JPH02235305A - Chip component - Google Patents

Abstract

PURPOSE:To make the title chip component compact and thin while enhancing the dimensional precision and mount-soldering precision by a method wherein a metallic plate electrode of a sealed part element is led out of an exterior resin side end and then covered with a conductive paste. CONSTITUTION:A metallic plate terminal 2a, etc., of a drum core 1 of a part element sealed with an exterior resin 4 is led out of the side of the resin 4 which is covered with a conductive paste 5 so as to form a metallic plate terminal 2a. In such a constitution, the metallic late terminal 2a covered with the conductive paste 3 can be structured without bending it with spring back process, etc., so that a chip component may be made compact and thin in high dimensional precision and mount-soldering precision.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention provides a chip component that is used in various electronic devices such as videos and televisions, and is especially suitable for recent high-density mounting and surface mounting.

Conventional technology For example, a conventional inductor has a structure as shown in FIG. In FIG. 3, an ultra-fine conducting wire is wound around the winding groove of a drum core 21 mainly made of sintered ferrite, and a coil 23 is connected to a pair of metal plate terminals 22! L and 22b are fixed, and the lead portion of the coil 23 is electrically connected to each of the metal plate terminals 22a and 22b to form a coil element.
This coil element was integrally molded with an exterior resin 24, and metal plate terminals 22a and 22b led out from the side of the exterior resin 24 were bent from the side of the exterior resin 24 along the bottom surface to serve as terminals for connection to an external circuit.

Problems to be Solved by the Invention In the chip component configured as described above, the metal plate terminals 22a and 22b led out from the side surface of the exterior resin 24 are bent twice along the exterior resin 24 from the side surface to the bottom surface. Electrodes with processing were the mainstream.

However, in the above configuration, it is difficult to make the metal plate terminal 221L thinner due to structural constraints, etc.
, 22b after bending, resulting in poor dimensional accuracy, and since the electrode portions are only on the side and bottom surfaces, the solderability during mounting is also unstable.

It is an object of the present invention to eliminate such drawbacks of conventional chip components, to provide a chip component that can be made smaller and thinner, and has good dimensional accuracy and mounting soldering accuracy.

Means for Solving the Problems In order to solve the above problems, the present invention leads the electrodes of a sealed component element through a metal plate to the end of the side surface of the exterior resin, and covers the entire side surface of the exterior resin with a conductive paste. Alternatively, you can use it as a terminal for connecting to an external circuit, or lead the electrode of the sealed component element to the edge of the side of the exterior resin through a metal plate, and cover the entire side of the resin exterior with conductive paste to connect it to the external circuit. It is configured to serve as a connection terminal.

The chip component of the present invention, which has the above-mentioned means, has a conductive paste covering the entire side surface of the exterior resin and uses it as a terminal for connection to an external circuit, thereby increasing the electrode area and eliminating the need for bending on the bottom surface. Therefore, the springback phenomenon caused by bending the metal plate can also be eliminated, improving dimensional accuracy.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings. FIG. 1 is a semi-transparent perspective view of a chip inductor in one embodiment of the present invention.

In FIG. 1, a pair of metal plate terminals 21L and 2b are fixed by applying a heat-resistant adhesive such as epoxy to one brim of a drum core 1 made of a magnetic or non-magnetic material.

The winding groove of the drum core 1 has a wire diameter of φ0.02 to φ. Coil 3 is provided by winding a 0.07 coated copper wire a predetermined number of times.
Each of the lead portions (not shown) is connected to the metal plate terminal 21L.
, 2blC are electrically connected to form a coil element.

This coil element is integrally molded with an insulating resin material such as epoxy or diallyl, and the metal plate terminals 21 and 2b protruding from the side surface of the exterior resin 4 are cut at the side edge of the exterior resin 4, and the entire side surface of the exterior resin 4 and A chip component is constructed in which an instantaneous or baking conductive paste 6 is applied nearby to serve as a terminal for connection to an external circuit.

In other words, by cutting the metal plate terminals 21L and 2b at the side edges of the exterior resin 4 and applying conductive paste 5 to the entire side surface of the exterior resin 4 and its vicinity, the metal plate terminals 21L and 2b are cut.
, 2b and the conductive paste 6, the conductive paste 6 becomes a terminal for connection to an external circuit. Furthermore, by applying the conductive paste 6 to the entire side surface of the exterior resin 4 and its vicinity, the six surfaces of the exterior resin 4, including the side, top and bottom, and front and rear surfaces, become terminals for connection to external circuits, making it easy to connect the components during mounting. There is no need to think about direction.

In addition, since there is no bending on the bottom surface of the exterior resin 4 of the metal plate terminals 2t, 2b, there is no springback of the metal plate terminals 21L, 2b, improving dimensional accuracy, and making it possible to make the product smaller and thinner. becomes.

FIG. 2 is a semi-transparent perspective view showing another embodiment of the chip component according to the present invention, in which 6 is a drum core made of a magnetic or non-magnetic material, and the drum core 6 is connected to a pair of metal plate terminals 7a, It is fixed to the wire diameter φo. 02~φ0.07
Coated copper wire up to the coil 8 is wound around the winding groove of the drum core 6.
The lead part of the coil 8 and a pair of metal plate terminals 7m are provided.
, 7b are electrically connected to form a coil element. The coil element is integrally molded with an insulating resin material to form an exterior resin 9.

Metal plate terminals 71L, 7b led out from the exterior resin 9
is cut and bent along the side surface of the exterior resin 9.

Conductive paste 1 is applied to the entire side surface of exterior resin 9 and its vicinity.
0 and use it as a terminal for connection to an external circuit.

As in this embodiment, by bending the metal plate terminals 71L and 7b along the side surface of the exterior resin 9 and applying conductive paste 10 to the side surface of the exterior resin 9 and the vicinity thereof, the metal plate terminal 71L and 7b are bent.
l! Electrical bonding is established between L, 7b and the conductive paste 10, increasing the contact area between them and improving the bonding reliability between them.

The following effect K is the same as the effect explained in FIG.

In the chip component of the present invention, which has a configuration that exceeds the effects of the invention, the electrode area is expanded by covering the entire side surface of the exterior resin with conductive paste, leading to improved soldering reliability during mounting. In addition, since there is no bending of the electrode plate terminals on the bottom surface of the exterior resin, there is no occurrence of springback or the like due to bending, which improves dimensional accuracy and makes it possible to make the device smaller and thinner.

Furthermore, there are six terminal surfaces for connection to an external circuit: the exterior resin side, the top bottom surface, and the front and back surfaces, so there is no need to consider the orientation of the components during mounting. Furthermore, since the connection terminals to the external circuit and the internal electrodes are not integrated, stress after mounting has less direct effect on the component elements, improving product reliability.

It has the above-mentioned advantages and is of great industrial value.

[Brief explanation of the drawing]

FIG. 1 is a semi-transparent perspective view showing one embodiment of the chip component of the present invention, FIG. 2 is a semi-transparent perspective view showing another embodiment of the present invention, and FIG. 3 is a half-sectional view of a conventional chip inductor. It is. 1, 6...Drum core, 2 & , 2b, 7
a, 7b...Metal plate terminal, 3.8...
・Coil, 4.9...Exterior resin, 5.1o...
...Conductive paste.

Claims (2)

[Claims] (1) A chip component in which the electrode of a component element sealed with an insulating resin is guided to the end of the side surface of the exterior resin through a metal plate, and the entire side surface of the exterior resin is covered with conductive paste to serve as a terminal for connection to an external circuit. (2) Bend the lead-out metal plate terminal on the side of the exterior resin,
The chip component according to claim 1, wherein the entire side surface of the exterior resin is covered with a conductive paste.