JPH01317728A - Production of optical disk substrate made of polyvinyl cyclohexane resin - Google Patents
Production of optical disk substrate made of polyvinyl cyclohexane resinInfo
- Publication number
- JPH01317728A JPH01317728A JP14984688A JP14984688A JPH01317728A JP H01317728 A JPH01317728 A JP H01317728A JP 14984688 A JP14984688 A JP 14984688A JP 14984688 A JP14984688 A JP 14984688A JP H01317728 A JPH01317728 A JP H01317728A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- optical disk
- temp
- optical
- toughness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 67
- 229920005989 resin Polymers 0.000 title claims abstract description 67
- 230000003287 optical effect Effects 0.000 title claims abstract description 65
- 239000000758 substrate Substances 0.000 title claims abstract description 55
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 229920002554 vinyl polymer Polymers 0.000 title abstract description 17
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 title abstract description 5
- 238000005984 hydrogenation reaction Methods 0.000 claims abstract description 24
- 238000001746 injection moulding Methods 0.000 claims abstract description 12
- 125000003118 aryl group Chemical group 0.000 claims abstract description 10
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052709 silver Inorganic materials 0.000 abstract description 5
- 239000004332 silver Substances 0.000 abstract description 5
- 229920001890 Novodur Polymers 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 description 23
- 238000000465 moulding Methods 0.000 description 16
- -1 vinyl aromatic hydrocarbon Chemical class 0.000 description 13
- 230000000704 physical effect Effects 0.000 description 9
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 8
- 230000007423 decrease Effects 0.000 description 7
- 239000012760 heat stabilizer Substances 0.000 description 7
- 239000003381 stabilizer Substances 0.000 description 7
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 6
- 229920001400 block copolymer Polymers 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 150000001993 dienes Chemical class 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000004417 polycarbonate Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 5
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 5
- 239000004926 polymethyl methacrylate Substances 0.000 description 5
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000004040 coloring Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000004580 weight loss Effects 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- CXWXQJXEFPUFDZ-UHFFFAOYSA-N tetralin Chemical compound C1=CC=C2CCCCC2=C1 CXWXQJXEFPUFDZ-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 230000000930 thermomechanical effect Effects 0.000 description 2
- AHAREKHAZNPPMI-AATRIKPKSA-N (3e)-hexa-1,3-diene Chemical compound CC\C=C\C=C AHAREKHAZNPPMI-AATRIKPKSA-N 0.000 description 1
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- VSAWBBYYMBQKIK-UHFFFAOYSA-N 4-[[3,5-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-2,4,6-trimethylphenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC1=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 VSAWBBYYMBQKIK-UHFFFAOYSA-N 0.000 description 1
- NJIDLJRHMJCJIV-UHFFFAOYSA-N C.C(CC)(=O)O Chemical compound C.C(CC)(=O)O NJIDLJRHMJCJIV-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 239000007868 Raney catalyst Substances 0.000 description 1
- 229910000564 Raney nickel Inorganic materials 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- CGRTZESQZZGAAU-UHFFFAOYSA-N [2-[3-[1-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]-2-methylpropan-2-yl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]-2-methylpropyl] 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCC(C)(C)C2OCC3(CO2)COC(OC3)C(C)(C)COC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 CGRTZESQZZGAAU-UHFFFAOYSA-N 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 1
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 1
- 238000010504 bond cleavage reaction Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000012668 chain scission Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004587 chromatography analysis Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 150000002642 lithium compounds Chemical class 0.000 description 1
- 238000010551 living anionic polymerization reaction Methods 0.000 description 1
- 230000005291 magnetic effect Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- PMJHHCWVYXUKFD-UHFFFAOYSA-N piperylene Natural products CC=CC=C PMJHHCWVYXUKFD-UHFFFAOYSA-N 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- PXXNTAGJWPJAGM-UHFFFAOYSA-N vertaline Natural products C1C2C=3C=C(OC)C(OC)=CC=3OC(C=C3)=CC=C3CCC(=O)OC1CC1N2CCCC1 PXXNTAGJWPJAGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明はポリビニルシクロヘキサン系樹脂製光ディスク
基板の製造法に関し、詳しくは特定の分子量を有し、耐
熱性、靭性に優れたポリビニルシクロヘキサン系樹脂よ
り高特性光ディスク基板を製造する方法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing an optical disk substrate made of polyvinylcyclohexane resin, and more specifically, to a method for manufacturing an optical disk substrate made of polyvinylcyclohexane resin, which has a specific molecular weight and has excellent heat resistance and toughness. The present invention relates to a method of manufacturing a high-performance optical disk substrate.
[従来の技術]
レーザーを用いた光学記録は高密度の情報記録、保存、
及び再生が可能であるため、近年その開発が積極的に行
なわれている。この様な光学記録の一例として光ディス
クを挙げることが出来る。一般に光ディスクは、透明な
基板とその上にコートされた種々の記録媒体とから基本
的に構成される。[Conventional technology] Optical recording using lasers is capable of high-density information recording, storage,
Since it can be recycled and regenerated, its development has been actively carried out in recent years. An optical disk can be cited as an example of such optical recording. In general, an optical disk basically consists of a transparent substrate and various recording media coated thereon.
光ディスクの透明基板には無色透明な合成樹脂が用いら
れるケースが多く、その代表的なものとしてポリカーボ
ネート(以下、rPCJと略称する。)又はポリメチル
メタクリレート(以下、rPMMAJと略称する。)を
挙げることができる。これらの樹脂は無色透明性に秀い
でる他、夫々に固有の優れた性質を有するものではある
が、光学材料、特に光ディスク基板としての要件を全て
備えている訳ではなく、解決すべき問題点を有している
0例えば、PCにおいてはその芳香族環に起因する複屈
折性の問題があり、また、吸水性或いは透水性において
も問題がある。一方、PMMAにおいては、耐熱性、吸
水性、靭性の面における問題点がかねてより指摘されて
いる。Colorless and transparent synthetic resins are often used for the transparent substrates of optical discs, and typical examples include polycarbonate (hereinafter abbreviated as rPCJ) and polymethyl methacrylate (hereinafter abbreviated as rPMMAJ). I can do it. Although these resins are colorless and transparent and have unique and excellent properties, they do not meet all the requirements for optical materials, especially optical disk substrates, and there are problems that need to be solved. For example, PC has the problem of birefringence due to its aromatic ring, and also has problems with water absorption or water permeability. On the other hand, problems with PMMA in terms of heat resistance, water absorption, and toughness have been pointed out for some time.
このように、これらの樹脂は夫々固有の問題点を内在さ
せつつ使用に供されているのであるが、実際には更に、
これらの樹脂よりなる透明基板の上にコートされる記録
媒体との関係において、後述のような新たな問題が生じ
ている。In this way, these resins are used with their own inherent problems, but in reality, there are also
In relation to recording media coated on transparent substrates made of these resins, new problems have arisen as described below.
一方、記録媒体については、従来より光ディスクの用途
に応じて多岐にわたる開発が行なわれている0例えば、
ライト・ワンス型と呼ばれる記録−再生専用のものでは
穴あけタイプのものが、またイレーザブル型と呼ばれる
、記録−再生一消去一再記録用のものでは、結晶社務現
象を利用した相社務タイプのもの、光磁気効果を利用し
た光磁気タイプのもの等が知られている。これらの記録
′ 媒体用材料は、ライト・ワンス型ではテルル又は
その酸化物、合金化合物等、イレーザブル型では、Gd
Fe、TbFe%GdFeCo。On the other hand, regarding recording media, a wide variety of developments have been carried out depending on the use of optical discs.
The write-once type, which is only for recording and playback, is a hole-drilling type, and the erasable type, which is used for recording, playback, erasing, and re-recording, is a double-drilling type that utilizes the crystalline phenomenon. Magneto-optical types that utilize magnetic effects are known. The materials for these recording media are tellurium or its oxide, alloy compound, etc. for the write-once type, and Gd for the erasable type.
Fe, TbFe%GdFeCo.
TbFeCoといった希土類−遷移金属のアモルファス
合金化合物等、無機系材料が主流とされており、一般に
高真空下でのスパッタリング等の乾式処決により、透明
基板上に成膜することにより形成されている。Inorganic materials such as rare earth-transition metal amorphous alloy compounds such as TbFeCo are mainstream, and are generally formed by forming a film on a transparent substrate by a dry process such as sputtering under a high vacuum.
ところで、PC,PMMAの吸湿性及び透水性は、一方
では基板自身の吸湿時の膨張によるソリの問題を引き起
こすものであるが、他方、基板を通しての水分の透過に
より記録媒体の腐蝕を引き起こし、光ディスクの寿命を
縮める原因となっている。By the way, the hygroscopicity and water permeability of PC and PMMA, on the one hand, cause the problem of warpage due to the expansion of the substrate itself when it absorbs moisture, but on the other hand, the permeation of moisture through the substrate causes corrosion of the recording medium, and the optical disc This causes a shortened lifespan.
また、基板用樹脂の耐熱性について更に言及すれば、次
のような問題がある。即ち、光ディスク、特にライト・
ワンス型、イレーザブル型等の光ディスクにおいては、
記録の書き込み、消去時の記録媒体の温度は200℃以
上にもなる。このため、ディスク基板にこの熱が直接か
かることは無いにしても、記録の書き込み、消去時には
基板が相当高温になることが予想され、耐熱性の低い樹
脂では、基板の変形成いはグループの変形等の問題が起
こり得る。Further, regarding the heat resistance of the substrate resin, there are the following problems. That is, optical discs, especially light discs,
For optical discs such as once type and erasable type,
The temperature of the recording medium during writing and erasing of records reaches 200° C. or more. For this reason, even though this heat is not directly applied to the disk substrate, it is expected that the substrate will reach a considerably high temperature when writing and erasing records, and resins with low heat resistance may cause deformation of the substrate or group formation. Problems such as deformation may occur.
一方、光ディスクの生産工程においては、基板或いは記
録媒体の経時変化防止等の目的で、熱処理工程を取り入
れることが多いが、生産性の向上のためには、できるだ
け高い処理温度で処理することにより処理時間を短縮す
ることが望まれる。On the other hand, in the production process of optical discs, a heat treatment process is often incorporated in order to prevent aging of the substrate or recording medium. It is desirable to shorten the time.
この様な観点からも、樹脂の耐熱性が低いと高い処理温
度を採用することができず、生産性を上げることができ
ないという不具合がある。From this point of view as well, if the heat resistance of the resin is low, a high treatment temperature cannot be used and productivity cannot be increased.
このようなことから、光ディスクの生産工程或いは使用
状況の高温度に酎えるには、耐熱性の低いPMMAでは
全く不十分であり、従来においては専ら、より耐熱性の
高いpcが透明基板材料として検討されている。しかし
ながら、PCでも必ずしも耐熱性が十分であるという評
価を受けているわけではなく、より高い耐熱性を備える
樹脂材料の出現が望まれている。For these reasons, PMMA, which has low heat resistance, is completely insufficient to handle the high temperatures encountered in the production process or usage conditions of optical discs, and conventionally, PC, which has higher heat resistance, has been used exclusively as a transparent substrate material. It is being considered. However, even PC is not necessarily evaluated as having sufficient heat resistance, and the emergence of resin materials with higher heat resistance is desired.
PC%PMMA等の従来の樹脂の欠点を補うものとして
、特開昭63−43910、特願昭62−157324
等において、ポリビニルシクロヘキサン系樹脂を光ディ
スク基板として用いる方法が提案されている。To compensate for the drawbacks of conventional resins such as PC%PMMA, Japanese Patent Application Laid-Open No. 63-43910, Japanese Patent Application No. 62-157324
A method of using a polyvinylcyclohexane resin as an optical disk substrate has been proposed in .
[発明が解決しようとする課題]
しかしながら、ポリビニルシクロヘキサン系樹脂を用い
た場合においても、必ずしも高特性光ディスク基板が得
られるわけではなく、いくつかの点で溝足し得る結果が
得られていないのが現状である。[Problems to be Solved by the Invention] However, even when polyvinylcyclohexane resin is used, it is not always possible to obtain a high-performance optical disc substrate, and satisfactory results have not been obtained in several respects. This is the current situation.
本発明者等は、前記特許出願において提案されているポ
リビニルシクロヘキサン系樹脂を用いた光ディスク基板
の成形性等について詳細に検討した結果、次のような知
見を得た。The present inventors conducted a detailed study on the moldability of the optical disc substrate using the polyvinylcyclohexane resin proposed in the patent application, and as a result, the following findings were obtained.
ポリビニルシクロヘキサン系樹脂は、通常、ビニル芳香
族系重合体の芳香環の水添により得られ、一般にポリス
チレン同様の脆性高分子として知られている樹脂である
。Polyvinylcyclohexane resin is usually obtained by hydrogenating the aromatic ring of a vinyl aromatic polymer, and is generally known as a brittle polymer similar to polystyrene.
前述した様にライト・ワンス型、イレーザブル型等の光
ディスクにおいては、その使用状況、生産工程において
、相当の熱履歴を受けることから、樹脂基板に対して高
い耐熱性が要求される。As mentioned above, optical disks such as write-once type and erasable type are subjected to considerable heat history during their use and production process, so high heat resistance is required of the resin substrate.
また、ディスク基板用樹脂材料としては、少なくとも射
出成形の際の金型離型時に破損しない程度の靭性も要求
される。Further, the resin material for the disk substrate is required to have at least a degree of toughness that will not cause damage during mold release during injection molding.
このような要求を満たすべく、耐熱性に秀れ、ある程度
の靭性を持つポリビニルシクロヘキサン系重合体を得る
ためには、合成に際し、芳香環の水添率を高くし、かつ
−窓以上の分子量を保持する必要がある。In order to meet these demands and obtain a polyvinylcyclohexane polymer with excellent heat resistance and a certain degree of toughness, it is necessary to increase the hydrogenation rate of the aromatic ring during synthesis and to increase the molecular weight above the window. need to be retained.
一方、光ディスク基板としては、ソリ、歪が少くグルー
プの転写性が良好である必要があり、このような観点か
らは、射出成形時の樹脂の流動性はできるだけ良好であ
ることが好ましい。On the other hand, as an optical disk substrate, it is necessary to have good group transferability with little warpage or distortion, and from this point of view, it is preferable that the fluidity of the resin during injection molding be as good as possible.
ところで、ある程度の靭性が保持されるような分子量を
持つポリビニルシクロヘキサン系樹脂の射出成形におい
て、その成形温度が低過ぎると、光ディスク基板の成形
としては流動性が不十分となり、逆に、成形温度が高過
ぎる場合には流動性は良好となるが、樹脂の劣化が起こ
り、成形品の靭性が不足したり、着色、シルバーストリ
ークが発生するなどの問題が生起する。By the way, in injection molding of polyvinylcyclohexane resin having a molecular weight that maintains a certain degree of toughness, if the molding temperature is too low, the fluidity will be insufficient for molding optical disk substrates; If it is too high, the fluidity will be good, but the resin will deteriorate, causing problems such as insufficient toughness of the molded product, coloring, and silver streaks.
このようなことから、透明性、耐熱性、靭性等に優れ、
しかも光学的歪の小さい光ディスク基板を得ることは極
めて難しく、従来においては、これらすべての特性を十
分に満足し得る光ディスク基板は提供されていなかフな
。Because of this, it has excellent transparency, heat resistance, toughness, etc.
Moreover, it is extremely difficult to obtain an optical disc substrate with low optical distortion, and conventionally, there has been no optical disc substrate that can fully satisfy all of these characteristics.
本発明はこのような従来の問題点を解決し、上記諸特性
を著しく改善したポリビニルシクロヘキサン系樹脂より
なる高特性光ディスク基板を提供することを目的とする
。It is an object of the present invention to solve these conventional problems and provide a high-performance optical disk substrate made of a polyvinylcyclohexane resin that has significantly improved the above-mentioned properties.
[課題を解決するための手段及び作用]本発明のポリビ
ニルシクロヘキサン系樹脂製光ディスク基板の製造法は
、スチレン系樹脂の芳香族環を水素添加して得られる、
数平均分子量40.000〜300,000、核水添率
90%以上のポリビニルシクロヘキサン系樹脂を、樹脂
温度270〜350℃、金型温度30〜120℃で射出
成形することを特徴とする。[Means and effects for solving the problems] The method for producing an optical disk substrate made of polyvinylcyclohexane resin of the present invention is obtained by hydrogenating an aromatic ring of a styrene resin.
A polyvinylcyclohexane resin having a number average molecular weight of 40,000 to 300,000 and a nuclear hydrogenation rate of 90% or more is injection molded at a resin temperature of 270 to 350°C and a mold temperature of 30 to 120°C.
即ち、本発明者等は前記従来の実情に鑑み、透明性、耐
熱性に優れ、靭性を持ち、光学的歪が小さい光ディスク
基板を得る方法につき鋭意検討を行なった結果、分子量
及び芳香族環の核水添率を特定したポリビニルシクロヘ
キサン系樹脂を特定の成形条件で射出成形することによ
り、透明性、耐熱性、靭性に゛優れ、光学的歪が小さい
光ディスク基板を製造し得ることを見出し、本発明に到
達した。That is, in view of the above-mentioned conventional circumstances, the present inventors have conducted intensive studies on a method for obtaining an optical disk substrate with excellent transparency, heat resistance, toughness, and small optical distortion. We discovered that by injection molding a polyvinylcyclohexane resin with a specified nuclear hydrogenation rate under specific molding conditions, it was possible to produce an optical disk substrate with excellent transparency, heat resistance, and toughness, and low optical distortion. The invention has been achieved.
以下に本発明の詳細な説明する。The present invention will be explained in detail below.
本発明で用いられるポリビニルシクロヘキサン系樹脂は
、スチレン系樹脂(スチレン系重合体)を核水添して得
られる。The polyvinylcyclohexane resin used in the present invention is obtained by nuclear hydrogenation of a styrene resin (styrene polymer).
原料のスチレン系重合体としては、ビニル芳香族炭化水
素重合体或いはビニル芳香族炭化水素ブロック共重合体
が挙げられる。後者のビニル芳香族炭化水素ブロック共
重合体としては、ビニル芳香族炭化水素重合体セグメン
ト(以下、「Aセグメント」と略称する。)と少なくと
も1種以上の共役ジエン重合体セグメント(以下、「B
セグメント」と略称する。)とから成るものが挙げられ
る。Examples of the raw material styrenic polymer include vinyl aromatic hydrocarbon polymers and vinyl aromatic hydrocarbon block copolymers. The latter vinyl aromatic hydrocarbon block copolymer includes a vinyl aromatic hydrocarbon polymer segment (hereinafter referred to as "A segment") and at least one conjugated diene polymer segment (hereinafter referred to as "B segment").
abbreviated as "segment". ).
モノマーとして用いられるビニル芳香族炭化水素として
は、スチレン、p−メチルスチレン、a−メチルスチレ
ン等を挙げることができ、特に代表的なものとしてスチ
レンが挙げられる。Examples of the vinyl aromatic hydrocarbon used as a monomer include styrene, p-methylstyrene, and a-methylstyrene, with styrene being a particularly representative example.
ビニル芳香族炭化水素重合体としては、これらのビニル
芳香族炭化水素1f!よりなる単独重合体或いは2種以
上の共重合体が挙げられる。特に接着性等が要求される
場合には、上記ビニル芳香族炭化水素と、これと共重合
可能な、極性基を持つ不飽和単量体とを、ビニル芳香族
炭化水素重合体の特性が失なわれない範囲で共重合して
得られる共重合体を用いるのが好ましい。As vinyl aromatic hydrocarbon polymers, these vinyl aromatic hydrocarbons 1f! Examples include a homopolymer or a copolymer of two or more. In particular, when adhesive properties are required, the above-mentioned vinyl aromatic hydrocarbon and an unsaturated monomer having a polar group that can be copolymerized with the vinyl aromatic hydrocarbon may be used to remove the properties of the vinyl aromatic hydrocarbon polymer. It is preferable to use a copolymer obtained by copolymerization within a range that does not occur.
次に、ビニル芳香族炭化水素ブロック共重合体中のAセ
グメントとしては、上述のビニル芳香族炭化水素重合体
と同様のものが挙げられる。また、ブロック共重合体中
のBセグメントの共役ジエンとしては1.3−ブタジェ
ン、イソプレン、2.3−ジメチル−183−ブタジェ
ン、1.3−ペンタジェン、1.3−へキサジエン等が
挙げられ、特に、1.3−ブタジェン、イソプレンが一
般的である。Aセグメント及びBセグメントからなるブ
ロック共重合体は、いわゆるリビングアニオン重合と称
せられる公知の方法、例えば有機リチウム化合物を開始
剤とし、ヘキサン、ヘブタンの様な炭化水素溶媒中で重
合する方法等により容易に得ることができる。なお、こ
のようなブロック共重合体中のAセグメントの含有量は
80重量%以上、好ましくは90重量%以上、更に好ま
しくは93重量%以上である。Aセグメントの含有量が
801i量%未満の場合には、水素付加後に得られる樹
脂の耐熱性が低下し、光ディスク基板としては不適なも
のとなる。Next, examples of the A segment in the vinyl aromatic hydrocarbon block copolymer include those similar to those of the vinyl aromatic hydrocarbon polymer described above. In addition, the conjugated diene of the B segment in the block copolymer includes 1,3-butadiene, isoprene, 2,3-dimethyl-183-butadiene, 1,3-pentadiene, 1,3-hexadiene, etc. In particular, 1,3-butadiene and isoprene are common. A block copolymer consisting of an A segment and a B segment can be easily produced by a known method called living anionic polymerization, such as a method in which polymerization is performed using an organic lithium compound as an initiator in a hydrocarbon solvent such as hexane or hebutane. can be obtained. The content of the A segment in such a block copolymer is 80% by weight or more, preferably 90% by weight or more, and more preferably 93% by weight or more. When the content of the A segment is less than 801i% by weight, the heat resistance of the resin obtained after hydrogenation decreases, making it unsuitable for use as an optical disc substrate.
本発明において、このような原料スチレン系重合体の分
子量は、数平均分子量で50,000以上であることが
好ましい、スチレン系重合体の分子量が低過ぎると、水
素付加後掲られる樹脂の耐熱性、靭性が低下する。In the present invention, the molecular weight of such raw material styrenic polymer is preferably 50,000 or more in terms of number average molecular weight.If the molecular weight of the styrenic polymer is too low, the heat resistance of the resin after hydrogenation will be affected. , the toughness decreases.
分子量の低下に伴う靭性の低下は、重合体中のジエン系
重合体の含有量が少いもの程著しい。The lower the content of the diene polymer in the polymer, the more remarkable the decrease in toughness accompanying the decrease in molecular weight.
従って、ジエン系重合体を含まない重合体に関しては、
数平均分子量がao、oooより大であることが好まし
い、一方、分子量の上限については特に制限はないが、
通常の場合、400.000以下であることが好ましい
。Therefore, regarding polymers that do not contain diene polymers,
It is preferable that the number average molecular weight is larger than ao or ooo, while there is no particular restriction on the upper limit of the molecular weight,
In normal cases, it is preferably 400.000 or less.
ポリビニルシクロヘキサン系樹脂は、このようなスチレ
ン系重合体を、芳香族水素化能を有する水素化触媒の存
在下で、核水添して得ることができる。ここで使用され
る水素化触媒としては、例えばニッケル、コバルト、ル
5−ニウム、ロジウム、白金、バラジクム等の金属又は
その酸化物、塩、錯体及びこれらを活性炭、ケイソウ土
、アルミナ等の担体に担持したもの等が挙げられる。こ
れらの中でも特にラネーニッケル、ラネーコバルト、安
定化ニッケル及びルテニウム、ロジウム又は白金のカー
ボン又はアルミナ担持触媒が、反応性の面から好ましい
。Polyvinylcyclohexane resin can be obtained by nuclear hydrogenating such a styrene polymer in the presence of a hydrogenation catalyst capable of aromatic hydrogenation. Examples of hydrogenation catalysts used here include metals such as nickel, cobalt, 5-nium, rhodium, platinum, and baladicum, or their oxides, salts, and complexes, and these on carriers such as activated carbon, diatomaceous earth, and alumina. Examples include those that are supported. Among these, Raney nickel, Raney cobalt, stabilized nickel and ruthenium, rhodium or platinum supported catalysts on carbon or alumina are particularly preferred from the viewpoint of reactivity.
核水添反応は、50〜250 k g / cゴの圧力
、100〜200℃の温度下にて、溶媒としてシクロヘ
キサン、メチルシクロヘキサン、n−オクタン、デカリ
ン、テトラリン、ナフサ等の飽和炭化水素系溶媒を用い
て行なうのが好ましい。その他、テトラヒドロフラン等
のエーテル系溶媒も使用することができる。The nuclear hydrogenation reaction is carried out at a pressure of 50 to 250 kg/c and a temperature of 100 to 200 °C using a saturated hydrocarbon solvent such as cyclohexane, methylcyclohexane, n-octane, decalin, tetralin, or naphtha as a solvent. It is preferable to use . In addition, ether solvents such as tetrahydrofuran can also be used.
なお、通常、スチレン系重合体の核水添においては、副
反応として重合体の分子鎖の切断を伴う、この分子鎮切
断を防ぐために、水素化はできるだけ高い水素圧力で、
かつ短時間で行なうことが好ましい。Normally, nuclear hydrogenation of styrenic polymers involves scission of the molecular chain of the polymer as a side reaction.In order to prevent this molecular chain scission, hydrogenation is carried out at as high a hydrogen pressure as possible.
It is also preferable to carry out the process in a short period of time.
本発明において、核水添反応による芳香核(芳香族環)
の核水添率は90%以上、好ましくは95%以上である
。核水添率が低く、90%未満であると、得られる樹脂
の耐熱性の低下、複屈折の増大等の問題があり好ましく
ない、なお、本発明において、樹脂の耐熱性としては、
サーモメカニカルアナライザーで測定した軟化点が15
0℃以上であることが好ましく、複屈折率としては光デ
ィスク基板として成形した場合、後述するΔn s、
sの値が30nm以下となるものが好ましい。In the present invention, aromatic nuclei (aromatic rings) due to nuclear hydrogenation reaction
The nuclear hydrogenation rate is 90% or more, preferably 95% or more. If the nuclear hydrogenation rate is low and is less than 90%, there are problems such as a decrease in the heat resistance of the resulting resin and an increase in birefringence, which is undesirable.In addition, in the present invention, the heat resistance of the resin is as follows:
The softening point measured with a thermomechanical analyzer is 15
The temperature is preferably 0° C. or higher, and the birefringence is Δn s, which will be described later, when molded as an optical disk substrate.
It is preferable that the value of s is 30 nm or less.
本発明において、このようにして得られるポリビニルシ
クロヘキサン系樹脂の分子量は、原料となるスチレン系
重合体の組成、分子量、水素化(水添)条件等に依存し
、またその適正範囲も、組成により異なるが、数平均分
子量で40.000〜300,000とする。靭性の面
からは、ジエン系重合体の含有量が小であるもの程、分
子量が高いことが要求され、ジエン系重合体を含有しな
いものに関しては、分子量は40,000より大であり
、好ましくは6o、oooより大であることが必要であ
る。分子量の上限は、成形性の面から規定される、数平
均分子量で300,000を超えると、良好な成形性が
得られない、。In the present invention, the molecular weight of the polyvinylcyclohexane resin thus obtained depends on the composition, molecular weight, hydrogenation conditions, etc. of the styrene polymer as a raw material, and its appropriate range also depends on the composition. Although the number average molecular weight is different, the number average molecular weight is 40,000 to 300,000. From the viewpoint of toughness, the lower the diene polymer content, the higher the molecular weight is required, and for those containing no diene polymer, the molecular weight is preferably greater than 40,000. must be greater than 6o,ooo. The upper limit of the molecular weight is determined from the viewpoint of moldability; if the number average molecular weight exceeds 300,000, good moldability cannot be obtained.
本発明においては、このようなポリビニルシクロヘキサ
ン系樹脂を下記の特定の条件で射出成形して光ディスク
基板を製造する。In the present invention, an optical disc substrate is manufactured by injection molding such a polyvinylcyclohexane resin under the following specific conditions.
成形の際の樹脂温度は270〜350℃、好ましくは2
80〜320℃とする。樹脂温度が過度に高く、350
℃を超えると、樹脂の分解が避けられなくなり、着色、
シルバーストリークの発生、靭性の低下等の問題が生起
し、好ましくない。逆に樹脂温度が過度に低く、270
℃未満であると、樹脂の流動性が低下し、グループ転写
性の不良、あるいは光学歪の増大等の問題が生起する。The resin temperature during molding is 270 to 350°C, preferably 2
The temperature shall be 80-320°C. Resin temperature is too high, 350
If the temperature exceeds ℃, decomposition of the resin becomes inevitable, causing coloring and
Problems such as the occurrence of silver streaks and a decrease in toughness occur, which is undesirable. On the other hand, the resin temperature is excessively low and 270
If the temperature is less than 0.degree. C., the fluidity of the resin decreases, leading to problems such as poor group transferability or increased optical distortion.
また、金型温度は30〜120℃、好ましくは、50〜
115℃とする。金型温度が高過ぎ120℃を超えると
、離型時の変形が大きくなり、反りの小さい成形物が得
られない、逆にあまりに低く、30℃未満では光学的歪
の小さい成形物が得られない。In addition, the mold temperature is 30 to 120°C, preferably 50 to 120°C.
The temperature shall be 115°C. If the mold temperature is too high and exceeds 120°C, the deformation during mold release will be large and a molded product with small warpage will not be obtained.On the other hand, if the mold temperature is too low and it is less than 30°C, a molded product with small optical distortion will not be obtained. do not have.
なお、射出成形に先立ち、樹脂の熱劣化防止のために樹
脂に安定剤を添加するのが好ましい。Note that, prior to injection molding, it is preferable to add a stabilizer to the resin in order to prevent thermal deterioration of the resin.
用いる安定剤の種類に関しては特に限定はないが、成形
温度が高いことから、安定剤自身の耐熱性が高いものを
用いることが好ましく、特に熱重量計において空気気流
下で測定されるところの5%重量減少温度が295℃以
上であるような熱安定剤を用いることが好ましい。There are no particular limitations on the type of stabilizer used, but since the molding temperature is high, it is preferable to use a stabilizer that itself has high heat resistance. It is preferred to use a heat stabilizer whose % weight loss temperature is 295°C or higher.
なお、本発明において、熱重量計において空気気流下で
測定されるところの5%重量減少温度とは、空気流量1
00mj!/分の流通下、20℃/分の昇温速度で加熱
した時の重量減を測定し、重量減が5.0重量%となっ
た時の温度である。In addition, in the present invention, the 5% weight loss temperature measured under air flow with a thermogravimeter means
00mj! The weight loss was measured when heated at a temperature increase rate of 20° C./minute under a flow of 20° C./minute, and this was the temperature at which the weight loss became 5.0% by weight.
このような熱安定剤としては、以下に例示するようなヒ
ンダードフェノール系熱安定剤、リン系熱安定剤又はイ
オウ系熱安定剤が挙げられる。Examples of such heat stabilizers include hindered phenol heat stabilizers, phosphorus heat stabilizers, and sulfur heat stabilizers as exemplified below.
ヒンダードフェノール系熱安定剤としては、テトラキス
[メチレン−3−(3,5−ジ−t−ブチル−4−ヒド
ロキシフェニル)]プロピオネートメタン、3.9−ビ
ス[1,1−ジメチル−2−(β−(3−t−ブチル−
4−ヒドロキシ−5−メチルフェニル)プロピオニルオ
キシ)エチル]−2,4,8,10−テトラオキサスピ
ロ[5,5]ウンデカン、1,3.5−トリス(3,5
−ジ−t−ブチル−4−ヒドロキシベンジル−5−)−
リアジン−2,4,6(IH。Examples of the hindered phenol heat stabilizer include tetrakis[methylene-3-(3,5-di-t-butyl-4-hydroxyphenyl)]propionate methane, 3,9-bis[1,1-dimethyl- 2-(β-(3-t-butyl-
4-hydroxy-5-methylphenyl)propionyloxy)ethyl]-2,4,8,10-tetraoxaspiro[5,5]undecane, 1,3,5-tris(3,5
-di-t-butyl-4-hydroxybenzyl-5-)-
Lyazine-2,4,6 (IH.
3H,5H)−トリオン、1,3.5−トリメチル−2
,4,6−トリス(3,5−ジ−t−ブチル−4−ヒド
ロキシベンジル)ベンゼン等が挙げられる。3H,5H)-trione, 1,3.5-trimethyl-2
, 4,6-tris(3,5-di-t-butyl-4-hydroxybenzyl)benzene and the like.
また、リン系熱安定剤としては、テトラキス(2,4−
ジ−t−ブチルフェニル)−4,4’−ビフェニレンホ
スフォ′ナイト、ビス(2,6−ジーt−ブチル−4−
メチルフェニル)ペンタエリスリトール−ジ−ホスファ
イト等が挙げられる。In addition, as a phosphorus-based heat stabilizer, tetrakis (2,4-
di-t-butylphenyl)-4,4'-biphenylenephosphonite, bis(2,6-di-t-butyl-4-
(methylphenyl) pentaerythritol di-phosphite and the like.
イオウ系安定剤としては、テトラキス[メチレン−3−
(ドデシルチオ)プロピオネートコメタン等が挙げられ
る。As a sulfur stabilizer, tetrakis[methylene-3-
(dodecylthio)propionate comethane and the like.
これら安定剤の好適な添加量は、ポリビニルシクロヘキ
サン系樹脂100重量部に対して0.01〜3重量部、
好ましくは0.05〜1重量部である。The suitable amount of these stabilizers to be added is 0.01 to 3 parts by weight per 100 parts by weight of the polyvinylcyclohexane resin;
Preferably it is 0.05 to 1 part by weight.
これらの安定剤とポリビニルシクロヘキサン系樹脂との
混合方法については特に制限はないが、通常は樹脂と安
定剤とをリボンブレンダー、タンブラーブレンダー、ヘ
ンシェルミキサー等で混合し、その後、バンバリーミキ
サ−1−軸押出機、二軸押出機等で溶融混練し、ベレッ
ト形状とすることにより混合する。しかして、このよう
にして得られたベレットを射出成形材料として用いる。There are no particular restrictions on the method of mixing these stabilizers with the polyvinylcyclohexane resin, but the resin and stabilizer are usually mixed using a ribbon blender, tumbler blender, Henschel mixer, etc., and then a Banbury mixer with one shaft. The mixture is melt-kneaded using an extruder, twin-screw extruder, etc., and formed into a pellet shape. The pellet thus obtained is then used as an injection molding material.
このような本発明の方法によれば、透明性、耐熱性、靭
性等に優れ、着色もなく光学歪の著しく小さい光ディス
ク基板を得ることができる。According to the method of the present invention, it is possible to obtain an optical disk substrate that has excellent transparency, heat resistance, toughness, etc., is free from coloration, and has extremely low optical distortion.
本発明の光ディスク基板を用いて光ディスクを製造する
際には、該基板表面に金属蒸着等により前述の記録媒体
の皮膜を形成するか、或いは塗布等の方法で有機色素系
材料の皮膜を設け、これらを更に保護膜で覆う等の方法
を採用することができる。When manufacturing an optical disc using the optical disc substrate of the present invention, a film of the above-mentioned recording medium is formed on the surface of the substrate by metal vapor deposition or the like, or a film of an organic dye material is provided by a method such as coating, A method such as further covering these with a protective film can be adopted.
【実施例]
以下に実施例及び比較例を挙げて本発明をより具体的に
説明するが、本発明はその要旨を超えない限り、以下、
の実施例に限定されるものではない。[Examples] The present invention will be explained in more detail by referring to Examples and Comparative Examples. However, unless it exceeds the gist of the present invention,
The present invention is not limited to this embodiment.
なお、以下の実施例及び比較例における各種物性は、次
の方法によって測定したものである。In addition, various physical properties in the following Examples and Comparative Examples were measured by the following methods.
■ 数平均分子量ニ
ゲル・パーミェーション・クロマトグラフィー(GPC
)により、THFを溶媒としてポリスチレンと同様に測
定し、ポリスチレン換算の数平均分子量を求めた。■ Number average molecular weight Nigel permeation chromatography (GPC)
) was measured in the same manner as polystyrene using THF as a solvent, and the number average molecular weight in terms of polystyrene was determined.
■ 核水添*(%):
ポリビニルシクロヘキサン系樹脂をテトラヒドロフラン
(THF)に溶解し、UV吸収により測定した。■ Nuclear hydrogenation* (%): Polyvinylcyclohexane resin was dissolved in tetrahydrofuran (THF) and measured by UV absorption.
■ 軟化温度(℃):
1)upont社製サーモメカニカルアナライザーを用
いて、5℃/分の昇温速度で軟化温度を測定した。■ Softening temperature (°C): 1) Using a thermomechanical analyzer manufactured by Upont, the softening temperature was measured at a heating rate of 5°C/min.
■ 光ディスク基板の光線透過率(%):JIS K
8714に準拠して測定した。■ Light transmittance (%) of optical disc substrate: JIS K
Measured in accordance with 8714.
■ 光ディスク基板の複屈折(nm):成形した厚さ1
.2mm、直径130mmのディスクの中央から5.5
cm位置での複屈折(以下「Δns、sJと略記する。■ Birefringence of optical disk substrate (nm): molded thickness 1
.. 2mm, 5.5 from the center of a 130mm diameter disc
Birefringence at cm position (hereinafter abbreviated as Δns, sJ).
)で評価した。複屈折は日本光学社製の偏光顕微鏡によ
り測定した。) was evaluated. Birefringence was measured using a polarizing microscope manufactured by Nippon Kogaku Co., Ltd.
■ 光ディスク基板の反り量(mm):N1DEK社フ
ラットテスターFT−7を用いて測定した。(2) Amount of warpage (mm) of optical disc substrate: Measured using a flat tester FT-7 manufactured by N1DEK.
■ 光ディスク基板の外観:
後述する方法で成形した光ディスク基板に関して、着色
、シルバーストリークの発生等を目視により調べた。■ Appearance of optical disc substrate: Optical disc substrates molded by the method described below were visually inspected for coloring, occurrence of silver streaks, etc.
実施例1
スチレン単独重合体の水添により得られた、数平均分子
量70,000、核水添率99%のポリビニルシクロヘ
キサン100重量部に、テトラキス[メチレン−3−(
3,5−ジ−t−ブチル−4−ヒドロキシフェニル)]
プロピオネートメタン(日本チバガイギー社製rI r
ganoxloloJ)O12重量部、テトラキス(2
,4−ジーt−ブチルフェニル)−4,4°−ビフェニ
レンホスフォナイト(同rI rgaphosP−EP
QJ )0.2重量部を添加し、押出機を用いて260
℃で溶融混練を行ないベレット化した。Example 1 Tetrakis[methylene-3-(
3,5-di-t-butyl-4-hydroxyphenyl)]
Propionate methane (manufactured by Ciba Geigy Japan)
ganoxlolo J) O 12 parts by weight, tetrakis (2
,4-di-t-butylphenyl)-4,4°-biphenylenephosphonite (rI rgaphosP-EP
Add 0.2 parts by weight of QJ) and use an extruder to
The mixture was melt-kneaded at ℃ to form pellets.
このペレットを射出成形機(名種社製「Ml 40AJ
)を用いて、可動金型側にグループ付スタンバ−を取
り付け、樹脂温度300℃、金型温度70℃で厚さ1.
2mm、直径130mmの円盤状光ディスク基板を成形
した。The pellets are then molded using an injection molding machine ("Ml 40AJ" manufactured by Nashusha Co., Ltd.).
), attach a stanbar with a group to the movable mold side, and set the resin temperature to 300°C and the mold temperature to 70°C to a thickness of 1.
A disc-shaped optical disc substrate having a diameter of 2 mm and a diameter of 130 mm was molded.
得られた光ディスク基板の物性を第1表に示す。Table 1 shows the physical properties of the optical disc substrate obtained.
実施例2
実施例1において、樹脂として、アニオン重合によるス
チレン−ブタジェン−スチレンブロック共重合体(ブタ
ジェン含量5重量%)の水添により得られた数平均分子
量60,000、核水添率99%のポリビニルシクロヘ
キサン系樹脂を用いたこと以外は、実施例1と同様に射
出成形を行なった。Example 2 In Example 1, the resin was obtained by hydrogenating a styrene-butadiene-styrene block copolymer (butadiene content 5% by weight) by anionic polymerization, with a number average molecular weight of 60,000 and a nuclear hydrogenation rate of 99%. Injection molding was carried out in the same manner as in Example 1, except that the polyvinylcyclohexane resin was used.
得られた光ディスク基板の物性を第1表に示す。Table 1 shows the physical properties of the optical disc substrate obtained.
実施例3
実施例1において、成形条件を樹脂温度290℃、金型
温度40℃としたこと以外は、実施例1と同様にして成
形を行なった。Example 3 Molding was carried out in the same manner as in Example 1 except that the molding conditions were a resin temperature of 290°C and a mold temperature of 40°C.
得られた光ディスク基板の物性を第1表に示す。Table 1 shows the physical properties of the optical disc substrate obtained.
実施例4
実施例1において、スチレン単独重合体の水添により得
られた、数平均分子量90,000、核水添98%のポ
リビニルシクロヘキサンを用い、成形条件を樹脂温度3
20℃、金型温度60℃としたこと以外は、実施例1と
同様にして成形を行なった。Example 4 In Example 1, polyvinylcyclohexane with a number average molecular weight of 90,000 and nuclear hydrogenation of 98% obtained by hydrogenating a styrene homopolymer was used, and the molding conditions were changed to a resin temperature of 3.
Molding was carried out in the same manner as in Example 1 except that the mold temperature was 20°C and the mold temperature was 60°C.
得られた光ディスク基板の物性を第1表に示す。Table 1 shows the physical properties of the optical disc substrate obtained.
比較例1
実施例1において、成形条件を樹脂温度260℃とした
こと以外は実施例1と同様にして成形を行なった。Comparative Example 1 Molding was carried out in the same manner as in Example 1 except that the molding conditions were a resin temperature of 260°C.
得られた光ディスク基板の物性を第1表に示す。Table 1 shows the physical properties of the optical disc substrate obtained.
比較例2
実施例1において、成形条件を樹脂温度370℃とした
こと以外は実施例1と同様にして成形を行なった。Comparative Example 2 Molding was carried out in the same manner as in Example 1 except that the molding conditions were set to a resin temperature of 370°C.
得られた光ディスク基板の物性を第1表に示す。Table 1 shows the physical properties of the optical disc substrate obtained.
比較例3
実施例1において、成形条件を金型温度140℃とした
こと以外は、実施例1と同様にして成形を行なった。Comparative Example 3 Molding was carried out in the same manner as in Example 1 except that the molding conditions were set to a mold temperature of 140°C.
得られた光ディスク基板の物性を第1表に示す。Table 1 shows the physical properties of the optical disc substrate obtained.
比較例4
実施例1において、樹脂として、スチレン単独重合体の
水添により得られた、数平均分子量35.000.核水
添率98%のポリビニルシクロヘキサンを用いたこと以
外は実施例1と同様にして成形を行なったところ、樹脂
が脆く、成形片にクラックが入った。Comparative Example 4 In Example 1, the resin was obtained by hydrogenating a styrene homopolymer and had a number average molecular weight of 35.000. When molding was carried out in the same manner as in Example 1 except that polyvinylcyclohexane with a nuclear hydrogenation rate of 98% was used, the resin was brittle and cracks appeared in the molded piece.
得られた光ディスク基板の物性を第1表に示す。Table 1 shows the physical properties of the optical disc substrate obtained.
第1表より明らかなように、本発明に従って、特定の分
子量及び核水添率のポリビニルシクロヘキサン系樹脂を
用い、特定条件にて射出成形することにより、耐熱性、
透明性、光特性、形状安定性に優れ、シルバーストリー
クや着色のない高特性光ディスク基板が得られる。As is clear from Table 1, according to the present invention, heat resistance,
A high-performance optical disk substrate with excellent transparency, optical properties, and shape stability, and no silver streaks or coloring can be obtained.
[発明の効果]
以上詳述した通り、本発明によれば、耐熱性、透明性等
に優れ、低吸湿性、低複屈折性で良好な靭性を有する高
特性ポリビニルシクロヘキサン樹脂から樹脂の劣化の問
題もなく、光特性に優れた高特性光ディスク基板を安定
生産することが可能とされる。[Effects of the Invention] As detailed above, according to the present invention, a high-performance polyvinyl cyclohexane resin having excellent heat resistance, transparency, etc., low moisture absorption, low birefringence, and good toughness can be used to prevent resin deterioration. It is possible to stably produce high-performance optical disc substrates with excellent optical properties without any problems.
代理人 弁理士 重 野 剛Agent: Patent attorney Tsuyoshi Shigeno
Claims (1)
る、数平均分子量40,000〜300,000、核水
添率90%以上のポリビニルシクロヘキサン系樹脂を、
樹脂温度270〜350℃、金型温度30〜120℃で
射出成形することを特徴とするポリビニルシクロヘキサ
ン系樹脂製光ディスク基板の製造法。(1) A polyvinylcyclohexane resin with a number average molecular weight of 40,000 to 300,000 and a nuclear hydrogenation rate of 90% or more, which is obtained by hydrogenating the aromatic ring of a styrene resin.
A method for manufacturing an optical disk substrate made of a polyvinylcyclohexane resin, characterized by injection molding at a resin temperature of 270 to 350°C and a mold temperature of 30 to 120°C.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14984688A JPH01317728A (en) | 1988-06-17 | 1988-06-17 | Production of optical disk substrate made of polyvinyl cyclohexane resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14984688A JPH01317728A (en) | 1988-06-17 | 1988-06-17 | Production of optical disk substrate made of polyvinyl cyclohexane resin |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01317728A true JPH01317728A (en) | 1989-12-22 |
Family
ID=15483932
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14984688A Pending JPH01317728A (en) | 1988-06-17 | 1988-06-17 | Production of optical disk substrate made of polyvinyl cyclohexane resin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01317728A (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5178926A (en) * | 1991-03-18 | 1993-01-12 | Mitsubishi Kasei Corporation | Hydrogenated vinyl aromatic hydrocarbon polymer composition and optical disc substrate |
WO1998055886A1 (en) * | 1997-06-06 | 1998-12-10 | Nippon Zeon Co., Ltd. | Molding material for plastic lenses |
WO1999032528A1 (en) * | 1997-12-18 | 1999-07-01 | Bayer Aktiengesellschaft | Vinyl cyclohexane based polymers |
WO2000034340A1 (en) * | 1998-12-04 | 2000-06-15 | Nippon Zeon Co., Ltd. | Hydrogenated polymers, resin composition, and process for producing substrate for information-recording medium |
WO2000070607A1 (en) * | 1999-05-12 | 2000-11-23 | Bayer Aktiengesellschaft | Substrates for optical storage media |
WO2001012680A1 (en) * | 1999-08-12 | 2001-02-22 | Zeon Corporation | Alicyclic hydrocarbon copolymer |
WO2001072895A1 (en) * | 2000-03-24 | 2001-10-04 | Bayer Aktiengesellschaft | Thermoplastic polyvinylcyclohexane moulding compounds with improved characteristics |
WO2002012362A1 (en) * | 2000-08-04 | 2002-02-14 | Zeon Corporation | Block copolymer, process for producing the same, and molded object |
JP2003502471A (en) * | 1999-06-11 | 2003-01-21 | ザ ダウ ケミカル カンパニー | Compositions comprising hydrogenated block copolymers and their end uses |
JP2003502470A (en) * | 1999-06-11 | 2003-01-21 | ザ ダウ ケミカル カンパニー | Composition comprising hydrogenated block copolymer and its use for end use |
WO2013047690A1 (en) | 2011-09-29 | 2013-04-04 | 三菱化学株式会社 | Hydrogenated block copolymer, resin composition, film and container |
-
1988
- 1988-06-17 JP JP14984688A patent/JPH01317728A/en active Pending
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5178926A (en) * | 1991-03-18 | 1993-01-12 | Mitsubishi Kasei Corporation | Hydrogenated vinyl aromatic hydrocarbon polymer composition and optical disc substrate |
WO1998055886A1 (en) * | 1997-06-06 | 1998-12-10 | Nippon Zeon Co., Ltd. | Molding material for plastic lenses |
US6486262B1 (en) | 1997-06-06 | 2002-11-26 | Nippon Zeon Co., Ltd. | Molding material for plastic lens |
WO1999032528A1 (en) * | 1997-12-18 | 1999-07-01 | Bayer Aktiengesellschaft | Vinyl cyclohexane based polymers |
US6433102B1 (en) | 1998-12-04 | 2002-08-13 | Nippon Zeon Co., Ltd. | Hydrogenated polymers, resin composition, and process for producing substrate for information-recording medium |
WO2000034340A1 (en) * | 1998-12-04 | 2000-06-15 | Nippon Zeon Co., Ltd. | Hydrogenated polymers, resin composition, and process for producing substrate for information-recording medium |
WO2000070607A1 (en) * | 1999-05-12 | 2000-11-23 | Bayer Aktiengesellschaft | Substrates for optical storage media |
JP2003502471A (en) * | 1999-06-11 | 2003-01-21 | ザ ダウ ケミカル カンパニー | Compositions comprising hydrogenated block copolymers and their end uses |
JP2003502470A (en) * | 1999-06-11 | 2003-01-21 | ザ ダウ ケミカル カンパニー | Composition comprising hydrogenated block copolymer and its use for end use |
WO2001012680A1 (en) * | 1999-08-12 | 2001-02-22 | Zeon Corporation | Alicyclic hydrocarbon copolymer |
US6686430B1 (en) | 1999-08-12 | 2004-02-03 | Zeon Corporation | Alicyclic hydrocarbon copolymer |
WO2001072895A1 (en) * | 2000-03-24 | 2001-10-04 | Bayer Aktiengesellschaft | Thermoplastic polyvinylcyclohexane moulding compounds with improved characteristics |
WO2002012362A1 (en) * | 2000-08-04 | 2002-02-14 | Zeon Corporation | Block copolymer, process for producing the same, and molded object |
US6965003B2 (en) | 2000-08-04 | 2005-11-15 | Zeon Corporation | Block copolymer, process for producing the same, and molded object |
WO2013047690A1 (en) | 2011-09-29 | 2013-04-04 | 三菱化学株式会社 | Hydrogenated block copolymer, resin composition, film and container |
US9127112B2 (en) | 2011-09-29 | 2015-09-08 | Mitsubishi Chemical Corporation | Hydrogenated block copolymer, resin composition, film and container |
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