JPH02170872A - Pinhole filler - Google Patents
Pinhole fillerInfo
- Publication number
- JPH02170872A JPH02170872A JP32376088A JP32376088A JPH02170872A JP H02170872 A JPH02170872 A JP H02170872A JP 32376088 A JP32376088 A JP 32376088A JP 32376088 A JP32376088 A JP 32376088A JP H02170872 A JPH02170872 A JP H02170872A
- Authority
- JP
- Japan
- Prior art keywords
- filler
- pinhole
- manufactured
- chemical industries
- pure chemical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000945 filler Substances 0.000 title claims abstract description 36
- 239000000203 mixture Substances 0.000 claims abstract description 4
- 229910000000 metal hydroxide Inorganic materials 0.000 claims description 11
- 150000004692 metal hydroxides Chemical class 0.000 claims description 11
- 229910052739 hydrogen Inorganic materials 0.000 abstract description 4
- 239000001257 hydrogen Substances 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 abstract description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract description 3
- 229910021502 aluminium hydroxide Inorganic materials 0.000 abstract 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 abstract 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 abstract 1
- 239000000920 calcium hydroxide Substances 0.000 abstract 1
- 235000011116 calcium hydroxide Nutrition 0.000 abstract 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 abstract 1
- 229910001679 gibbsite Inorganic materials 0.000 abstract 1
- FLTRNWIFKITPIO-UHFFFAOYSA-N iron;trihydrate Chemical compound O.O.O.[Fe] FLTRNWIFKITPIO-UHFFFAOYSA-N 0.000 abstract 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 abstract 1
- 239000000347 magnesium hydroxide Substances 0.000 abstract 1
- 235000012254 magnesium hydroxide Nutrition 0.000 abstract 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 abstract 1
- 229910021509 tin(II) hydroxide Inorganic materials 0.000 abstract 1
- 229910021511 zinc hydroxide Inorganic materials 0.000 abstract 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 23
- 239000000126 substance Substances 0.000 description 19
- 239000002244 precipitate Substances 0.000 description 12
- 235000019441 ethanol Nutrition 0.000 description 10
- 239000007787 solid Substances 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000011575 calcium Substances 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 5
- 239000000049 pigment Substances 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910001629 magnesium chloride Inorganic materials 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- VFWCMGCRMGJXDK-UHFFFAOYSA-N 1-chlorobutane Chemical compound CCCCCl VFWCMGCRMGJXDK-UHFFFAOYSA-N 0.000 description 1
- SQCZQTSHSZLZIQ-UHFFFAOYSA-N 1-chloropentane Chemical compound CCCCCCl SQCZQTSHSZLZIQ-UHFFFAOYSA-N 0.000 description 1
- FXNDIJDIPNCZQJ-UHFFFAOYSA-N 2,4,4-trimethylpent-1-ene Chemical group CC(=C)CC(C)(C)C FXNDIJDIPNCZQJ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- 229910018626 Al(OH) Inorganic materials 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- NHTMVDHEPJAVLT-UHFFFAOYSA-N Isooctane Chemical compound CC(C)CC(C)(C)C NHTMVDHEPJAVLT-UHFFFAOYSA-N 0.000 description 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 229910019440 Mg(OH) Inorganic materials 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 206010052428 Wound Diseases 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- RDHPKYGYEGBMSE-UHFFFAOYSA-N bromoethane Chemical compound CCBr RDHPKYGYEGBMSE-UHFFFAOYSA-N 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- QGJOPFRUJISHPQ-NJFSPNSNSA-N carbon disulfide-14c Chemical compound S=[14C]=S QGJOPFRUJISHPQ-NJFSPNSNSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- JVSWJIKNEAIKJW-UHFFFAOYSA-N dimethyl-hexane Natural products CCCCCC(C)C JVSWJIKNEAIKJW-UHFFFAOYSA-N 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- -1 i-nitropropane Chemical compound 0.000 description 1
- ULYZAYCEDJDHCC-UHFFFAOYSA-N isopropyl chloride Chemical compound CC(C)Cl ULYZAYCEDJDHCC-UHFFFAOYSA-N 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- LYGJENNIWJXYER-UHFFFAOYSA-N nitromethane Chemical compound C[N+]([O-])=O LYGJENNIWJXYER-UHFFFAOYSA-N 0.000 description 1
- 239000012454 non-polar solvent Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、塗膜表面の傷等や、ＳＭＣ表面のピンホー
ルを充填するのに用いるピンホール充填剤に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a pinhole filler used to fill scratches on the surface of a coating film and pinholes on the surface of SMC.
（従来の技術）
ピンホール充填剤は、従来技術には見あたらないが、近
い材料としてパテがある。公知の通り、自動車において
は、フェンダ−やドア等に大きな凹凸が発生した場合に
はパテが補修剤として、主に基材の面形状を出す為に使
用されている。(Prior Art) A pinhole filler is not found in the prior art, but putty is a similar material. As is well known, in automobiles, when large irregularities occur on fenders, doors, etc., putty is used as a repair agent, mainly to improve the surface shape of the base material.
（発明が解決しようとする課題）
しかしながら、このような従来のパテにあっては、顔料
を展色剤と練り合わせた粘土状の物質であり、大きな凹
凸を補修することを目的とする組成となっていたため、
微細な傷や穴等は充填されず、ピンホール充填剤として
は適用できない。またＳＭＣ成形品等についてはピンホ
ール充填剤が無い為ブライマー塗布し、焼付した後、サ
ンドペーパーで研摩し、ピンホールを除去する方法が行
なわれているのが現状である。(Problem to be solved by the invention) However, such conventional putty is a clay-like substance made by kneading pigments with a color vehicle, and its composition is aimed at repairing large irregularities. Because I was
It does not fill minute scratches or holes, and cannot be used as a pinhole filler. Furthermore, since there is no pinhole filler for SMC molded products, the current method is to apply a primer, bake, and then polish with sandpaper to remove pinholes.
（課題を解決するための手段）
この発明は、このような従来の問題点に着目し、鋭意研
究の結果なされたもので、金属水酸化物をヒドロゾルま
たはオルガノゾルとして含有させた組成にしたピンホー
ル充填剤により上記問題点を解決したものである。(Means for Solving the Problems) This invention has been made as a result of intensive research focusing on these conventional problems. The above problems are solved by using a filler.
以下、この発明を説明する。This invention will be explained below.
まず構成を説明すると、本発明のピンホール充填剤は必
須成分として金属水酸化物をヒドロゾルあるいはオルガ
ノゾルとして含有する。使用される金属水酸化物は、た
とえばＺｎ（ＯＨ）ｚ、 Ａ ｌ （ＯＨ）＋ 。First, the structure will be explained. The pinhole filler of the present invention contains a metal hydroxide as an essential component in the form of a hydrosol or an organosol. The metal hydroxides used are, for example, Zn(OH)z, Al(OH)+.
Ｃａ（ＯＨ）ｔ、 Ｆ１３（ＯＨ）３． ＣｕＱＩ
Ｉ、 Ｎ１（Ｏｌｌ）ｚ、 Ｍｇ（ＯＨ）ｚ 。Ca(OH)t, F13(OH)3. CuQI
I, N1(Oll)z, Mg(OH)z.
Ｉｒ（ＯＨ）４．Ｃａ（ＯＲ）ｘ、 Ｃａ（Ｏｔｌ）３
．＾ｕ （ＯＨ） ｓ ｌＣｒ （０１１） ３・２Ｈ
ｔＯ＋ Ｚｒ（０１’ｌＬ Ｈｎｆ１２０． ５Ｃ（
０１１）３． ５ｎ（０１１）ｚＳｒ（Ｏｉｌ）ｚ、
５ｒ（ＯＦＩ）ｚ −８１１ｚＯ，Ｃｅ（０１（）ｓ
、 Ｃｅ（ＯＨ）ａ −１１ｔＯ＋ Ｔａ （０１
１） Ｓ＋ Ｂｉ （Ｏｌｌ） ３ １ Ｂｅ（Ｏ
Ｈ） ！ ・ｎＨ２Ｏ，Ｌａ（ＯＨ） ３＋ ＬｉＯＨ
等が挙げられ、要求特性として溶媒に対する溶解度が低
く、化学的安定性に優れ、溶媒に分散させた時のｐ）Ｉ
が中性に近いものが好ましく、なかでもＣａ（ＯＨ）ｚ
、 Ｍｇ（０１１）ｚ、 Ｚｎ（叶）２．八！（ＯＨ）
３．５ｎ（ＯＲ）ｚ、 Ｆｅ（Ｏｌｌ）：＋ が好ま
しい。またこれらの金属水酸化物を固形分中に１００重
景置台有することが好ましいが、従来から使用されてい
る顔料、充填剤、増量剤との併用も可能であり、その場
合、固形分中の金属水酸化物は、１０重量％以上含有さ
れていれば良い、また研磨成分であるＡ ｌ ｚＯｓ等
との併用は充填効果を妨げるので、さけた方が良い。通
常金属水酸化物は粉末として用いられ、塗膜表面のピン
ホールの発生原因が顔料の欠落により生ずるため、この
顔料の粒径（酸化チタンＴｉＯ２では平均粒径０．２５
μ）より小さい粒径の粉末として用いるのが好ましい。Ir(OH)4. Ca(OR)x, Ca(Otl)3
．． ＾u (OH) s lCr (011) 3・2H
tO+ Zr(01'lL Hnf120.5C(
011)3. 5n(011)zSr(Oil)z,
5r(OFI)z -811zO,Ce(01()s
, Ce(OH)a −11tO+ Ta (01
1) S+ Bi (Oll) 3 1 Be(O
H)!・nH2O, La(OH) 3+ LiOH
The required properties are low solubility in solvents, excellent chemical stability, and p)I when dispersed in solvents.
It is preferable that Ca(OH)z is close to neutrality, especially Ca(OH)z
, Mg(011)z, Zn(Kano)2. Eight! (OH)
3.5n(OR)z, Fe(Oll):+ is preferred. In addition, it is preferable that these metal hydroxides are contained in the solid content in a 100-fold scale, but it is also possible to use them in combination with conventionally used pigments, fillers, and extenders. It is sufficient that the metal hydroxide is contained in an amount of 10% by weight or more, and it is better to avoid using it in combination with Al zOs, which is a polishing component, since this will impede the filling effect. Metal hydroxides are usually used as powders, and since pinholes on the coating surface are caused by missing pigments, the particle size of this pigment (for titanium oxide TiO2, the average particle size is 0.25
μ) It is preferable to use it as a powder with a smaller particle size.
溶媒は非極性溶媒として、ｎ−ペンタン、ヘキサン、イ
ソオクタン、石油エーテル、ｎ−デカン、シクロヘキサ
ン、シクロペンクン、ジイソブチレン、１−ペンテン、
二硫化炭素、四塩化炭素、塩化アミル、塩化ブチル、キ
シレン、ｉ−プロピルエーテル、塩化イソプロピル、ト
ルエン、クロロベンゼン、ベンゼン、臭化エチル、エチ
ルエーテル、クロロホルム等が挙げられ、極性溶媒とし
て、メチルイソブチルケトン、テトラヒドロフラン、２
塩化エチレン、メチルエチルケトン、ｉ−ニトロプロパ
ン、アセトン、ジオキサン、酢酸エチル、酢酸メチル、
アルミアルコール、アニリン、ジエチルアミン、ニトロ
メタン、アセトニトリル、ピリジン、ブチルセロソルブ
、ｉ−プロパツール、エタノール、メタノール、エチレ
ングリコール、酢酸、水、等が挙げられる。いずれも金
属水酸化物をコロイド粒子として分散可能であるが、取
り扱い作業性や、塗膜等基材への影響を考慮すると、水
、エタノール、メタノールが好ましい。この溶媒中の固
形分は３０重量％趙〜７０ ｆｉ量％未満含有されてい
れば使用可能であるが、取扱性の面がら考慮すると４０
〜６０重量％が好ましい。The solvent is a nonpolar solvent such as n-pentane, hexane, isooctane, petroleum ether, n-decane, cyclohexane, cyclopenkune, diisobutylene, 1-pentene,
Examples include carbon disulfide, carbon tetrachloride, amyl chloride, butyl chloride, xylene, i-propyl ether, isopropyl chloride, toluene, chlorobenzene, benzene, ethyl bromide, ethyl ether, chloroform, etc. As a polar solvent, methyl isobutyl ketone , tetrahydrofuran, 2
Ethylene chloride, methyl ethyl ketone, i-nitropropane, acetone, dioxane, ethyl acetate, methyl acetate,
Examples include aluminum alcohol, aniline, diethylamine, nitromethane, acetonitrile, pyridine, butyl cellosolve, i-propanol, ethanol, methanol, ethylene glycol, acetic acid, water, and the like. Although metal hydroxides can be dispersed in the form of colloidal particles in any of them, water, ethanol, and methanol are preferable in consideration of handling efficiency and the effect on substrates such as coatings. It can be used if the solid content in this solvent is between 30% by weight and less than 70% by weight, but from the viewpoint of handling, it is possible to use 40% by weight.
~60% by weight is preferred.
（作 用）
ヒンホール内に塗り込まれたピンホール充填剤に含まれ
る溶媒は時間の経過とともに徐々に蒸発し、ヒドロゾル
、あるいはオルガノゾル、またはヒドロゾルあるいはオ
ルガノシルトと他の充填剤が残る。この溶媒の蒸発の過
程で、ヒドロゾル、あるいはオルガノゾル中に含まれる
ＯＨ基が、基材または他の充填剤と水素結合による接着
力を次第に高め、完全に溶媒が蒸発した時には、この０
■基による水素結合によって充填剤が固定できると推定
される。(Function) The solvent contained in the pinhole filler filled into the pinhole gradually evaporates over time, leaving a hydrosol, organosol, or hydrosol or organosilt and other fillers. In the process of evaporation of the solvent, the OH groups contained in the hydrosol or organosol gradually increase the adhesion force with the base material or other fillers due to hydrogen bonding, and when the solvent is completely evaporated, the
It is presumed that the filler can be fixed by hydrogen bonding through groups.
次に取扱性の面からピンホール充填剤の最適固形分比を
求める実験を行った結果を表１に示す。Next, Table 1 shows the results of an experiment to determine the optimum solids content ratio of the pinhole filler from the viewpoint of handleability.
溶媒としてエタノール、固形物としてＣａ （ＯＨ）
ｚを計量混合し、取扱性を評価した。結果から固定分３
０重量％以下は粘度が低すぎさらさらとし、７０重量％
以上ではボッボッした状態で使用することができず、３
５〜６５重量％が好ましく、更に４０〜６０重四％が重
量好ましかった。またこの結果から固形分を５０重量％
に設定し、この固形分中に含まれる金属水酸化物の含有
量を増減し、充填効果を調べた結果を第１図に示す。Ethanol as solvent, Ca(OH) as solid
z was weighed and mixed, and the handleability was evaluated. Fixed portion 3 from the result
If it is less than 0% by weight, the viscosity is too low and it becomes smooth, and if it is 70% by weight.
With the above conditions, it cannot be used in a messy state, and 3
It is preferably 5 to 65% by weight, and more preferably 40 to 60% by weight. Also, from this result, the solid content was 50% by weight.
Fig. 1 shows the results of investigating the filling effect by increasing or decreasing the content of metal hydroxide contained in the solid content.
溶媒としてエタノール、金属水酸化物としてＭｇ （Ｏ
ｌｌ）よ、他の充填剤として？１ｇＯを計量混合し、こ
れらを塗装板に塗り込んだ後、カーボンブラックによる
黒化の度合を色差計で測定した結果、固定分生の金属水
酸化物含有量は５重量％以下では効果がなく１０〜１０
０重量％含有されていれば効果があった。Ethanol as a solvent and Mg (O
ll) Yo, as other fillers? After measuring and mixing 1gO and applying these to the painted board, the degree of blackening due to carbon black was measured using a color difference meter. As a result, it was found that there was no effect if the metal hydroxide content of the fixed fraction was less than 5% by weight. 10-10
It was effective if the content was 0% by weight.
Δ：ややサラサラの液状またはややボッボッの固体 ×：サラサラの液状またはボッボッの固体（実施例） 次に本発明を実施例および試験例により説明する。Δ: Slightly smooth liquid or slightly lumpy solid ×: Smooth liquid or thick solid (Example) Next, the present invention will be explained with reference to Examples and Test Examples.
実五Ｉ引り
塩化アルミニウム（へ臼洋３和光純薬工業（株）製、１
級） １７１ｇを、純水１０００ｃｃに溶解した。次い
で５Ｎ Ｎａ０ＩＩ （和光純薬工業（株）製、１級）
で中和し、ＰＨを７にした。生成した沈澱を濾過洗浄し
、５０°Ｃのオーブンで一昼夜乾燥した。Real 5 I drawn aluminum chloride (Heusuyo 3 manufactured by Wako Pure Chemical Industries, Ltd., 1
grade) was dissolved in 1000 cc of pure water. Then 5N Na0II (manufactured by Wako Pure Chemical Industries, Ltd., grade 1)
It was neutralized and the pH was brought to 7. The generated precipitate was filtered and washed, and dried in an oven at 50°C overnight.
次いで沈澱物を取り出し、１００ｇの純水と練り合わせ
てピンホール充填剤を得た。Next, the precipitate was taken out and mixed with 100 g of pure water to obtain a pinhole filler.
裏庭貫１
塩化アルミニウム（Ａｊ２ＣＩ！ｚ和光純薬工業（株）
製、１級） １７１ｇを、純水１０００ｃｃに溶解した
。次いで５Ｎ Ｎａ０１ｌ （和光純薬工業（株）製、
１級）で中和し、ｐＨを７にした。生成した沈澱を濾過
洗浄し、５０°Ｃのオーブンで一昼夜乾燥した。沈澱物
を取り出し、１００ｇのエチルアルコール（和光純薬工
業（株）製、特級）と練り合わせてピンホール充填剤を
得た。Backyard 1 Aluminum chloride (Aj2CI!z Wako Pure Chemical Industries, Ltd.)
171g (171g) was dissolved in 1000cc of pure water. Next, 5N Na01l (manufactured by Wako Pure Chemical Industries, Ltd.,
The pH was adjusted to 7. The generated precipitate was filtered and washed, and dried in an oven at 50°C overnight. The precipitate was taken out and mixed with 100 g of ethyl alcohol (manufactured by Wako Pure Chemical Industries, Ltd., special grade) to obtain a pinhole filler.
ス去ｌ吐ｌ
塩化マグネシウム（ＭｇＣｆｚ和光純薬工業（株）製、
１級） １６３ｇを、純水１０００ｃｃに溶解した。次
いで５Ｎ Ｎａ０１１ （和光純薬工業（株）製、１級
）で中和し、ｐＨを７にした。生成した沈澱を濾過洗浄
し、５０”Ｃのオーブンで一昼夜乾燥した。次いで沈澱
物を取り出し、１００ｇのエチルアルコール（和光線薬
工業（株）製、特級）と練り合わせてピンホール充填剤
を得た。Discharge Magnesium chloride (MgCfz manufactured by Wako Pure Chemical Industries, Ltd.)
163g of grade 1) was dissolved in 1000cc of pure water. Then, it was neutralized with 5N Na011 (manufactured by Wako Pure Chemical Industries, Ltd., grade 1) to bring the pH to 7. The generated precipitate was filtered and washed, and dried in an oven at 50"C for a day and night.Then, the precipitate was taken out and mixed with 100 g of ethyl alcohol (special grade, manufactured by Wako Shinyaku Kogyo Co., Ltd.) to obtain a pinhole filler. .
夫１桝互
塩化カルシウム（ＣａＣｌ ２和光純薬工業（株）製、
１級） １５０ｇを、純水１０００ｃｃに溶解した。Calcium chloride (CaCl 2 manufactured by Wako Pure Chemical Industries, Ltd.)
150g of grade 1) was dissolved in 1000cc of pure water.
５Ｎ Ｎａ０１１ （和光純薬工業（株）製、１級）で
中和し、ｐＨを７にした。生成した沈澱を濾過洗浄し、
５０″Ｃのオーブンで一昼夜乾燥した。次いで沈澱物を
取り出し、１００ｇのエチルアルコール（和光純薬工業
（株）製、特級）と練り合わせてピンホール充填剤を得
た。It was neutralized with 5N Na011 (manufactured by Wako Pure Chemical Industries, Ltd., grade 1) to bring the pH to 7. The generated precipitate is filtered and washed,
It was dried in an oven at 50''C for a day and night.Then, the precipitate was taken out and kneaded with 100g of ethyl alcohol (manufactured by Wako Pure Chemical Industries, Ltd., special grade) to obtain a pinhole filler.
夫藷ｍ工
塩化亜鉛（ＺｎＣｌ ｚ和光純薬工業（株）製、１級）
１３７ｇを純水１０００ｃｃに溶解した。次いで５Ｎ
Ｎａｉｌ （和光純薬工業（株）製、１級）で中和し、
ｐＨを７にした。Zinc chloride (ZnCl manufactured by Wako Pure Chemical Industries, Ltd., grade 1)
137g was dissolved in 1000cc of pure water. Then 5N
Neutralize with Nail (manufactured by Wako Pure Chemical Industries, Ltd., grade 1),
The pH was set to 7.
生成した沈澱を濾過洗浄し、５０°Ｃのオーブンで一昼
夜乾燥した。次いで沈澱物を取り出し、１００ｇのエチ
ルアルコール（和光純薬工業（株）製、特級）と練り合
わせてピンホール充填剤を得た。The generated precipitate was filtered and washed, and dried in an oven at 50°C overnight. Next, the precipitate was taken out and mixed with 100 g of ethyl alcohol (manufactured by Wako Pure Chemical Industries, Ltd., special grade) to obtain a pinhole filler.
実施班旦
塩化マグネシウム（ＭｇＣ／！、和光純薬工業（株）製
、１級）９８ｇを、純水１０００ｃｃに溶解した。次い
で５Ｎ ＮａＯＨ（和光純薬工業（株）製、１級）で中
和し、ｐＨを７にした。In the implementation example, 98 g of magnesium chloride (MgC/!, manufactured by Wako Pure Chemical Industries, Ltd., grade 1) was dissolved in 1000 cc of pure water. Then, it was neutralized with 5N NaOH (manufactured by Wako Pure Chemical Industries, Ltd., grade 1) to adjust the pH to 7.
生成した沈澱を濾過洗浄し、５０°Ｃのオーブンで一昼
夜乾燥した。次いで沈澱物を取り出し、酸化マグネシウ
ム４０ｇ （和光純薬工業（株）製、１級）と、１００
ｇのエチルアルコール（和光純薬工業（株）製、特級）
と練り合わせてピンホール充填剤を得た。The generated precipitate was filtered and washed, and dried in an oven at 50°C overnight. Next, the precipitate was taken out, and 40 g of magnesium oxide (manufactured by Wako Pure Chemical Industries, Ltd., grade 1) and 100 g of magnesium oxide were added.
g of ethyl alcohol (manufactured by Wako Pure Chemical Industries, Ltd., special grade)
A pinhole filler was obtained by kneading with.
跋朕斑上
ＳＭＣ表面へのピンホール充填剤の充填評価を以下に示
すようにして行った。Evaluation of the filling of the pinhole filler onto the SMC surface on the scarlet spot was performed as shown below.
実施例２．３．４および５で作製した４種類のピンホー
ル充填剤と自動車用パテ（ロック計量板金パテ（０５７
−０３０６） 、ロック・ペイント社製）を、ＳＭＣ表
面にそれぞれ塗り込み、余分な充填剤は拭き取った。処
理した５種類のＳＭＣ表面と無処理のＳＭＣ表面に中塗
り塗料（関西ペイント（株）製、ＫＰ ＫＰＸ−３６グ
レー）をスプレー塗布し、１４０°Ｃで３０分間焼付け
した後、表面のピンホールの発生状態を目視により評価
した。得た結果を表２に示す。表２の結果からパテを塗
り込んだ面は、無処理面と同様、多くのピンホール発生
が認められたが、金属水酸化物を塗り込んだ面は明らか
にピンホールの減少が確認され、特にＡ１１）ｆｆは効
果があった。Four types of pinhole fillers prepared in Examples 2.3.4 and 5 and automotive putty (lock metering sheet metal putty (057)
-0306), manufactured by Rock Paint Co., Ltd.) was applied to the SMC surface, and excess filler was wiped off. Intermediate paint (Kansai Paint Co., Ltd., KP KPX-36 Gray) was spray applied to the five types of treated SMC surfaces and the untreated SMC surface, and after baking at 140°C for 30 minutes, the pinholes on the surface were removed. The state of occurrence was visually evaluated. The results obtained are shown in Table 2. From the results in Table 2, the surface coated with putty had as many pinholes as the untreated surface, but the surface coated with metal hydroxide clearly had fewer pinholes. In particular, A11)ff was effective.
去−一亀
◎：ビンホール数極めて少ない
○：ピンホール数少ない
×：ピンホール数多い
拭腋皿叢
塗膜表面へのピンホール充填剤の充填評価を次に示すよ
うに評価用塗装板を作製して行なった。- Ichigame ◎: Very few pinholes ○: Few pinholes ×: Wiping plate with many pinholes To evaluate the filling of the pinhole filler on the coating surface, a painted plate for evaluation was prepared as shown below. I did it.
先ず評価用塗装板は、自動車用塗料（メラミンアルキド
樹脂）に酸化チタン８０重量部を混合し、顔料の含有率
を高くし、ブリキ板に塗布焼付けた後市販のコンパウン
ド入すワックスで研磨し作製した。評価はこの塗装板に
実施例１〜６で作製した６種類のピンホール充填剤を塗
り込み、余分な充填剤を拭き取った後、ゴム用カーボン
ブラックをすり込み、黒化の度合いを色差計で測定し、
Ｌａ” ｂ”座標におけるカーボンブラックをすり込ま
ない面を基準とする色差ΔＥ値で比較した。First, the painted plate for evaluation was prepared by mixing 80 parts by weight of titanium oxide with automotive paint (melamine alkyd resin) to increase the pigment content, applying it to a tin plate, baking it, and polishing it with a commercially available wax compound. did. For evaluation, six types of pinhole fillers prepared in Examples 1 to 6 were applied to this painted board, and after wiping off the excess filler, carbon black for rubber was rubbed in, and the degree of blackening was measured using a color difference meter. measure,
A comparison was made using the color difference ΔE value based on the surface on which no carbon black was rubbed at the La"b" coordinate.
尚比較のため充填剤を塗り込まない無処理のものについ
てΔＥ値を評価した。For comparison, the ΔE value was evaluated for an untreated sample without filler applied.
評価結果を表３に示すが、研磨面にピンホール充填剤を
塗り込んだ試料のΔＥ値は１であり、研磨面そのままの
試料のΔＥ値は２０であり、優れた充填効果が得られた
。The evaluation results are shown in Table 3. The ΔE value of the sample with the pinhole filler applied to the polished surface was 1, and the ΔE value of the sample with the polished surface as it was was 20, indicating that an excellent filling effect was obtained. .
（発明の効果）
以上説明してきたように、この発明によれば、その構成
を充填剤中に金属水酸化物をヒドロゾル、またはオルガ
ノゾルとして含有させた組成としたため、充填剤中に含
まれるＯＨ基による水素結合により充填剤が固定され、
傷やピンホールが好首尾に充填できるという効果が得ら
れる。(Effects of the Invention) As described above, according to the present invention, since the filler has a composition in which the metal hydroxide is contained in the form of a hydrosol or organosol, the OH group contained in the filler is The filler is fixed by hydrogen bonding,
The effect is that wounds and pinholes can be successfully filled.
第１図はピンホール充填剤の固形分中の水酸化物含有量
と性能の関係を示す線図である。
特許出願人 日産自動車株式会社FIG. 1 is a diagram showing the relationship between the hydroxide content in the solid content of a pinhole filler and its performance. Patent applicant Nissan Motor Co., Ltd.
Claims (1)
て単独またはそれらの混合物を含有することを特徴とす
るピンホール充填剤。1. A pinhole filler containing a metal hydroxide alone or in a mixture thereof as a hydrosol or organosol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32376088A JPH02170872A (en) | 1988-12-23 | 1988-12-23 | Pinhole filler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32376088A JPH02170872A (en) | 1988-12-23 | 1988-12-23 | Pinhole filler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02170872A true JPH02170872A (en) | 1990-07-02 |
Family
ID=18158321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32376088A Pending JPH02170872A (en) | 1988-12-23 | 1988-12-23 | Pinhole filler |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02170872A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111548666A (en) * | 2020-06-06 | 2020-08-18 | 范林 | Waterproof and bacteriostatic weakly-alkaline negative oxygen ion putty powder for purifying air and preparation method thereof |
-
1988
- 1988-12-23 JP JP32376088A patent/JPH02170872A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111548666A (en) * | 2020-06-06 | 2020-08-18 | 范林 | Waterproof and bacteriostatic weakly-alkaline negative oxygen ion putty powder for purifying air and preparation method thereof |
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