JPH023299B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a resin molding device, and more particularly to a resin molding device for semiconductors that avoids molding defects of a package.

[Technical background of the invention and its problems] One of the semiconductor manufacturing processes is a resin molding process in which a semiconductor element is molded with resin, and a conventional resin molding device in this process has an upper mold and a lower mold. After the semiconductor element is set in the cavity formed by the upper and lower molds, resin is poured into the pot from the cavity through the resin injection groove, and the resin is poured into the pot. Generally, a plunger attached to a transfer cylinder from a resin sealing device pushes the resin in the pot and press-fits it into the cavity, thereby molding the semiconductor element into the resin.

By the way, it has traditionally been necessary to align the plunger of the resin sealing device with the molded post.
If this alignment is not good, the pot and plunger will rub against each other, causing wear on the pot and plunger, and resin will adhere to the area around the plunger, causing increased wear. Furthermore, due to wear, the molding pressure becomes insufficient, causing fatal defects in the molded package such as resin loss. In order to solve this problem, it is necessary to align the pot and plunger with high precision, and this work has the disadvantage of requiring advanced technology and many years of experience.

[Object of the Invention] The present invention has been made in view of the above-mentioned difficulties, and provides a highly reliable resin encapsulation device for semiconductors in which the plunger is integrated into a mold, thereby making it easy to align the pot and the plunger. This is what I am trying to do.

[Summary of the Invention] The present invention relates to a semiconductor device in which a semiconductor element placed in a cavity formed by an upper mold and a lower mold is molded with resin by pressing resin in a pot with a plunger. In the resin sealing device, a guide post extending vertically is provided at the resin inlet of the pot, a slidable guide plate is provided on the guide post, and a plunger rod to which the plunger is attached is attached to the guide plate. It is characterized by what it did.

[Embodiments of the Invention] Details of the present invention will be described below based on embodiments shown in the drawings.

As shown in the drawing, the molding die of the resin sealing device of the present invention is such that resin (not shown) put into a pot 2 is poured into cavities 1, 1', etc. formed by an upper die and a lower die using a plunger 3. Press cavity 1,
1'... Semiconductor element (not shown) set within
are molded with resin, and guide posts 4, 4'... extending vertically are provided at the resin inlet of the pot 2, and the guide posts 4, 4'...
A guide plate 5 that can freely slide in the vertical direction is provided, and a plunger rod 6 to which a plunger 3 is attached is attached to the guide plate 5, so that the plunger mechanism is integrated into the upper mold.

In the mold type of the resin sealing device having the above configuration, after semiconductor elements are set in the cavities 1, 1', etc. and resin is poured into the pot 2, transfer from the resin sealing device (not shown) is carried out. The plunger 3 is pushed into the pot 2 by lowering the cylinder 7, and the resin in the pot 2 passes through the resin injection groove 8 and is press-fitted into the cavities 1, 1', . . . to mold the semiconductor element. When the molding is completed, the transfer cylinder 7 is released and the plunger 3 is returned to its original position by the springs 9, 9', . . . .

Here, since the plunger mechanism is integrated into the upper mold, the guide posts 4, 4'...
Since the plunger 3 and the pot 2 can be easily aligned, it is no longer necessary to precisely adjust the positions of the mold and the transfer cylinder 7. Therefore, the accuracy of alignment between the plunger and the pot has been improved, and the wear life of the plunger and the pot has been increased five times compared to the conventional method.

[Effects of the Invention] As is clear from the embodiments described above, the present invention eliminates the need for aligning the plunger and pot based on many years of experience and advanced technology, and eliminates the need for alignment work between the plunger and pot due to wear and tear on the plunger and pot. It is possible to completely avoid fatal package defects such as appearance defects due to insufficient resin molding pressure and unfilled defects due to resin defects. Furthermore, the ease of assembling and disassembling the mold increases reliability and ensures safe work.

[Brief explanation of drawings]

The drawing is a front view showing a mold type of a resin sealing device for a semiconductor according to the present invention, including a cross section thereof. 1, 1'... Cavity, 2... Pot, 3... Plunger, 4, 4'... Guide post, 5... Guide plate,
6...Plunger rod, 7...Transfer cylinder, 8...Resin injection groove, 9, 9'...Spring.

Claims (1)

[Claims] 1 In the cavity formed by the upper mold and lower mold,
In a semiconductor resin sealing device that molds a semiconductor element positioned in the cavity with resin by pressing resin introduced into a pot with a plunger, a guide extends vertically to the resin input port of the pot. 1. A resin encapsulation device for a semiconductor, characterized in that a post is provided, a slidable guide plate is provided on the guide post, and a plunger rod to which the plunger is attached is attached to the guide plate.