JPH02214112A - Thin-film manufacturing apparatus - Google Patents
Thin-film manufacturing apparatusInfo
- Publication number
- JPH02214112A JPH02214112A JP3462389A JP3462389A JPH02214112A JP H02214112 A JPH02214112 A JP H02214112A JP 3462389 A JP3462389 A JP 3462389A JP 3462389 A JP3462389 A JP 3462389A JP H02214112 A JPH02214112 A JP H02214112A
- Authority
- JP
- Japan
- Prior art keywords
- gas
- sample
- specimen
- thin film
- reaction vessel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 238000006243 chemical reaction Methods 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract 2
- 238000000151 deposition Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 abstract description 13
- 230000002093 peripheral effect Effects 0.000 abstract description 2
- 239000007789 gas Substances 0.000 description 27
- 239000012495 reaction gas Substances 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000010419 fine particle Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は薄膜製造装置に係り、特に均一な成膜を行うた
めの反応ガス供給・排気系の改良に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a thin film manufacturing apparatus, and particularly to an improvement in a reaction gas supply/exhaust system for uniform film formation.
反応容器内に反応ガスを供給し、容器内で気相化学反応
を行わせ、反応生成物を基板上に薄膜として堆積させる
薄膜製造装置として、従来、第5図に示すものがある。2. Description of the Related Art There is a conventional thin film manufacturing apparatus shown in FIG. 5 that supplies a reaction gas into a reaction vessel, causes a gas phase chemical reaction to occur within the vessel, and deposits a reaction product as a thin film on a substrate.
この薄膜製造装置は、反応ガス供給口21を有する筒状
の反応容器22内に試料(基板)23をセットするため
の試料ホルダ24が設置され、反応ガス供給口21に対
応する面に排気口25が設けられ、容器周囲には試料加
熱用RFコイル26が巻装されている。This thin film manufacturing apparatus includes a sample holder 24 for setting a sample (substrate) 23 in a cylindrical reaction vessel 22 having a reaction gas supply port 21, and an exhaust port on the surface corresponding to the reaction gas supply port 21. 25, and a sample heating RF coil 26 is wound around the container.
なお、この種の装置に関連するものとして、例えば特開
昭63−53932号公報に記載のものがある。An example of a device related to this type of device is described in Japanese Patent Application Laid-Open No. 63-53932.
この薄膜製造装置では、反応ガスのガス進入方向に対し
て試料23の表面が傾斜した状態でセットされており、
排気ガスの流れ方向に対しても試料23の表面は傾斜し
た状態にある。In this thin film manufacturing apparatus, the surface of the sample 23 is set to be inclined with respect to the direction in which the reaction gas enters.
The surface of the sample 23 is also inclined with respect to the flow direction of the exhaust gas.
上記した従来の装置では、反応ガス供給口21より反応
容器22内に導入されたガスは、試料23に向けて流れ
て行くが、試料23の表面が傾斜しているため、反応ガ
スが試料23に到達後、乱流となり、試料23の表面に
均一に反応ガスが流れなくなる。また、試料加熱用RF
コイル26を介して試料23を加熱すると、反応容器2
2内に対流が起こり、ガスの流れが乱れがますます大き
くなってくる。この結果、試料23に対して均一に成膜
を行うことができないという問題がある。In the conventional apparatus described above, the gas introduced into the reaction vessel 22 from the reaction gas supply port 21 flows toward the sample 23. However, since the surface of the sample 23 is inclined, the reaction gas flows into the sample 23. After reaching , a turbulent flow occurs and the reaction gas no longer flows uniformly over the surface of the sample 23. In addition, RF for sample heating
When the sample 23 is heated through the coil 26, the reaction vessel 2
Convection occurs within 2, and the turbulence in the gas flow becomes increasingly large. As a result, there is a problem in that it is not possible to uniformly form a film on the sample 23.
本発明の目的は、上記した従来技術の課題を解決し、試
料表面に対するガスを流れを均一にすることによって均
一な成膜を行うことができる薄膜製造装置を提供するこ
とにある。An object of the present invention is to solve the problems of the prior art described above and to provide a thin film manufacturing apparatus that can form a uniform film by uniformizing the flow of gas to the surface of a sample.
〔課題を解決するための手段〕
上記した目的は、反応容器に設けられるガス供給口を、
試料の薄膜を堆積させる面に対し、垂直方向にガスを導
入可能なガス供給管の先端開口部とし、排気口を試料の
薄膜を堆積させる面とは反対側の反応容器面に設けるこ
とによって達成される。[Means for solving the problem] The above purpose is to
This is achieved by providing an opening at the end of the gas supply pipe that allows gas to be introduced perpendicularly to the surface on which the thin sample film is deposited, and an exhaust port on the surface of the reaction vessel opposite to the surface on which the thin sample film is deposited. be done.
ガス供給管の先端開口部から反応容器内に導入されたガ
スは、垂直方向に流下する。このとき、試料の薄膜を堆
積させる面と反対側の反応容器面に設けられた排気口を
介して排気されるため、試料表面に到達したガスは、試
料表面に沿って均一に流れた後、排気口から排出される
。この結果、試料表面の薄膜の膜厚分布が均一となる。The gas introduced into the reaction vessel from the opening at the tip of the gas supply pipe flows down in the vertical direction. At this time, the gas is exhausted through the exhaust port provided on the side of the reaction vessel opposite to the side on which the thin film of the sample is deposited, so the gas that reaches the sample surface flows uniformly along the sample surface. It is discharged from the exhaust port. As a result, the thickness distribution of the thin film on the sample surface becomes uniform.
また、ガス供給管の先端開口部を反応容器の底部側に、
排気口を反応容器の上部側にそれぞれ配置した、所謂デ
ポジションアップにすれば、試料加熱の際の熱による対
流が原因で生しるガスの乱流が防止され、均一成膜がよ
り効果的になり、同時に微粒子の試料表面への付着は防
止される。Also, place the tip opening of the gas supply pipe on the bottom side of the reaction vessel.
By arranging the exhaust ports at the top of the reaction vessel, which is a so-called "deposition up" system, turbulence of gas caused by convection due to heat during sample heating is prevented, and uniform film formation is more effective. At the same time, fine particles are prevented from adhering to the sample surface.
以下、本発明の実施例を図面に基づいて説明する。 Embodiments of the present invention will be described below based on the drawings.
第1図は本発明の薄膜製造装置の第1実施例を示す縦断
面図である。この薄膜製造装置は、その内部で気相化学
反応を行なわせる反応容器29反反応容器1内ガスを供
給するガス供給管1、その表面に薄膜を堆積させる試料
3.試料3を保持する試料ホルダ4、ガス及び反応生成
物を吸引・排気する排気口5、試料3を試料ホルダ4を
介して回転させるための回転軸6、試料3を加熱するヒ
ータ7とから構成される。FIG. 1 is a longitudinal sectional view showing a first embodiment of the thin film manufacturing apparatus of the present invention. This thin film manufacturing apparatus consists of a reaction vessel 29 in which a gas phase chemical reaction is carried out, a gas supply pipe 1 for supplying the gas inside the reaction vessel 1, a sample 3 in which a thin film is deposited on the surface thereof. Consisting of a sample holder 4 that holds the sample 3, an exhaust port 5 that suctions and exhausts gas and reaction products, a rotating shaft 6 that rotates the sample 3 via the sample holder 4, and a heater 7 that heats the sample 3. be done.
ガス供給管1は、円筒状に形成され、その上部は略球部
状に形成された反応容器lの上部中心より垂直方向に設
置されており、管下端部は漏斗状の開口部1aを備えて
いる。試料3は開口部1aの鉛直下に所定の間隔をおい
て配置されており、排気口5には試料3の外周辺部を包
囲するように開口部5aが設けられている。The gas supply pipe 1 is formed into a cylindrical shape, the upper part of which is installed vertically from the center of the upper part of the reaction vessel l formed into a substantially spherical shape, and the lower end of the pipe is provided with a funnel-shaped opening 1a. ing. The sample 3 is arranged vertically below the opening 1a at a predetermined interval, and the exhaust port 5 is provided with an opening 5a so as to surround the outer periphery of the sample 3.
この薄膜製造装置においては、ガス供給管1aから供給
されたガスは、開口部1aにより水平方向に広がりなが
ら、垂直に流れて行く、そして、試料3の表面に到達し
たガスは、試料3の外周辺部に向って流れ排気口5から
排気される。したがって反応容器1内に導入されたガス
は、試料3の表面を均一に流れることになり、均一成膜
が可能となる。In this thin film manufacturing apparatus, the gas supplied from the gas supply pipe 1a flows vertically while spreading horizontally through the opening 1a, and the gas that reaches the surface of the sample 3 flows outside the sample 3. It flows toward the peripheral area and is exhausted from the exhaust port 5. Therefore, the gas introduced into the reaction vessel 1 flows uniformly over the surface of the sample 3, making it possible to form a uniform film.
第2図は本発明の薄膜製造装置の第2実施例を示し、反
応容器1の底部側にガス供給管1、上部側に排気口5が
それぞれ配設され、試料ホルダ4にセットされた試料3
の下面側に薄膜を堆積させる、所謂デポジションアップ
型とした以外は、第1図に示す薄膜製造装置と同じであ
る。FIG. 2 shows a second embodiment of the thin film manufacturing apparatus of the present invention, in which a gas supply pipe 1 is provided at the bottom side of the reaction vessel 1, an exhaust port 5 is provided at the top side, and a sample is set in a sample holder 4. 3
The apparatus is the same as the thin film manufacturing apparatus shown in FIG. 1, except that it is of a so-called deposition-up type in which a thin film is deposited on the lower surface of the apparatus.
したがって、第2実施例ではヒータ7は反応容器2の上
部側に配置されており、例えば反応容器2内で常圧で、
試料3の温度を250°C以上の条件で成膜を行う場合
、薄膜を堆積させる試料3の面(下面)側頭域の熱対流
によるガス乱れがより少なくなるという効果がある。ま
た、第2実施例はデボジシランアップ型としているので
、反応生成物等の微粒子が試料表面に付着して膜質を低
下させることがない。Therefore, in the second embodiment, the heater 7 is arranged at the upper side of the reaction vessel 2, and for example, the heater 7 is placed at the upper part of the reaction vessel 2, and the heater 7 is placed in the reaction vessel 2 at normal pressure.
When film formation is performed under conditions where the temperature of the sample 3 is 250° C. or higher, there is an effect that gas turbulence due to thermal convection in the temporal region of the surface (lower surface) of the sample 3 on which the thin film is deposited is reduced. Furthermore, since the second embodiment is of the devodisilane-up type, fine particles such as reaction products will not adhere to the sample surface and deteriorate the film quality.
第3図は本発明の薄膜製造装置の第3実施例を示し、反
応容器2に壁面の一部を光透過窓8で構成し、紫外線ラ
ンプ9を配置している点以外は、第1図に示す第1実施
例と同じである。FIG. 3 shows a third embodiment of the thin film manufacturing apparatus of the present invention, which is similar to that shown in FIG. This is the same as the first embodiment shown in FIG.
第3実施例においては、開口部1aからのガスは試料3
の表面側に垂直に流れ、試料3の周辺部から開口部5a
を経て排気される。したがって紫外線エネルギーにより
生成される反応生成物は光透過窓8側に流れることが少
なく、光透過窓8の曇が防止され、再現性及び歩留りを
向上させることができる。In the third embodiment, the gas from the opening 1a is transferred to the sample 3.
Flows perpendicularly to the surface side of the sample 3, and flows from the periphery of the sample 3 to the opening 5a.
It is then exhausted. Therefore, reaction products generated by ultraviolet energy are less likely to flow toward the light-transmitting window 8, preventing the light-transmitting window 8 from fogging, and improving reproducibility and yield.
第4図は本発明の薄膜製造装置の第4実施例を示し、第
1図に示す第1実施例と異なる点は、反応容器12の底
部側は漏斗状に形成され、排気口5が反応容器12と一
体化構造とされていることである。このため、第4実施
例においては第1実施例における効果の他に装置構造が
小型化、簡素化され、メンテナンスが容易になるという
効果がある。FIG. 4 shows a fourth embodiment of the thin film manufacturing apparatus of the present invention, which differs from the first embodiment shown in FIG. It has an integrated structure with the container 12. Therefore, in addition to the effects of the first embodiment, the fourth embodiment has the advantage that the device structure is miniaturized and simplified, and maintenance is facilitated.
以上のように本発明によれば、薄膜が堆積される試料の
表面に対し、反応ガスが垂直に流れ、かつ試料周辺部側
に流れるので、試料表面におけるガスの供給が均一とな
る。このため、均一成膜が可能となり、再現性1歩留り
が向上する。As described above, according to the present invention, the reaction gas flows perpendicularly to the surface of the sample on which a thin film is deposited and flows toward the sample periphery, so that the gas supply on the sample surface becomes uniform. Therefore, uniform film formation becomes possible, and reproducibility and yield are improved.
第1図は本発明の薄膜製造装置の第1実施例を示す縦断
面図、第2図は本発明の薄膜製造装置の第2実施例を示
す継断面図、第3図は本発明の薄膜製造装置の第3実施
例を示す縦断面図、第4図は本発明の薄膜製造装置の第
4実施例を示す縦断面図、第5図は従来の1膜製造装置
の縦断面図である。
1・・・・・・ガス供給管、2・・・・・・反応容器、
3・・・・・・試料、4・・・・・・試料ホルダ、5・
・・・・・排気口、6・・・・・・回転軸、7・・・・
・・試料加熱ヒータ、12・・・・・・反応容器。
代理人 弁理士 西 元 勝
第1図
第3図
第2図
第4図FIG. 1 is a vertical cross-sectional view showing a first embodiment of the thin film manufacturing apparatus of the present invention, FIG. 2 is a cross-sectional view showing a second embodiment of the thin film manufacturing apparatus of the present invention, and FIG. FIG. 4 is a vertical cross-sectional view showing a third embodiment of the manufacturing apparatus, FIG. 4 is a vertical cross-sectional view showing the fourth example of the thin film manufacturing apparatus of the present invention, and FIG. 5 is a vertical cross-sectional view of a conventional single-film manufacturing apparatus. . 1... Gas supply pipe, 2... Reaction container,
3...sample, 4...sample holder, 5.
...Exhaust port, 6... Rotation shaft, 7...
...Sample heating heater, 12...Reaction vessel. Agent: Patent Attorney Masaru Nishimoto Figure 1 Figure 3 Figure 2 Figure 4
Claims (3)
ホルダにセットし、反応容器にガス供給口及び排気口を
備えたものおいて、前記ガス供給口が前記試料の薄膜を
堆積させる面に対し、垂直方向にガスを導入可能なガス
供給管の先端開口部からなり、前記排気口が前記試料の
薄膜を堆積させる面とは反対面側の反応容器面に設けら
れていることを特徴とする薄膜製造装置。(1) A reaction vessel in which a sample for depositing a thin film is set in a sample holder, and the reaction vessel is equipped with a gas supply port and an exhaust port, and the gas supply port is the surface on which the thin film of the sample is deposited. In contrast, the method is characterized in that it consists of an opening at the tip of a gas supply pipe that can introduce gas in a vertical direction, and that the exhaust port is provided on the surface of the reaction vessel opposite to the surface on which the thin film of the sample is deposited. thin film manufacturing equipment.
に配置され、前記排気口が反応容器の底部側に配置され
ていることを特徴とする請求項(1)記載の薄膜製造装
置。(2) The thin film manufacturing apparatus according to claim (1), wherein the tip opening of the gas supply pipe is arranged on the upper side of the reaction vessel, and the exhaust port is arranged on the bottom side of the reaction vessel. .
に配置され、前記排気口が反応容器の上部側に配置され
ていることを特徴とする請求項(1)記載の薄膜製造装
置。(3) The thin film manufacturing apparatus according to claim (1), wherein the tip opening of the gas supply pipe is arranged at the bottom side of the reaction vessel, and the exhaust port is arranged at the upper side of the reaction vessel. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3462389A JPH02214112A (en) | 1989-02-14 | 1989-02-14 | Thin-film manufacturing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3462389A JPH02214112A (en) | 1989-02-14 | 1989-02-14 | Thin-film manufacturing apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02214112A true JPH02214112A (en) | 1990-08-27 |
Family
ID=12419517
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3462389A Pending JPH02214112A (en) | 1989-02-14 | 1989-02-14 | Thin-film manufacturing apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02214112A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007067213A (en) * | 2005-08-31 | 2007-03-15 | Mitsubishi Electric Corp | Vapor-phase epitaxy device |
-
1989
- 1989-02-14 JP JP3462389A patent/JPH02214112A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007067213A (en) * | 2005-08-31 | 2007-03-15 | Mitsubishi Electric Corp | Vapor-phase epitaxy device |
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