JPH0210256A - Method for detecting flaw in ceramic board - Google Patents
Method for detecting flaw in ceramic boardInfo
- Publication number
- JPH0210256A JPH0210256A JP16190588A JP16190588A JPH0210256A JP H0210256 A JPH0210256 A JP H0210256A JP 16190588 A JP16190588 A JP 16190588A JP 16190588 A JP16190588 A JP 16190588A JP H0210256 A JPH0210256 A JP H0210256A
- Authority
- JP
- Japan
- Prior art keywords
- infrared rays
- ceramic substrate
- board
- infrared
- camera
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 claims description 42
- 230000007547 defect Effects 0.000 abstract description 14
- 230000002950 deficient Effects 0.000 abstract description 9
- 238000001514 detection method Methods 0.000 abstract description 6
- 238000012544 monitoring process Methods 0.000 abstract 1
- 238000011179 visual inspection Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、電子部品等に使用されるセラミックス基板の
欠陥の有無を検査するための、セラミックス基板の探傷
方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a flaw detection method for ceramic substrates for inspecting the presence or absence of defects in ceramic substrates used for electronic components and the like.
［従来の技術］
電子部品に使用されているセラミックス基板は、クラッ
ク、穴等の欠陥の有無を検査し、不良品を排除して良品
のみを使用する必要がある。[Prior Art] Ceramic substrates used in electronic components must be inspected for defects such as cracks and holes, and defective products must be excluded to use only good products.
従来から行われているセラミックス基板の探傷方法とし
て、目視検査、セラミックス基板の表面を加熱して、そ
こから放射される赤外線を検出する方法等がある。Conventional flaw detection methods for ceramic substrates include visual inspection, heating the surface of the ceramic substrate, and detecting infrared rays emitted from the surface.
［発明が解決しようとする課題］
従来から行われている目視検査は最も多く採用されてい
るが、多くの人手と時間を要し、光の当て方によっては
欠陥を見落すことがあった。[Problems to be Solved by the Invention] Visual inspection, which has been conventionally performed, is the most commonly used method, but it requires a lot of manpower and time, and defects may be overlooked depending on the way the light is applied.
またセラミックス基板の表面を加熱して放射される赤外
線を検出する方法は、加熱に時間がかかると共に、多く
のエネルギーを必要とし、しかも均一に加熱することが
むずかしい点があった。Furthermore, the method of heating the surface of a ceramic substrate and detecting the infrared rays emitted therefrom takes a long time to heat, requires a lot of energy, and is difficult to heat uniformly.
本発明はこのような従来の欠点を除去し、極めて短時間
に精度の高い検出ができるようにしたセラミックス基板
の探傷方法を提供するものである。The present invention eliminates these conventional drawbacks and provides a method for detecting flaws on ceramic substrates that enables highly accurate detection in an extremely short period of time.
［課題を解決するための手段］
本発明は、セラミックス基板の一方の面より赤外線を照
射し、前記セラミックス基板の他方の面側に透過した赤
外線を検出することを特徴とするセラミックス基板の探
傷方法である。[Means for Solving the Problems] The present invention provides a flaw detection method for a ceramic substrate, characterized by irradiating infrared rays from one side of the ceramic substrate and detecting the infrared rays transmitted to the other side of the ceramic substrate. It is.
［作 用］
短時間で表面のみならす、裏面や内部の欠陥も検査する
ことかできる。[Function] In a short time, it is possible to inspect not only the surface but also the back and internal defects.
［実 施 例］ 以下、本発明の実施例を図面を参照して説明する。[Example] Embodiments of the present invention will be described below with reference to the drawings.
第１図は本発明の方法の一実施例に使用する装置の正面
図であって、セラミックス基板ｌの裏面には赤外線ラン
プ２を設け、セラミックス基板ｌの表面側には赤外線カ
メラ３を設けである。赤外線カメラ３は、処理装置４、
モニタテレビ５に順次接続されている。FIG. 1 is a front view of an apparatus used in an embodiment of the method of the present invention, in which an infrared lamp 2 is provided on the back side of the ceramic substrate l, and an infrared camera 3 is provided on the front side of the ceramic substrate l. be. The infrared camera 3 includes a processing device 4,
They are sequentially connected to a monitor television 5.
赤外線ランプ２がセラミックス基板ｌの裏面を照射する
と、赤外線はセラミックス基板ｌの裏面から表面側に透
過し、セラミックス基板ｌの表面から再放射して赤外線
カメラ３に到達する。赤外線カメラ３は到達した赤外線
を撮影し、この電気信号を処理装置４で信号処理し、モ
ニタテレビ５に画像として写し出す。When the infrared lamp 2 illuminates the back side of the ceramic substrate l, the infrared rays are transmitted from the back side of the ceramic substrate l to the front side, are re-radiated from the front side of the ceramic substrate l, and reach the infrared camera 3. The infrared camera 3 photographs the infrared rays that have arrived, and the processing device 4 processes this electrical signal and displays it on a monitor television 5 as an image.
セラミックス基板！の裏面、内部または表面にクラック
、穴等の欠陥がある場合には、セラミックス基板ｌの表
面から赤外線放射率が変るので、モニタテレビ５に欠陥
部６として写し出される。従って欠陥部６が写し出され
たセラミックス基板１は不良品として排除する。Ceramic substrate! If there is a defect such as a crack or a hole on the back, inside, or surface of the ceramic substrate 1, the infrared emissivity from the surface of the ceramic substrate 1 changes, so that the defect is displayed on the monitor television 5 as a defect 6. Therefore, the ceramic substrate 1 on which the defective portion 6 is exposed is rejected as a defective product.
赤外線ランプ２は、モニタテレビ５が１つの画像を写し
出すのに必要な０．５〜２秒間だけ点灯すれば、１枚の
セラミックス基板ｌの探傷を完了することができる。赤
外線ランプ２の光量は、セラミックス基板１の材質、板
厚により設定し、欠陥部と無欠陥部との赤外線放射率の
差が大きくなるようにする。If the infrared lamp 2 is turned on for only 0.5 to 2 seconds required for the monitor television 5 to display one image, flaw detection of one ceramic substrate l can be completed. The amount of light from the infrared lamp 2 is set depending on the material and thickness of the ceramic substrate 1 so that the difference in infrared emissivity between the defective part and the defect-free part becomes large.
第２図は本発明の他の実施例に使用する装置の斜視図で
あって、駆動モータ７によってコンベヤ８を第２図の左
方から右方へ移動させ、複数のセラミックス基板ｌを搬
送できるようになっている。コンベヤ８の下側には赤外
線ランプ２を上向きに設置し、その直上におけるコンベ
ヤ８の上側には、赤外線カメラ３を下向きに設けである
。赤外線カメラ３はデータ処理および制御器９に接続さ
れ、データ処理および制御器９は、モニタテレビ５と排
出器用制御器ＩＯとに接続されている。排出器用制御器
ＩＯは、コンベヤ８の終端近くの側方に設けである排出
器１１を制御するもので、排出器用制御器１０から排出
器１１に制御信号が送られると、排出器１１のロッド１
２が伸長し、赤外線カメラ３の下を通過した直後の１枚
のセラミックス基板１を、第２図においてコンベヤ８の
手前側に排出する。FIG. 2 is a perspective view of a device used in another embodiment of the present invention, in which a conveyor 8 is moved from the left to the right in FIG. 2 by a drive motor 7, and can convey a plurality of ceramic substrates l. It looks like this. An infrared lamp 2 is installed below the conveyor 8 facing upward, and an infrared camera 3 is installed directly above the conveyor 8 facing downward. The infrared camera 3 is connected to a data processing and controller 9, which is connected to a monitor television 5 and an ejector controller IO. The ejector controller IO controls the ejector 11 installed on the side near the end of the conveyor 8. When a control signal is sent from the ejector controller 10 to the ejector 11, the ejector 11 rod is 1
2 extends and one ceramic substrate 1 immediately after passing under the infrared camera 3 is discharged to the front side of the conveyor 8 in FIG.
第２図に示す装置において、セラミックス基板１はコン
ベヤ８の上に並べられ、順次左方から右方へ搬送されて
来る。１枚のセラミックス基板ｌが赤外線カメラ３の直
下まで搬送されて来るとコンベヤ８を一時停止し、赤外
線ランプ２を点灯すると、赤外線はコンベヤ８及びセラ
ミックス基板ｌを透過し、セラミックス基板ｌの表面か
ら再放射して赤外線カメラ３に到達する。これによりデ
ータ処理および制御器９を介してモニタテレビ５に画像
が写し出され、セラミックス基板ｌの欠陥の有無を判別
することができる。In the apparatus shown in FIG. 2, ceramic substrates 1 are arranged on a conveyor 8 and are sequentially conveyed from left to right. When one ceramic substrate l is conveyed directly below the infrared camera 3, the conveyor 8 is temporarily stopped and the infrared lamp 2 is turned on.The infrared rays pass through the conveyor 8 and the ceramic substrate l, and are emitted from the surface of the ceramic substrate l. The light is re-radiated and reaches the infrared camera 3. As a result, an image is displayed on the monitor television 5 via the data processing and controller 9, and it is possible to determine whether there is a defect in the ceramic substrate 1.
赤外線ランプ２が一定時間点灯した後消灯すると、コン
ベヤ８は再び駆動される。そしてセラミックス基板ｌに
欠陥がなかった場合には、そのセラミックス基板ｌはコ
ンベヤ８の端部まで搬送される。ところがセラミックス
基板１に欠陥があった場合には、データ処理および制御
器９がこれを判別して排出器用制御器ｌＯに信号を出力
する。そしてコンベヤ８が駆動されて欠陥のあるセラミ
ックス基板１が赤外線カメラ３の直下から出た時点で排
出器用制御器ｌＯから排出器１１に制御信号が送られ、
排出器１１のロッド１２が伸長して欠陥があったセラミ
ックス基板１をコンベヤ８の手前側に排出する。When the infrared lamp 2 is turned off after being turned on for a certain period of time, the conveyor 8 is driven again. If there is no defect in the ceramic substrate l, the ceramic substrate l is conveyed to the end of the conveyor 8. However, if there is a defect in the ceramic substrate 1, the data processing and controller 9 determines this and outputs a signal to the ejector controller IO. When the conveyor 8 is driven and the defective ceramic substrate 1 comes out from directly below the infrared camera 3, a control signal is sent from the ejector controller IO to the ejector 11.
The rod 12 of the ejector 11 extends and ejects the defective ceramic substrate 1 to the front side of the conveyor 8.
第３図は本発明のさらに他の実施例に使用する装置を、
第２図とは異なる部分のみ示した斜視図であって、コン
ベヤ８の下側に設けである赤外線ランプ２は、コンベヤ
８の移動方向に対して直角方向の直線状に赤外線を照射
するようになっている。この実施例においては、コンベ
ヤ８を一時停止させずに移動させたままであっても、直
線状の赤外線はコンベヤ８と共に移動しているセラミッ
クス基板ｌの第３図における右側縁から左側縁にかけて
順次透過し、データ処理および制御器９を介してモニタ
テレビ５にセラミックス基板１の状態を側縁から順次写
し出すことになる。この実施例では赤外線ランプ２の点
灯およびコンベヤ８の移動を継続したままで、多数のセ
ラミックス基板１の欠陥の有無を、連続的に判別するこ
とかできる。FIG. 3 shows an apparatus used in yet another embodiment of the present invention.
This is a perspective view showing only the parts different from FIG. 2, and the infrared lamp 2 provided below the conveyor 8 is configured to emit infrared rays in a straight line perpendicular to the moving direction of the conveyor 8. It has become. In this embodiment, even if the conveyor 8 is kept moving without stopping temporarily, the linear infrared rays are transmitted sequentially from the right side edge to the left side edge in FIG. 3 of the ceramic substrate l moving with the conveyor 8. Then, the state of the ceramic substrate 1 is sequentially displayed on the monitor television 5 from the side edge through the data processing and controller 9. In this embodiment, the presence or absence of defects in a large number of ceramic substrates 1 can be continuously determined while the infrared lamp 2 continues to be lit and the conveyor 8 continues to move.
［発明の効果］
本発明は、目視検査のように光の当て方による欠陥の見
落しがなく、セラミックス基板を加熱する必要もなく、
極めて短時間に、しかもセラミックス基板の表面のみで
なく内部や裏面の欠陥の有無を高い精度で検出すること
ができる。[Effects of the Invention] The present invention does not overlook defects due to the way light is applied, unlike visual inspection, and there is no need to heat the ceramic substrate.
It is possible to detect the presence or absence of defects not only on the surface of a ceramic substrate but also on the inside and back surface with high accuracy in an extremely short time.
第１図は本発明の方法の一実施例に使用する装置の正面
図、第２図は本発明の他の実施例に使用する装置の斜視
図、第３図は本発明のさらに他の実施例に使用する装置
を第２図とは異なる部分のみ示した斜視図である。
図中、■はセラミックス基板、２は赤外線ランプ、３は
赤外線カメラ、５はモニタテレビを示す。FIG. 1 is a front view of an apparatus used in one embodiment of the method of the invention, FIG. 2 is a perspective view of an apparatus used in another embodiment of the invention, and FIG. 3 is a further embodiment of the invention. FIG. 2 is a perspective view of the device used in the example, showing only the different parts from FIG. 2; In the figure, ■ indicates a ceramic substrate, 2 indicates an infrared lamp, 3 indicates an infrared camera, and 5 indicates a monitor television.
Claims (1)
前記セラミックス基板の他方の面側に透過した赤外線を
検出することを特徴とするセラミックス基板の探傷方法
。1) Irradiate infrared rays from one side of the ceramic substrate,
A method for detecting flaws in a ceramic substrate, comprising detecting infrared rays transmitted to the other side of the ceramic substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16190588A JPH0210256A (en) | 1988-06-29 | 1988-06-29 | Method for detecting flaw in ceramic board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16190588A JPH0210256A (en) | 1988-06-29 | 1988-06-29 | Method for detecting flaw in ceramic board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0210256A true JPH0210256A (en) | 1990-01-16 |
Family
ID=15744250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16190588A Pending JPH0210256A (en) | 1988-06-29 | 1988-06-29 | Method for detecting flaw in ceramic board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0210256A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0469552A (en) * | 1990-07-10 | 1992-03-04 | Ngk Spark Plug Co Ltd | Nondestructive inspecting method for ceramic member |
| JP2006071524A (en) * | 2004-09-03 | 2006-03-16 | Kanto Auto Works Ltd | Crack detector for press-molded article |
| JP2015190957A (en) * | 2014-03-28 | 2015-11-02 | 三菱マテリアル株式会社 | Internal defect inspection method of ceramic substrate |
| US9947569B2 (en) | 2015-01-30 | 2018-04-17 | Nichia Corporation | Carrier tape and pack |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60171441A (en) * | 1984-02-16 | 1985-09-04 | Shinkawa Ltd | Detection of die bond adhesive state |
| JPS60242353A (en) * | 1984-05-17 | 1985-12-02 | Fujitsu Ltd | Detecting method of defect in molding |
| JPS62126338A (en) * | 1985-11-28 | 1987-06-08 | Komatsu Ltd | Method for detecting flaw of ceramic coating |
-
1988
- 1988-06-29 JP JP16190588A patent/JPH0210256A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60171441A (en) * | 1984-02-16 | 1985-09-04 | Shinkawa Ltd | Detection of die bond adhesive state |
| JPS60242353A (en) * | 1984-05-17 | 1985-12-02 | Fujitsu Ltd | Detecting method of defect in molding |
| JPS62126338A (en) * | 1985-11-28 | 1987-06-08 | Komatsu Ltd | Method for detecting flaw of ceramic coating |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0469552A (en) * | 1990-07-10 | 1992-03-04 | Ngk Spark Plug Co Ltd | Nondestructive inspecting method for ceramic member |
| JP2006071524A (en) * | 2004-09-03 | 2006-03-16 | Kanto Auto Works Ltd | Crack detector for press-molded article |
| JP2015190957A (en) * | 2014-03-28 | 2015-11-02 | 三菱マテリアル株式会社 | Internal defect inspection method of ceramic substrate |
| US9947569B2 (en) | 2015-01-30 | 2018-04-17 | Nichia Corporation | Carrier tape and pack |
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