JPH02268490A - Printed board having storing section - Google Patents

Abstract

PURPOSE:In a printed board on which electronic components are mounted, to promote thinning by providing a recessed or through-hole-shaped storing section in the board burying the whole or one part of the electronic component in the storing section under the conditions that the connection to a wiring pattern is secured. CONSTITUTION:It is so constituted that electronic components may be fixed and supported by the inwall by bringing the dimensions of the storing section 3 close to the outside dimensions of an electronic component 5 as far as possible to surely store the electronic component 5 in a storing section 3 and surely fix it. Or, a jutting-out part 15 is projected to the bottom of a storing section 3 and the component 5 are placed on this jutting-out part 15, and then a lead terminal 8 is extended upward and is connected by solder. Furthermore, to omit processing the electronic component into curvature along the inwall of a recess, etc., inside the storing section 3, the storing section 3 is constituted as a recess which does not penetrate the board 1, and also a wiring pattern 7 is extended from the margin of the storing section 3 to the inwall of the recess and the base 17, and the electrode 20 of the component 5 is placed on the bottom 17, and is soldered by reflow.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a printed circuit board with electronic components mounted thereon, which has a storage section that prevents the mounting height from increasing due to protrusion of the electronic components. Regarding the board.

(Prior Technology) In Tanitane 3 equipment, electrical equipment, etc., piezoelectric devices and capacitors are used in wiring patterns on printed circuit boards. A circuit unit with electronic components mounted on a resistor cap is often used.

When mounting electronic components on a printed circuit board, the terminals of the electronic components are connected to the wiring pattern on the board by soldering by reflow or the like.

By the way, with the trend toward miniaturization of communication equipment, electronic equipment, etc., there is a strong tendency for circuit units formed on printed circuit boards to become smaller and thinner, but the thickness of the circuit unit is dependent on the thickness of the printed circuit board. Since the dimensions are determined by the total dimensions of the design and the mounting height of the components, there was a natural limit to how small and thin conventional circuit units could be made.

(Objective of 9! Ming) The present invention has been made in view of the above, and it is an object of the present invention to prevent an increase in the thickness of the entire printed circuit board due to the mounting height of the components in a printed circuit board on which electronic components are mounted. The purpose of the present invention is to provide a printed circuit board with a thinner housing Z6.

(Summary of the Invention) In order to achieve the object (1), the present invention stores an electronic component in the housing portion of a printed circuit board having a housing portion on the board surface, and also connects the terminal of the electronic component with a pattern on the printed circuit board. It is characterized by the connection of

(Embodiments of the Invention) Hereinafter, the present invention will be described in detail based on embodiments shown in the accompanying drawings.

FIG. 1 is a cross-sectional view showing a first embodiment of the present invention, in which a recess or hole (hereinafter referred to as a storage section) 3 for storage is formed in a location where electronic components are mounted on a printed circuit board 1. After embedding and storing the electronic component 5 in the storage section 3 and ensuring the connection between the wiring pattern 7 around the periphery of the storage section 3 and the electronic component glue end 8, the L door opening of the storage section is closed using hlo. W did +
It has i4 formation. Examples of the electronic components 5 suitable for storing in the storage section 3 of this embodiment include chip type transistors, cylindrical resistors, coils, etc. It becomes possible to reliably reduce the size of the temporary circuit unit.

In FIG. 1, a predetermined gap is left between the illustrated electronics items and the inner wall of the storage section, but in reality, it is preferable to make them as close together as possible.

In this embodiment, in order to reliably fix the electronic component 5 to be stored in the storage section 3, it is necessary to make the internal dimensions of the storage section 3 as close as possible to the external dimensions of the electronic component 5, so that the electronic component 5 is fixedly supported by the inner wall. There is.

Further, the difficulty of fixing due to the dimensional difference between the housing part 3 and the electronic component in the thickness direction of the printed circuit board is always a problem as long as the housing part 3 is a through hole. Then, as the positioning stability of the electronic component 5 decreases, it becomes difficult to properly position the tip of the lead terminal extending from the electronic component to the wiring pattern F, and a connection failure occurs.

In order to eliminate such disadvantages and inconveniences, as shown in FIG. It is effective to extend it upward and connect it with solder. By placing the electronic component 5 on the overhanging portion 150, installation stability can be obtained, and the position (δ) of the lead terminal and the wiring pattern can be ensured during reflow.

L2 In each embodiment, electronic components with lead terminals are stored in storage section 3.
Since the lead terminal is stored inside the recess, it is necessary to bend the lead terminal into a bent shape along the inner wall of the recess, etc., but if this processing step can be omitted, the manufacturing configuration can be further simplified. can be achieved.

That is, FIG. 3 is characterized in that the housing part 3 is configured as a recess that does not penetrate the printed circuit board 1, and the wiring pattern 7 is extended from the peripheral edge of the housing part 3 to the inner wall of the recess and the bottom surface 17L. , wiring pattern 7 on bottom surface 17
By placing the electrode 20 of the electronic component 5 as a chip component thereon and soldering it by reflow, it is possible to omit the pressurizing cage for the lead terminal.

When the storage section 3 is configured as a recess as shown in FIG. 3, electronic components 1 other than chip components, such as DP (Dual
It is also possible to store In1ine Package). That is, the lead terminal 8 of the DIP 5 as shown in FIG. 4fa) is cut at the position of the arrow Δ to make it shorter, and the main body of the DIR5 is seated on the bottom surface of the storage section 3 as shown in FIG. 4(b). By doing so, the amount of protrusion of the DIP 5 can be shortened and a reduction in thickness can be achieved.

FIG. 5 shows an example of the configuration of a printed circuit board that accommodates cylindrical electronic components 5 such as coils, cylindrical resistors, and electrolytic capacitors. By aligning and seating the bottom surface of the electronic component in the housing portion 3, the thickness L of the printed circuit board together with the height of the component can be reduced.

In addition, in the type 1j shown in FIGS. 1 to 3, there is a step 2 on the periphery of the opening of the recess 3 as shown in FIG.
5, and by placing four lids 10 on these steps 25'', the protrusion of the lid 10 can be eliminated.

(Effects of the Invention) As explained above, according to the present invention, in a printed circuit board on which electronic components are mounted, a recess or a through-hole-shaped storage section is provided in the printed circuit board to ensure connection with a wiring button. Since the entire electronic component or part of the electronic component is buried in the housing section, it is possible to prevent the overall thickness of the printed circuit board from increasing due to the mounting height of the component and realize an I-shaped configuration. can.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing the first embodiment of the present invention, FIG. 2 is a sectional view showing the structure of the second embodiment, and FIG. 3 is a sectional view showing the structure of the third embodiment. FIG. 4(b) is an explanatory diagram of electronic components used in the fourth embodiment and their storage state, FIG. 5 is an explanatory diagram of the configuration of the fifth embodiment, and FIG. 6 is an explanatory diagram of the sixth embodiment. It is an explanatory diagram of... Printed circuit board S3... Storage section (recess, hole)
5...Electronic components 7...Wiring pattern 8...
Leat terminal 10... Algae 5... Overhanging part 17
...Bottom Patent Applicant Togamma 6 Tsushinki Co., Ltd. Agent Ju Ben Umi Hitoshi Suzuki Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6

Claims (4)

[Claims] (1) A printed circuit board having a storage section on the board surface, and an electronic component is stored in the storage section of the printed circuit board, and the terminal of the electronic component is connected to a pattern on the printed circuit board. substrate. (2) A printed circuit board having a storage section according to claim 1, wherein a step for supporting the electronic component is provided in the storage section. (3) A print having a storage portion according to claim 2, wherein a wiring pattern is formed to extend from the peripheral edge of the storage recess to the step to connect the terminal of the electronic component. substrate. (4) A printed circuit board having a storage section according to any one of claims 1 to 3, wherein the storage section is sealed.