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JPH018287Y2 - - Google Patents

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Publication number
JPH018287Y2
JPH018287Y2 JP1984185515U JP18551584U JPH018287Y2 JP H018287 Y2 JPH018287 Y2 JP H018287Y2 JP 1984185515 U JP1984185515 U JP 1984185515U JP 18551584 U JP18551584 U JP 18551584U JP H018287 Y2 JPH018287 Y2 JP H018287Y2
Authority
JP
Japan
Prior art keywords
tapered
tapered table
surface plate
polishing
lap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984185515U
Other languages
Japanese (ja)
Other versions
JPS6199461U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984185515U priority Critical patent/JPH018287Y2/ja
Publication of JPS6199461U publication Critical patent/JPS6199461U/ja
Application granted granted Critical
Publication of JPH018287Y2 publication Critical patent/JPH018287Y2/ja
Expired legal-status Critical Current

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  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Description

【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、研摩装置に関し、特に磁気ヘツドの
ヘツド面に曲面加工を行うに適した研摩装置に関
する。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a polishing device, and particularly to a polishing device suitable for performing curved surface processing on the head surface of a magnetic head.

磁気ヘツドは高分解能化、高感度化に伴い、そ
の構造は小型で微細なものとなるため、その製造
工程中における機械加工には高い工作精度が要求
される。
As the resolution and sensitivity of magnetic heads increases, their structures become smaller and finer, so high machining accuracy is required in the machining process during the manufacturing process.

特に磁気ヘツドのヘツド面は、磁気特性に大き
な影響を有するため、その曲面加工には格別の精
密さが要求される。
In particular, the head surface of a magnetic head has a great influence on magnetic properties, and therefore, special precision is required in machining the curved surface.

〔従来の技術〕[Conventional technology]

従来までは走行面(R面)を有するヘツドHの
ラツプは第4図に示すようにヘツド形状と相反す
る凹形のR面を有するラツプ工具Jを製作し矢印
Yの如くヘツドHの長手方向に往復摺動させるハ
ンドラツプにて加工していた。
Conventionally, the lapping of a head H having a running surface (R surface) was made by manufacturing a lapping tool J having a concave R surface opposite to the head shape, as shown in Fig. 4, and lapping the head H in the longitudinal direction as shown by arrow Y. Processing was performed using a hand wrap that slid back and forth.

〔考案が解決しようとする問題点〕[Problem that the invention attempts to solve]

上記の研摩装置にあつては、人手による研摩の
ため磁気ヘツド長手方向のギヤツプデイプスのア
ンバランス又はラツプ工具Jの摩耗によるR形状
のくずれ等発生し、電磁変換特性のバラツキ、ヘ
ツド走行面の異常、摩耗が生じ又は磁気テープの
損傷など欠点が多かつた。
In the case of the above-mentioned polishing device, due to manual polishing, imbalance of the gear depth in the longitudinal direction of the magnetic head or distortion of the R shape due to wear of the lap tool J may occur, variations in electromagnetic conversion characteristics, abnormalities in the running surface of the head, etc. There were many drawbacks such as wear and tear and damage to the magnetic tape.

〔問題点を解決するための手段〕[Means for solving problems]

本考案は上記問題点を解消した研摩精度の高い
研摩装置を提供するもので、その手段は、ラツプ
定盤面上で研摩される被研摩体を外周上に載置す
る回転体と、ラツプ定盤を保持してなる第1のテ
ーパ台と、前記第1のテーパ台と傾斜面が対向す
る如く配置され、かつ前記第1のテーパ台を前記
傾斜面上で滑動せしめる如く前記第1のテーパ台
とバネで結合されてなる第2のテーパ台とを備え
た研摩装置によりなされる。
The present invention provides a polishing device with high polishing accuracy that solves the above-mentioned problems.The present invention consists of a rotating body for placing the object to be polished on the outer periphery of the lap surface plate, and a lap surface plate. a first tapered table that holds a first tapered table; and a first tapered table that is arranged such that an inclined surface faces the first tapered table and that allows the first tapered table to slide on the inclined surface. This is done by a polishing device equipped with a second tapered table connected by a spring.

〔作用〕[Effect]

上記研摩装置は、被研摩体を研摩するラツプ定
盤を保持する機構として、傾斜面が対向配置され
てなり、かつ前記ラツプ定盤を載置する第1のテ
ーパ台を滑動すべく、互いにバネで結合された1
対のテーパ台を採用したため、前記第1のテーパ
台の滑動に伴い前記ラツプ定盤が前記被研摩体側
に押し上げられる結果、前記被研摩体とラツプ盤
面は常に密着状態に保持され、良好な研摩面が得
られる。又、前記ラツプ定盤載置機構をガイド機
構により走行せしめるため、ラツプ定盤面の摩耗
も均一となり研摩精度が向上する。
The above-mentioned polishing device has inclined surfaces arranged opposite each other as a mechanism for holding a lap surface plate for polishing an object to be polished, and springs are attached to each other in order to slide the first tapered table on which the lap surface plate is placed. 1 combined with
Since a pair of tapered tables is used, as the first tapered table slides, the lapping surface plate is pushed up toward the object to be polished, and as a result, the object to be polished and the surface of the lapping plate are always maintained in close contact, resulting in good polishing. A surface is obtained. Further, since the lap surface plate mounting mechanism is moved by a guide mechanism, wear on the surface of the lap surface plate becomes uniform and polishing accuracy is improved.

〔実施例〕〔Example〕

以下図面を参照して本考案の実施例を詳述す
る。
Embodiments of the present invention will be described in detail below with reference to the drawings.

第1図a,bは本考案の実施例構成を示す正面
図および側面図である。
FIGS. 1a and 1b are a front view and a side view showing an embodiment of the present invention.

磁気ヘツドHは、回転体(リング)K周上に固
定され、回転しながらラツプ定盤Lの盤面と摺動
し、研摩される。
The magnetic head H is fixed on the circumference of a rotating body (ring) K, and slides on the surface of the lap surface plate L while rotating, thereby being polished.

リングKの回転軸N1の一端は歯車M1に結合さ
れ、この歯車M1はモータM2により回転駆動され
る歯車M3と噛合する。
One end of the rotation axis N 1 of the ring K is connected to a gear M 1 , and this gear M 1 meshes with a gear M 3 rotationally driven by a motor M 2 .

回転軸N1の他端は支持軸N2を有する軸受けN3
により支持される。
The other end of the rotation axis N 1 has a bearing N 3 with a support axis N 2
Supported by

ラツプ定盤Lは第1のテーパ台上に載置され
る。この第1のテーパ台T1はボールガイドBを
介して傾斜面が対向配置される第2のテーパ台
T2とバネDで結合される。このテーパ台T1
T2、ボールガイドBはラツプ定盤Lの保持機構
を形成する。
The lap surface plate L is placed on the first tapered table. This first tapered table T1 is connected to a second tapered table whose inclined surfaces are arranged opposite to each other via a ball guide B.
It is connected by T 2 and spring D. This tapered table T 1 ,
T 2 , the ball guide B forms a holding mechanism for the lap surface plate L.

この一対のテーパ台T1,T2、は第2図に示す
ように空洞部W1,W2内にバネDを設け、このバ
ネDの両端はピンE1,E2で各テーパ台T1,T2
固定されるため、第1のテーパ台T1には調整台
S上に固定されている第2のテーパ台T2面上を
矢印Z方向へ滑動させる力が働く。調整台Sは弾
性板が2つ折りになつたバネ状部材で構成され、
折り曲げ部Qとは反対側はネジ足Vにて間隙Gの
調整が行われるようになつているためラツプ定盤
Lの盤面の傾きが調整される。
The pair of tapered tables T 1 and T 2 are provided with springs D in the hollow parts W 1 and W 2 as shown in FIG. 1 and T2 , a force acts on the first tapered table T1 to cause it to slide on the surface of the second tapered table T2 , which is fixed on the adjustment table S, in the direction of arrow Z. The adjustment table S is composed of a spring-like member in which an elastic plate is folded in two.
On the opposite side from the bent portion Q, the gap G is adjusted by a screw foot V, so that the inclination of the surface of the lap surface plate L is adjusted.

Aはローラガイドであつて、モータM4の回転
軸に直結された回転軸N4と、ネジ結合されてお
り、モータの正逆回転に応じてローラF1〜F3
設けられた上体部AUは矢印X1,X2方向に移動
する。従つてラツプ定盤Lも矢印X1,X2方向に
移動する。
A is a roller guide, which is screwed to a rotating shaft N4 that is directly connected to the rotating shaft of a motor M4 , and has an upper body provided with rollers F1 to F3 according to the forward and reverse rotation of the motor. Section AU moves in the directions of arrows X 1 and X 2 . Accordingly, the lap surface plate L also moves in the directions of arrows X 1 and X 2 .

ATは突起部であつて、下体部ADに設けたマ
イクロスイツチ等の検知部C1,C2と係触すると、
モータM4の回転は反転する。つまり、ローラガ
イドAの上体部AUはこの検知部C1,C2で定めら
れる範囲内で上記移動動作を繰り返す。
AT is a protrusion, and when it comes into contact with detection parts C 1 and C 2 such as micro switches provided on the lower body part AD,
The rotation of motor M4 is reversed. That is, the upper body part AU of the roller guide A repeats the above movement operation within the range determined by the detection parts C 1 and C 2 .

第3図に実線で示す磁気ヘツドHを同図に破線
で示す形状にする研摩は次のようにして行われ
る。
Polishing to form the magnetic head H shown by the solid line in FIG. 3 into the shape shown by the broken line in the figure is carried out as follows.

磁気ヘツドHをリングKの外周面上に取り付け
モータM2の回転によりリングKを回転させる。
磁気ヘツドHはラツプ定盤L1上に砥粒供給部LT
から供給される砥粒によつて研摩されるが、研摩
時間の経過とともに、研摩量が増大するので、こ
れに伴い、第1のテーパ台T1はバネDの力によ
り矢印Z方向へ除々に移動し、ラツプ定盤Lの盤
面は常に磁気ヘツドHの研摩面と密着状態に保た
れる。
A magnetic head H is attached to the outer peripheral surface of the ring K, and the ring K is rotated by the rotation of the motor M2 .
The magnetic head H has an abrasive grain supply section LT on the lap surface plate L1 .
However, as the polishing time elapses, the amount of polishing increases, and as a result, the first tapered table T1 is gradually moved in the direction of the arrow Z by the force of the spring D. The surface of the lap surface plate L is always kept in close contact with the polishing surface of the magnetic head H.

第1のテーパ台T1の矢印方向Zへの移動はス
トツパTSとの係触により停止するので、この停
止位置の設定により磁気ヘツドの研摩量が規定さ
れる。
Since the movement of the first tapered table T1 in the direction of the arrow Z is stopped by engagement with the stopper TS, the amount of polishing of the magnetic head is determined by setting this stop position.

ローラガイドAは前述のように往復運動を行つ
ており、ラツプ定盤Lも同様に往復運動を行うた
め、磁気ヘツドHの研摩に伴い生じるこのラツプ
定盤Lの盤面の摩耗は盤面全面に旦り均一とな
る。
As mentioned above, the roller guide A makes a reciprocating motion, and the lap surface plate L also makes a reciprocating motion, so the wear on the surface of the lap surface plate L that occurs when the magnetic head H is polished is not caused by the wear on the entire surface of the surface. It becomes uniform.

考案の効果 このようにラツプ定盤はバネにより結合された
1対のテーパ台により保持され、又この一対のテ
ーパ台はローラガイドにより保持されるため、磁
気ヘツドの研摩量の如何によらず常にラツプ定盤
の盤面と、磁気ヘツドは密着し、かつ、ラツプ定
盤の盤面の摩耗も盤面全面に旦り均一となつて、
平面性が損われず被研摩体の研摩面は良好なもの
となる。
Effects of the invention In this way, the lap surface plate is held by a pair of tapered tables connected by a spring, and this pair of tapered tables is held by a roller guide, so it is always held regardless of the amount of polishing of the magnetic head. The surface of the lap surface plate and the magnetic head are in close contact, and the wear on the surface of the lap surface plate is uniform over the entire surface.
The polished surface of the object to be polished is good without loss of flatness.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図a,bは本考案の実施例構成図、第2図
は、テーパ台の結合の様子を示す図、第3図は磁
気ヘツドの構成図、第4図は従来の研摩方法を説
明する図である。 K:回転体、L:ラツプ定盤、T1,T2:テー
パ台、B:バネ、S:調整台、A:ガイド機構。
Figures 1a and b are configuration diagrams of an embodiment of the present invention, Figure 2 is a diagram showing how the taper table is connected, Figure 3 is a configuration diagram of the magnetic head, and Figure 4 explains the conventional polishing method. This is a diagram. K: rotating body, L: lap surface plate, T 1 , T 2 : taper table, B: spring, S: adjustment table, A: guide mechanism.

Claims (1)

【実用新案登録請求の範囲】 1 ラツプ定盤面上で研摩される被研摩体を外周
上に載置する回転体と、前記ラツプ定盤を保持
してなる第1のテーパ台と、前記第1のテーパ
台と傾斜面が対向する如く配置され、かつ前記
第1のテーパ台を前記傾斜面上で滑動せしめる
べく前記第1のテーパ台とバネで結合されてな
る第2のテーパ台とを備えてなることを特徴と
する研摩装置。 2 前記第2のテーパ台を載置してなり、該第2
のテーパ台を走行せしめるガイド機構を設けた
ことを特徴とする特許請求の範囲第(1)項記載の
研摩装置。
[Claims for Utility Model Registration] 1. A rotating body for placing an object to be polished on the outer periphery of the lapping surface plate, a first tapered table holding the lapping surface plate, and the first tapered table. and a second tapered table arranged such that the tapered table and the inclined surface face each other, and connected to the first tapered table by a spring so as to allow the first tapered table to slide on the inclined surface. A polishing device characterized by: 2 The second tapered table is mounted, and the second tapered table is placed on the second tapered table.
2. The polishing apparatus according to claim 1, further comprising a guide mechanism for causing the tapered table to travel.
JP1984185515U 1984-12-06 1984-12-06 Expired JPH018287Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984185515U JPH018287Y2 (en) 1984-12-06 1984-12-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984185515U JPH018287Y2 (en) 1984-12-06 1984-12-06

Publications (2)

Publication Number Publication Date
JPS6199461U JPS6199461U (en) 1986-06-25
JPH018287Y2 true JPH018287Y2 (en) 1989-03-06

Family

ID=30742985

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984185515U Expired JPH018287Y2 (en) 1984-12-06 1984-12-06

Country Status (1)

Country Link
JP (1) JPH018287Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2542143B2 (en) * 1992-01-22 1996-10-09 関電興業株式会社 Disc seat laminating machine

Also Published As

Publication number Publication date
JPS6199461U (en) 1986-06-25

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