JPH01295893A - Thermal transfer material - Google Patents

Abstract

PURPOSE:To avoid sticking phenomena, to improve the heat conductivity, sliding property and toughness of a coating film, by providing a transfer ink layer on one surface of a base material composed of a plastic film and a protecting layer having a resin composition satisfying a specified formula on the other surface of said base material. CONSTITUTION:A melting type or sublimating type transfer ink layer 1 is formed on one surface of a base material 2 composed of a plastic film. A protecting layer having a resin composition satisfying formulae (I)-(III) is formed on the other surface. If an acryl silicone resin in the resin of the protecting layer is less than 20wt.%, the sliding property of the obtained layer is not sufficient, causing a sticking phenomenon. If it is more than 80wt.%, the resin is not fully hardened and the bonding force is deteriorated. Further, if a urethane silicone resin is mixed in not less than 80wt.%, the heat-proof property of the layer is decreased and accordingly the layer may be melted and adhered to a thermal head. In the event an acryl resin is mixed not less than 80wt.%, the sliding property is lost, resulting in sticking phenomena. The acryl silicone resin is such that the acryl resin and silicone resin are chemically coupled to each other, and the urethane silicone resin is such that the urethane resin and silicone resin are chemically coupled to each other. In the formulae, A, B and C designate an acryl silicone resin, urethane silicone resin and acryl resin, respectively, while % is wt.%.

Description

Detailed Description of the Invention (Industrial Application 1?) The present invention relates to a thermal transfer material suitable for use as a thermal transfer ribbon, and in particular has improved sticking, heat transfer efficiency, slipperiness, and coating toughness. Regarding thermal transfer materials.

(Prior art) In a heat-sensitive transfer material in which a meltable or sublimable transfer ink layer is provided on one side of a base material made of a plastic film, the protective layer provided on the other side of the base material has conventionally been heat-curable. Heat-resistant protective layers made of synthetic resins, heat-resistant protective layers made of fluorine-based resins, water-based polymers, and/or reactive low-molecular-weight substances, and heat-resistant protective layers made of these resin layers with inorganic particles have been proposed. Japanese Patent Publication No. 55-7467,
JP-A-56-155794).

(Problems to be Solved by the Invention) The previously proposed heat-resistant protective layer made of thermosetting resin does not cause sticking, but as the temperature increases, it does slip to varying degrees. The disadvantage is that it worsens the sex. When inorganic particles are added for the purpose of improving this drawback, the surface becomes too rough, causing problems such as poor adhesion to the heating head and deterioration of heat transfer efficiency.

Furthermore, those coated with a fluororesin have the disadvantage that the toughness of the coating film is poor.

The present inventor has conducted studies with the aim of improving the above-mentioned drawbacks of thermal transfer materials, and providing a thermal transfer material suitable for thermal transfer ribbons that is free from sticking and has improved heat transfer efficiency, slipperiness, and coating toughness. As a result, it was discovered that the above object could be achieved by specifying the type and blending ratio of the resin constituting the protective layer of the heat-sensitive transfer material.

(Means for Solving the Problems) The above-mentioned object of the present invention is to provide a thermal transfer material in which a meltable or sublimable transfer ink layer is provided on one side of a base material made of a plastic film. This can be achieved by using a heat-sensitive transfer material provided with a protective layer made of a resin composition satisfying the following formulas (1) to (■) on its surface.

20%≦A≦80% ・・・・・・・・・・ (I) 0
%≦B≦80% ・・・・・・・・・ (II) 0%≦
C≦80% −・・−・・・・・・ (1[) (in the formula,
A is acrylic silicone resin, B is urethane silicone resin, C is acrylic resin, and % is weight %. )
The drawing is a schematic cross-sectional view of the thermal transfer material of the present invention, in which a meltable or sublimable transfer ink layer 1 is provided on one side of a base material 2 made of a plastic film, and an acrylic silicone resin layer is provided on the other side of the base material. Urethane silicone resin and/or
Alternatively, a heat-sensitive transfer material formed with a protective layer 3 containing an acrylic resin is shown.

The unique structure of the thermal transfer material of the present invention is that the resin composition constituting the protective layer 3 includes an acrylic silicone resin as an essential component, and a urethane silicone resin and/or an acrylic resin are blended therein. The resin composition is made such that the blending ratio of is within a specific range.

The acrylic silicone resin in the resin constituting the protective layer is 2
If the weight is less than 0 weight, the sliding property will be insufficient and a sticking phenomenon will occur, and if it exceeds 80 weight %, curing will be insufficient and the adhesive strength will decrease, making it impossible to achieve the object of the present invention. Furthermore, if the amount of urethane silicone resin blended exceeds 80% by weight, heat resistance will decrease and fusion with the thermal head will occur. Furthermore, if the amount of acrylic resin blended exceeds 80% by weight, the slipperiness will be lost and a sticking phenomenon will occur.

The acrylic silicone resin, urethane silicone resin, and acrylic resin used in the present invention are all well-known commercially available resins. Acrylic silicone resin is a chemical combination of acrylic resin and silicone resin, and urethane silicone resin is a chemical combination of urethane resin and silicone resin. It is something that Preferred specific examples of each will be explained below.

A preferred acrylic silicone resin is one obtained by grafting or/and block polymerization of a known acrylic resin and a known silicone resin, and a representative example thereof can be shown by the following chemical formula.

However, in the formula, X represents -OH, -OR, -CN, -CI, -F or -COOR, and R represents -CH3, -C2H5, -C
Lower alkyl groups such as 3H7, -04H, etc. or -CH2C
Indicates a substituted alkyl group such as H20H. A plurality of R's may be the same or different.

n, m and l all represent 10 to 500.

A preferred urethane silicone resin is one obtained by grafting or/and block polymerization of a urethane resin and a silicone resin, and a representative example thereof can be shown by the following chemical formula.

However, in the formula, R1 and R2 are -CH2-, -C2H4-, -C
, H6-.

-C4H8+, -C5H,. -, -C6H,2-, -C
8H Yu. - represents a divalent monovalent hydrogen group such as -, R has the same definition as above, and η, 1 and i′+ n″ are each 10
~500.

A preferred acrylic resin is called an acrylic polyol, and a representative example thereof can be shown by the following chemical formula.

However, in the formula, R3 and R4 are -H or -CH3, -C2H5
,-C.

Lower alkyl groups such as H,, -C, H9, R5 is -(CH
2) -2° also indicates 10 to 500.

As the plastic film base material constituting the thermal transfer material of the present invention, known plastic films can be used, such as polyester film, polycarbonate film, triacetylcellulose film, cellophane film, polyamide film, and polyimide film. , polyphenylene sulfide film, aramid film, polyolefin film, etc. However, from the viewpoint of cost and heat resistance, polyester film and polycarbonate film are preferred. Further, the thickness of the base material made of plastic film is not particularly limited, but is usually 18 to 14 μm.

There are no particular limitations on the meltable or sublimable ink constituting the transfer ink layer provided on one surface of the plastic film substrate, and any known ink may be used as appropriate. The main ingredients of hot-melt ink are (1) waxes with appropriate melting points such as paraffin wax, microcrystalline wax, and carnauba wax, (2) pigments, and (3) softeners such as oil. Typical examples include those to which various additives have been added.

On the other hand, sublimation inks include (1) cellulose-based water-soluble acrylics such as hydroxyethyl cellulose, polyvinyl alcohol, or polyamide-based 4!4! ! L(z)
Mainly made of yellow, magenta, and cyan sublimable dyes,
Typical examples include those to which various additives are added as necessary.

Further, the thickness of the transfer ink layer is not particularly limited, but usually 05 to 10 μm, preferably 2 to 7 μm.

Next, a typical manufacturing method of the thermal transfer material of the present invention will be explained, but it is not limited to this, of course. Or two or more types can be combined.

(A) Acrylic silicone tree! IL (B) urethane silicone resin and (C) acrylic resin 20%≦A
A coating liquid for forming a protective layer is prepared by blending it in an appropriate solvent with a composition ratio of ≦80%, 0%≦B≦80%, 0%≦C≦80%, and this coating liquid is applied to gravure coating, reverse coating, It is applied to one side of a plastic film substrate using a method such as spray coating. Next, it is dried at 66 to 120° C. for about 10 to 30 seconds to form a protective layer.

Subsequently, a meltable ink or a sublimable ink is applied to the other surface of the film base material in the same manner as described above, and then dried at a predetermined temperature to form a transfer ink layer to produce a heat-sensitive transfer material. The protective layer and the transfer ink layer may be formed in any order or may be formed simultaneously.

(Effects of the Invention) As already mentioned, the thermal transfer material of the present invention uses acrylic silicone resin (A) as the resin constituting the protective layer.
is an essential component, and urethane silicone resin (B) is added to this.
and/or acrylic resin (C), and the resin composition is 20%≦A≦80%, 0%≦B≦80
% and 0%≦C≦80%, it is possible to obtain a thermal transfer material that is free from sticking and has excellent heat transfer efficiency, slipperiness, and coating toughness.

Further, the thermal transfer material of the present invention can be suitably used in word processors, facsimile machines, barcode pleaters, graphic printers, automatic ticket issuing machines, and the like.

(Example) Examples will be given below to further clarify the effects of the present invention. In the examples, the measurement methods and evaluation criteria for each characteristic are as follows.

(1) Dynamic friction coefficient μPdi Running object [2
Glass plate (3+m thick x 50m) with a weight of 00gr on it
Measurements are taken by running a (m x 80 questions) across the protective layer surface at a speed of 300 m+/min.

(2) Stick phenomenon: When using clay-coated paper as the recording paper and recording with the following thermal head, stick phenomenon is marked as "x", otherwise "○".
”.

Main and sub-scanning linear density; 4 dots/111 recording power; 0.9 w/dot head heating time; 513 (3) Heat resistance; using a thermal gradient tester (210 to 250°C), overlap the protective layer surface and aluminum foil. , and 0.4 kg/cd for 5 seconds to examine the adhesion between the i-layer surface and the aluminum foil. If not all are in close contact, "o" otherwise "
×”.

(4) Adhesive strength: Apply a commercially available cellophane adhesive tape (manufactured by Chiban) to the surface of the protective layer at 90 degrees, and when the area of the protective layer adhered to the cellophane tape is less than 10%, the adhesive strength with the base material is measured. rQJ, and when it was 10% or more but less than 40%, it was marked "Δ", and when it was 40% or more, it was marked "x".

(5) Energy consumption: This is expressed as the amount of energy required to perform complete transfer using clay coated paper with a thickness of approximately 60 μm and the heating head used in measurement method (2). "○J", thicker than 0.7mJ (1.0mJ or less is marked as [ΔJ], larger than 1.0mJ is marked as "x").

(Examples 1 to 3. Comparative Examples 1 to 4) 30 parts of paraffin wax, 30 parts of ester wax, 30 parts of carnauba wax, and acetic acid were added to one side of a base film made of biaxially stretched polyethylene terephthalate film with a thickness of 60 μm. 15 parts of vinyl-ethylene copolymer,
4μ of hot-melt ink consisting of 20 parts of carbon black
-Apply. Next, on the other side of the base film, a protective layer having the following composition is applied to a dry thickness of 0.2 to 0.5 μm. However, drying was performed in hot air at 100° C. for 20 seconds. The mixing weight % of the protective layer is 20≦A≦80.20≦C≦80
A: C=20: 80 (Example 1), A: C==50: so (Example 2)
, A:C=80:20 (Example 3).

For comparison, A alone (comparative example 1), A: C=9
0:10 (Comparative Example 2), A:C=10:90
(Comparative Example 3) and a protective layer having a composition of C alone (Comparative Example 4) were prepared.

However, 2% of isocyanate resin was added to accelerate the curing reaction. As the resin A, US-300 manufactured by Toagosei Chemical Industry Co., Ltd.; as resin B, Atompond BN-38 manufactured by Ichiba Research Institute; and as resin C, Acridic A-801 manufactured by Dainippon Ink and Chemicals Co., Ltd. were used.

The characteristic values of each of the heat-sensitive transfer materials thus obtained were measured, and the results are shown in Table 1 below.

As is clear from Table 1, Examples 1 to 3 all showed excellent characteristic values and exhibited the effects aimed at by the present invention. On the other hand, Comparative Examples 1 and 2 lacked adhesive strength with the base material, and in particular Comparative Example 1, a blocking phenomenon occurred, and the effects of the present invention were not exhibited. Furthermore, in Comparative Examples 3 and 4, a stick phenomenon occurred and the effects aimed at by the present invention could not be obtained.

(Examples 4 to 6. Comparative Examples 5 to 7) Same base film, hot melt ink layer, and protective layer composition as in Example 1, but the mixed weight % of the protective layer was 40≦A≦60.
, 20≦B≦60, A: B=
40:60 (Example 4), A:B=60:40
(Example 5) The composition ratio was set as A:B=80:20 (Example 6).

For comparison, protective layers having the compositions of A:B=90:io (Comparative Example 5), A:B=10:90 (Comparative Example 6), and B alone (Comparative Example 7) were prepared. However, in order to accelerate the curing reaction, 2% of isocyanate resin was added. The characteristic values of each of the heat-sensitive transfer materials thus obtained were measured, and the results are shown in Table 2 below.

As is clear from Table 2, Examples 4 to 6 all exhibit excellent characteristic values and satisfy the effects aimed at by the present invention. On the other hand, Comparative Example 5 lacks adhesive strength with the base material, Comparative Examples 6 and 7 have poor heat resistance, and the effects of the present invention are not exhibited.

Table 1 Table 2

BRIEF DESCRIPTION OF THE DRAWINGS The drawing is a schematic cross-sectional view of the heat-sensitive transfer material of the present invention. 1... Transfer ink layer, 2... Plastic film base material, 3... Protective layer. Patent applicant: Toyo Metallizing Co., Ltd. 11. . Agent Patent Attorney Takehiko Saito! Pano... (patent attorney Ryoji Kawase).

Claims (1)

[Claims] (1) In a thermal transfer material in which a meltable or sublimable transfer ink layer is provided on one side of a base material made of a plastic film, the following formulas (I) to (III) are satisfied on the other side of the base material. A heat-sensitive transfer material characterized by having a protective layer made of a resin composition. 20%≦A≦80%…………(I) 0%≦B≦80%…………(II) 0%≦C≦80%…………(III) (In the formula, A is acrylic silicone Resin, B is urethane silicone resin, C is acrylic resin, % is weight %.)