JPH01217058A - Resin composition for laminated board and production of laminated board - Google Patents
Resin composition for laminated board and production of laminated boardInfo
- Publication number
- JPH01217058A JPH01217058A JP4344688A JP4344688A JPH01217058A JP H01217058 A JPH01217058 A JP H01217058A JP 4344688 A JP4344688 A JP 4344688A JP 4344688 A JP4344688 A JP 4344688A JP H01217058 A JPH01217058 A JP H01217058A
- Authority
- JP
- Japan
- Prior art keywords
- laminated board
- laminate
- epoxy resin
- butadiene
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims description 7
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 239000003822 epoxy resin Substances 0.000 claims abstract description 16
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 16
- 229920000459 Nitrile rubber Polymers 0.000 claims abstract description 10
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 claims abstract description 10
- 125000003277 amino group Chemical group 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 abstract description 6
- 238000005452 bending Methods 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 2
- 238000002156 mixing Methods 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 239000000539 dimer Substances 0.000 description 3
- GQWWGRUJOCIUKI-UHFFFAOYSA-N 2-[3-(2-methyl-1-oxopyrrolo[1,2-a]pyrazin-3-yl)propyl]guanidine Chemical compound O=C1N(C)C(CCCN=C(N)N)=CN2C=CC=C21 GQWWGRUJOCIUKI-UHFFFAOYSA-N 0.000 description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229920000151 polyglycol Polymers 0.000 description 2
- 239000010695 polyglycol Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、可撓性に優れた積層板用樹脂組成物およびこ
れを用いた折曲げ可能な積層板に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a resin composition for laminates having excellent flexibility and a bendable laminate using the same.
従来の技術
電子機器の小型、軽量化が進み、これに組込んだ部品の
空間を効率的に利用するため、プリント配線によるこれ
までの平面的な回路板に替えて、立体的な回路板が多用
化されている。そのための手段として、
■ プリント配線板の絶縁基板として硬質板と７レキシ
ブル板の併用あるいは硬質板とリード線との併用。Conventional technology As electronic devices become smaller and lighter, three-dimensional circuit boards are being used instead of the conventional flat circuit boards with printed wiring in order to efficiently utilize the space of the components incorporated into them. It is widely used. As a means for this purpose, 1) Use a combination of a rigid board and a 7 flexible board, or use a combination of a rigid board and a lead wire, as an insulating substrate for a printed wiring board.
■ フレキシブル板のみによる回路板の作製。■ Manufacturing a circuit board using only flexible boards.
等がとられているが、船主工程を簡略にするため、硬質
板の折り曲げを可能にする要求が出ている。However, in order to simplify the process for ship owners, there is a demand for bending of rigid plates.
上記硬質板として、積層板が使用されるわけであるが、
積層板の可撓性を向上させるため、可撓性付与剤として
、ダイマー酸変性エポキシ樹脂、１よ
ポリグリコール型エポキシ樹脂、あるいろ反応性希釈剤
等を添加し、エポキシ樹脂の改質がおこなわれでいるが
、折り曲げを可能とする可披、性が充分得られず、耐薬
品性も悪いという欠点がある。A laminate board is used as the above-mentioned hard board,
In order to improve the flexibility of the laminate, the epoxy resin is modified by adding flexibility imparting agents such as dimer acid-modified epoxy resin, 1-polyglycol type epoxy resin, and various reactive diluents. However, it has the disadvantage that it does not have sufficient flexibility to allow bending and has poor chemical resistance.
発明が解決しようとする課題
本発明は、上記の点に鑑み、可撓性に優れた積層板用樹
脂組成物を提供し、折り曲げが可能な耐薬品性に優れた
積層板を得ることを目的とする。Problems to be Solved by the Invention In view of the above points, an object of the present invention is to provide a resin composition for a laminate with excellent flexibility, and to obtain a laminate that can be bent and has excellent chemical resistance. shall be.
課題を解決するための手段
本発明は上記の目的を達成するためになされたもので、
末端にアミノ基を有するブタジエン−アクリロニトリル
共重合体をエポキシ樹脂に５〜６０重量％含有させたこ
とを特徴とする。Means for Solving the Problems The present invention has been made to achieve the above objects.
It is characterized in that the epoxy resin contains 5 to 60% by weight of a butadiene-acrylonitrile copolymer having an amino group at the terminal.
また、上記積層板用樹脂組成物を、シート状、基材に含
浸乾燥して得たプリプレグを積層成形して積層板を得る
ものである。Further, a laminate is obtained by laminating and molding a prepreg obtained by impregnating and drying a base material in sheet form with the resin composition for a laminate.
作用
本発明は、通常のエポキシ樹脂に比べ高分子量でかつ分
子構造に鎖状構造を導入することで樹脂の架橋密度を下
げるとともに、その硬化物の伸縮性を向上させて可撓性
を保持させるものである。Function The present invention has a higher molecular weight than ordinary epoxy resins and introduces a chain structure into the molecular structure, thereby lowering the crosslinking density of the resin and improving the elasticity of the cured product to maintain flexibility. It is something.
この項目につき鋭意検討を重ねた結果、末端に７ミノ基
を有するブタジエン−アクリロニトリル共重合体をエポ
キシ樹脂に併用するとき、良好な可撓性が得られること
を見い出した。As a result of intensive studies on this topic, it was discovered that good flexibility can be obtained when a butadiene-acrylonitrile copolymer having a 7-mino group at the terminal is used in combination with an epoxy resin.
末端にアミノ基を有するブタジエン−アクリロニトリル
共重合体の含有量が５重ｊｉ９６より小であるときには
、十分な可撓性得られず積層板を折り曲げることができ
ない。また、６０重量部を越えると、折り曲げた際、折
り曲げ部分にクラックが発生する。When the content of the butadiene-acrylonitrile copolymer having an amino group at the terminal is less than 5-fold ji96, sufficient flexibility cannot be obtained and the laminate cannot be bent. Moreover, if it exceeds 60 parts by weight, cracks will occur at the bent portion when it is bent.
尚、本発明に使用する末端にアミノ基を有するブタジエ
ン−アクリロニトリル共重合体のアクリロニ） ＩＪル
の含有量は特に限定しないが、１０〜２０９６が好まし
いものである。アクリロニトリルの含有量が少ないとき
には、エポキシ樹脂との相溶性が悪く、また多すぎると
耐湿耐熱性が悪くなる傾向にある。The content of acrylonitrile in the butadiene-acrylonitrile copolymer having an amino group at the terminal used in the present invention is not particularly limited, but is preferably 10 to 2096. When the content of acrylonitrile is small, the compatibility with the epoxy resin is poor, and when the content is too large, the moisture and heat resistance tends to be poor.
実施例 本発明の詳細な説明する。Example The present invention will be described in detail.
実施例１〜３、比較例１〜２
末端にアミノ基を有するブタジエン−アクリロニトリル
共重合体（アミン当量：９００、アクリＥ：ｌ 、：
） ！Ｊル含有率： １７９６） 、ジアミノジフェニ
ルメタン（アミン当ｊｌ：４９）、二官能エポキシ樹脂
（エポキシ当ｉ：４７５）を第１表の如く配合しく重量
部） 、ＢＦ３−モノエチルアミン錯体を０．５重量部
加えた後、これをガラス不織布基材（重さ： ７５ ｆ
／ｗ？：日本バイリーン製）に含浸乾燥して樹脂量７５
重量％のプリプレグを得た。該プリプレグを３枚積層し
、両表面に銅箔（厚み２３５μｍ）を配置後加熱、加圧
して０．６ ｍ厚みの両面銅張積層板を得た。Examples 1 to 3, Comparative Examples 1 to 2 Butadiene-acrylonitrile copolymer having an amino group at the end (amine equivalent: 900, Acrylic E: l,:
)! Jl content: 1796), diaminodiphenylmethane (jl per amine: 49), bifunctional epoxy resin (jl per epoxy: 475) as shown in Table 1 (parts by weight), BF3-monoethylamine complex 0.5 After adding parts by weight, this was added to the glass nonwoven fabric base material (weight: 75 f
/w? : Made by Nippon Vilene) and dried to obtain a resin amount of 75.
% prepreg by weight was obtained. Three sheets of the prepreg were laminated, copper foil (thickness: 235 μm) was placed on both surfaces, and then heated and pressed to obtain a double-sided copper-clad laminate with a thickness of 0.6 m.
従来例に
官能エポキシ樹脂（エポキシ当量：４７５）５０重量部
、ダイマー酸変性エポキシ当量＝４３０油化シェル製）
５０を皿部、ジシアンジアミド３重量部、２−エチル−
４−メチルイミダゾール０．４重量部を配合し、この組
成物を用いて他は、実施例１と同様にして０．６■厚み
の両面銅張積層板を得た。In the conventional example, 50 parts by weight of functional epoxy resin (epoxy equivalent: 475), dimer acid-modified epoxy equivalent = 430 (manufactured by Yuka Shell)
50 in the dish part, 3 parts by weight of dicyandiamide, 2-ethyl-
A double-sided copper-clad laminate having a thickness of 0.6 .mu.m was obtained in the same manner as in Example 1 except that 0.4 parts by weight of 4-methylimidazole was blended and this composition was used.
従来例２
従来例１のダイマー酸変性エポキシ樹脂のかわりにポリ
グリコール型エポキシ樹脂（エポキシ当量：３２０、ダ
ウケミカル製）を使用し、他は、従来例１と同様にして
０．６ ｖｘｍ厚みの両面銅張積層板を得た。Conventional Example 2 A polyglycol type epoxy resin (epoxy equivalent: 320, manufactured by Dow Chemical) was used in place of the dimer acid-modified epoxy resin of Conventional Example 1, and the other conditions were the same as in Conventional Example 1, with a thickness of 0.6 vxm. A double-sided copper-clad laminate was obtained.
実施例１〜３、比較例１〜２、従来例１〜２の特性を第
１表に示す。Table 1 shows the characteristics of Examples 1-3, Comparative Examples 1-2, and Conventional Examples 1-2.
また、実施例３において、末端にアミノ基を有するブタ
ジエン−アクリロニトリル共重合体中のアクリロニトリ
ルの含有率を変化させたときのエポキシ樹脂との相溶性
及び積層板としたときの特性を第２表に示す。In addition, in Example 3, the compatibility with the epoxy resin when the content of acrylonitrile in the butadiene-acrylonitrile copolymer having an amino group at the terminal was changed and the properties when made into a laminate are shown in Table 2. show.
測定方法
（１） 銅箔引きはがし強さ：ＪＩＳ−Ｃ−６４８１
に準拠した。Measurement method (1) Copper foil peeling strength: JIS-C-6481
Compliant with.
（２）耐薬品性＝４０℃の塩化メチレンで３分間処理し
た。(2) Chemical resistance: Treated with methylene chloride at 40°C for 3 minutes.
■＝異常なし、 △：肌荒れあり
Ｘ：肌荒れ大
（３）折り曲げ性：クラックを生じずに折り曲げが可能
なそれぞれに適した十分に径の小さい円柱棒の周面に沿
って積層板を折り曲げ、折り曲げの力を解除した後に折
り曲げの状態を保持できる半径を示した。■ = No abnormality, △: Rough skin The radius at which the bent state can be maintained after the bending force is released is shown.
（４）はんだ耐熱性：ＪＩＳ−Ｃ−６４８１に準拠した
。(4) Soldering heat resistance: Compliant with JIS-C-6481.
発明の効果
上述のように本発明は、末端にアミノ基を有するブタジ
エン−アクリロニトリル共重合体をエポキシ樹脂に５〜
６０重量％含有させた樹脂組成物としたことにより、折
り曲げ性、耐薬品性に優れた積層板を提供することがで
き、その工業的価値は極めて大なるものである。Effects of the Invention As described above, the present invention provides an epoxy resin with a butadiene-acrylonitrile copolymer having an amino group at the end.
By using a resin composition containing 60% by weight, a laminate with excellent bending properties and chemical resistance can be provided, and its industrial value is extremely large.
Claims (1)
リル共重合体をエポキシ樹脂に５〜６０重量％含有させ
たことを特徴とする積層板用樹脂組成物。 ２、第１項における積層板用樹脂組成物をシート状基材
に含浸乾燥して得たプリプレグを積層成形することを特
徴とする積層板の製造法。[Scope of Claims] 1. A resin composition for a laminate, comprising an epoxy resin containing 5 to 60% by weight of a butadiene-acrylonitrile copolymer having an amino group at the terminal. 2. A method for producing a laminate, which comprises laminating and molding a prepreg obtained by impregnating and drying a sheet-like base material with the resin composition for a laminate according to item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4344688A JPH01217058A (en) | 1988-02-26 | 1988-02-26 | Resin composition for laminated board and production of laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4344688A JPH01217058A (en) | 1988-02-26 | 1988-02-26 | Resin composition for laminated board and production of laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01217058A true JPH01217058A (en) | 1989-08-30 |
Family
ID=12663928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4344688A Pending JPH01217058A (en) | 1988-02-26 | 1988-02-26 | Resin composition for laminated board and production of laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01217058A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5592750A (en) * | 1979-01-04 | 1980-07-14 | Dunlop Co Ltd | Rubber*resin composition |
| JPS61179224A (en) * | 1985-02-05 | 1986-08-11 | Sumitomo Chem Co Ltd | Epoxy resin composition |
-
1988
- 1988-02-26 JP JP4344688A patent/JPH01217058A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5592750A (en) * | 1979-01-04 | 1980-07-14 | Dunlop Co Ltd | Rubber*resin composition |
| JPS61179224A (en) * | 1985-02-05 | 1986-08-11 | Sumitomo Chem Co Ltd | Epoxy resin composition |
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