JPH0210748A - Electronic part mounting method - Google Patents

Abstract

PURPOSE:To realize thinner type mounting of an electronic part by performing relative positioning between electronic parts and the storing hole of a mounting board by a seat means capable of removal and mounting so as to connect them to become conductive, and removing the seat material after sealing them. CONSTITUTION:Upon bonding and fixing a board 3 onto a heat resistant adhesive tape 13 constituting a seat means, an electronic part 1 is bonded and fixed so that it may be positioned in the specified relative position in a storing hole 5, and wire bonding by wires 15 and sealing by sealant 7 are performed so as to fix the electronic part 1 to the board 3, and then the adhesive tape is separated. Furthermore, the seat means will suffice if it can be mounted or removed easily after the mounting of the electronic part 1 is finished, so thinner type mounting of the electric part 1 can be realized.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a method for mounting electronic components suitable for mounting electronic components into a portable medium such as an IC card.

(Prior Art) In recent years, so-called IC cards, for example, have been attracting attention as portable media containing electronic components such as a CPU and memory.

Although IC cards are approximately the same in appearance and size as the currently popular magnetic cards, they will likely replace magnetic cards in the near future due to their huge amount of information storage and high processing power. It is expected to become popular.

By the way, when mounting electronic components to be incorporated into an IC card, various methods have been adopted to achieve the required thickness reduction. One method is to form a storage hole 5 slightly larger than the size of the electronic component 1 in the mounting position of the board 3 on which the electronic component 1 is mounted, as shown in FIG. There is a method of mounting the dam 9 by sealing the area surrounded by the dam 9 with a sealant 7 after wire bonding. According to this method, compared to the case where electronic components are mounted on a board, it is possible to achieve a reduction in thickness by approximately the thickness of the board.

(Problems to be Solved by the Invention) However, this mounting method had the following improvements. That is, when mounting the electronic component 1, the relative position of the electronic component 1 and the handle hole 5 of the board 3 is accurately determined and held at least during the mounting. A pedestal board 11 is required for temporarily fixing the board 3, but this pedestal board 11 is essentially required only during mounting, and is not particularly necessary after mounting. This is an obstacle to further making IC cards thinner.

The present invention has been made in view of the above, and an object thereof is to provide a method for mounting electronic components that can contribute to even thinner mounting of electronic components.

[Structure of the invention]

(Means for Solving the Problems) In order to achieve the above object, the present invention provides an electronic component to be mounted in a storage hole formed in a mounting board so as to block the bottom surface of the storage hole. The gist of the present invention is to remove the pedestal means after temporarily fixing it to a desired relative position using a removable pedestal means, positioning it, connecting it electrically and sealing it to the substrate.

(Function) In the electronic component mounting method according to the present invention, the relative positioning of the electronic component with respect to the storage hole of the board is performed using a removable pedestal means provided so as to close the bottom surface of the storage hole, and the electronic component This pedestal means is removed after being fixed to the substrate by electrically connecting and sealing.

(Example) Hereinafter, the present invention will be explained in detail using the drawings.

FIG. 1(A) to FIG. 1(C) show an embodiment of the present invention. The feature is that the substrate 3 is adhesively fixed on a heat-resistant adhesive tape 13 constituting the pedestal means, and then the electronic component 1 is adhesively fixed on the adhesive tape 13 at a predetermined relative position in the storage hole 5. After fixing the electronic component 1 to the substrate 3 by wire bonding with the wire 15 and sealing with the sealant 7 (see FIG. 1(A)), .

(B)), and the adhesive tape 13 is removable (see Figure 1 (C)). Components that are the same as those in Figure 3 are given the same reference numerals, and detailed explanations are omitted. do.

The adhesive tape 13 is selected from a material that can withstand the melting temperature of the sealant 7 and does not deform or break.

Therefore, according to this embodiment, since the adhesive tape is no longer used after the mounting is completed, proper mounting can be ensured and there is no problem with thinning, compared to conventional mounting methods.

Although adhesive tape is used as the pedestal means in this embodiment, it is not limited to this, and any material may be used as long as it can be easily attached and detached after the mounting is completed.

In addition, by using an insulating adhesive tape, as shown in Figure 2, it can be used as an insulating sheet without peeling it off after mounting, or it can be used as an insulating sheet separately. It is possible to omit the work step of providing it.

In the embodiment shown in FIG. 2, the adhesive tape 13 is provided not only on the bottom surface of the substrate 3 but also on the surface thereof so that the height of the sealant 7 is adjusted so that it is flush with the substrate 3. Here, the second
In the figure, 17 is an exterior sheet.

〔Effect of the invention〕

As explained above, according to the present invention, the electronic component is positioned relative to the storage hole of the board by the removable pedestal means provided to cover the bottom surface of the storage hole, and the electronic component is electrically connected and sealed. Since this pedestal means is removed after being fixed to the board by stopping, it is possible to contribute to even thinner mounting of electronic components.

[Brief explanation of the drawing]

1 (A> to 1C) are diagrams showing an embodiment of the present invention, FIG. 2 is a diagram showing a modification of the present invention, and FIG. 3 is a diagram showing a conventional example. 1 ...Electronic component 3...Substrate 5...Accommodation hole 7...Sealant 9...Damt...Pedestal board 3...Adhesive tape 5...Wire 7...Exterior sheet cover (A) Figure (B) Figure (C)

Claims (1)

[Claims] After positioning the electronic component to be mounted in the storage hole formed in the mounting board by temporarily fixing it at a required relative position using a removable pedestal means provided to cover the bottom of the storage hole, A method for mounting an electronic component, which comprises removing a pedestal means after fixing the component to a substrate by making a conductive connection and sealing.