JPH02294059A - Ic package - Google Patents

Abstract

PURPOSE:To prevent the generation of current leak and crosstalk by providing each lead with a plurality of pads for contact. CONSTITUTION:Each IC lead 2 is provided with a plurality of pads 3, 4 for contact. As a result, when measuring contacts come into contact with contact parts 5 at the time of testing electric characteristics, the intervals between contacts can be made wide. Hence mutual interference between the contacts and difficulty of contact arrangement can be avoided even in the case of narrow intervals between the IC leads 2. Thereby, the generation of current leak and crosstalk can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC package, and particularly to the structure of its leads. [Prior art] As shown in Fig. 4, in a conventional IC package, each IC
The structure was such that lead 2 had only one typer 6. [Problems to be Solved by the Invention] The conventional IC package lead described above had a structure in which there was only one tieper 6, as shown in FIG. For this reason, in electrical property tests, the measurement contact is typer 6.
However, as the spacing between the IC leads 2 becomes narrower, the contacts interfere with each other, making it very difficult to arrange the contacts, and electrically causing current leakage. There is also a drawback that crosstalk etc. may occur.

[Means to solve the problem]

The present invention is characterized in that, in an IC package having a plurality of leads, each lead is provided with a plurality of contact pads for electrical property testing. [Example] Next, the present invention will be explained with reference to the drawings. FIG. 1 is a diagram showing a first embodiment of the present invention. In this embodiment, contact pads 3 and 4 are provided for each IC lead 2 protruding from the IC package 1. When testing electrical characteristics after incorporating an IC into such an IC package, the contact portion 5 shown by diagonal lines in FIG.
The measurement contact makes contact.

FIG. 3 is a diagram showing a second embodiment of the present invention. In this embodiment, a plurality of contact pads 3.4 are laid out in a zigzag pattern so as not to interfere with each other. In this embodiment, while the contact pads 3 and 4 are laid out in a zigzag pattern, the contact pads for electrical property testing are also laid out in a zigzag pattern, allowing for a wide gap between the contacts and the resistance added to the contacts. It has the advantage that electrical parts such as capacitors can be easily attached.

〔Effect of the invention〕

As explained above, the present invention provides a plurality of contact pads on each lead of an IC package.
For IC leads whose inter-lead spacing is narrow and shrinking,
This allows for wider spacing between contacts for electrical property testing, which has the effect of reducing current leakage, crosstalk, etc.

[Brief explanation of drawings]

FIG. 1 is a plan view showing the first embodiment of the present invention, FIG. 3 is a plan view showing a second embodiment of the present invention, and FIG. 4 is a plan view showing a conventional I
FIG. 5, which is a plan view showing the C package, is a diagram for explaining the contact positions of the contacts for electrical characteristic testing with respect to the conventional IC package. 1...IC package, 2...IC lead, 3.4
...Contact pad, 5...Contact part of electrical property test contact, 6...Tie bar

Claims (1)

[Claims] An IC package having a plurality of leads, characterized in that each lead is provided with a plurality of electrical property test contact pads.