 in the figure indicates a connection point between the finger lead 10 and the wiring 12.

As explained above, in the first embodiment, the finger leads formed on the film are connected to the connection lands of the IC chip, and a wiring block consisting of a plurality of short wirings is formed on the substrate. Since the finger leads and the wiring are connected in a meandering manner, the wiring on the board can be kept to a minimum area, and common wiring can be used for multiple IC chips. Because it can be pulled out and formed from any position,
The length of the terminal lead-out wire can be shortened and the pitch can be increased.

In addition, since the row of connection points between the finger leads and the wiring is parallel to the row of connection points between the connection lands on the chip and the finger leads, it is possible to avoid misalignment in the y-axis direction when aligning for connection. There is also the advantage that there is no need to take much consideration and therefore there is no need to make the pitch of the connection points particularly large.

Next, a second embodiment of the present invention will be described with reference to FIG.

FIG. 3 is a partial plan view showing the second embodiment,
In the figure, 15 is an IC chip, 16 is a plurality of connection lands formed on this IC chip 15, 17 is a dummy connection land also formed on the IC chip 15,
18 is a film; 19 is a plurality of finger leads formed on the film 18 and having a U-shaped planar shape; 20 is a plurality of wiring blocks formed on a substrate and has a U-shaped planar shape; and 21 is each wiring block 2.
Wires 0 and 22 are terminal lead lines.

In this example, the IC is
Finger leads 19 in which part or all of the connection lands 16 of the chip 15 are formed on the film 18.
The device is connected to the dummy connection land 17 using the method shown in FIG. Similarly, connect the IC chip 1 using outer bonding.
5 is mounted on a board.

The second embodiment described above is an effective method when the number of connection lands is relatively small compared to the chip size, especially the width of the IC chip, and in addition to obtaining the same effects as the first embodiment, Since the alignment of the finger leads is less likely to be disturbed, there is an advantage that workability when performing outer bonding is good.

As described above with reference to each of the embodiments, the present invention enables common wiring to be obtained for multiple IC chips in a minimum area, and also enables a large number of terminal lead-out lines to be connected from arbitrary positions at large pitches as needed. Moreover, since it can be pulled out in a short length, it is effective as a mounting structure for IC chips in display drive circuits, etc., for example.

[Brief explanation of drawings]

FIG. 1 is a partial plan view showing a conventional IC chip mounting structure, FIG. 2 is a partial plan view showing an embodiment of the IC chip mounting structure according to the present invention, and FIG. 3 is a partial plan view showing another embodiment of the IC chip mounting structure according to the present invention. FIG. 7,15...IC chip, 8,16...Connection land, 9,18...Film, 10,19...Finger lead, 11,20...Wiring block,
12, 21... Wiring, 13, 22... Terminal lead wire, 14... Connection point, 17... Dummy connection land.

Claims (1)

[Scope of Claims] 1. In an IC chip mounting structure for mounting a plurality of IC chips by connecting each to wiring on a substrate, the plurality of IC chips are arranged so as to be substantially lined up in a straight line. A plurality of U-shaped wiring blocks each formed of a plurality of wirings corresponding to a plurality of connection lands of at least one type provided on each IC chip are formed in an area on the substrate, and the wiring blocks are connected to the plurality of wirings and the IC chip. A film carrier is provided with a plurality of U-shaped finger leads corresponding to a plurality of connection lands of each IC chip, and the plurality of connection lands of each IC chip are connected to the wiring of the corresponding wiring block via the finger leads of the film carrier. An IC chip mounting structure characterized in that adjacent wiring blocks are connected in series through these finger leads. 2. The IC chip mounting structure according to claim 1, wherein the plurality of wirings formed on the substrate have terminal lead lines. 3. A patent characterized in that the connecting lands of the IC chip have only a plurality of true connecting lands, and the connecting lands are connected to the wiring of the corresponding wiring block via the finger leads of the film carrier. A mounting structure for an IC chip according to claim 1. 4 The connection land of the IC chip has a plurality of true connection lands and a plurality of dummy connection lands, and the true connection land is connected to the wiring of the corresponding wiring block via the finger lead of the film carrier. 2. The IC chip mounting structure according to claim 1, wherein a dummy connection land is connected to the wiring of a wiring block adjacent to the wiring block via the finger lead.