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JPH0178040U - - Google Patents

Info

Publication number
JPH0178040U
JPH0178040U JP1987173897U JP17389787U JPH0178040U JP H0178040 U JPH0178040 U JP H0178040U JP 1987173897 U JP1987173897 U JP 1987173897U JP 17389787 U JP17389787 U JP 17389787U JP H0178040 U JPH0178040 U JP H0178040U
Authority
JP
Japan
Prior art keywords
heat sink
wiring board
printed wiring
semiconductor element
rubber sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987173897U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987173897U priority Critical patent/JPH0178040U/ja
Publication of JPH0178040U publication Critical patent/JPH0178040U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の実施例の断面図、第２図は本
考案の実施例の構成説明図、第３図は従来例の正
面図、第４図ａは従来例の断面図、同図ｂは平面
図、第５図ａは他の従来例の正面図、同図ｂは従
来例の断面図である。 １……半導体素子、２……放熱体、３……プリ
ント配線板、４……半導体素子１の足、５……距
離、６……絶縁スリーブ、７……ラバーシート。 Fig. 1 is a sectional view of an embodiment of the present invention, Fig. 2 is an explanatory diagram of the configuration of an embodiment of the invention, Fig. 3 is a front view of a conventional example, and Fig. 4a is a sectional view of a conventional example. 5b is a plan view, FIG. 5a is a front view of another conventional example, and FIG. 5b is a sectional view of the conventional example. DESCRIPTION OF SYMBOLS 1... Semiconductor element, 2... Heat sink, 3... Printed wiring board, 4... Legs of semiconductor element 1, 5... Distance, 6... Insulating sleeve, 7... Rubber sheet.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子に放熱体を取付けてプリント配線基
板に実装するものにおいて、前記半導体素子と前
記放熱体との間および前記放熱体と前記プリント
配線基板との間に連続的に熱伝導性と絶縁特性に
優れたラバーシートを介在させたことを特徴とす
るプリント配線基板実装構造。 In a device in which a heat sink is attached to a semiconductor element and mounted on a printed wiring board, thermal conductivity and insulation properties are continuously maintained between the semiconductor element and the heat sink and between the heat sink and the printed wiring board. A printed wiring board mounting structure featuring a superior rubber sheet.
JP1987173897U 1987-11-16 1987-11-16 Pending JPH0178040U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987173897U JPH0178040U (en) 1987-11-16 1987-11-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987173897U JPH0178040U (en) 1987-11-16 1987-11-16

Publications (1)

Publication Number Publication Date
JPH0178040U true JPH0178040U (en) 1989-05-25

Family

ID=31465783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987173897U Pending JPH0178040U (en) 1987-11-16 1987-11-16

Country Status (1)

Country Link
JP (1) JPH0178040U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009290049A (en) * 2008-05-30 2009-12-10 Fujitsu Ltd Insulating sheet, power supply circuit, and electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009290049A (en) * 2008-05-30 2009-12-10 Fujitsu Ltd Insulating sheet, power supply circuit, and electronic device

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