JPH02173292A - Reflow method for tin and tin alloy plated material - Google Patents
Reflow method for tin and tin alloy plated materialInfo
- Publication number
- JPH02173292A JPH02173292A JP32848688A JP32848688A JPH02173292A JP H02173292 A JPH02173292 A JP H02173292A JP 32848688 A JP32848688 A JP 32848688A JP 32848688 A JP32848688 A JP 32848688A JP H02173292 A JPH02173292 A JP H02173292A
- Authority
- JP
- Japan
- Prior art keywords
- tin
- bar
- alloy
- plating
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims description 19
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims description 16
- 229910001128 Sn alloy Inorganic materials 0.000 title claims description 13
- 238000000034 method Methods 0.000 title claims description 6
- 238000007747 plating Methods 0.000 claims abstract description 31
- 238000010791 quenching Methods 0.000 claims abstract description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 8
- 238000009713 electroplating Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 2
- 238000005260 corrosion Methods 0.000 abstract description 8
- 230000007797 corrosion Effects 0.000 abstract description 8
- 230000000171 quenching effect Effects 0.000 abstract description 7
- 229910045601 alloy Inorganic materials 0.000 abstract description 5
- 239000000956 alloy Substances 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 238000009835 boiling Methods 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- -1 bismuth and antimony Chemical class 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
- C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
皇栗上■■亙分互
本発明は、銅または銅合金の条に錫または錫合金のりフ
ローめっきを施す方法に関するもので、特にリフロー処
理におけるクエンチ方法を改良することにより、クエン
チスティンの発生が少く外観と耐食性に優れる錫または
錫合金リフローめっき材を製造する方法に関する。[Detailed Description of the Invention] The present invention relates to a method of applying flow plating of tin or tin alloy glue to a strip of copper or copper alloy, and in particular, to improve the quenching method in reflow treatment. The present invention relates to a method for producing a tin or tin alloy reflow plated material that is less likely to generate quench stain and has excellent appearance and corrosion resistance.
の ′と。 占
銅または銅合金条のりフロー錫およびリフロー処理めっ
き材は導電性、強度、耐食性、半田付性等の品質に優れ
るため、端子、コネクタ等の電子部品用材料として一般
的に用いられている。' and. BACKGROUND OF THE INVENTION Flow tin soldered copper or copper alloy strips and reflow-treated plating materials have excellent qualities such as conductivity, strength, corrosion resistance, and solderability, and are therefore commonly used as materials for electronic components such as terminals and connectors.
部品加工前の銅または銅合金の条にめっきする場合、銅
または銅合金条に錫または錫合金を電気めっきした後、
ガスバーナー炉、電気炉、あるいは赤外線炉に連続的に
通し、めっき皮膜の融点以上にめっき条を加熱し溶融さ
せた後、引き続きクエンチ槽に通入し、クエンチ（凝固
）させることによりリフローめっき材を製造するのが一
般的である。When plating copper or copper alloy strips before processing parts, after electroplating tin or tin alloys on copper or copper alloy strips,
Reflow plating material is produced by continuously passing it through a gas burner furnace, electric furnace, or infrared furnace to heat and melt the plating strip above the melting point of the plating film, and then passing it through a quench tank to quench (solidify) it. It is common to manufacture
従来、上記クエンチは、めっき層が溶融状態のまま、水
に浸漬することにより行われるのが一般的である。とこ
ろが、水の沸点以上に加熱されためっき層が溶融状態の
めっき条を水槽（クエンチＮ）に通入すると、めっき条
に近接する部分で水の沸騰が生じる。そして、この沸騰
により生じた気泡が、溶融状態のめっき層の冷却凝固の
均一性をはばむことになり、凝固しためっき表面が微視
的に平滑性を失うようになる。この状態は、目視可能で
あって、クエンチスティンと呼ばれ、外観及びわずかで
はあるが耐食性低下の原因となる。Conventionally, the above-mentioned quenching is generally performed by immersing the plating layer in water while it is in a molten state. However, when a plating strip with a molten plating layer heated above the boiling point of water is passed through a water tank (quench N), water boils in the vicinity of the plating strip. The bubbles generated by this boiling interfere with the uniformity of cooling and solidification of the molten plating layer, causing the surface of the solidified plating to microscopically lose its smoothness. This condition is visible to the naked eye and is called quench stain, which causes a decrease in appearance and corrosion resistance, albeit slightly.
が しようとする
本発明は、如上のごとき状況に鑑みなされたものであっ
て、上述したクエンチスティンの発生しない錫および錫
合金めっき材のりフロ一方法を提供することを課題とす
る。The present invention has been made in view of the above situation, and an object of the present invention is to provide a method for laminating tin and tin alloy plated materials in which the above-mentioned quench stain does not occur.
以下本発明の詳細な説明する。The present invention will be explained in detail below.
課 を”′するための
本発明の特徴は、銅または銅合金の条に錫または錫合金
を電気めっき後、この錫または錫合金めっき条を連続的
に加熱炉上部より下方に炉内を通過させてめっき層を溶
融させ、さらにその下方のクエンチ槽に通入しクエンチ
させるリフローめっき材の製造方法において、１ＪＩｌ
板速度が１０〜３０ｍ／ｍｉｎであり、クエンチ槽に通
入する際の材料温度が２５０℃以下であり、かつクエン
チ槽液温が４０〜８０℃であることにある。The feature of the present invention for this purpose is that after electroplating a copper or copper alloy strip with tin or a tin alloy, the tin or tin alloy plated strip is continuously passed through the furnace from the upper part of the furnace to the lower part. In a method for producing a reflow plating material, the plating layer is melted by melting the plating layer, and the plating material is passed through a quench tank below to be quenched.
The plate speed is 10 to 30 m/min, the material temperature when passing through the quench tank is 250°C or less, and the quench tank liquid temperature is 40 to 80°C.
本発明では、銅合金として黄銅、りん青銅等のＪＩＳに
定められる合金以外のものも使用できる。In the present invention, copper alloys other than those specified by JIS, such as brass and phosphor bronze, can also be used.
これらの合金条は連続めっきラインにおいてリフローめ
っきが施される。These alloy strips are subjected to reflow plating in a continuous plating line.
これらの合金条は、連続めっきラインに通板され、アル
カリ脱脂、電解脱脂、酸洗等の公知の方法により表面を
洗浄して活性化される。次いで、必要に応じ、銅、ニッ
ケル等の下地めっき用電解槽にて下地めっきが施された
後、錫または錫合金のめっき槽で目的の上地金属が電気
めっきされる。These alloy strips are passed through a continuous plating line, and their surfaces are cleaned and activated by known methods such as alkaline degreasing, electrolytic degreasing, and pickling. Next, if necessary, after base plating is applied in an electrolytic bath for base plating of copper, nickel, etc., a target base metal is electroplated in a tin or tin alloy plating bath.
錫合金としては、錫を５〜４５重播％含む半田めっきが
最も一般的であるが、その他船以外にもビスマス、アン
チモン等一般に半田成分として公知の金属を含有してい
るものも有効に用い得る。As a tin alloy, solder plating containing 5 to 45% tin is most common, but other metals other than those containing metals such as bismuth and antimony, which are generally known as solder components, can also be effectively used. .
錫または錫合金で電気めっきされた条は、水洗、乾燥の
工程を経た後、加熱炉に通入される。このリフロー処理
は、加熱炉上部よりまっすぐ下方に炉内を通過させ、め
っき層を溶融させた後、そのさらに下方のクエンチ槽水
中に浸漬し、瞬時にめっき層を凝固させる。この時、水
冷によるクエンチを採用するかぎりにおいて、めっき材
と接する水面の沸騰を防ぐことはできない、しかし、本
発明では、クエンチ槽への材料の進入速度、材料温度お
よび水温の範囲を適正に選ぶことにより、沸騰によるク
エンチスティンを最小に押えることが可能となる。The strip electroplated with tin or tin alloy is passed through the steps of washing and drying, and then passed through a heating furnace. In this reflow treatment, the plating layer is passed through the furnace straight down from the upper part of the heating furnace to melt the plating layer, and then immersed in water in a quench tank further below to instantly solidify the plating layer. At this time, as long as water cooling is used for quenching, boiling of the water surface in contact with the plating material cannot be prevented. However, in the present invention, the rate at which the material enters the quench tank, the material temperature, and the range of water temperature are appropriately selected. This makes it possible to minimize quench staining caused by boiling.
すなわち、通板速度がｌＯ〜３０ｍ／ｓｉｎであり、が
つクエンチ槽に進入する際の材料温度が２５０℃以下で
あり、かつクエンチ槽水温が４０〜８０℃である条件で
リフロー処理を行うと、クエンチスティンがほとんど発
生せず、外観と耐食性に優れたりフローめっき材を得る
ことができる。通板速度、材料温度および水温がその範
囲を外れるとクエンチスティンが発生し易くなる。That is, if the reflow treatment is performed under the conditions that the threading speed is 10 to 30 m/sin, the material temperature when entering the Gatsu quench tank is 250 ° C or less, and the quench tank water temperature is 40 to 80 ° C. It is possible to obtain a flow plated material with almost no quench stain and excellent appearance and corrosion resistance. If the threading speed, material temperature, and water temperature are out of these ranges, quench stain is likely to occur.
したがって、本発明により、リフロー処理された銅およ
び銅合金上の錫および錫合金めっきりフロー材はクエン
チスティンがほとんど発生せず、美麗な外観を有し、耐
食性も優れるため、電子部品用材料として極めて好適で
ある。Therefore, according to the present invention, tin and tin alloy clearly flowed materials on reflow-treated copper and copper alloys hardly generate quench stain, have a beautiful appearance, and have excellent corrosion resistance, so they are extremely suitable as materials for electronic components. suitable.
以下実施例により本発明を具体的に説明する。The present invention will be specifically explained below using Examples.
実施例
０、：ｈｍ厚、３００ｍｍ幅のりん青銅（Ｃｕ−３χＳ
ｎ）条を連続めっきラインで銅下地０．５μｍ、錫１．
２μ畢を電気めっきした後、連続的にリフロー処理を行
った。Example 0: Phosphor bronze (Cu-3χS) with a thickness of hm and a width of 300 mm
n) Strips are coated with a copper base of 0.5 μm and tin of 1.5 μm using a continuous plating line.
After electroplating a 2μ layer, reflow treatment was performed continuously.
通板速度とりフロー処理を様々に変え、得られためっき
条の外観と耐塩水噴霧性を評価した結果を第１表に示す
。Table 1 shows the results of evaluating the appearance and salt water spray resistance of the plated strips obtained by varying the plate passing speed and flow treatment.
ただし、銅めっきは無光沢硫酸銅浴、錫は無光沢硫酸浴
をそれぞれ用いた。However, a matte copper sulfate bath was used for copper plating, and a matte sulfuric acid bath was used for tin.
第
表
ＩＳ
Ｚ ２３７１に定められた条件の塩水噴霧試験に供し、
白色の腐食生成物が発生するまでに要した時間を示し、
この時間が長いほど耐食性耐食性が良い。Subjected to salt spray test under the conditions specified in Table IS Z 2371,
Indicates the time required for white corrosion products to occur,
The longer this time, the better the corrosion resistance.
Claims (1)
この錫または錫合金めっき条を連続的に加熱炉上部より
下方に炉内を通過させてめっき層を溶融させ、さらにそ
の下方のクエンチ槽に通入しクエンチさせるリフローめ
っき材の製造方法において、通板速度が１０〜３０ｍ／
ｍｉｎであり、クエンチ槽に通入する際の材料温度が２
５０以下であり、かつクエンチ槽液温が４０〜８０℃で
あることを特徴とする錫および錫合金めっき材のリフロ
ー方法。After electroplating tin or tin alloy on copper or copper alloy strip,
In a method for manufacturing reflow plated materials, the tin or tin alloy plated strip is continuously passed through the furnace from the upper part of the furnace to melt the plating layer, and then passed through a quench tank below to be quenched. Plate speed is 10-30m/
min, and the material temperature when passing through the quench tank is 2
50C or less and a quench tank liquid temperature of 40 to 80C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32848688A JPH02173292A (en) | 1988-12-26 | 1988-12-26 | Reflow method for tin and tin alloy plated material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32848688A JPH02173292A (en) | 1988-12-26 | 1988-12-26 | Reflow method for tin and tin alloy plated material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02173292A true JPH02173292A (en) | 1990-07-04 |
Family
ID=18210814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32848688A Pending JPH02173292A (en) | 1988-12-26 | 1988-12-26 | Reflow method for tin and tin alloy plated material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02173292A (en) |
-
1988
- 1988-12-26 JP JP32848688A patent/JPH02173292A/en active Pending
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