JPH0170349U - - Google Patents
Info
- Publication number
- JPH0170349U JPH0170349U JP1987166095U JP16609587U JPH0170349U JP H0170349 U JPH0170349 U JP H0170349U JP 1987166095 U JP1987166095 U JP 1987166095U JP 16609587 U JP16609587 U JP 16609587U JP H0170349 U JPH0170349 U JP H0170349U
- Authority
- JP
- Japan
- Prior art keywords
- flexible substrate
- sealing
- flexible
- sealing structure
- support plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は、この考案の好適な実施例を断面した
斜視図である。第２図は、第１図に示すものの支
持板の端部にフレキシブル基板を巻回する状態を
示した一部切欠した断面図である。第３図は、支
持板の別の実施例を示した一部切欠した断面図で
ある。
１……フレキシブル基板、２ａ……パワー素子
、３……支持板、４……封止樹脂、５……放熱板
。
FIG. 1 is a sectional perspective view of a preferred embodiment of this invention. FIG. 2 is a partially cutaway sectional view showing a state in which the flexible substrate is wound around the end of the support plate of the device shown in FIG. 1. FIG. 3 is a partially cutaway sectional view showing another embodiment of the support plate. DESCRIPTION OF SYMBOLS 1... Flexible board, 2a... Power element, 3... Support plate, 4... Sealing resin, 5... Heat sink.
Claims (1)
該フレキシブル基板の端部に固着された支持板と
、前記フレキシブル基板を封止する封止樹脂とか
ら構成されたことを特徴とするフレキシブル基板
の封止構造。 (2) 前記フレキシブル基板に放熱板を固着した
ことを特徴とする実用新案登録請求の範囲第１項
記載のフレキシブル基板の封止構造。[Scope of claim for utility model registration] (1) A flexible board on which electronic components are mounted,
A sealing structure for a flexible substrate, comprising a support plate fixed to an end of the flexible substrate, and a sealing resin for sealing the flexible substrate. (2) The flexible substrate sealing structure according to claim 1, which is characterized in that a heat sink is fixed to the flexible substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987166095U JPH0170349U (en) | 1987-10-29 | 1987-10-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987166095U JPH0170349U (en) | 1987-10-29 | 1987-10-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0170349U true JPH0170349U (en) | 1989-05-10 |
Family
ID=31453175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987166095U Pending JPH0170349U (en) | 1987-10-29 | 1987-10-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0170349U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012134272A (en) * | 2010-12-21 | 2012-07-12 | Nec Corp | Component built-in module, electronic apparatus including the component built-in module, and manufacturing method of the component built-in module |
| JP2016539034A (en) * | 2013-09-27 | 2016-12-15 | タクトテク オーユー | Method for manufacturing an electromechanical structure and apparatus for carrying out the method |
-
1987
- 1987-10-29 JP JP1987166095U patent/JPH0170349U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012134272A (en) * | 2010-12-21 | 2012-07-12 | Nec Corp | Component built-in module, electronic apparatus including the component built-in module, and manufacturing method of the component built-in module |
| JP2016539034A (en) * | 2013-09-27 | 2016-12-15 | タクトテク オーユー | Method for manufacturing an electromechanical structure and apparatus for carrying out the method |