JPH0230450Y2 - - Google Patents

Description

[Detailed Description of the Invention] "Industrial Application Field" The present invention relates to a seed plate used as a cathode in electrolytic refining of copper, and particularly to a seed plate that can prevent warping and slime adhesion.

"Prior Art" In copper electrolytic refining, it is desirable to charge as many electrodes as possible into an electrolytic cell in order to improve productivity. On the other hand, short circuits between the electrodes must be prevented as much as possible, and the seed plate serving as the cathode is required to have excellent verticality and flatness.

However, this type of seed plate is made by electrodepositing a thin copper plate on the surface of a mother plate made of rolled copper plate or stainless steel, and then peeling off the thin copper plate, so there is no warping or bending caused by this peeling process. must be corrected by some means to improve verticality and flatness.

Conventionally, when performing this straightening, the thin copper plate is pressed into a press mold to form grooves and beads arranged alternately in a cross pattern, lattice pattern, square ring pattern, concentric circle pattern, etc., or by using a roller leveler. A method of forming many parallel beads has been adopted.

``Problems to be solved by the invention'' However, in the case of press-forming beads in the above-mentioned parallel patterns, lattice patterns, square ring patterns, etc.
Since the flatness was insufficient immediately after pressing, it was necessary to manually correct it again, which was a disadvantage in that it was time-consuming. On the other hand, those with concentric beads have the advantage that they have good flatness immediately after pressing and do not require rework. There was a problem in that the slime produced tends to accumulate in this horizontal portion, and this slime is incorporated into the precipitated copper, degrading the quality of the refined copper. Incidentally, this problem also applies to the beads of each of the above-mentioned patterns.

On the other hand, with a seed plate that has been straightened using a roller leveler, the beads are formed in the vertical direction of the seed plate, so slime is less likely to accumulate on the beads, but the roller leveler itself is more expensive than the press equipment described above. However, the drawback was that it required a large amount of money to implement.

"Purpose of the invention" The present invention was made in view of the above circumstances, and an object thereof is to provide a seed plate for electrolytic refining that has high verticality and flatness and has less slime adhesion.

"Means for Solving the Problems" The seed plate for electrolytic refining of the present invention has beads extending horizontally in the upper and lower parts, and the central part is not connected to the horizontal beads and is vertical. The present invention is characterized in that a plurality of beads are formed that extend without interruption only in the direction, and the height of the lower horizontal bead is lower than the height of the other beads.

"Embodiments" Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a plan view showing the pressing surface of a press mold for producing a seed plate according to the present invention, and FIG. 2 is a sectional view of the same mold.

This mold consists of an upper mold 1 and a lower mold 2 arranged oppositely.
At the upper and lower parts of the press surface of the upper die 1, one protrusion 3A and one groove 3B are formed, each extending in the horizontal direction. Further, in the center of the upper mold 1, vertically extending protrusions 4A and grooves 4B are formed alternately at regular intervals, and the parts other than these protrusions 3A, 4A and grooves 3B, 4B are formed. It is considered to be flat. The vertical protrusion 4A and groove 4B are spaced apart from the horizontal protrusion 3A and groove 3B. The reason for this is that when the horizontal and vertical beads of the molded seed plate are connected, distortion occurs in the connected portion due to imbalance of residual stress, causing problems such as warping of the seed plate. Said protrusion 3
The cross section of A and 4A is a gentle arc with a height of about 1 to 4 mm, especially the protrusion 3A at the bottom of the lower mold 2.
The amount of protrusion is slightly lower than that of the other protrusions 3A and 4A. On the other hand, the cross section of each of the grooves 3B and 4B is U-shaped and has a depth substantially equal to the height of the opposing protrusions 3A and 4A.

On the other hand, the protrusion 3 of the upper mold 1 is attached to the lower mold 2 of the mold.
Concave grooves 3B and 4B are located at positions opposite to A and 4A, and protrusions 3 are located at positions opposite to concave grooves 3B and 4B of the upper mold.
A and 4A are formed respectively.

When a thin copper plate A is sandwiched between such a mold and pressed, beads extending horizontally at the upper and lower parts of the thin copper plate A are formed by the protrusions 3A and grooves 3B of the mold, and the protrusions 4A and groove 4
B forms a vertical bead. This equalizes the residual stress in the horizontal and vertical directions inside the seed plate and imparts rigidity, so the flatness of the seed plate is improved and it can be used without having to be manually straightened again. can.

In addition, in the seed plate obtained in this way, horizontal beads to which slime easily adheres are formed only at the upper and lower parts of the seed plate, which reduces the amount of slime incorporated into the deposited copper. It is possible to improve the quality of refined copper. That is, since the upper part of the seed plate is placed in a shallow place within the electrolyte, the amount of slime falling onto the seed plate is small, and even if there is a horizontal bead, slime is difficult to adhere to. In addition, since the amount of copper precipitated at the bottom of the seed plate is small compared to other parts of the seed plate, the thickness of the bottom of the cathode plate, which corresponds to the bead at the bottom of the seed plate, is relatively thin, making it difficult for slime to adhere to it. It is. Moreover,
Since the protruding amount of the bead at the bottom of the seed plate is smaller than the other beads, it becomes even more difficult for slime to adhere to it.

Furthermore, since the mold used for molding this seed plate has linear protrusions 3A, 4A and grooves 3B, 4B formed on the pressing surface, concentric protrusions and grooves are formed. Compared to conventional molds, it has the advantage of being easier to manufacture and cheaper.

In addition, in the seed plate for electrolytic refining described above, the cross section of the bead is a gentle arc shape, but the present invention is not limited to this, and may be U-shaped, V-shaped, U-shaped, etc.

Further, in the seed plate, there was only one horizontal bead on the upper part of the seed plate, but two or more may be formed on the upper part of the seed plate since there is less slime adhesion.

"Effects of the Invention" The seed plate for electrolytic refining of the present invention provides the following excellent effects.

Beads extending in the horizontal and vertical directions equalize residual stress in each direction, provide rigidity, and provide sufficient flatness.
In particular, as a result of forming a plurality of beads that extend only in the vertical direction, vertical warpage, which has been difficult to correct in the past, can be extremely reduced.

Horizontal beads to which slime easily adheres are formed only at the top and bottom of the seed plate, and only beads extending uninterrupted in the vertical direction that can avoid slime adhesion are formed in the central part. Slime does not remain on the beads extending in the vertical direction, and therefore the amount of slime incorporated into the deposited copper can be reduced, and the quality of refined copper can be improved.

The mold used for seed plate molding has linear protrusions and grooves, so it is easier and cheaper to manufacture than conventional molds with concentric protrusions and grooves. is cheap.

Since the protruding amount of the bead at the bottom of the seed plate is smaller than the other beads, it is even more difficult for slime to adhere to it.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing the pressing surface of a press die for producing the seed plate of the present invention, and FIG. 2 is a sectional view of the die. 1...Upper mold, 2...Lower mold, 3A, 4A...Protrusion, 3B, 4B...Concave groove.

Claims (1)

[Scope of utility model registration request] In a flat plate-shaped seed plate for electrolytic refining, beads extending horizontally are formed in the upper and lower parts, respectively, and only a bead in the center part that is not connected to the horizontal beads and extends without interruption in the vertical direction. 1. A seed plate for electrolytic refining, characterized in that a plurality of beads are formed, and the height of the lower horizontal bead is lower than the height of the other beads.