JPH01318280A - Correction of pattern - Google Patents

Abstract

PURPOSE:To surely perform repair in a minute pattern while contriving the reduction of repair mandays by providing a nozzle by which suction or delivery is performed and a cartridge which has a blowing-out hole for blowing out jellylike filler for forming a conductive material on the edge thereof and performing the filling of a faulty part. CONSTITUTION:Compressed air 28 is sent into a cartridge 4 and filler 5 stored in the cartridge 4 is blown out from an exhaust nozzle 4A while suction is performed in a nozzle 3 by a suction pump 23 and the filler 5 blown out is taken in a hole 3B of an edge 3A. Next, the nozzle 3 is moved up, moved right above an insulating base material 1 set on a table 36 by a transfer mechanism and positioned at a faulty part of a pattern 2. The compressed air 24 is sent out in the nozzle 3, the filler 5 is delivered from the hole 3B of the edge 3A, the filling is performed in the faulty part 6. Thus chips 11 and cracks 12 of the faulty part 6 can be repaired. Thereby, the repair of a minute pattern can easily be performed and the improvement of quality and the reduction of mandays can be contrived.

Description

[Detailed Description of the Invention] [Summary] This invention relates to a pattern repair method in which a conductive material is filled into a defective portion of a pattern stretched over an insulating base material, and the defective portion is repaired. The cartridge is equipped with a nozzle for suction or discharge, and a spout for spouting a jelly-like filler that forms a conductive material at the tip of the nozzle. First, by bringing the tip of the nozzle into contact with the spout, a predetermined amount of the filler is injected into the tip of the nozzle by suction from the nozzle, and then, the tip of the nozzle is applied to the defective area. The defective area is first filled with a suction nozzle that adsorbs the balls forming the conductive material, and a supply nozzle that drips adhesive. The tip of the supply nozzle is positioned, the adhesive is dripped onto the defective area by discharge from the supply nozzle, the ball is then adsorbed to the tip by suction from the suction nozzle, and the adhesive is adsorbed onto the defective area. The defective portion is filled by positioning the tip of the nozzle and dropping the ball from the tip when suction of the suction nozzle is stopped.

[Industrial application field]

The present invention relates to a method for repairing a pattern by filling a conductive material into a defective part of a pattern stretched over an insulating base material, such as a chip or a crack, to repair the defective part.

In recent years, as semiconductor elements have become more densely packaged and faster, the patterns of printed circuit boards on which semiconductor elements are mounted have also become finer.

Therefore, as shown in the explanatory diagram of the printed circuit board in Fig. 7,
In the pudding+-a temporary 13 formed by stretching a fine pattern 2 made of a conductor on an insulating base material 1, if the widths Gl and G2 of the pattern 2 are, for example, 50 to 60μ, the pattern When a defective spot 6 such as a chip 11 as shown in (a) or a crack 12 as shown in (b) occurs in 2, it becomes difficult and time-consuming to repair it.

Therefore, it is desired that such fine patterns 2 on the printed board 13 can be easily repaired.

[Conventional technology]

Conventionally, this was done as shown in the conventional explanatory diagram of FIG.

FIG. 8(at)(a2) is a perspective view, and FIG. 8(b) is a side view.

As shown in FIG. 8(al), first, the tip 30A of the correction pen 30 is inserted into the container 31 containing the filler 5 made of conductive paste as shown by the arrow, and an appropriate amount is inserted into the tip 30A. Then, as shown in (a2), the tip 30 of the correction pen 30 to which the filler 5 is attached is attached.
A was moved to the defective area 6 of the pattern 2, and the filler 5 was filled into the defective area 6.

Further, in such filling, a microscope 32 is usually used, and the defective area 6 is magnified by the microscope 32 to be visually observed.

Therefore, the defective portion 6 of the pattern 2 has been repaired by filling the defective portion 6 with the filler 5.

Therefore, in the repair using such a correction pen 30,
This will require manpower and skill.

Further, as shown in (b), a control unit 3 drives the table 36 in the X-Y direction according to a command of predetermined data 11.
7 and a lifting mechanism 33 that vertically lifts and lowers the case 34 containing the filler 5 with respect to the upper surface of the table 36.
, the defective part 6 of pattern 2 is positioned directly below the case 34, the case 34 is lowered by the elevating mechanism 33, and the case 34 is pressurized as indicated by the arrow, thereby ejecting the filler 5 from the nozzle 35 of the case 34. By doing so, the defective location 6 was filled with the filler material 5.

Therefore, by inputting the position data of the defective part 6, the defective part 6 is positioned directly below the case 34,
The defective location 6 was repaired by lowering the case 34 using an elevating mechanism and spouting an appropriate amount of the filler 5 from the nozzle 35.

[Problem to be solved by the invention]

However, the method using a correction pen shown in FIG. 8(al)(a2) requires a lot of manpower and skill for correction.

Therefore, there is a problem in that many skilled workers are required for correction.

Furthermore, in the repair using the drawing device 38 shown in FIG. In order to eject the material 5, a jet nozzle with a diameter of a certain size is required.

Therefore, when the width of the pattern 2 is as fine as the above-mentioned 50 to 60 μm width, there is a problem that filling cannot be performed.

Therefore, an object of the present invention is to reliably repair fine patterns and to reduce the number of repair man-hours.

[Means to solve the problem]

Figure 1 is a perspective view of the principle of the invention of wood brush 1, and Figure 2 is a perspective view of the principle of the invention of wood brush 1.
FIG. 2 is a perspective view of the principle of the invention.

As shown in FIGS. 1 and 2, the cartridge is equipped with a nozzle for suctioning or discharging, and a cartridge having a spout for spouting a jelly-like filler forming a conductive material at the tip of the nozzle. By bringing the tip of the nozzle into contact with the spout, a predetermined amount of the filler is injected into the tip of the nozzle by suction from the nozzle.Next, the tip of the nozzle is positioned at the defective location, and the nozzle is removed. The defective area is filled by discharging adhesive, or it is equipped with a suction nozzle that adsorbs the balls forming the conductive material and a supply nozzle that drops adhesive, and first, the tip of the supply nozzle is applied to the defective area. and drop the adhesive onto the defective location by ejection from the supply nozzle.Next, the ball is attracted to the tip by suction from the suction nozzle, and the tip of the suction nozzle is positioned at the defective location. Then, when the suction of the suction nozzle is stopped, the ball is dropped from the tip, thereby filling the defective area.

With this configuration, the above-mentioned problem is solved.

[Effect]

That is, the filler is stored in a cartridge, a predetermined amount of filler to be filled is sucked from the cartridge into a nozzle, and the nozzle from which the filler has been sucked is positioned at the defective location to discharge the filler. or
Adhesive is dropped onto the defective area by a supply nozzle, balls forming the filler are adsorbed by a suction nozzle, and the balls are dropped onto the defective area where the adhesive has been dropped.

Therefore, it is possible to correct patterns with a finer width than with a drawing device, and it is also possible to correct patterns with a fine width reliably and easily without having to do it manually as in the past, improving quality. It is possible to improve the performance and reduce the number of man-hours.

〔Example〕

The present invention will be explained in detail below with reference to FIGS. 3, 4, 5, and 6. FIG. 3 is a perspective view of an embodiment of the invention of Woodbrush 1, FIG. 4 is a perspective view of the main part of Woodbrush 1's invention, FIG. 5 is a flowchart of the invention of Woodbrush 1, and FIG. FIGS. 2A and 2B are explanatory diagrams of an embodiment according to the invention of Brush 2, in which (a) is a perspective view;
(bl) (b2) is a plane surface of the main part. The same reference numerals indicate the same objects throughout the figures.

As shown in FIG. 3, the insulating base material l having the pattern 2 to be corrected is locked on a table 36 driven in the X-Y direction by the clamp 20, and the transfer mechanism 26 and the lifting mechanism 33
The nozzle 3, which is moved and raised and lowered by the pump, is connected to a suction pump 23 and compressed air 24 via a tube 25 and a switching pulp 22.

Further, the cartridge 4 having the spout 4A is mounted on the table 3.
Compressed air 28 is sent to the cartridge 4 via a tube 29 and a switching pulp 27, and the paste-like filler 5 stored in the cartridge 4 is jetted out from the spout 4A. It is formed so that

Therefore, first, the nozzle 3 is transferred directly below the ejection port 4A of the cartridge 4 by the transfer mechanism 26, and the tip 3A of the nozzle 3 and the ejection port 4A are brought into alignment by lowering the elevating mechanism 33 as shown by the dotted line.

By matching this tip 3A and the spout 4A, (
As shown in b), compressed air 28 is sent into the cartridge 4 to eject the filler 5 stored in the cartridge 4 from the ejection port 4A, and at the same time, the suction pump 2 is sent to the nozzle 3.
3, suction is performed in the direction of arrow B, and the ejected filler 5 is taken into the hole 3B at the tip 3^.

In this case, it is preferable to provide a stirrer in the cartridge 4 to constantly stir the stored filler 5.

Next, the nozzle 3 is raised by the lifting mechanism 33 and moved by the transfer mechanism directly above the insulating base material l set on the table 36, and the nozzle 3 is positioned at the defective spot 6 of the pattern 2 by driving the table 36. .

For such positioning, a camera sensor 21 or the like is used, and the camera sensor 21 detects the marking IA displayed on the insulating base material 1, and the nozzle 3 is accurately positioned at a predetermined defective location 6.

Nozzle 3 positioned in this way (a) in Fig. 4
As shown in FIG. 2, compressed air 24 is sent out, and the filler 5 is discharged from the hole 3B of the tip 3A as shown by arrow C, and the defective location 6 is filled.

Therefore, by filling the defective portion 6 with the filler 5 in this manner, the chips 11 and cracks 12 in the defective portion 6 can be repaired.

Furthermore, such filling using the nozzle 3 can be performed by the process shown in FIG.

The insulating base material 1 to be corrected is set on the table 36, and the cartridge 4 is pressurized with compressed air by controlling the switching valve 27 to eject a predetermined amount of filler 5, and in synchronization with this pressurization. The switching valve 22 is controlled, the nozzle 3 is suctioned, and the filler 5 is suctioned into the nozzle 3.

On the other hand, by inputting correction data including the coordinate data of the defective part 6 to be corrected in the pattern 2 and reading the correction data, the transfer position by the transfer mechanism 26 is determined, and the filler 5 is sucked. The nozzle 3 is positioned at a predetermined defective location 6.

Therefore, by controlling the switching valve 22, the compressed air
4 is delivered to the nozzle 3, and the filler 5 is discharged.

If there is a place to be filled next due to this discharge, the nozzle 3 is subsequently transferred to the cartridge 4 and the same control is repeated, and the process ends when all the places to be filled are filled.

In addition, in the case shown in Fig. 6, as shown in (a),
A supply nozzle 7 and a suction nozzle 8 are arranged with respect to the insulating base material 1 set on a table 36 that is transferred in the direction,
Each of them is configured to be transferred by the above-mentioned transfer mechanism 26 and elevating mechanism 33.

In addition, adhesive 9 is stored in the supply nozzle 7, and an appropriate amount of adhesive 9 is dripped from the tip 7A by applying pressure as indicated by the arrow.
The suction nozzle 8 is transferred to a container 40 in which balls 10 forming a filling material are stored, and the balls 10 are suctioned at the tip 8A by suction of air as indicated by arrow E.

Therefore, the supply nozzle 7 is positioned at the defective part 6 of the pattern 2 to be corrected, the adhesive 9 is dropped to adhere to the defective part 6, and the supply nozzle 7 is retreated from the defective part 6. Next, the suction nozzle 8 that has suctioned the ball 10 is transferred to the defective location 6 to which the adhesive 9 has been adhered, and after positioning, the suction in the direction of the arrow E is stopped and the ball 10 is dropped from the tip 8A. Further, this dropping of the ball 10 is repeated depending on the state of the defective location 6.

Therefore, in this case, if the ball 10 is made to have a fine diameter and the defective part 6 is in a state where there is only one chip, then (bl)
As shown in (b2), a plurality of balls 10 are concentrated on the chip 11 to fill the chip 11, and in the case of a crack, (b2)
As shown in FIG. 2, the balls 10 are arranged in succession so that the cracks 11 are buried.

In addition, the balls 10 arranged by falling in this way
Since it is fixed by the adhesive 9, this state is maintained until it is brought into the firing process, and the defective part 6 can be completely repaired.

〔Effect of the invention〕

As explained above, according to the present invention, a fine amount of filler is held at the tip of a nozzle, or a fine ball is sucked into a suction nozzle to discharge the filler to a defective location, or Defective areas can be repaired by letting the ball fall.

Therefore, it is possible to easily repair a pattern with a fine width without requiring any manual effort, and the quality can be improved and the number of man-hours can be reduced, which has a great practical effect.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of the principle of the invention of the bookcase 1. FIG. 2 is a perspective view of the principle of the invention of the bookcase 2. FIG. 3 is a perspective view of an embodiment of the bookcase 1 according to the invention. FIG. 4 is a perspective view of the main part of the invention of the bookcase 1. FIG. 5 is a flowchart of the invention in bookcase 1. FIG. 6 is an explanatory diagram of an embodiment according to the invention of bookcase 2, (a
) is a perspective view, (bl) (b2) is a plan view of the main part. FIG. 7 is an explanatory diagram of the printed circuit board, and (a) and (b) are plan views of the main parts. FIG. 8 is an explanatory diagram of the conventional technology, and (al) and (a2) are perspective views. (b) shows a side view. In the figure, 1 is an insulating base material, and 2 is a pattern. 3 is the nozzle, 4 is the cartridge. 5 is the filler, 6 is the defective area. 3A is the tip, 4A is the spout. 7 is a supply nozzle, 8 is an adsorption nozzle. 9 is glue, 10 is ball. 7^, 8A indicate the tip. Bookcase 1 Inventions n Atsuji Kun Scientific Regulations No. 1 m Wood J 2 /) Sunset L Rishi Yue Map No. 2 Figure 714 Materials (, Wooden Box 10 1/)'2 MingQfuO-y'r-FfD No. 5 C (b+) (b2) Youngest brother 2nd MeiC Niyoichi cusp (he) Chigen no mouth H diagram No. 6
Figure L Σ Pudding L Man Otan Sword Pudding F Bar grade (Li (I)) Pusong F difference board n
g. Brightness Figure 7

Claims (1)

[Claims] [1] Defective locations (6) due to chips or cracks occurring at predetermined locations in the pattern (2) stretched over the insulating base material (1)
This is a pattern correction method for repairing the defective part (6) by filling a conductive material in the area, and the method includes a nozzle (3) that performs suction (B) or discharge (C), and a tip (3A) of the nozzle (3). ) is equipped with a cartridge (4) having a spout (4A) from which the jelly-like filler (5) forming the conductive material is spouted;
) by bringing the tip (3A) of the nozzle (3) into contact with the spout (4A), the suction (B) of the nozzle (3) causes a predetermined amount of the filler (5) to come into contact with the tip (3A) of the nozzle (3). injected into
Next, the tip (3) of the nozzle (3) is placed on the defective location (6).
A method for correcting a pattern, characterized in that the defective area (6) is filled with the discharge (C) of the nozzle (3) by positioning the nozzle (A). [2] A pattern correction method for repairing a defective portion (6) according to claim 1 by filling the defective portion (6) with a conductive material, the method comprising: adsorbing the ball (10) forming the conductive material; a suction nozzle (8) for dripping adhesive (9), and a supply nozzle (for dripping adhesive (9)).
7), first, position the tip (7A) of the supply nozzle (7) at the defective location (6), and discharge (D) from the supply nozzle (7) to remove the defective location (6). The adhesive (9) is dropped onto the suction nozzle (8).
The ball (10) is moved to the tip (8A) by suction (E).
The tip (8A) of the suction nozzle (8) is positioned on the defective spot (6), and when the suction (E) of the suction nozzle (8) is stopped, the ball (1) is sucked from the tip (8A).
A method for correcting a pattern, characterized in that the defective location (6) is filled by dropping the defective portion (6).