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JPH02213714A - Substrate mounting structure for position detecting sensor - Google Patents

Substrate mounting structure for position detecting sensor

Info

Publication number
JPH02213714A
JPH02213714A JP3573989A JP3573989A JPH02213714A JP H02213714 A JPH02213714 A JP H02213714A JP 3573989 A JP3573989 A JP 3573989A JP 3573989 A JP3573989 A JP 3573989A JP H02213714 A JPH02213714 A JP H02213714A
Authority
JP
Japan
Prior art keywords
substrate
case
slider
cover
detection sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3573989A
Other languages
Japanese (ja)
Other versions
JPH07104176B2 (en
Inventor
Minoru Fujioka
稔 藤岡
Akira Kondo
晃 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Priority to JP3573989A priority Critical patent/JPH07104176B2/en
Publication of JPH02213714A publication Critical patent/JPH02213714A/en
Publication of JPH07104176B2 publication Critical patent/JPH07104176B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)

Abstract

PURPOSE:To prevent the positional deviation of a substrate by a temp. change by setting the position where the substrate is mounted to a case in proximity to the position where a slider and the case are mounted. CONSTITUTION:The slider 45 moves toward a cover 3 side while compressing a coil spring 5, when an object to be measured comes into contact with the front end 43a of a pin 43 for operating a movable member and moves further near to a sensor. A contact part 41a of a brush 41 on the resistor surface 1a of the substrate 1 moves together with the slider 4 and changes the resistance value of the substrate 1. Both the substrate 1 and the slider 4 are assembled to the case 2 side independently from the cover and the generation of an error by the fluctuation in the assembly position of the case 2 and the cover 3 is obviated. A stopper part 2d with which the substrate 1 comes into contact and an end face 21a of a bushing 21 with which the slider 4 comes into contact are in proximity to each other and, therefore, there is substantially no influence of the size change of the case 2 by the temp. change.

Description

【発明の詳細な説明】 「産業上の利用分野」 本発明は、被検出物の位置に応じて抵抗値の変化する位
置検出センサに関し、詳しくは前記位置検出センサの内
部における基板の取付構造に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a position detection sensor whose resistance value changes depending on the position of an object to be detected, and more particularly relates to a mounting structure of a substrate inside the position detection sensor. .

「従来の技術」 従来の位置検出センサにおける基板の取付構造について
、第7図を参照して説明する。
"Prior Art" A mounting structure for a substrate in a conventional position detection sensor will be described with reference to FIG.

基板1はセラミック等の脆性材料によってなり、抵抗体
面1aを有する。基板1の端部1bは、ケース2の内部
を閉塞するカバー3の内側に片持ちはり状に接合されて
いる。摺動子4は、スライダ45と操作ピン43とが一
体にモールドされてなり、ケース2に摺動自在に保持さ
れている。スライダ45にはブラシ41が固着されてい
る。ブラシ41の先端には接触部41aが設けられ、こ
の接触部41aが抵抗体面1aを摺動して基板lの抵抗
値が変化する0図示しない被検出物が操作ピン43の先
端部43aに当接して、さらにセンサに近接すると、ス
ライダ45がコイルばね5を圧縮してカバー3側に向か
って移動する。
The substrate 1 is made of a brittle material such as ceramic, and has a resistor surface 1a. An end portion 1b of the substrate 1 is cantilevered to the inside of a cover 3 that closes off the inside of the case 2. The slider 4 is formed by integrally molding a slider 45 and an operation pin 43, and is slidably held in the case 2. A brush 41 is fixed to the slider 45. A contact portion 41 a is provided at the tip of the brush 41 , and this contact portion 41 a slides on the resistor surface 1 a to change the resistance value of the substrate l. When the slider 45 comes into contact with the sensor and approaches the sensor, the slider 45 compresses the coil spring 5 and moves toward the cover 3 side.

「発明が解決しようとする問題点」 上記の構成による、従来の位置検出センサにおける基板
の取付構造では、基板1はカバー3に接合され、摺動子
4はケース2に保持されている。
"Problems to be Solved by the Invention" In the conventional substrate mounting structure for a position detection sensor having the above configuration, the substrate 1 is joined to the cover 3 and the slider 4 is held by the case 2.

このため基板1と摺動子4とは、カバー3とケース2と
の組付のばらつきによる影響をそのまま受け、個々のセ
ンサ間のばらつきが避けられないという問題点があった
For this reason, the substrate 1 and the slider 4 are directly affected by variations in assembly between the cover 3 and the case 2, and there is a problem in that variations between individual sensors are unavoidable.

また、基板1の接合位置と摺動子4の保持位置とが離れ
ているため、温度変化による、基板1゜摺動子4.ケー
ス2等、熱膨張率が異なるとともに伸縮の基準位置も大
きく異なる各部品の寸法変化によって、高温時と低温時
とでは接触部41aと抵抗体面1aとの相対位置がずれ
、大きな誤差が発生するという問題点があった。
In addition, since the bonding position of the substrate 1 and the holding position of the slider 4 are far apart, temperature changes may cause the substrate 1 and the slider 4 to move. In case 2, etc., the relative position of the contact portion 41a and the resistor surface 1a deviates between the high temperature and low temperature due to the dimensional change of each component, which has a different coefficient of thermal expansion and a large difference in the reference position of expansion and contraction, resulting in a large error. There was a problem.

そして、脆性材料によってなる基板1がカバー3に片持
ちはり状に接合されているため、温度変化により基板1
とカバー3との熱膨張率の違いのために発生する熱変形
のため、基板1の位置がずれるという問題点があった。
Since the substrate 1 made of a brittle material is joined to the cover 3 in a cantilever shape, the substrate 1
There was a problem in that the position of the substrate 1 was shifted due to thermal deformation caused by the difference in coefficient of thermal expansion between the cover 3 and the cover 3.

本発明は以上の問題点に鑑みてなされたものであり、組
立によって個々のセンサ間のばらつきが少なくなり、温
度変化による誤差が少なくなるような、位置検出センサ
の基板取付構造を提供することを第一の課題とする。
The present invention has been made in view of the above problems, and it is an object of the present invention to provide a substrate mounting structure for a position detection sensor, which reduces variations between individual sensors through assembly and reduces errors due to temperature changes. This should be the first issue.

また、本発明は、温度変化による基板の位置ずれを防止
できるような、位置検出センサの基板取付構造を提供す
ることを第二の課題とする。
A second object of the present invention is to provide a substrate mounting structure for a position detection sensor that can prevent displacement of the substrate due to temperature changes.

「課題を解決するための手段および作用」上記第一の課
題を解決するための本発明の位置検出センサの基板取付
構造は、抵抗体面を有する基板と、前記抵抗体面を摺動
して前記基板の電気抵抗を変える接触部を有する摺動子
と、該摺動子を摺動自在に保持するケースと、該ケース
内を閉塞するカバーとを備え、前記基板と摺動子との相
対位置に応じた抵抗値を示す位置検出センサの基板取付
構造において、前記基板がケースに取付けられ、その取
付位置を前記摺動子とケースとの取付位置に近接させた
ことを特徴とする。
"Means and Effects for Solving the Problem" A substrate mounting structure for a position detection sensor according to the present invention for solving the first problem described above includes a substrate having a resistor surface, and a mounting structure for sliding the resistor surface on the substrate. A slider having a contact portion that changes the electrical resistance of the substrate, a case that slidably holds the slider, and a cover that closes the inside of the case, the slider having a contact portion that changes the electrical resistance of the substrate, and a cover that closes the inside of the case. In the substrate mounting structure for a position detection sensor that exhibits a corresponding resistance value, the substrate is attached to a case, and the mounting position thereof is located close to the mounting position of the slider and the case.

上記構成によれば、基板と摺動子とがいずれもケースに
取付けられているから、基板と摺動子との相対位置のば
らつきは、ケースの成形時における寸法のばらつきによ
る影響を受けるのみとなり、ケースとカバーの組付位置
のばらつきによる影響は受けなくなる。
According to the above configuration, since both the board and the slider are attached to the case, variations in the relative positions of the board and the slider are only affected by variations in dimensions during molding of the case. , it is no longer affected by variations in the assembly position of the case and cover.

また、基板とケースの取付位置を、摺動子とケースの取
付位置に近接させているので、温度変化によるケースの
寸法変化の影響を少なくできる。
Furthermore, since the mounting position of the board and the case is located close to the mounting position of the slider and the case, the influence of dimensional changes in the case due to temperature changes can be reduced.

また、基板と摺動子は、ともにケース側の取付部を基準
位置として膨張、収縮するので、温度変化による誤差は
両者の熱膨張率の違いのみに起因する。
Further, since both the substrate and the slider expand and contract with the mounting portion on the case side as the reference position, errors due to temperature changes are caused only by the difference in coefficient of thermal expansion between the two.

次に、前記第二の課題を解決するための本発明の位置検
出センサの基板取付構造は、前記基板がばね部材により
ケースに押圧されるとともに、前記基板とばね部材とは
、基板に設けられた係合穴と、ばね部材に設けられ前記
係合穴に係合する爪とにより、互いに位置決めされるこ
とを特徴とする。
Next, in the substrate mounting structure of the position detection sensor of the present invention for solving the second problem, the substrate is pressed against the case by a spring member, and the substrate and the spring member are provided on the substrate. They are characterized in that they are positioned relative to each other by an engaging hole provided in the spring member and a pawl that is provided in the spring member and engages with the engaging hole.

上記構成によれば、基板とケースとが接合されてはおら
ず、それぞれ伸縮可能であり、熱膨張率の差による熱応
力の発生が防止され、基板の割れが防止される。また外
部の衝撃がばね部材により緩和されるため、基板の割れ
が防止される。そして、ばね部材と基板とは互いに位置
決めされ、ずれが防止されている。
According to the above configuration, the board and the case are not joined to each other and can be expanded and contracted, so that generation of thermal stress due to a difference in coefficient of thermal expansion is prevented, and cracking of the board is prevented. Furthermore, since external impact is alleviated by the spring member, cracking of the board is prevented. The spring member and the substrate are positioned relative to each other and are prevented from shifting.

「実施例」 以下本発明の実施例につき図面を参照して説明する。"Example" Embodiments of the present invention will be described below with reference to the drawings.

第1図は本発明の実施例である位置検出センサの主要部
を示す断面図、第2図はカバーをはずした状態を示す左
側面図、第3図は右側面図、第4図は基板とばね部材と
を示す斜視図である。
Figure 1 is a sectional view showing the main parts of a position detection sensor according to an embodiment of the present invention, Figure 2 is a left side view with the cover removed, Figure 3 is a right side view, and Figure 4 is a board. It is a perspective view showing a spring member.

この位置検出センサは、基板1.板ばね6.摺動子4.
ケース2.カバー3等を備え、取付面2aを図示しない
被検出物の固定部材に取付けて基準とし、図示しない被
検出物の移動部材を操作ビン43の先端部43aに当接
させて、その位置を検出するものである。
This position detection sensor consists of a substrate 1. Leaf spring 6. Slider 4.
Case 2. It is equipped with a cover 3, etc., and the mounting surface 2a is attached to a fixed member of the object to be detected (not shown) as a reference, and a moving member of the object to be detected (not shown) is brought into contact with the tip 43a of the operation bottle 43 to detect its position. It is something to do.

ケース2は合成樹脂等の絶縁材料によってなり、基板1
.板ばね6.摺動子4.およびコイルばね5を開口部2
b側より装着し、ターミナル7、該ターミナル7に接続
されるリード線71.および該リード線71をまとめる
グロメット73を取付面2a側より装着するようになっ
ている。ケース2には、ブツシュ21が固着されている
。第2図に示すようにケース2には装着fR2cが対向
的に2箇所設けられて、その奥にはストッパ部2dが形
成されている。
The case 2 is made of an insulating material such as synthetic resin, and the case 2 is made of an insulating material such as synthetic resin.
.. Leaf spring 6. Slider 4. and coil spring 5 to opening 2
A terminal 7 is installed from the b side, and a lead wire 71 is connected to the terminal 7. A grommet 73 for collecting the lead wires 71 is attached from the mounting surface 2a side. A bushing 21 is fixed to the case 2. As shown in FIG. 2, mounting fR2c is provided at two opposing locations in the case 2, and a stopper portion 2d is formed at the back of the mounting fR2c.

基板1はセラミック等の脆性材料によってなり、その−
面に抵抗体面1aが形成されている。基板1は装着溝2
Cをガイドとして、開口部2b側から、端部1bがスト
ッパ部2dに当接するように装着されている。第4図に
示すように、基板1には端部1bの近傍に211I所の
係合穴ICが穿設されている。
The substrate 1 is made of a brittle material such as ceramic, and its -
A resistor surface 1a is formed on the surface. Board 1 has mounting groove 2
Using C as a guide, it is mounted from the opening 2b side so that the end 1b abuts against the stopper 2d. As shown in FIG. 4, an engagement hole IC at 211I is bored in the substrate 1 near the end 1b.

板ばね6は略円弧状断面に曲げられ、一端に2箇所の爪
6aが立上げられている。板ばね6は基板1とともにケ
ース2に装着されるが、このとき係合穴ICに爪6aが
係合して、板ばね6が基板1に対してずれないようにな
っている。ケース2に装着後、板ばね6は円弧状断面の
外径側がケース2の内壁に当接し、基板1を弾性的に支
持する。
The leaf spring 6 is bent into a substantially arcuate cross section, and has two pawls 6a raised at one end. The leaf spring 6 is attached to the case 2 together with the board 1, but at this time, the claw 6a engages with the engagement hole IC to prevent the leaf spring 6 from shifting with respect to the board 1. After being attached to the case 2, the outer diameter side of the arc-shaped cross section of the leaf spring 6 contacts the inner wall of the case 2, and elastically supports the board 1.

摺動子4は、スライダ45.ブラシ41.および操作ピ
ン43が接合されて一体となっている。
The slider 4 includes a slider 45. Brush 41. and an operation pin 43 are joined to form a single unit.

スライダ45と操作ピン43とは一体にモールドされて
いる。操作ピン43はブツシュ21に移動自在に嵌合さ
れ、スライダ45はコイルばね5によりブツシュ21側
に向けて付勢されている。ブラシ41は弾性を有する導
電材料によってなり、スライダ45の突出部45aに固
着され、接触部41aに向けて二股に分岐している。接
触部41aは摺動子4とともに移動し、基板1の抵抗値
を変化させる。基板1はラグターミナル75.ターミナ
ル7によってリード線71に接続され、このリード線7
1により出力が取り出される。
The slider 45 and the operation pin 43 are integrally molded. The operating pin 43 is movably fitted into the bushing 21, and the slider 45 is urged toward the bushing 21 by the coil spring 5. The brush 41 is made of an elastic conductive material, is fixed to the protruding portion 45a of the slider 45, and is bifurcated toward the contact portion 41a. The contact portion 41a moves together with the slider 4 and changes the resistance value of the substrate 1. The board 1 is a lug terminal 75. Connected to lead wire 71 by terminal 7, this lead wire 7
1, the output is taken out.

ケース2に各部品が装着され、ターミナル7の舌片7a
とラグターミナル75とが溶接等により接合された後、
カバー3が取付けられる。このとき、ケース2の開口部
2bに設けられた溝2eに装着されるOリング22によ
りケース2の内部が密閉される。
Each part is attached to the case 2, and the tongue piece 7a of the terminal 7
After the and lug terminal 75 are joined by welding or the like,
Cover 3 is attached. At this time, the inside of the case 2 is sealed by the O-ring 22 installed in the groove 2e provided in the opening 2b of the case 2.

「作動」 次に、上記構成の作動について説明する。"Operation" Next, the operation of the above configuration will be explained.

図示しない被測定物が可動部材操作ビン43の先端部4
3aに当接して、さらにセンサに近接すると、スライダ
45がコイルばね5を圧縮しながら、カバー3側に向か
って移動する。基板1の抵抗体面1a上におけるブラシ
41の接触部41aは摺動子4とともに移動し、基板1
の抵抗値を変化させる。
The object to be measured (not shown) is the tip 4 of the movable member operating bin 43.
3a and further approaches the sensor, the slider 45 moves toward the cover 3 while compressing the coil spring 5. The contact portion 41a of the brush 41 on the resistor surface 1a of the substrate 1 moves together with the slider 4, and
change the resistance value of

このような本実施例による位置検出センサでは、基板1
と摺動子4とが、ともにカバーとは独立してケース2側
に組付けられており、ケース2とカバー3の組付は位置
のばらつきによる誤差は発生しなくなっている。
In the position detection sensor according to this embodiment, the substrate 1
and slider 4 are both assembled to the case 2 side independently of the cover, and errors due to positional variations no longer occur when assembling the case 2 and cover 3.

また、基板1が当接するストッパ部2dと、摺動子4が
当接するブツシュ21の端面21aとが近接しているの
で、温度変化によるケース2の寸法変化の影響を受けに
くくなっている。
Furthermore, since the stopper portion 2d, which the substrate 1 contacts, and the end surface 21a of the bushing 21, which the slider 4 contacts, are close to each other, the case 2 is less susceptible to dimensional changes due to temperature changes.

そして、基板1と摺動子4のスライダ45とは、温度変
化に際して、ストッパ部2dあるいはブツシュ21の端
面21a側を基準に同一方向に向かって膨張あるいは収
縮する。従って、基板1とスライダ45の寸法変化が相
殺され、誤差は基板1とスライダ45との熱11張率の
差によるわずかな寸法となる。
The substrate 1 and the slider 45 of the slider 4 expand or contract in the same direction with respect to the stopper portion 2d or the end surface 21a of the bush 21 as a reference when the temperature changes. Therefore, the dimensional changes between the substrate 1 and the slider 45 are canceled out, and the error becomes a slight dimensional error due to the difference in thermal elongation between the substrate 1 and the slider 45.

基板1はケース2に対して、板ばね6により弾性的に支
持されており、温度変化の際、熱膨張率の違いにより基
板1とケース2の寸法変化が異なっても、熱応力が発生
することはない、また本実施例によれば、略長方形の基
板1がケース2に対向的に設けられた2箇所袋着711
12cに装着されているので、当接部分の面積が増大さ
れ、面積あたりの衝撃荷重が減少されるようになってい
る。
The board 1 is elastically supported with respect to the case 2 by a leaf spring 6, and thermal stress is generated even if the dimensions of the board 1 and the case 2 differ due to differences in thermal expansion coefficients when the temperature changes. According to this embodiment, the substantially rectangular substrate 1 is provided in two places in the bag 711 facing the case 2.
12c, the area of the contact portion is increased and the impact load per area is reduced.

「他の実施例」 本発明は上記実施例の細部にまで限定されるものではな
く、例えば、第5図、第6図に示すように、ケース2に
設けられる装着溝2Cの開口部2b側に突出部2fを設
けるのであってもよい。
"Other Embodiments" The present invention is not limited to the details of the above embodiments. For example, as shown in FIGS. 5 and 6, the opening 2b side of the mounting groove 2C provided in the case 2 The protruding portion 2f may be provided in the protruding portion 2f.

このようにすれば、装着後の基板1が突出部2fに当接
して抜けにくくなる。また基板1の開口部2b側の端部
が突出部2fを通過したか否かを判断することによって
、基板1がストッパ部2dに当接する位置に正しく装着
されたかどうかを確認できるので、自動組立の際の不良
品検出手段として有効である。
This makes it difficult for the mounted board 1 to come into contact with the protrusion 2f and come off. Furthermore, by determining whether or not the end of the board 1 on the opening 2b side has passed through the protrusion 2f, it is possible to check whether the board 1 is correctly attached to the position where it contacts the stopper part 2d. It is effective as a means of detecting defective products when

「発明の効果」 以上述べたように、本発明の位置検出センサの基板取付
構造では、基板と摺動子との相対位置のばらつきが、ケ
ースの成形誤差のみに依存し、ケースに対するカバーの
組付位置の影響を受けないので、精度が向上するととも
に、製造時にカバーの組付位置精度をラフにできるとい
う効果がある。
"Effects of the Invention" As described above, in the substrate mounting structure of the position detection sensor of the present invention, the variation in the relative position between the substrate and the slider depends only on the molding error of the case, and the assembly of the cover with respect to the case Since it is not affected by the attachment position, the accuracy is improved and there is an effect that the accuracy of the assembly position of the cover can be made rough during manufacturing.

また、基板とケースの取付位置を、摺動子とケースとの
取付位置に近接させているので、温度変化番こよるケー
スの寸法変化の影響を受けにくくなる。基板と摺動子は
、ともにケース側の取付部が基準位置となってカバ一方
向に膨張あるいは収縮するので、温度変化による誤差は
両者の熱m張率の違いによるわずかな値になるという効
果がある。
Furthermore, since the mounting position of the board and the case is located close to the mounting position of the slider and the case, the case is less susceptible to dimensional changes due to temperature changes. Since both the substrate and the slider expand or contract in one direction of the cover with the mounting part on the case side serving as the reference position, the error due to temperature changes is a small value due to the difference in thermal elongation of the two. There is.

また、第2の発明による位置検出センサの基板取付構造
では、基板とケースとがそれぞれ伸縮可能であって、熱
応力の発生が防止されるとともにばね部材により外部か
らの衝撃が吸収されるので、基板の割れが防止されると
いう効果がある。
In addition, in the substrate mounting structure of the position detection sensor according to the second invention, the substrate and the case are each expandable and contractible, preventing the generation of thermal stress and absorbing external shocks by the spring member. This has the effect of preventing the substrate from cracking.

そして、ばね部材と基板とが互いに位置決めされている
から、ケースへの組付時にはいずれか一方のみを押し込
むことにより、ばね部材と基板とを装着できる。
Since the spring member and the board are positioned relative to each other, the spring member and the board can be attached by pushing only one of them when assembling the case.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の実施例である位置検出センサを示す断
面図、第2図は前記位置検出センサの左側面図、第3図
は前記位置検出センサの右側面図、第4図は基板とばね
部材とを示す斜視図、第5図は本発明の他の実施例であ
る位置検出センサを示す断面図、第6図はその左側面図
、第7図は従来の位置検出センサを示す断面図である。 100.基板、 la、、、抵抗体面、・ lc、、、
係合穴、 201.ケース、 411.摺動子、 41
a。 8.接触部、 611.板ばね、 6a、、、爪。 第4図 第 図 第 図
FIG. 1 is a sectional view showing a position detection sensor according to an embodiment of the present invention, FIG. 2 is a left side view of the position detection sensor, FIG. 3 is a right side view of the position detection sensor, and FIG. 4 is a board FIG. 5 is a sectional view showing a position detection sensor according to another embodiment of the present invention, FIG. 6 is a left side view thereof, and FIG. 7 is a conventional position detection sensor. FIG. 100. Substrate, la, , resistor surface, lc,...
Engagement hole, 201. Case, 411. Slider, 41
a. 8. Contact portion, 611. Leaf spring, 6a...claw. Figure 4 Figure 4

Claims (2)

【特許請求の範囲】[Claims] (1) 抵抗体面を有する基板と、前記抵抗体面を摺動
して前記基板の電気抵抗を変える接触部を有する摺動子
と、該摺動子を摺動自在に保持するケースと、該ケース
内を閉塞するカバーとを備え、前記基板と摺動子との相
対位置に応じた抵抗値を示す位置検出センサの基板取付
構造において、前記基板がケースに取付けられ、その取
付位置を前記摺動子とケースとの取付位置に近接させた
ことを特徴とする位置検出センサの基板取付構造。
(1) A substrate having a resistor surface, a slider having a contact portion that slides on the resistor surface to change the electrical resistance of the substrate, a case that slidably holds the slider, and the case. In the substrate mounting structure of the position detection sensor, the substrate is attached to the case, and the mounting position is changed to the slider. A substrate mounting structure for a position detection sensor, characterized in that the position detection sensor is mounted close to the mounting position between the sensor and the case.
(2) 前記基板がばね部材によりケースに押圧される
とともに、 前記基板とばね部材とは、基板に設けられた係合穴と、
ばね部材に設けられ前記係合穴に係合する爪とにより、
互いに位置決めされることを特徴とする請求項(1)記
載の位置検出センサの基板取付構造。
(2) The board is pressed against the case by a spring member, and the board and spring member are connected to an engagement hole provided in the board,
and a pawl provided on the spring member that engages with the engagement hole,
2. A substrate mounting structure for a position detection sensor according to claim 1, wherein the two are positioned with respect to each other.
JP3573989A 1989-02-15 1989-02-15 Board mounting structure for position detection sensor Expired - Lifetime JPH07104176B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3573989A JPH07104176B2 (en) 1989-02-15 1989-02-15 Board mounting structure for position detection sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3573989A JPH07104176B2 (en) 1989-02-15 1989-02-15 Board mounting structure for position detection sensor

Publications (2)

Publication Number Publication Date
JPH02213714A true JPH02213714A (en) 1990-08-24
JPH07104176B2 JPH07104176B2 (en) 1995-11-13

Family

ID=12450199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3573989A Expired - Lifetime JPH07104176B2 (en) 1989-02-15 1989-02-15 Board mounting structure for position detection sensor

Country Status (1)

Country Link
JP (1) JPH07104176B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108318057A (en) * 2018-04-13 2018-07-24 航天科技控股集团股份有限公司 A kind of sensor of compensation thermal deformation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108318057A (en) * 2018-04-13 2018-07-24 航天科技控股集团股份有限公司 A kind of sensor of compensation thermal deformation

Also Published As

Publication number Publication date
JPH07104176B2 (en) 1995-11-13

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