JPH02165660A - Electronic parts - Google Patents

Abstract

PURPOSE:To improve heat radiating property by forming the supporting opening to support a chip at the supporting member to support an electronic circuit chip, and fixing the electronic circuit chip to the supporting member so that the circuit pattern formation face of the electronic circuit chip may be sealed together with a conductor part provided in the supporting member. CONSTITUTION:In a vessel 1 to become a supporting member, the supporting opening 10 to support a semiconductor chip 2 as an electronic circuit chip is formed. And the semiconductor chip 2 is fixed to the vessel 1 in the condition that the circuit pattern formation face is turned to the same side as a conductor part 3. According to this constitution, the circuit pattern formation face of the electronic circuit chip is protected by sealing, and at the same time the insulating board face of this electronic circuit chip becomes in the conditions that it contacts with the air outside the electronic parts, and heat radiation is done between the semiconductor chip and the space, and the heat radiating property improves.

Description

DETAILED DESCRIPTION OF THE INVENTION [Objective of the Invention (Field of Industrial Application)] The present invention relates to electronic components, and particularly to a fixing structure for electronic circuit chips.

(Prior Art) In recent years, the demand for devices to be lighter, thinner, shorter, and smaller has become unstoppable. Furthermore, improvements in their functionality and performance are required, and as a natural result, there is a strong demand for improvements in implementation and new implementation techniques.

However, in advancing miniaturization, problems arise for both manufacturers and users.

For example, miniaturization requires the development and introduction of superior materials and construction methods, and from an economic perspective, the cost of equipment increases, the efficiency of its use decreases, and the burden of depreciation of equipment increases. There are reports such as.

On the other hand, those who use miniaturized chip components find it difficult to handle the components because they are too small1, and they are often lost or mixed up.

One solution to these problems is to package miniaturized chips in packages with dimensions that are convenient for use by the final handler.

Such a semiconductor package uses ceramics, glass, metal, plastic, etc. as a container material to house the chip, and the semiconductor chip is bonded to these containers, and then chip electrodes and the container are formed. The conductor portion is electrically connected by wire bonding.

Figure i5 is a cross-sectional view showing the structure of such a conventional electronic component. In the figure, a container 1 serving as a support member for an electronic circuit chip contains, for example, a semiconductor chip 2 as an electronic circuit chip.
is fixed throughout.

Further, the container 1 has a conductor part 3 for connecting the semiconductor chip 2, and the semiconductor chip 2 and the conductor part 3 are electrically connected by a bonding wire 4.

The semiconductor chip 2 and conductor portion 3 thus housed in the container 1 are sealed with a sealing metal 5, and a lead bin 6 for connecting the electronic component to other devices is further connected to the container 1. .

That is, this semiconductor chip 2 is completely sealed within the container 1 and is in a state of being cut off from the outside air.

The containers are sealed by soldering an alumina lid with a metalized periphery using Au-8n preform, or by electric resistance welding a metal lid to a weld ring. .

Resin sealing, in which the chip is directly sealed with resin, is also used.

(Problem 8 to be Solved by the Invention) Incidentally, as ICs become more highly integrated, the amount of heat generated during operation of semiconductor elements increases, and the heat dissipation performance of semiconductor packages has become a problem.

For this reason, aluminum nitride ceramics and beryllia ceramics, which have high thermal conductivity, have begun to be frequently used as container materials.

However, these ceramics also have a limit in thermal conductivity, and the lack of heat dissipation performance is an impediment to achieving higher packaging density.

Furthermore, as the operating temperature of electronic components increases, the difference in thermal expansion coefficient between a semiconductor material such as silicon used as an insulating substrate of an electronic circuit chip and a support member such as a container has become a problem.

In other words, the difference in thermal expansion coefficient between the container material and the semiconductor chip causes stress, which can cause cracks in the semiconductor chip. Therefore, the container material must be selected with the thermal expansion coefficient taken into consideration. There is.

The present invention was made in response to such problems.
The purpose is to provide electronic components with excellent heat dissipation properties and easy selection of materials.

[Structure of the Invention] (Means for Solving the Problems) The electronic component of the present invention includes an electronic circuit chip in which a predetermined circuit pattern is formed on an insulating chip, and a support opening that supports the electronic circuit chip. and a chip support member having a conductor portion connecting the circuit pattern of the electronic circuit chip, and fixing the electronic circuit chip to the chip support member such that the circuit pattern forming surface faces the same side as the conductor portion, The circuit pattern forming surface of the electronic circuit chip and the conductor portion to which the circuit pattern is connected are sealed with a sealing member.

(Function) According to the electronic component of the present invention, a support opening that supports the chip is formed in the support member that supports the electronic circuit chip, and the circuit pattern forming surface of the electronic circuit chip is provided in the support member. The electronic circuit chip is fixed to the support member so as to be sealed together with the conductor portion.

Therefore, the insulating chip surface of the electronic circuit chip is in direct contact with the air outside the sealed electronic component, and heat is dissipated between the chip and the air, so that heat dissipation can be improved.

On the other hand, since the circuit pattern forming surface of the electronic circuit chip is sealed, the circuit pattern is protected.

Further, since the electronic circuit chip is exposed to the outside in this way, the cooling time of the chip can be shortened by blowing air or the like.

Further, since the bonding area between the electronic circuit chip and the support member is small, the influence of stress caused by the difference in coefficient of thermal expansion between the chip and the support member is small, and the selection of the support member material is facilitated.

(Example) Next, an example of the present invention will be specifically described using the drawings. Note that the same parts as in FIG. 5 are given the same reference numerals, and the explanation of the overlapping parts will be omitted.

Embodiment 1 FIG. 1 is a diagram showing the structure of a semiconductor package in an embodiment of the present invention, and FIG. 2 is a sectional view of the semiconductor package shown in FIG. 1.

A support opening 10 for supporting a semiconductor chip 2 as an electronic circuit chip is formed in a container 1 serving as a support member.

The semiconductor chip 2 is fixed to the container 1 with the circuit pattern forming surface facing the same side as the conductor portion 3.

The fixing in this example was carried out with the circuit pattern formed surface of the semiconductor chip 2 in contact with the capacitor 2ri1.

Such an electronic component is manufactured, for example, as follows.

First, through-holes are formed by punching in a ceramic green sheet whose main component is aluminum nitride, and at the same time, support openings for supporting the semiconductor chip are formed in the portion where the semiconductor chip is to be fixed.

Next, the through holes are filled with a conductive paste such as tungsten by screen printing, and a desired circuit pattern is printed on the green sheet.

Then, these green sheets are laminated and integrated by thermocompression bonding, degreased, and fired to produce a ceramic multilayer substrate container.

Thereafter, the semiconductor chip is fixed face down to the container so as to close the support opening formed in the container, and the semiconductor chip and the conductor portion formed in the container are electrically connected by wire bonding.

Finally, the lower part of the container is sealed using metal as a sealing member to form a package.

Electronic components manufactured using this method have good heat dissipation properties because the circuit pattern of the semiconductor chip is protected by sealing, and the insulating substrate surface of the semiconductor chip is in contact with air. Ta.

Furthermore, since the bonding area of the chip was reduced, the amount of bonding agent used could be reduced, leading to cost reductions.

Furthermore, even when the material for the container was selected as a container and there was a difference in the coefficient of thermal expansion between the semiconductor chip and the container material, the incidence of cracks was significantly reduced compared to electronic components with conventional structures.

Embodiment 2 FIG. 3 is a diagram showing another embodiment of the present invention. Note that the symbols are the same as in FIG. 1.

In this embodiment, the semiconductor chip 2 is placed in the support opening 1 of the container 1.
0, the insulating substrate surface of the semiconductor chip 2 is fixed to the container 1.
It is fixed so that it is in contact with the That is, it is in a fixed state inside the container 1.

Even with such a structure, the same effects as in Example 1 could be obtained.

Embodiment 3 FIG. 4 is a sectional view showing still another embodiment of the present invention.

In the figure, a printed circuit board 11 which is a chip support member is shown.
A conductor portion 3 is printed on the substrate, and a semiconductor chip 2 is fixed to a printed circuit board 11 in the same state as in the first embodiment.

Further, the circuit pattern of the semiconductor chip 2 is electrically connected to the conductor portion 3 by a bonding wire 4.

The circuit pattern and conductor portion 3 of the semiconductor chip 2 are sealed by botting using a resin 15 as a sealing member.

By adopting such a structure, it becomes easy to attach the semiconductor chip, and further, the sealing performance is improved because the support opening part serves as a cavity part.

As is clear from these results, by forming a support opening in the portion of the container where the semiconductor chip is fixed and bringing the semiconductor chip into contact with the air outside the container, heat dissipation could be improved.

Further, since the area of the support opening and the amount of bonding material used to bond the semiconductor chip and the container can be reduced, costs can be reduced.

[Effects of the Invention] As explained above, according to the electronic component of the present invention, the circuit pattern forming surface of the electronic circuit chip is protected by sealing, and at the same time, the insulating substrate surface of the electronic circuit chip is protected from the outside of the electronic component. The semiconductor chip is in contact with the air, and heat dissipation occurs between the semiconductor chip and the air, improving heat dissipation.

Therefore, it becomes possible to achieve higher density.

Furthermore, since the bonding area between the electronic circuit chip and the support member is small, bonding defects due to differences in thermal expansion coefficients are reduced, and the material for the support member can be easily selected.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing the structure of an electronic component according to an embodiment of the present invention;
FIG. 2 is a sectional view of FIG. 1, FIGS. 3 and 4 are sectional views of other embodiments of the present invention, and FIG. 5 is a sectional view of a conventional electronic component. 1... Container 2... Semiconductor chip 3... Conductor portion 4... Bonding wire 5...・・・
... Sealing metal 6 ... Lead pin 10 ... Support opening Applicant: Toshiba Corporation

Claims (1)

[Claims] (1) A chip support member having an electronic circuit chip with a predetermined circuit pattern formed on an insulating chip, and a support opening that supports the electronic circuit chip and a conductor portion that connects the circuit pattern of the electronic circuit chip. The electronic circuit chip is fixed to the chip support member so that the circuit pattern forming surface faces the same side as the conductor part, and the circuit pattern forming surface of the electronic circuit chip and the conductor to which the circuit pattern is connected are provided. An electronic component characterized in that a portion of the electronic component is sealed with a sealing member.