JPH0211789Y2 - - Google Patents

Description

[Detailed description of the invention] Industrial application field The present invention relates to an IC socket used for inspecting or mounting an IC package, and in particular, the invention relates to an IC socket used for inspecting or mounting an IC package. While intervening the IC contact pieces arranged in parallel on the side, the contacts placed between the partition walls and the above
This invention relates to an IC socket that makes contact with an IC contact piece.

Conventional technology Conventionally, dual in-line IC packages have adopted a clamping type in which the IC contact piece is held between the contacts of an IC socket to make contact, and flat type ICs have also been used.
A package or a leadless IC package usually adopts a mounting configuration in which an IC contact piece is placed on top of the contact of an IC socket to make contact.

In the latter case, as shown in FIG. 1, contact partition walls 2 are usually arranged in a comb-like shape on two to four sides of the IC mounting portion of the IC socket board 1, and the IC package 3 is connected to the end surface of the partition walls. A mounting space 4 is defined for the IC package 3, and while the IC package 3 is received in this space 4, the ICs installed in parallel on the side of the IC package 3 are
A contact means is employed in which the contact piece 5 is placed on the contact 6 implanted between the contact partition walls 2.
However, in this case, the IC contact piece 5 is connected to the contact partition wall 2.
When the partition wall 2 intervenes between the IC contact pieces 5 (in other words, the partition wall 2 intervenes between the IC contact pieces 5), friction occurs between the side edge of the IC contact piece 5 and the inner surface of the partition wall 2.

In particular, in the case of IC sockets for testing, the frequency of attachment and detachment of the IC package 3, that is, the frequency of this friction, is extremely high, and synthetic resin bulkheads that are integrally molded tend to wear out prematurely, resulting in looseness, loss of positioning function, etc. Invite.

For example, if the amount of protrusion of the IC contact piece 5 from the side surface of the IC package 3 is small, the IC contact piece 5 may be attached to the partition wall 2.
Since it intervenes near the end face of the IC package, the edge of the partition wall 2 that restricts the side surface of the IC package is damaged.

Furthermore, in recent years, due to demands for high-density contact, miniaturization, etc., the pitch in which the IC contacts 5 are arranged side by side has become narrower and narrower. Moreover, in this case, in order to maintain the strength of the IC contact piece 5,
There is a desire to reduce only the parallel pitch without making the tangent pieces thinner.

Therefore, the interval between the IC contact pieces inevitably becomes smaller, so the thickness of the contact partition wall 2 interposed between the contact pieces must be made as thin as possible. However, due to molding technology problems, the contact partition wall 2 There is a limit to how thin the wall can be made, and there is also the problem that if it is made too thin, it will not be able to maintain wall strength that can withstand normal use.

Problems to be Solved by the Invention This invention solves the problems caused by the miniaturization of the pitch of the IC contact pieces and the narrowing of the interval between the contact pieces.
This is an attempt to effectively overcome the limitations of thinning contact partition walls in sockets.

Further, the present invention aims to provide an IC socket in which the contact partition wall has sufficient strength to effectively prevent wear even in the case of frequently used IC packages.

By simultaneously regulating the side edges and front edges of the IC contact piece itself that is used for the contact, it is possible to
The present invention provides an IC socket that maintains proper relative position of IC contact pieces and ensures contact under minute pitches.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention aims to solve the above-mentioned problems by integrally providing a reinforcing piece of ceramic or the like on the contact partition wall, which has conventionally been formed of integrally molded resin. Protruding from the end face of the contact partition wall, forming a step portion facing the front edge of the IC contact piece by the contact partition end face on the side of the projecting part, and intervening the reinforcing piece protrusion part between the IC contact pieces, in other words. Then, while intervening the IC contact piece between the adjacent reinforcing piece protrusions and regulating the position, the IC contact piece is
The front edge of the contact piece is regulated so as to make contact with the contact.

As a result of the above, when the IC package is attached to or removed from the IC socket, the IC contact piece is restrained by the reinforcing piece that protrudes from the end face of the contact bulkhead, and is interposed between the protruding parts of the reinforcing piece to make corresponding contact with the contact. fulfilled. By adding the reinforcing piece, the edge portion of the contact partition wall where the IC contact piece intervenes can be made as thin as possible, effectively dealing with the arrangement of IC contact pieces with minute pitches and narrow intervals, and further improving the thickness of the IC package. To prevent wear caused by repeated attachment and detachment.

Embodiment The embodiment of the present invention explained above is further illustrated in the drawings (second
This will be explained in detail based on the following figures.

In the same embodiment, reference numeral 11 denotes a socket board, and contact partition walls 12 are arranged in parallel in a comb-like shape on the four sides of the IC mounting portion of the socket board 11.
A mounting space 14 for the IC package 13 is defined.

The IC contact piece 15 is of a J-bend type, extending from the side surface of the IC package to the lower edge, and bent into a substantially J shape at the lower edge.

A contact 16 is provided between the contact partition walls 12.
is implanted, and its vertically elastically displaceable end protrudes into the IC mounting space 14 in front of the bulkhead 12, and the bent end of the IC contact piece 15 is placed on the lower edge of the IC package cage. . Reference numeral 19 represents an IC holding cover for maintaining the IC mounting state, and reference numeral 20 represents a lock lever of the cover.

The contact partition wall 12 of the IC socket constructed as described above is preferably provided with a reinforcing piece 17 on the entire wall thereof that can protrude from the end face of the partition wall.

A reinforcing piece portion that can protrude from the end face of the contact partition wall is interposed between the IC contact pieces 15, in other words, the IC contact piece 15 is interposed between the reinforcing piece protrusions 17a, and the contact 16 is placed in contact with the above-mentioned contact 16 under this intervention. obtain.

The reinforcing piece 17 is constructed as a separate part and is integrally attached to the contact partition wall 12.

A suitable material for the reinforcing piece 17 is a thin ceramic plate with high wear resistance.

A very thin ceramic plate of about 0.3 to 0.5 mm can be used.

As shown in detail in FIG. 3, the reinforcing piece 17 made of the ceramic thin plate or the like is embedded in the thickness of the contact partition wall 12 so as to form a multilayer structure, and its edge is made to protrude from the edge surface of the contact partition wall. .

To give a more specific example, a slit 18 is preformed and placed on the center line of the wall thickness of the contact partition wall 12, a reinforcing piece 17 made of a separate part is inserted into the slit 18, and the edge of the slit 18 is inserted. Make the contact protrude from the end face of the partition wall.

Preferably, the slit 18 is extended to the socket base portion to which the base of the contact partition wall 12 is connected, and the reinforcing piece 17 is press-fitted into the rear slit extension portion to form an integral structure. 17b indicates a press-fitted portion of the reinforcing piece 17.

As a result of the above, the protruding portion 17a of the reinforcing piece 17 is protruded from the center of the end face of the contact partition wall 12 as shown in FIGS. 4 and 5 (FIG. 5 is shown with the contacts removed). A stepped portion 12a is formed by the end face of the contact partition wall 12 on both sides. As shown in FIG. 5, the IC contact piece 15 is widened to a position close to the side surface of the reinforcing piece protrusion 17a, and the IC contact piece 15 has a stepped portion 12a, which is the end face of the contact partition, bordering on the reinforcing piece protrusion 17a. It is confronted with the leading edge of.

Thereby, the front edge of the IC contact piece 15 can be restricted, and the side edges of the IC contact piece 15 can be restricted by the reinforcing piece protrusion 17a.

As another example of a composite structure of the reinforcing piece 17 and the contact partition wall 12, FIG. Similarly to the above, the contact partition wall 12 is made to protrude from the end surface of the contact partition wall 12 to form a stepped portion 12a having a one-sided structure. The above-mentioned press-fitting means can also be used for this attachment.

As shown in an enlarged view in FIG.
At the bottom of the end face, there is a stepped portion 12b that is at the same level as the protruding end face of the reinforcing piece or extends beyond the same end face and reaches the lower edge of the IC package cage.
form. This stepped portion 12b can restrict the lower end surface of the IC contact piece 15 or the lower edge of the base of the IC package.

The embodiment shown in FIG. 6 can also have a similar structure.

Effects of the invention According to the invention, as detailed above, the contact partition wall has a composite structure of a synthetic resin molded wall and a reinforcing piece, and the reinforcing piece isolates the IC contact pieces.
By using a mechanism that intervenes between the IC contacts,
This makes it possible to make the intervening part of the IC contact piece as thin as possible, making it possible to cope with minute pitches of the IC contact piece without sacrificing strength, and providing higher wear resistance. did it.

In other words, it is possible to make the easily deformable IC contact piece have sufficient strength without making the IC contact piece smaller or, conversely, to make it wider, and also to increase the interval between the IC contact pieces in accordance with the thinning mentioned above. It also made it possible to narrow it down further.

Further, as described above, it is possible to ensure wear resistance while being thin, and to provide a socket that can withstand long-term use without losing its positioning effect even in cases where frequent attachment and detachment of an IC package is required, such as an IC socket for inspection.

In addition, the present invention eliminates the protrusion from the end surface of the contact partition wall.
While intervening between the IC contact pieces and regulating their side edges, the front edge of the IC contact pieces is controlled by a step formed by the end face of the contact partition on the side of the protrusion, and the protrusion intervenes and regulates the front edge of the IC contact piece. By simultaneously restricting the side edges and front edges of the IC contact piece by the stepped portion, the relative position of the IC contact piece to the contact is maintained appropriately, and highly reliable contact is ensured even if there is a minute pitch between the two. Furthermore, by forming the protrusion with a reinforcing piece, the above-mentioned abrasion resistance can be obtained and the partition wall can be thinned without any difficulty in forming, while the positioning effect can be maintained for a long period of time. Thus, we were able to provide an IC socket that can effectively deal with the miniaturization of the pitch of the IC contacts.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of a conventional IC socket in comparison with the present invention, and Fig. 2 and subsequent figures show embodiments of the present invention.
Fig. 2 is a perspective view of the IC socket, Fig. 3 is an enlarged perspective view of the socket base, Fig. 4 is an enlarged perspective view of the contact partition, and Fig. 5 is a view between the IC contacts in the partition. FIG. 6 is an enlarged plan view showing another example of the mounting structure of the reinforcing piece. 11...Socket base, 12...Contact bulkhead, 13...IC package, 14...IC mounting space, 15...IC contact piece, 16...Contact,
17...Reinforcement piece, 17a...Protrusion of reinforcement piece, 1
8... Slits.

Claims (1)

[Scope of utility model registration request] A reinforcing piece 17 is integrally provided on the contact partition wall 12 arranged in parallel with the IC package mounting portion of the socket board 11, and the end of the reinforcing piece 17 is made to protrude from the end surface of the contact partition wall 12, so that the protruding portion 17 of the reinforcing piece
A step 12a is formed by the end face of the contact partition wall 12 on the side of a, and the protrusion 17a of the reinforcing piece 17 is
The protrusion 17a is inserted between the IC contact pieces 15 arranged in parallel on the side of the IC package, and the side edges of the IC contact pieces 15 are restricted by the intervention of the protrusion 17a.
is opposed to the front edge of the IC contact piece 15 to regulate the front edge, and the regulation by the intervention of the protruding portion 17a and the stepped portion 1
2a. An IC socket characterized in that the contact 16 arranged between the contact partition walls 12 and the IC contact piece 15 are brought into contact with each other under the regulation of the IC socket 2a.