JPH01255182A - Seal connection method for connector - Google Patents
Seal connection method for connectorInfo
- Publication number
- JPH01255182A JPH01255182A JP63083907A JP8390788A JPH01255182A JP H01255182 A JPH01255182 A JP H01255182A JP 63083907 A JP63083907 A JP 63083907A JP 8390788 A JP8390788 A JP 8390788A JP H01255182 A JPH01255182 A JP H01255182A
- Authority
- JP
- Japan
- Prior art keywords
- connector
- end conductor
- wire end
- resin
- sealing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 19
- 239000003566 sealing material Substances 0.000 claims abstract description 14
- 239000004020 conductor Substances 0.000 claims abstract description 13
- 239000000843 powder Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 10
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 3
- 239000002904 solvent Substances 0.000 abstract description 2
- 229920001169 thermoplastic Polymers 0.000 abstract description 2
- 239000004416 thermosoftening plastic Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract 2
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 239000002245 particle Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Insulated Conductors (AREA)
Abstract
Description
【発明の詳細な説明】
生業よ盗上」女工
本発明は各種分野において使用されるワイヤーハーネス
のワイヤー端導体部とコネクターの接続方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of connecting a wire end conductor portion of a wire harness and a connector used in various fields.
従沸部ユ辷佇
電子機器の発達により広範囲にワイヤーを用いた接続が
行われている。特に近年接続の信頼性と脱着の容易さよ
りコネクターを用いたいわゆるワイヤーハーネスが自動
車、家電機器、産業用機器等種々の分野において使用さ
れている。通常ワイヤーハーネスはワイヤーの端部絶縁
被覆を除去し、コネクターをカシメにより接続するもの
であるが高温、高温等の環境条件によってワイヤー導体
部とコネクターとの接触点において酸化劣化を生じ接続
抵抗が上がるという問題を生じていた。しかして、信頼
性を重視する場合、対策としてコネクターをカシメた後
、更に接続部分にハンダ付けが行われるのが一般的であ
る。Due to the development of electronic equipment, connections using wires have become widespread. Particularly in recent years, so-called wire harnesses using connectors have been used in various fields such as automobiles, home appliances, and industrial equipment due to their reliability of connection and ease of attachment and detachment. Normally, wire harnesses are made by removing the insulation coating from the ends of the wires and connecting the connectors by caulking.However, due to environmental conditions such as high temperatures, oxidation deterioration occurs at the contact point between the wire conductor and the connector, increasing the connection resistance. This caused a problem. However, when reliability is important, it is common to swage the connector and then solder the connection part as a countermeasure.
、Ｈ＜”しよ゛と る１問題
現在、上記の如きハンダ付は作業は手作業にて行われて
おり、非常に生産性が低い工程となっている。特にコネ
クターが大きく熱容量が大きい場合、特に生産性の低下
を生じている。上記問題を解決すべく、種々の自動化へ
のアプローチが行われたが未だ解決するにいたっていな
い。本発明は従来技術におけるワイヤーハーネスのワイ
ヤー端導体部とコネクターの接続信頼性を高め、かつ工
程の合理化を目的としたものである。, H In particular, this has caused a decrease in productivity.In order to solve the above problem, various approaches to automation have been made, but the problem has not been solved yet. The purpose is to improve the connection reliability of the connector and the connector, and to streamline the process.
１８″ｔ るための
本発明は、ワイヤーハーネスのワイヤー端導体部に、コ
ネクターをカシメにより接続する際、熱変形温度が１０
０℃以上の有機樹脂中に金属粉を分散させたシール材を
、該コネクターと該ワイヤー端導体部間、及びその周辺
に設けることを特徴とするコネクターの接続方法、を要
旨とするものである。In the present invention, the heat deformation temperature is 10 mm when connecting the connector to the wire end conductor part of the wire harness by caulking.
The gist of the present invention is a method for connecting a connector, characterized in that a sealing material in which metal powder is dispersed in an organic resin at a temperature of 0° C. or higher is provided between the connector and the wire end conductor and around the same. .
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
本発明に用いられる有機樹脂としては、熱硬化性樹脂系
のシール材、熱可塑性樹脂系のシール材のいづれでもよ
（、又混合して用いられても構わない。例えばポリエス
テル樹脂、ポリオレフィン樹脂、アクリル樹脂、エポキ
シ樹脂、ポリイミド樹脂、ポリウレタン樹脂、フェノー
ル樹脂、塩化ビニール樹脂、メラミン樹脂、ポリエーテ
ルスルホン樹脂、ポリフェニレンサルファイド樹脂、ポ
リエーテルイミド樹脂、ポリフェニレンオキサイド樹脂
、ビスマレイミド樹脂、ビスマレイミドトリアジン樹脂
等があげられる。これら有機シール材の熱変形温度は、
１００℃以上が好ましく、さらに好ましくは１２０ ’
Ｃ以上である。この上限はとくに制限はないが、通常４
００℃以下、好ましくは、３５０ ’Ｃ以下である。熱
変形温度がｉｏｏ ’ｃ未満では、過電流が流れた場合
の発熱により変形フローを生じ好ましくない。なお、本
発明において、熱変形温度とは、軟化温度又は分解温度
のうち、何れか低温度で起こる方の温度を云う。The organic resin used in the present invention may be either a thermosetting resin sealing material or a thermoplastic resin sealing material (or a mixture may be used. For example, polyester resin, polyolefin resin, Acrylic resin, epoxy resin, polyimide resin, polyurethane resin, phenolic resin, vinyl chloride resin, melamine resin, polyether sulfone resin, polyphenylene sulfide resin, polyetherimide resin, polyphenylene oxide resin, bismaleimide resin, bismaleimide triazine resin, etc. The heat distortion temperature of these organic sealants is
Preferably 100°C or higher, more preferably 120'
C or higher. There is no particular limit to this upper limit, but it is usually 4
00°C or less, preferably 350'C or less. If the thermal deformation temperature is less than ioo'c, deformation flow occurs due to heat generation when an overcurrent flows, which is undesirable. In the present invention, the heat distortion temperature refers to the softening temperature or the decomposition temperature, whichever is lower.
本発明で用いる金属粉としては、例えば、銅粉、銀粉、
カーボン粉、真鍮粉、ステンレス粉、アルミ粉、ニッケ
ル扮、鉄粉等およびこれらの混合粉が挙げられる。用い
られるこれら金属粉の粒子径としては、特に制限はない
が、平均で０．０１〜５０μｍ程度のものが好ましい。Examples of the metal powder used in the present invention include copper powder, silver powder,
Examples include carbon powder, brass powder, stainless steel powder, aluminum powder, nickel powder, iron powder, etc., and mixed powders thereof. The particle size of these metal powders used is not particularly limited, but it is preferably about 0.01 to 50 μm on average.
また、金属粉のを機樹脂中への含存率としては、有機樹
脂固形分および金属粉に対し、１〜８５重量部が望まし
い。有機樹脂中への金属粉の分散方法は特に限定するも
のではないが、通常、ニーダ−１三本ロール、ミキサー
等を用いて行われる。The content of metal powder in the resin is preferably 1 to 85 parts by weight based on the solid content of the organic resin and the metal powder. The method for dispersing the metal powder into the organic resin is not particularly limited, but it is usually carried out using a kneader with three rolls, a mixer, or the like.
本発明においては、有機樹脂中に金属粉を分散させたこ
れらシール材に、種々の無機フィラー、消泡剤、チクソ
性付与剤、接着性付与剤等を添加しても構わない。In the present invention, various inorganic fillers, antifoaming agents, thixotropic agents, adhesive agents, etc. may be added to these sealing materials in which metal powder is dispersed in an organic resin.
本発明のシール材をコネクターとワイヤー端導体部間お
よびその周辺に設ける方法としては、特に限定するもの
ではないが、溶剤を用いてシール材を塗布し乾燥する方
法、熱可塑性シール材を加熱し、低粘度化して塗布する
方法、２液タイプの熱硬化性シール材を混合塗布する方
法などがあげられる。いづれにしても、ライン上で自動
化の可能な方法である。Methods for applying the sealing material of the present invention between the connector and the wire end conductor and around the area are not particularly limited, but methods include applying the sealing material using a solvent and drying it, and heating the thermoplastic sealing material. , a method of coating with a low viscosity, and a method of mixing and coating a two-component type thermosetting sealant. In any case, this is a method that can be automated on the line.
の１ 口
このようにして得られたワイヤーハーネスは生産性と良
好な接続抵抗を兼備えた工業的に有用なものである。The wire harness thus obtained is industrially useful, having both productivity and good connection resistance.
皇嵐皿
以下に実施例を記載する。ここで抵抗値の測定は、横河
ヒューレノトバソカード社製４３２８Ａミリオームメー
ターを使用し、耐湿試験は、４０“Ｃ９５％ＲＨ５００
時間、耐熱試験は、１５０℃５００時間での抵抗値測定
での結果である。Koran Dish Examples are described below. Here, the resistance value was measured using a 4328A milliohm meter manufactured by Yokogawa Hule Notobaso Card Co., Ltd., and the humidity test was performed using a 40"C95%RH500
The time and heat resistance tests are the results of resistance value measurements at 150°C for 500 hours.
実施例 １
コネクタ一部に２ｆｉ性エポキシ樹脂ストラクトボンド
ＥＨ−４５４（三井東圧化学社製 熱変形温度１８０℃
）主剤１００重量部に対し真鍮扮（平均粒径３５μｍ
）１００重量部を混合し、三本ロールにて分散し硬化
剤とともにスタティックミキサーを取りつけたデイスペ
ンサーを用いて二液混合したシール材を０．２ｇ塗布し
その後ワイヤー端導体部をのせ、コネクターのカシメ工
程にて接続し、２４時間放置して硬化させ、ワイヤーハ
ーネスを作成した。初期抵抗、耐湿処理後の抵抗及び耐
熱テスト後の抵抗を表−１に示す。Example 1 2fi epoxy resin Structbond EH-454 (manufactured by Mitsui Toatsu Chemical Co., Ltd., heat distortion temperature 180°C) was applied to a part of the connector.
) Based on 100 parts by weight of the main agent, brass powder (average particle size 35 μm
) 100 parts by weight was mixed, dispersed using a three-roll roll, and applied with a curing agent and 0.2 g of the two-component mixture sealing material using a dispenser equipped with a static mixer.Then, the wire end conductor was placed on the connector. The wire harness was connected in the caulking process and left to harden for 24 hours to create a wire harness. Table 1 shows the initial resistance, resistance after moisture resistance treatment, and resistance after heat resistance test.
実施例 ２
コネクタ一部にポリオレフィン樹脂ＭＴメルトＰ−７５
０（三井東圧化学社製 熱変形温度１２０’Ｃ）１００
重量部に銅粉（平均粒径１０μｍ ）４００重量部を
混合し、三本ロールにて分散して得られたシール材を加
熱型デイスペンサーにて１８０℃に加熱し０．８ ｇ塗
布し実施例１と同様にワイヤーハーネスを作成し、特性
評価を行った。結果を表−１に示す。Example 2 Polyolefin resin MT Melt P-75 in a part of the connector
0 (manufactured by Mitsui Toatsu Chemical Co., Ltd., heat distortion temperature 120'C) 100
400 parts by weight of copper powder (average particle size 10 μm) was mixed with 400 parts by weight and dispersed using three rolls. The resulting sealing material was heated to 180°C with a heating dispenser and applied in an amount of 0.8 g. A wire harness was created in the same manner as in Example 1, and its characteristics were evaluated. The results are shown in Table-1.
実施例 ３
コネクタ一部にポリエステル樹脂バイロン２００（東洋
紡社製 熱変形温度１６０℃）をメチルエチルケトンに
て溶解し固形分１００重量部に対してニンケル扮（平均
粒径１５μｍ）５０重量部を混合し、高速ミキサーで分
散してえられたシール材を、デイスペンサーを用いて、
固型分として０．２ｇｌ布し実施例１と同様にカシメ工
程をとった後、１００℃で乾燥し、ワイヤーハーネスを
作成し、特性評価を行った。結果を表−１に示す。Example 3 Polyester resin Vylon 200 (manufactured by Toyobo Co., Ltd., heat deformation temperature 160°C) was dissolved in methyl ethyl ketone in a part of the connector, and 50 parts by weight of Ninkel Gyaku (average particle size 15 μm) was mixed with 100 parts by weight of solid content. Using a dispenser, the sealant obtained by dispersing with a high-speed mixer is
After applying 0.2 g of the cloth as a solid content and performing the crimping process in the same manner as in Example 1, it was dried at 100°C, a wire harness was prepared, and its characteristics were evaluated. The results are shown in Table-1.
実施例 ４
実施例３と同様にポリイミド（熱変形温度２２０’Ｃ）
の塩化メチレン溶液の固形分１００重量部に対し、銀粉
（平均粒径１０μｍ ）８０重量部を混合し、ニーグー
で分散して得られたシール材を用いてワイヤーハーネス
を作成し、特性評価を行った。結果を表−１に示す。Example 4 Polyimide (heat distortion temperature 220'C) as in Example 3
80 parts by weight of silver powder (average particle size 10 μm) was mixed with 100 parts by weight of the solid content of the methylene chloride solution of 100% by weight, and dispersed with Ni-Goo.A wire harness was created using the obtained sealing material, and the characteristics were evaluated. Ta. The results are shown in Table-1.
実施例 ５
実施例３と同様に、フェノール樹脂レヂトツブＰＬ−２
２８５（群栄化学工業社製 熱変形温度２００°ｃ）１
００重世部をに対し銅粉（平均粒径１０１７ｍ１０ｌ７
重量部を混合し、三木ロールにて分散して得られたシー
ル材を用いてワイヤーハーネスを作成し、特性評価を行
った。結果を表−１に示す。Example 5 Similar to Example 3, phenolic resin resin resin PL-2
285 (manufactured by Gunei Chemical Industry Co., Ltd., heat distortion temperature 200°c) 1
Copper powder (average particle size 1017m10l7)
A wire harness was prepared using a sealing material obtained by mixing parts by weight and dispersing with a Miki roll, and its characteristics were evaluated. The results are shown in Table-1.
比較例 １
コネクターとワイヤー端導体部をカシメ工程により接続
し、そのままの状態にてワイヤーハーネスとして評価し
た。結果を表−１に示す。Comparative Example 1 A connector and a wire end conductor were connected by a caulking process and evaluated as a wire harness in that state. The results are shown in Table-1.
比較例 ２
比較例１と同様にして接続した後、ハンダゴテにて半田
付けを行い、ワイヤーハーネスを作成し、評価した。結
果を表−１に示す。Comparative Example 2 After connections were made in the same manner as in Comparative Example 1, soldering was performed using a soldering iron to create a wire harness and evaluate it. The results are shown in Table-1.
比較例の場合、半田付けの際、ワイヤーハーネスの放熱
性のため、所要時間が２分／−木と非常に長時間を要し
、本願発明の実施例がすべて０．５秒／−本以下であっ
たことと著しい対象をなしている。In the case of the comparative example, due to the heat dissipation of the wire harness, it took a very long time to solder, about 2 minutes per piece, whereas all the examples of the present invention required less than 0.5 seconds per piece. It has become a remarkable subject to the fact that it was.
Claims (1)
ターをカシメにより接続する際、熱変形温度が１００℃
以上の有機樹脂中に金属粉を分散させたシール材を、該
コネクターと該ワイヤー端導体部間、及びその周辺に設
けることを特徴とするコネクターの接続方法。(1) When connecting the connector to the wire end conductor part of the wire harness by caulking, the heat distortion temperature is 100℃.
A method for connecting a connector, characterized in that a sealing material in which metal powder is dispersed in the above-mentioned organic resin is provided between the connector and the wire end conductor portion and around the same.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63083907A JPH01255182A (en) | 1988-04-05 | 1988-04-05 | Seal connection method for connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63083907A JPH01255182A (en) | 1988-04-05 | 1988-04-05 | Seal connection method for connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01255182A true JPH01255182A (en) | 1989-10-12 |
Family
ID=13815689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63083907A Pending JPH01255182A (en) | 1988-04-05 | 1988-04-05 | Seal connection method for connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01255182A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05135808A (en) * | 1991-11-13 | 1993-06-01 | Yazaki Corp | Waterproof terminal connection structure and its manufacture |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS64661A (en) * | 1987-03-24 | 1989-01-05 | Yazaki Corp | Wire connection structure of crimp-style terminal |
-
1988
- 1988-04-05 JP JP63083907A patent/JPH01255182A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS64661A (en) * | 1987-03-24 | 1989-01-05 | Yazaki Corp | Wire connection structure of crimp-style terminal |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05135808A (en) * | 1991-11-13 | 1993-06-01 | Yazaki Corp | Waterproof terminal connection structure and its manufacture |
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