JPH02218757A - Electrically conductive material - Google Patents
Electrically conductive materialInfo
- Publication number
- JPH02218757A JPH02218757A JP3895389A JP3895389A JPH02218757A JP H02218757 A JPH02218757 A JP H02218757A JP 3895389 A JP3895389 A JP 3895389A JP 3895389 A JP3895389 A JP 3895389A JP H02218757 A JPH02218757 A JP H02218757A
- Authority
- JP
- Japan
- Prior art keywords
- copper powder
- electrically conductive
- component
- conductive material
- determined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 42
- 229920001940 conductive polymer Polymers 0.000 claims abstract description 14
- 230000032683 aging Effects 0.000 abstract description 10
- 239000002245 particle Substances 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 6
- 239000003973 paint Substances 0.000 abstract description 6
- 230000003647 oxidation Effects 0.000 abstract description 3
- 238000007254 oxidation reaction Methods 0.000 abstract description 3
- 239000000843 powder Substances 0.000 abstract description 3
- 238000000889 atomisation Methods 0.000 abstract description 2
- 239000003638 chemical reducing agent Substances 0.000 abstract description 2
- 238000005868 electrolysis reaction Methods 0.000 abstract description 2
- 229920000767 polyaniline Polymers 0.000 abstract description 2
- 229920000128 polypyrrole Polymers 0.000 abstract description 2
- 229920000123 polythiophene Polymers 0.000 abstract description 2
- 238000006722 reduction reaction Methods 0.000 abstract description 2
- 230000003679 aging effect Effects 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 238000004438 BET method Methods 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920000547 conjugated polymer Polymers 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- -1 polyphenylene Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は新規な導電性材料、より詳しくは銅粉の耐エー
ジング性を向上させた導電性材料に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a novel conductive material, and more particularly to a conductive material with improved aging resistance of copper powder.
銅粉はその良好な導電性を１１用して導電塗料その他各
種の導電性材料に用いられている。導電塗料として用い
る場合は導電性を有するとともに耐熱エージング、耐湿
エージング性が良好なことが要求される。Copper powder is used in conductive paints and various other conductive materials due to its good conductivity. When used as a conductive paint, it is required to have good conductivity and good heat aging resistance and moisture aging resistance.
例えば、銅粉をカップリング剤で表面処理すること（特
Ｃ８昭６０−３０２００号公報）、電解銅粉を有機チタ
ネートで被覆すること（特開昭５９−１７４６６１号公
報）、銅粉をカルボン酸処理すること（特開昭６０−２
５８２７３号公報）、銅粉の表面を半田メツキすること
（特開昭５７−１１３５０５号公報）、銅粉の表面に金
属銀を置換析出させること（特開昭６０−２４３２７７
号公報）などが提案されている。For example, surface treatment of copper powder with a coupling agent (Japanese Patent Publication No. C8 Sho 60-30200), coating of electrolytic copper powder with an organic titanate (Japanese Unexamined Patent Publication No. Sho 59-174661), coating copper powder with a carboxylic acid To process (Unexamined Japanese Patent Publication No. 60-2
58273), soldering the surface of copper powder (Japanese Patent Laid-Open No. 57-113505), and displacing metallic silver on the surface of copper powder (Japanese Patent Laid-Open No. 60-243277).
Publication No. 2), etc. have been proposed.
このような従来技術においてはある程度の効果は確認で
きるものであったが、特に導電塗料として用いるとき、
耐熱、耐湿エージングなどの環境試験における経時変化
が大きく、信頼性に欠ける面があった。Although it was possible to confirm some degree of effectiveness with such conventional technology, especially when used as a conductive paint,
Environmental tests such as heat resistance and humidity aging showed large changes over time, resulting in a lack of reliability.
従って、本発明は特に導電塗料として用いる場合のかか
る問題点を解決して、銅粉の導電性能を低下させること
なく、銅粉の耐エージング性を向上させた導電材料を提
供することを目的とするものであり、本発明者らの研究
によれば、銅粉に導電性ポリマーを加えることによりか
かる目的が違成されることが見出された。Therefore, it is an object of the present invention to solve these problems particularly when used as a conductive paint, and to provide a conductive material that improves the aging resistance of copper powder without reducing its conductive performance. According to research conducted by the present inventors, it has been found that this purpose can be achieved by adding a conductive polymer to copper powder.
かくて、本発明は銅粉と導電性ポリマーを含む導電性材
料を提供するものである。Thus, the present invention provides a conductive material comprising copper powder and a conductive polymer.
本発明を以下に詳しく説明する。 The invention will be explained in detail below.
本発明で用いられる銅粉は、電解法、アトマイズ法、化
学還元法などより得られる銅粉である。The copper powder used in the present invention is a copper powder obtained by an electrolysis method, an atomization method, a chemical reduction method, or the like.
例えば、見掛密度０，５〜２．５ｔｃ／ｄ、タップ密度
０． ９〜４． ５ｇ／ｃＩｌ、比表面積はＢＥＴ法で
０．５ば７ｇ以下、平均粒径は光透過法で０．５〜２０
μｍ１粒度分布は光透過法で最大粒子径が５０μｍの銅
粉が特性上好ましい。銅粉表面状態は、酸化波膜が除去
されていることが望ましく、被膜除去後における表面処
理、例えば、界面活性剤、カルボン酸、アミノ基合釘白
°機化合物類で処理されているものを用いることができ
る。For example, apparent density 0.5-2.5tc/d, tap density 0.5-2.5tc/d. 9-4. 5 g/cIl, specific surface area is 0.5 to 7 g or less by BET method, average particle size is 0.5 to 20 by light transmission method.
Copper powder having a maximum particle size of 50 μm as measured by a light transmission method is preferable in terms of characteristics. Regarding the surface condition of the copper powder, it is desirable that the oxidation wave film has been removed, and the surface treatment after the film removal, such as surface treatment with a surfactant, carboxylic acid, or amino-based whitening compound, is recommended. Can be used.
また、本発明で用いられる導電性ポリマーは、−船釣に
π結合をＦｉする共役ポリマーである。例えば、ポリア
セチレン、ポリチオフェン、ポリアニリン、ポリピロー
ル、ポリフェニレンなどが挙げられる。導電性ポリマー
は、均一な溶液や粉末あるいは溶媒中に懸濁の状態で用
いられる。粉末の場合、平均粒径が光透過法で最大粒子
径が５０μｒｎ以下が特性上好ましいが、本発明におい
て特別限定するものではない。すなわち、本発明に用い
られる銅粉物性と同程度であれば良好に用いることがで
きる。Further, the conductive polymer used in the present invention is a conjugated polymer having a π bond. Examples include polyacetylene, polythiophene, polyaniline, polypyrrole, polyphenylene, and the like. The conductive polymer is used in the form of a homogeneous solution, powder, or suspension in a solvent. In the case of powder, it is preferable from the viewpoint of characteristics that the average particle size is 50 μrn or less and the maximum particle size measured by a light transmission method, but this is not particularly limited in the present invention. That is, if the copper powder physical properties are comparable to those used in the present invention, it can be used satisfactorily.
さらに、本発明における銅粉に対する導電性ポリマーの
含有状態は、銅粉表面に対して、全部もしくは部分的に
コーティングされたり、銅粉中において、均一に粒子が
分散されている状態を菖う。Furthermore, the state in which the conductive polymer is contained in the copper powder in the present invention includes a state in which the surface of the copper powder is fully or partially coated, or a state in which the particles are uniformly dispersed in the copper powder.
含有率は、銅粉重量に対して、導電性ポリマーが０．１
〜５０重量９６、好ましくは０，５〜３０重口％含有さ
れるものとする。０．１小量９６未満では銅粉の耐エー
ジングが著しく低下し、５０重量％を超えると銅粉の導
電性がかなり低下するので好ましくない。The content ratio is 0.1% of the conductive polymer to the weight of the copper powder.
It shall be contained in an amount of 96% by weight, preferably 0.5% to 30% by weight. If the amount is less than 0.1% by weight, the aging resistance of the copper powder will be significantly reduced, and if it exceeds 50% by weight, the conductivity of the copper powder will be significantly reduced, which is not preferable.
前述の構成からなる本発明においては、導電性ポリマー
が銅粉表面及び近傍に存在することにより、銅粉自身の
酸化を抑制する。これは、導電性ポリマーが有機物であ
るため、酸化劣化することは無く、かつそれ自身高導電
性を有するので、比較的高含Ｈ率でも銅粉の導電性の低
下がほとんどみられない。In the present invention having the above configuration, the presence of the conductive polymer on and near the surface of the copper powder suppresses oxidation of the copper powder itself. This is because the conductive polymer is an organic substance, so it does not undergo oxidative deterioration, and it itself has high conductivity, so there is almost no decrease in the conductivity of the copper powder even at a relatively high H content.
以下に本発明の例を示すが本発明はこれに限定されるも
のではない。Examples of the present invention are shown below, but the present invention is not limited thereto.
本発明に用いた銅粉を表１に示す。Table 1 shows the copper powder used in the present invention.
本発明に用いた導電性ポリマーは、電解重合法により得
られたものを、機械的粉砕法で下記粒径に調製したもの
を用いた。The conductive polymer used in the present invention was obtained by electrolytic polymerization and prepared by mechanical pulverization to the following particle size.
表 ２
例１
表１の銅粉に対して、表２の導電性ポリマー溶液（銅粉
重量に対して導電性ポリマー０．５．２．０．１０重量
９６）を加えて、混合相ミキサーで３０分間処理した。Table 2 Example 1 To the copper powder in Table 1, the conductive polymer solution in Table 2 (conductive polymer 0.5.2.0.10 weight 96 to copper powder weight) was added and mixed in a mixed phase mixer. Processed for 30 minutes.
その後、溶媒を除去して８０℃の高温、５０℃／９５％
ＲＨの高湿環境ドに５００時間放置することによって、
初期（処理直後）に対する銅粉の変色度合を観察した。After that, the solvent was removed and the temperature was increased to 80°C, 50°C/95%.
By leaving it in a RH high humidity environment for 500 hours,
The degree of discoloration of the copper powder was observed compared to the initial stage (immediately after treatment).
同様に表１の銅粉のみのブランク試験も行った。Similarly, a blank test using only the copper powder shown in Table 1 was also conducted.
その結果、本発明によって処理された銅粉は、８０℃の
高温、６０℃／ ９５ ％ ＲＨの高湿環境下において
５００時間放置してもほとんど変色していなかった。As a result, the copper powder treated according to the present invention showed almost no discoloration even after being left for 500 hours at a high temperature of 80° C. and a high humidity environment of 60° C./95% RH.
他方、ブランク試験の銅粉は、８０℃の高温、６０℃／
９５？ｔｌ、ＲＨの高湿環境下において著しく変色して
いた。On the other hand, the copper powder in the blank test was heated at a high temperature of 80℃, 60℃/
95? It was noticeably discolored under the high humidity environment of tl and RH.
以上の結果により本発明の銅粉は著しく耐熱、耐湿エー
ジング特性に優れていることがわかった。From the above results, it was found that the copper powder of the present invention has extremely excellent heat resistance and moisture aging resistance.
例２
例１で処理された銅粉に対して、アクリル系樹脂溶液（
Ｉｉ’ｉ’ｌ型分：６０重Ｍ１９６）を用いて、長さ１
０印、幅０．５ｃｍの導体回路を形成して体８２固釘抵
抗を測定した。同様に表１の銅粉のみのブランク試験も
行った。Example 2 An acrylic resin solution (
Ii'i'l type: 60 weight M196), length 1
A conductor circuit with a 0 mark and a width of 0.5 cm was formed to measure the resistance of the body 82 fixed nail. Similarly, a blank test using only the copper powder shown in Table 1 was also conducted.
その結果、本発明によって処理された銅粉は、およそ９
．５Ｘ１０ 〜１．７Ｘ１０−”Ω・印の体積固有抵抗
を有していた。As a result, the copper powder treated according to the present invention has approximately 9
．． It had a volume resistivity of 5 x 10 to 1.7 x 10-'' ohms.
他方、ブランク試験の銅粉は、およそ６，５×１０〜７
．２Ｘ１０−３Ω・（７）の体積固有抵抗を有していた
。On the other hand, the copper powder in the blank test was approximately 6.5 x 10~7
．． It had a volume resistivity of 2×10 −3 Ω·(7).
以上の結果により本発明の銅粉は優れた導電性を何する
ことがわかった。The above results revealed that the copper powder of the present invention has excellent conductivity.
本発明にかかる導電性材料によれば銅粉の耐熱エージン
グ、耐湿エージング特性が向上し、特に導電塗料用導電
性材料として誠に良好なものを提供することができて有
効である。The conductive material according to the present invention improves the heat aging resistance and moisture aging resistance of copper powder, and is particularly effective in providing a very good conductive material for conductive paints.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3895389A JPH02218757A (en) | 1989-02-18 | 1989-02-18 | Electrically conductive material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3895389A JPH02218757A (en) | 1989-02-18 | 1989-02-18 | Electrically conductive material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02218757A true JPH02218757A (en) | 1990-08-31 |
Family
ID=12539564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3895389A Pending JPH02218757A (en) | 1989-02-18 | 1989-02-18 | Electrically conductive material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02218757A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5225110A (en) * | 1989-06-13 | 1993-07-06 | Cookson Group Plc | Coated particulate metallic materials |
| AU745105B2 (en) * | 1998-02-04 | 2002-03-14 | Electrocopper Products Limited | Low density high surface area copper powder and electrodeposition process for making same |
-
1989
- 1989-02-18 JP JP3895389A patent/JPH02218757A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5225110A (en) * | 1989-06-13 | 1993-07-06 | Cookson Group Plc | Coated particulate metallic materials |
| AU745105B2 (en) * | 1998-02-04 | 2002-03-14 | Electrocopper Products Limited | Low density high surface area copper powder and electrodeposition process for making same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101602929B (en) | A method for improving the conductive percolation efficiency of conductive adhesive | |
| US4888216A (en) | Copper powder for electroconductive paints and process for production thereof | |
| US2444034A (en) | Electrically conducting adhesive | |
| JPS6136796B2 (en) | ||
| JPS612202A (en) | Soldable electroconductive composition, method of producing same, method of treating substrate applied with said composition, method of coating metal and article applied with same composition | |
| JPH0768562B2 (en) | Method for producing solderable copper powder for conductive paint | |
| JPH024873A (en) | Electric conductive coating susceptible to solvent processing | |
| JPH02218757A (en) | Electrically conductive material | |
| JPS6015464A (en) | Pigment | |
| JP4374831B2 (en) | Conductive paste and ceramic electronic components | |
| KR100390638B1 (en) | Electrically conductive silicone paste | |
| JPH0982133A (en) | Manufacture of conductive powder | |
| JPS62179566A (en) | Electrically conductive resin composition | |
| JPH06346006A (en) | Water-based electrically conductive coating | |
| JPH02185575A (en) | Conductive resin composition | |
| JPS6394502A (en) | Conducting filler and manufacture thereof | |
| JPH0447604A (en) | Conductive resin composition | |
| JPH09255900A (en) | Thermosetting type carbon-based electroconductive coating material | |
| JPH02218762A (en) | Copper powder for electrically conductive paint | |
| JPH0320341A (en) | Copper powder for thick film composition | |
| JP2730119B2 (en) | Insulating paint | |
| JPH083544A (en) | Water repellent treatment agent and surface water repellent treatment member | |
| JPH10188670A (en) | Flat conductive metal powder, its manufacture, and conductive paste with flat conductive metal powder | |
| KR100467678B1 (en) | Metal oxide colloid forming composition and method for producing metal oxide colloidal particles using same | |
| JPH05314813A (en) | Copper paste for conductor circuit and manufacture thereof |